EP2056406A4 - Circuit connecting material, connection structure for circuit member using the same and production method thereof - Google Patents

Circuit connecting material, connection structure for circuit member using the same and production method thereof

Info

Publication number
EP2056406A4
EP2056406A4 EP07792046A EP07792046A EP2056406A4 EP 2056406 A4 EP2056406 A4 EP 2056406A4 EP 07792046 A EP07792046 A EP 07792046A EP 07792046 A EP07792046 A EP 07792046A EP 2056406 A4 EP2056406 A4 EP 2056406A4
Authority
EP
European Patent Office
Prior art keywords
circuit
same
production method
connection structure
connecting material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07792046A
Other languages
German (de)
French (fr)
Other versions
EP2056406A1 (en
Inventor
Takashi Tatsuzawa
Kouji Kobayashi
Naoki Fukushima
Takanobu Kobayashi
Akihiro Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to EP10197088A priority Critical patent/EP2339695A1/en
Publication of EP2056406A1 publication Critical patent/EP2056406A1/en
Publication of EP2056406A4 publication Critical patent/EP2056406A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
EP07792046A 2006-08-25 2007-08-06 Circuit connecting material, connection structure for circuit member using the same and production method thereof Withdrawn EP2056406A4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10197088A EP2339695A1 (en) 2006-08-25 2007-08-06 Circuit connecting material, connection structure for circuit member using the same and production method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006229086 2006-08-25
JP2006314652 2006-11-21
JP2007160577A JP4650456B2 (en) 2006-08-25 2007-06-18 Circuit connection material, circuit member connection structure using the same, and manufacturing method thereof
PCT/JP2007/065376 WO2008023565A1 (en) 2006-08-25 2007-08-06 Circuit connecting material, connection structure for circuit member using the same and production method thereof

Publications (2)

Publication Number Publication Date
EP2056406A1 EP2056406A1 (en) 2009-05-06
EP2056406A4 true EP2056406A4 (en) 2010-09-08

Family

ID=39106652

Family Applications (2)

Application Number Title Priority Date Filing Date
EP10197088A Withdrawn EP2339695A1 (en) 2006-08-25 2007-08-06 Circuit connecting material, connection structure for circuit member using the same and production method thereof
EP07792046A Withdrawn EP2056406A4 (en) 2006-08-25 2007-08-06 Circuit connecting material, connection structure for circuit member using the same and production method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP10197088A Withdrawn EP2339695A1 (en) 2006-08-25 2007-08-06 Circuit connecting material, connection structure for circuit member using the same and production method thereof

Country Status (7)

Country Link
US (1) US20100012358A1 (en)
EP (2) EP2339695A1 (en)
JP (1) JP4650456B2 (en)
KR (1) KR101024479B1 (en)
CN (3) CN102522635A (en)
TW (2) TW200829094A (en)
WO (1) WO2008023565A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7604868B2 (en) * 1997-03-31 2009-10-20 Hitachi Chemical Company, Ltd. Electronic circuit including circuit-connecting material
JP2008291161A (en) * 2007-05-28 2008-12-04 Sony Chemical & Information Device Corp Method for producing adhesive, and method for connecting electrical component
EP2053546A1 (en) * 2007-10-26 2009-04-29 Gemplus Radiofrequency communication device comprising a timer
JP5368054B2 (en) * 2008-10-15 2013-12-18 日本メクトロン株式会社 Method for manufacturing flexible circuit board and flexible circuit board
JP2011105861A (en) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd Circuit-connecting material and connected structure
JP4752986B1 (en) * 2010-01-08 2011-08-17 日立化成工業株式会社 Adhesive film for circuit connection and circuit connection structure
JP5206840B2 (en) * 2010-06-14 2013-06-12 日立化成株式会社 Adhesive film for circuit connection, circuit connection structure using the same, and circuit member connection method
CN103261277B (en) 2010-12-17 2015-12-02 积水化学工业株式会社 The manufacture method of polyamic acid particle, the manufacture method of polyimide particle, polyimide particle and electronic component-use grafting material
WO2013042203A1 (en) * 2011-09-20 2013-03-28 日立化成株式会社 Adhesive composition, film adhesive, adhesive sheet, circuit connector and circuit member connection method
GB201116932D0 (en) * 2011-10-01 2011-11-16 Young Peter J Device to detect unattended open door or draw
EP2770540A4 (en) 2011-10-17 2015-05-20 Nat Inst Of Advanced Ind Scien Semiconductor element bonding method and bonding structure
JP5936882B2 (en) * 2012-03-02 2016-06-22 デクセリアルズ株式会社 CIRCUIT CONNECTION MATERIAL, AND METHOD FOR MANUFACTURING MOUNTING BODY USING THE SAME
CN106960067B (en) * 2016-01-08 2021-11-12 中兴通讯股份有限公司 Electronic device, and method and system for compensating stress sensitive parameters
CN109790424B (en) * 2016-09-23 2020-12-08 E.I.内穆尔杜邦公司 Conductive adhesive
CN106973498B (en) * 2017-04-25 2019-04-12 安徽宏鑫电子科技有限公司 A kind of two sided pcb
JP7185252B2 (en) 2018-01-31 2022-12-07 三国電子有限会社 Method for producing connection structure
JP7046351B2 (en) 2018-01-31 2022-04-04 三国電子有限会社 How to make a connection structure
JP7160302B2 (en) * 2018-01-31 2022-10-25 三国電子有限会社 CONNECTED STRUCTURE AND METHOD OF MAKING CONNECTED STRUCTURE
US11224131B2 (en) * 2018-04-04 2022-01-11 Lenovo (Singapore) Pte. Ltd. Systems and methods for surface mounting cable connections
CN110275577B (en) * 2019-06-25 2022-04-12 京东方科技集团股份有限公司 Ultrasonic module and display screen

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0372880A2 (en) * 1988-12-05 1990-06-13 Hitachi Chemical Co., Ltd. Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
EP0995784A1 (en) * 1997-07-04 2000-04-26 Nippon Zeon Co., Ltd. Adhesive for semiconductor components
JP2001068832A (en) * 1999-08-25 2001-03-16 Hitachi Chem Co Ltd Wiring board and method of manufacturing the same
WO2007029534A1 (en) * 2005-09-02 2007-03-15 Konan Gakuen Polyamide acid containing metal ultrafine metal particle

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120941A (en) 1974-08-14 1976-02-19 Seikosha Kk DODENSEISETSUCHAKUZAI
CA1068205A (en) * 1975-03-27 1979-12-18 Yutaka Hori Heat-curable composite sheet
US4212959A (en) * 1978-05-09 1980-07-15 Mitsubishi Denki Kabushiki Kaisha Heat resistant resin composition
JPS58167124A (en) * 1982-03-29 1983-10-03 Nippon Oil & Fats Co Ltd Manufacture of plastic lens
JPS59120436A (en) 1982-12-27 1984-07-12 Seikosha Co Ltd Manufacture of anisotropically conductive rubber sheet
JPS59204613A (en) * 1983-05-06 1984-11-20 Hitachi Chem Co Ltd Heat-resistant resin composition
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
US5158818A (en) * 1984-01-30 1992-10-27 National Starch And Chemical Investment Holding Corporation Conductive die attach tape
JPS60191228A (en) 1984-10-29 1985-09-28 Seiko Epson Corp Connecting structure of display device
CA1272536A (en) * 1985-05-28 1990-08-07 Tsutomu Suda Propylene polymer composition
CN1003524B (en) * 1985-10-14 1989-03-08 株式会社日立制作所 Electroless gold plating solution
CA1337700C (en) 1985-10-15 1995-12-05 Anthony Revis Process for preparation of silyl ketene acetals
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JPH01251787A (en) 1988-03-31 1989-10-06 Toshiba Corp Connecting device for electronic parts
JPH04115407A (en) * 1990-09-03 1992-04-16 Soken Kagaku Kk Anisotropic conductive adhesive composite
JPH07123179B2 (en) * 1990-10-05 1995-12-25 信越ポリマー株式会社 Circuit board connection structure with anisotropic conductive adhesive
JP3128291B2 (en) * 1990-10-31 2001-01-29 株式会社東芝 Maleimide resin composition and resin-sealed semiconductor device using the same
JPH04174980A (en) 1990-11-07 1992-06-23 Hitachi Chem Co Ltd Connecting member for circuit
US5096962A (en) * 1990-11-29 1992-03-17 Lord Corporation Acrylic adhesive compositions
WO1993020562A1 (en) * 1992-04-03 1993-10-14 Thermoset Plastics, Inc. Conductor-filled thermosetting resin
US5208266A (en) * 1992-04-28 1993-05-04 Toshimichi Yamazaki Lightly crosslinked polymeric foams and process for making same
JPH05339555A (en) * 1992-06-08 1993-12-21 Sumitomo Bakelite Co Ltd Adhesive composition
JP3048197B2 (en) * 1992-08-05 2000-06-05 シャープ株式会社 Anisotropic conductive film
JP3288146B2 (en) * 1992-09-16 2002-06-04 日立化成工業株式会社 Conductive adhesive film, bonding method, support member with conductive adhesive film, and semiconductor device
US5667899A (en) * 1992-09-16 1997-09-16 Hitachi Chemical Co. Ltd. Electrically conductive bonding films
US5395876A (en) * 1993-04-19 1995-03-07 Acheson Industries, Inc. Surface mount conductive adhesives
JP3907217B2 (en) 1993-07-29 2007-04-18 日立化成工業株式会社 Circuit connection material and circuit connection method using the connection material
JPH07157631A (en) * 1993-12-03 1995-06-20 Maruzen Petrochem Co Ltd Thermosetting resin composition
JPH0873832A (en) * 1994-09-05 1996-03-19 Hitachi Chem Co Ltd Resin paste and semiconductor device
TW345727B (en) * 1996-08-22 1998-11-21 Hitachi Ltd Resin encapsulated semiconductor device and process for producing the same
JPH10212364A (en) * 1996-11-26 1998-08-11 Ajinomoto Co Inc Prepreg for laminate and production of printed wiring board by using the same
CN1218439C (en) * 1997-02-27 2005-09-07 精工爱普生株式会社 Connecting structure, liquid crystal device, electronic equipment, anisotropic conductive adhesive and method for manufacturing the adhesive
US7604868B2 (en) * 1997-03-31 2009-10-20 Hitachi Chemical Company, Ltd. Electronic circuit including circuit-connecting material
JP3587859B2 (en) * 1997-03-31 2004-11-10 日立化成工業株式会社 Circuit connection material, circuit terminal connection structure and connection method
JPH10330724A (en) * 1997-05-30 1998-12-15 Hitachi Chem Co Ltd Heat-resistant adhesive, semiconductor chip with heat-resistant adhesive layer, lead frame with heat-resistant adhesive layer, film with heat-resistant adhesive layer and semiconductor device
JP3715754B2 (en) * 1997-08-25 2005-11-16 株式会社巴川製紙所 Method for forming patterned cured resin layer
JPH1165112A (en) * 1997-08-25 1999-03-05 Tomoegawa Paper Co Ltd Uv-curing resin composition, uv-curing adhesive sheet and forming method of patterned hardened resin layer
JP3719471B2 (en) * 1997-09-02 2005-11-24 日立化成工業株式会社 IC chip adhesive film
JP3477367B2 (en) 1998-05-12 2003-12-10 ソニーケミカル株式会社 Anisotropic conductive adhesive film
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
WO2001014484A1 (en) * 1999-08-25 2001-03-01 Hitachi Chemical Company, Ltd. Adhesive agent, method for connecting wiring terminals and wiring structure
JP4433564B2 (en) 2000-05-17 2010-03-17 日立化成工業株式会社 Adhesive for circuit connection
JP2002285135A (en) * 2001-03-27 2002-10-03 Shin Etsu Polymer Co Ltd Anisotropic electroconductive adhesive and connecting structure using the same
JP2003027035A (en) * 2001-07-16 2003-01-29 Nitto Denko Corp Adhesive composition and adherent sheet
EP2182585B1 (en) * 2003-06-25 2011-08-10 Hitachi Chemical Company, Ltd. Circuit member connecting structure
JP2005194393A (en) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd Adhesive film for circuit connection, and circuit connection structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0372880A2 (en) * 1988-12-05 1990-06-13 Hitachi Chemical Co., Ltd. Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
EP0995784A1 (en) * 1997-07-04 2000-04-26 Nippon Zeon Co., Ltd. Adhesive for semiconductor components
JP2001068832A (en) * 1999-08-25 2001-03-16 Hitachi Chem Co Ltd Wiring board and method of manufacturing the same
WO2007029534A1 (en) * 2005-09-02 2007-03-15 Konan Gakuen Polyamide acid containing metal ultrafine metal particle
US20090134364A1 (en) * 2005-09-02 2009-05-28 Hidemi Nawafune Polyamide acid containing ultrafine metal particle

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008023565A1 *

Also Published As

Publication number Publication date
TWI373284B (en) 2012-09-21
EP2339695A1 (en) 2011-06-29
WO2008023565A1 (en) 2008-02-28
CN102136309A (en) 2011-07-27
KR101024479B1 (en) 2011-03-23
EP2056406A1 (en) 2009-05-06
KR20090042829A (en) 2009-04-30
CN101507057A (en) 2009-08-12
US20100012358A1 (en) 2010-01-21
TW200829094A (en) 2008-07-01
CN101507057B (en) 2011-12-21
CN102522635A (en) 2012-06-27
JP2008150573A (en) 2008-07-03
TW201108876A (en) 2011-03-01
JP4650456B2 (en) 2011-03-16

Similar Documents

Publication Publication Date Title
EP2056406A4 (en) Circuit connecting material, connection structure for circuit member using the same and production method thereof
EP2178094A4 (en) Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
EP2003735A4 (en) Terminal and method for producing the same
EP2164311A4 (en) Circuit board and method for manufacturing the same
EP2003729A4 (en) Antenna assembly and method for manufacturing the same
EP2217044A4 (en) Circuit board and method for manufacturing the same
PL1954745T3 (en) Adhesive formulation, method for the production thereof, and use thereof
PL2115217T3 (en) Dewatering screen and method for the production thereof
ZA200810677B (en) Fusion proteins, uses thereof and processes for producing same
EP2096648A4 (en) Conductive film and method for manufacturing the same
EP1963380A4 (en) Fluoropolymer dispersion and method for making the same
EP2117022A4 (en) Electrical contact member, method for producing the same, and electrical contact
EP2084745A4 (en) Device, and method for manufacturing the same
EP2043120A4 (en) Keytop and method for manufacturing the same
EP2148393A4 (en) Circuit-connecting material, and connection structure for circuit member
EP2234466A4 (en) Mounted board and method for manufacturing the same
EP2123616A4 (en) Graphite material and method for manufacturing the same
EP2173012A4 (en) Fretting-resistant connector and process for manufacturing the same
HK1121004A1 (en) Sock and method for producing the same
HK1135852A1 (en) Anti-biocontaminant products and processes for making the same
EP1931190A4 (en) Flat display member and method for manufacturing same, and flat display and method for manufacturing same
PT2225314T (en) Silicone-self-adhesives, method for the production thereof, complexes using same and uses
EP2061097A4 (en) Thermoelectric material, method for producing the same, and thermoelectric converter
EP1995265A4 (en) Polyarylene and process for producing the same
EP2224472A4 (en) Substrate and method for manufacturing the same

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20090226

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

A4 Supplementary search report drawn up and despatched

Effective date: 20100805

17Q First examination report despatched

Effective date: 20111004

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20120215