EP2051539A1 - MEMS-Mikrofongehäuse - Google Patents

MEMS-Mikrofongehäuse Download PDF

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Publication number
EP2051539A1
EP2051539A1 EP08017149A EP08017149A EP2051539A1 EP 2051539 A1 EP2051539 A1 EP 2051539A1 EP 08017149 A EP08017149 A EP 08017149A EP 08017149 A EP08017149 A EP 08017149A EP 2051539 A1 EP2051539 A1 EP 2051539A1
Authority
EP
European Patent Office
Prior art keywords
mems microphone
case
chip
pcb substrate
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08017149A
Other languages
English (en)
French (fr)
Inventor
Chung-Dam Song
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSE Co Ltd
Original Assignee
BSE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSE Co Ltd filed Critical BSE Co Ltd
Publication of EP2051539A1 publication Critical patent/EP2051539A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a micro electro mechanical systems (MEMS) microphone package, and more particularly, to a MEMS microphone package that can shield a MEMS microphone chip from noise to greatly improve sound quality and reduce manufacturing costs, by ground-connecting a metal case to a main board using an assembly process including bending and clamping an end of the case.
  • MEMS micro electro mechanical systems
  • a condenser microphone includes a diaphragm and a back plate.
  • the diaphragm has a flexible membrane attached to a side electrode and is vibrated by an acoustic pressure.
  • the back plate is spaced apart from the diaphragm through a spacer and faces each other.
  • the diaphragm and the back plate form parallel electrode plates of a condenser and provide electric charges between the both electrode plates by applying a DC voltage to the both electrode plates or forming an electret at one of the both electrode plates.
  • Such a general condenser microphone is assembled in a curling manner where a diaphragm, a spacer, a base 1, a back plate, a base 2, and a PCB to which an electric circuit is mounted are sequentially stacked on a cylindrical case and then an end of the case is bent and clamped toward the PCB.
  • a distance between the diaphragm and the back plate is changed by an external acoustic pressure, and then capacitance of a condenser is also changed, and this change of the capacitance is processed by an electric circuit so that electrical signals are provided according to the change of the acoustic pressure.
  • a condenser microphone used in communication products includes an electret that is formed on a back plate with a high molecular membrane.
  • Such condenser microphones are economical, but there is a limit to miniaturization.
  • an electrical capacity structure is realized on a silicon wafer in a die shape using a semiconductor-manufacturing technology and a micromachining technology.
  • This electrical capacity structure is referred to as a silicon condenser microphone chip or a MEMS microphone chip.
  • Such MEMS microphone chips must be packaged for protection against exterior interference.
  • a technology of packaging a MEMS microphone chip is disclosed in U.S. Patent No. 6,781,231 , entitled “MICROELECTROMECHANICAL SYSTEM PACKAGE WITH ENVIRONMENTAL AND INTERFERENCE SHIELD", issued on August 24, 2004.
  • FIG. 1 such a MEMS microphone package is achieved in the manner where a housing is formed by attaching a case 34 including a conductive layer or a conductor to a PCB substrate 32 through a conductive adhesive 36.
  • a MEMS microphone chip 10 and an application specific integrated circuit (ASIC) 20 are mounted to the PCB substrate 32.
  • the ASIC 20 is configured to electrically drive the MEMS microphone chip 10 and process signals.
  • the case 34 including a sound hole 34a is attached to the PCB substrate 32 through the adhesive 36 to protect the MEMS microphone chip 10 therein.
  • a MEMS microphone packaging method including attaching a case to a PCB substrate with an adhesive or welding is different from a cheap curling operation where a metal case is bent and components are fixed in the metal case to assemble a microphone.
  • new mechanical equipment is required for the attaching or the welding, thereby increasing building cost for a new manufacturing line.
  • the present invention is directed to a MEMS microphone package that substantially obviates one or more problems due to limitations and disadvantages of the related art.
  • the invention is defined in claim 1. Particular embodiments are set out in the dependent claims.
  • the present invention provides a MEMS microphone package that can improve noise-blocking characteristics and reduce manufacturing costs without an additional manufacturing facility, by directly mounting a metal case of the MEMS microphone package to a main board using a curling process where an end of the metal case is bent and clamped in a condenser microphone-assembling process.
  • the MEMS microphone package is generally tetragonal such that a direction is easily recognized in a process of mounting the MEMS microphone package to a main substrate using a surface mounting technology (SMT). While a curling process, where components are inserted into a case and then an end of the case is bent and clamped, is easily performed on the circular microphone, an edge of the tetragonal microphone is difficult to bend.
  • SMT surface mounting technology
  • the MEMS microphone package of the present invention allows a curling process to be performed even on a tetragonal microphone by chamfering an end of a tetragonal case of the tetragonal microphone and includes a support to form a space between the tetragonal case and a PCB to which the MEMS microphone is mounted.
  • a MEMS microphone package including: a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation; a PCB substrate to which a MEMS microphone chip and an ASIC chip are mounted, the PCB substrate being inserted into the case; and a support configured to support the PCB substrate and define a space between the case and the PCB substrate.
  • the tetragonal container-shaped case having the open-side may include: four chamfered edges on the open-side, for preventing ends of respective surfaces of the case from overlapping ends of adjacent surfaces of the case in the curling operation. Also, a sound hole for introducing an external sound is disposed in at least one of a bottom of the case and the PCB substrate.
  • the MEMS microphone chip and the ASIC chip may be mounted to a surface of the PCB substrate, and a conductive pattern for connection to the metal case may be provided to a boundary of another surface, and connection terminals including a power (Vdd) terminal, an output terminal, and a ground (GND) terminal may be provided to a center of the surface having the boundary.
  • Vdd power
  • GND ground
  • the MEMS microphone package may further include a metal mesh for preventing a foreign object and a noise from being introduced into the inner space through the sound hole of the case.
  • FIG. 1 is a cross-sectional view illustrating a related art MEMS microphone package
  • FIG. 2 is a cut-away perspective view illustrating a MEMS microphone package according to an embodiment of the present invention
  • FIG. 3 is a cross-sectional view illustrating a MEMS microphone package according to an embodiment of the present invention.
  • FIG. 4 is a bottom view illustrating a MEMS microphone package according to an embodiment of the present invention.
  • FIG. 5 is a perspective view illustrating a case used in a MEMS microphone package according to an embodiment of the present invention.
  • FIG. 6 is a perspective view illustrating a support used in a MEMS microphone package according to an embodiment of the present invention.
  • FIG. 7 is a cut-away perspective view illustrating a MEMS microphone package according to another embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating a MEMS microphone package according to another embodiment of the present invention.
  • FIG. 2 is a cut-away perspective view illustrating a MEMS microphone package 100 according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view illustrating the MEMS microphone package 100 according to the embodiment of the present invention.
  • FIG. 4 is a bottom view illustrating the MEMS microphone package 100 according to the embodiment of the present invention.
  • a tetragonal condenser microphone includes a tetragonal container-shaped case 102, a PCB substrate 106, and a support 104.
  • the tetragonal container-shaped case 102 has an open-side for receiving parts and open-side ends 102c having chamfered edges for easy curling.
  • the PCB substrate 106 is inserted into the case 102, and a MEMS microphone chip 10 and an ASIC chip 20 are mounted to the PCB substrate 106.
  • the support 104 supports the PCB substrate 106 to define a space between the case 102 and the PCB substrate 106.
  • the metal case 102 used in the microphone package 100 according to the present invention, has a tetragonal shape with the open side.
  • the case 102 includes the four edges 102b of the open side and a sound hole 102a.
  • the four edges 102b are chamfered to prevent the respective ends 102c from overlapping the adjacent ends 102c when curling.
  • the sound hole 102a is disposed in a bottom of the case 102.
  • the sound hole 102a may be disposed in the PCB substrate 106, not the case 102, according to sound introduction structure of a condenser microphone.
  • the support 104 has a tetragonal ring shape and is disposed between the bottom of the case 102 and the PCB substrate 106 and defines an inner space and supports the PCB substrate 106 when curling the ends 102c. That is, the microphone package 100 according to the present invention is configured to prevent the respective ends 102c from overlapping the adjacent ends 102c when curling, thereby providing an easy curling operation and preventing deformation of the case 102 due to the support 104 during the curling.
  • the MEMS microphone chip 10 and the ASIC chip 20 are mounted to a surface of the PCB substrate 106.
  • a conductive pattern for connection to the case 102 is provided to a boundary of another surface, and connection terminals 108 including a power (Vdd) terminal, an output terminal and a ground (GND) terminal are provided to a center of the surface for the conductive pattern.
  • connection terminals 108 including a power (Vdd) terminal, an output terminal and a ground (GND) terminal are provided to a center of the surface for the conductive pattern.
  • Vdd power
  • GND ground
  • the MEMS microphone chip 10 includes a back plate and a diaphragm. The back plate is formed on a silicon wafer using a MEMS technology, and then a spacer is formed between the diaphragm and the back plate.
  • the ASIC chip 20 is connected to the MEMS microphone chip 10 to process electrical signals.
  • the ASIC chip 20 includes a voltage pump and a buffer amplifier.
  • the voltage pump provides a bias voltage such that the MEMS microphone chip 10 serves as a condenser microphone.
  • the buffer amplifier amplifies or impedance-matches electrical sound signals detected through the MEMS microphone chip 10 to provide the signals through the connection terminals 108 to the outside.
  • the protruding connection terminals 108 are adapted for surface mounting to a main substrate 200.
  • the tetragonal ring-shaped support 104 is inserted into the tetragonal container-shaped metal case 102 having the open-side, then the PCB substrate 106 having the MEMS microphone chip 10 and the ASIC chip 20 that are surface-mounted is inserted and disposed on the support 104, and then the ends 102c are bent toward the PCB substrate 106 through the curling to closely contact the conductive pattern, so that the MEMS microphone package 100 is completed.
  • the support 104 is inserted in the case 102 and supports the PCB substrate 106 to which circuit components are surface-mounted and defines the inner space, and the ends 102c are in close contact with the PCB substrate 106 through the curling.
  • the MEMS microphone package 100 is mounted to the main substrate 200 through a surface mounting technology (SMT) or a soldering method.
  • SMT surface mounting technology
  • the MEMS microphone package 100 is connected to pads 204 of the main substrate 200 corresponding to the connection terminals 108 of the PCB substrate 106, and the ends 102c are connected to ground patterns 202 of the main substrate 200 to electrically shield the entire microphone as a Faraday cup that prevents the outside noise from being introduced into the microphone.
  • SMT surface mounting technology
  • the MEMS microphone package 100 is connected to pads 204 of the main substrate 200 corresponding to the connection terminals 108 of the PCB substrate 106, and the ends 102c are connected to ground patterns 202 of the main substrate 200 to electrically shield the entire microphone as a Faraday cup that prevents the outside noise from being introduced into the microphone.
  • the diaphragm of the MEMS microphone chip 10 vibrates and capacitance changes between the diaphragm and the back plate.
  • the change of the capacitance is amplified as electrical signals in the buffer amplifier of the ASIC chip 20 and output to the main substrate 200 through the output terminal.
  • FIG. 7 is a cut-away perspective view illustrating a MEMS microphone package according to another embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating the MEMS microphone package according to the embodiment of FIG. 7 .
  • the MEMS microphone package includes a tetragonal container-shaped case 102, a metal mesh 110, a support 104, and a PCB substrate 106.
  • the tetragonal container-shaped metal case 102 has an open-side for receiving parts and open-side ends 102c having chamfered edges for easy curling.
  • a sound hole 102a is disposed in a bottom of the case 102.
  • the metal mesh 110 prevents a foreign object from being introduced into an inner space through a sound hole 102a.
  • the support 104 supports the PCB substrate 106 to define a space between the case 102 and the PCB substrate 106.
  • the MEMS microphone package according to this embodiment can further improve shielding performance and prevent a foreign object and a RF noise from being introduced through the sound hole 102a into the inner space, by adding the metal mesh 110 for preventing a foreign object from being introduced through the sound hole 102a into the inner space and blocking outside noise, to the structure of the embodiment illustrated in FIG. 2 .
  • the microphone package of this embodiment is the same as that of the previous embodiment except that the metal mesh 110 is added to prevent a foreign object or the RF noise from being introduced into the inner space through the sound hole 102a.
  • the same part as those in the description of the previous embodiment will be omitted.
  • the MEMS microphone package according to the present invention manufactured through the curling process where the end of the metal case is chamfered and clamped, shields the MEMS microphone chip therein against external noise to greatly improve the sound quality, by directly connecting the bent ends of the case to the main board to form a Faraday cup when mounting the microphone package to the main board.
  • the noise-blocking performance is improved by preventing the RF noise of the antenna from being introduced into the antenna even when the antenna and the microphone are adjacent to each other, thereby maintaining the excellent sound quality.
  • the MEMS microphone chip when packaged, manufacturing costs are reduced without an additional manufacturing facility, and when the curling operation is performed, the ends of the tetragonal container-shaped case are prevented from overlapping the adjacent ends, so that the curling operation is easily performed and the deformation of the case due to the support in the curling operation is prevented.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Pressure Sensors (AREA)
EP08017149A 2007-10-18 2008-09-29 MEMS-Mikrofongehäuse Withdrawn EP2051539A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070104981A KR100925558B1 (ko) 2007-10-18 2007-10-18 멤스 마이크로폰 패키지

Publications (1)

Publication Number Publication Date
EP2051539A1 true EP2051539A1 (de) 2009-04-22

Family

ID=40260696

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08017149A Withdrawn EP2051539A1 (de) 2007-10-18 2008-09-29 MEMS-Mikrofongehäuse

Country Status (8)

Country Link
EP (1) EP2051539A1 (de)
JP (1) JP4777406B2 (de)
KR (1) KR100925558B1 (de)
CN (1) CN201195694Y (de)
MY (1) MY150111A (de)
SG (1) SG152176A1 (de)
TW (1) TWM345339U (de)
WO (1) WO2009051317A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013028399A2 (en) * 2011-08-19 2013-02-28 Knowles Electronics, Llc Acoustic apparatus and method of manufacturing
US8737674B2 (en) 2011-02-11 2014-05-27 Infineon Technologies Ag Housed loudspeaker array
WO2021128418A1 (zh) * 2019-12-26 2021-07-01 潍坊歌尔微电子有限公司 麦克风封装结构以及电子设备

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TWI401774B (zh) * 2010-01-18 2013-07-11 Chipmos Technologies Inc 微機電晶片封裝結構及其製造方法
KR101109102B1 (ko) * 2010-01-18 2012-01-31 주식회사 비에스이 멤스 마이크로폰 패키지
CN102238455A (zh) * 2010-04-23 2011-11-09 安国国际科技股份有限公司 具有电磁波接收器的声音感测器
KR101320574B1 (ko) 2011-11-30 2013-10-23 주식회사 비에스이 멤스 마이크로폰
US20130284537A1 (en) * 2012-04-26 2013-10-31 Knowles Electronics, Llc Acoustic Assembly with Supporting Members
KR101339909B1 (ko) * 2012-04-30 2013-12-10 전자부품연구원 마이크로폰 패키지
KR101224448B1 (ko) * 2012-04-30 2013-01-21 (주)파트론 센서 패키지 및 그의 제조 방법
KR101334578B1 (ko) * 2012-05-11 2013-11-28 한국기계연구원 개구부를 포함하는 전자기기 패키지
KR101493510B1 (ko) * 2014-01-03 2015-02-16 주식회사 비에스이 외부 회로와 연결되기 위한 단자가 두 개인 멤스 마이크로폰
KR20160127212A (ko) 2015-04-23 2016-11-03 (주)이미지스테크놀로지 멤스 마이크로폰 및 그 제조방법
KR101700571B1 (ko) 2016-06-24 2017-02-01 (주)이미지스테크놀로지 멤스 마이크로폰
KR101698312B1 (ko) 2016-06-24 2017-01-23 (주)이미지스테크놀로지 멤스 마이크로폰 및 그 제조방법
KR101949594B1 (ko) 2017-05-30 2019-04-29 서울대학교산학협력단 멤스 트랜스듀서 패키지 및 이를 포함하는 멤스 장치
KR101949593B1 (ko) 2017-05-30 2019-02-18 서울대학교산학협력단 멤스 장치
CN108282731B (zh) * 2018-03-07 2024-01-16 钰太芯微电子科技（上海）有限公司 一种声学传感器及微机电麦克风封装结构
CN110278519A (zh) * 2019-08-01 2019-09-24 华景科技无锡有限公司 一种硅麦克风
CN110808240A (zh) * 2019-10-31 2020-02-18 北京燕东微电子有限公司 层叠封装结构及其制造方法
KR20240014979A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
KR20240014978A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
KR20240014981A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
KR20240014980A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
CN115665635B (zh) * 2022-11-10 2023-09-05 广范企业发展（连云港）有限公司 一种mems麦克风及其生产方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001268695A (ja) * 2000-03-22 2001-09-28 Hosiden Corp エレクトレットコンデンサマイクロホン
WO2005069682A1 (en) 2004-01-20 2005-07-28 Bse Co., Ltd A parallelepiped type condenser microphone for smd
EP1755360A1 (de) 2005-08-20 2007-02-21 BSE Co., Ltd. Silizium Kondensatormikrofon und Verfahren zum Einbringen eines Mikrofons in ein Gehäuse
JP2007150507A (ja) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd マイクロホンパッケージ
EP1898666A2 (de) * 2006-09-05 2008-03-12 BSE Co., Ltd. Elektretkondensatormikrofon

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
KR100544279B1 (ko) * 2004-02-27 2006-01-23 주식회사 비에스이 평행육면체형 지향성 콘덴서 마이크로폰
KR100675024B1 (ko) * 2005-06-13 2007-01-30 주식회사 비에스이 콘덴서 마이크로폰의 도전 베이스 및 이를 이용한 콘덴서마이크로폰
KR100675027B1 (ko) * 2005-08-10 2007-01-30 주식회사 비에스이 실리콘 콘덴서 마이크로폰 및 이를 위한 실장 방법
US7419853B2 (en) * 2005-08-11 2008-09-02 Hymite A/S Method of fabrication for chip scale package for a micro component
KR100632694B1 (ko) * 2005-08-20 2006-10-16 주식회사 비에스이 일렉트릿 콘덴서 마이크로폰
CN101189909B (zh) * 2006-06-02 2011-08-17 宝星电子株式会社 利用密封垫的smd电容传声器及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001268695A (ja) * 2000-03-22 2001-09-28 Hosiden Corp エレクトレットコンデンサマイクロホン
WO2005069682A1 (en) 2004-01-20 2005-07-28 Bse Co., Ltd A parallelepiped type condenser microphone for smd
EP1755360A1 (de) 2005-08-20 2007-02-21 BSE Co., Ltd. Silizium Kondensatormikrofon und Verfahren zum Einbringen eines Mikrofons in ein Gehäuse
JP2007150507A (ja) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd マイクロホンパッケージ
EP1898666A2 (de) * 2006-09-05 2008-03-12 BSE Co., Ltd. Elektretkondensatormikrofon

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8737674B2 (en) 2011-02-11 2014-05-27 Infineon Technologies Ag Housed loudspeaker array
WO2013028399A2 (en) * 2011-08-19 2013-02-28 Knowles Electronics, Llc Acoustic apparatus and method of manufacturing
WO2013028399A3 (en) * 2011-08-19 2013-05-10 Knowles Electronics, Llc Acoustic apparatus and method of manufacturing
US8879767B2 (en) 2011-08-19 2014-11-04 Knowles Electronics, Llc Acoustic apparatus and method of manufacturing
WO2021128418A1 (zh) * 2019-12-26 2021-07-01 潍坊歌尔微电子有限公司 麦克风封装结构以及电子设备

Also Published As

Publication number Publication date
WO2009051317A1 (en) 2009-04-23
MY150111A (en) 2013-11-29
JP2009100471A (ja) 2009-05-07
KR20090039375A (ko) 2009-04-22
JP4777406B2 (ja) 2011-09-21
TWM345339U (en) 2008-11-21
KR100925558B1 (ko) 2009-11-05
CN201195694Y (zh) 2009-02-18
SG152176A1 (en) 2009-05-29

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