EP2040895A1 - Method for the production of material plates and material plate - Google Patents

Method for the production of material plates and material plate

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Publication number
EP2040895A1
EP2040895A1 EP07786098A EP07786098A EP2040895A1 EP 2040895 A1 EP2040895 A1 EP 2040895A1 EP 07786098 A EP07786098 A EP 07786098A EP 07786098 A EP07786098 A EP 07786098A EP 2040895 A1 EP2040895 A1 EP 2040895A1
Authority
EP
European Patent Office
Prior art keywords
chip
fiber material
board
plasma treatment
fibers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07786098A
Other languages
German (de)
French (fr)
Other versions
EP2040895B1 (en
Inventor
Herbert Ruhdorfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interglarion Ltd
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Interglarion Ltd
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Publication date
Application filed by Interglarion Ltd filed Critical Interglarion Ltd
Priority to PL07786098T priority Critical patent/PL2040895T3/en
Priority to SI200731265T priority patent/SI2040895T1/en
Publication of EP2040895A1 publication Critical patent/EP2040895A1/en
Application granted granted Critical
Publication of EP2040895B1 publication Critical patent/EP2040895B1/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/27—Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/3188—Next to cellulosic
    • Y10T428/31895—Paper or wood

Definitions

  • the present invention relates to a method for the production of material plates made of chip or fiber material, in particular chipboard, LDF (low density fiberboard), MDF (Medium Density fiberboard), HDF (high density fiberboard - high density fiberboard) and Oriented Strandboard (OSB) boards made of directionally oriented chips.
  • chipboard LDF (low density fiberboard), MDF (Medium Density fiberboard), HDF (high density fiberboard - high density fiberboard) and Oriented Strandboard (OSB) boards made of directionally oriented chips.
  • LDF low density fiberboard
  • MDF Medium Density fiberboard
  • HDF high density fiberboard - high density fiberboard
  • OSB Oriented Strandboard
  • the provided for example by cutting wood chips are first dried and then sorted by chip size, for example, in two classes, namely the larger middle-class chips and the smaller surface shavings, and either stored separately or directly for further processing fed.
  • the chips are then glued and sprinkled on a conveyor belt, that the outer layer chips and the middle layer chips are arranged in the middle of the non-pressed chip bed, which is finally pressed in a continuous process by means of a belt press to plates.
  • the present invention provides a method of the generic type, comprising the steps of: providing dried chip or fiber material, plasma treatment of the dried chip or fiber material, gluing the plasma-treated chip or fiber material, pressing the glued chip or Fiber material to material plates.
  • the decisive difference between the process according to the invention and the known process therefore consists in the fact that the dried chip or fiber material according to the invention is subjected to the additional step of a plasma treatment before being glued.
  • a plasma treatment a process gas is ionized in the space between two electrodes subjected to high voltage.
  • the dried chips or fibers are exposed to the process gas plasma thus formed, whether it is trickled through the plasma or that they are moved through the plasma in bulk, for example on a conveyor line.
  • the ions penetrate into the surface of the chips or fibers, for example up to 10 ⁇ m deep.
  • the resulting physical and chemical changes in the chip or fiber surface have not yet been clarified.
  • it is a scientifically proven fact that such a treatment causes an improved adhesion of the surface, so that, as desired, an applied layer of glue on such a treated better adhered chip or fiber surface.
  • the plasma-treated chips or fibers manage with a significantly lower amount of glue than in the conventional method, and the material plates produced by the method according to the invention despite the lower amount of glue used still meet the mechanical requirements according to the industry standards valid for the individual material plates. Since the savings in the amount of glue to be used per cubic meter of material plate material far outweigh the investment costs to be allocated to the production of this cubic meter of material plate material, the material plates can be produced more economically by the method according to the invention.
  • liquid glue needs to be used, which after curing a quantity of not more than 50kg, preferably not more than 45kg, solid Glue corresponds.
  • This is equal to more than 15%, preferably more than 25%, glue saving compared to conventional methods.
  • even a glue saving of about 30% is achieved, which corresponds to the use of 63kg liquid glue or about 42kg solid glue.
  • the step according to the invention of the plasma treatment of the dried chip or fiber material can be realized, for example, by exposing in each case a predetermined amount of chip or fiber material in a low-pressure chamber to a low-pressure plasma in a batchwise process. This can ensure that the chip or fiber material is uniform, i. as far as possible on all surfaces of all individual shavings and fibers is plasma-treated, so that subsequently the surface properties over the entire Spanoder fiber material are homogeneous. Alternatively, however, one may also pass it in a continuous process past a nozzle of an atmospheric pressure plasma generator.
  • the process gas used in the plasma treatment may comprise as main component oxygen or / and nitrogen and / or argon.
  • a low-pressure plasma for plasma treatment for example, air can be used as process gas, whereby a complicated evacuation of the low-pressure chamber can be prevented before the introduction of the process gas, and the pressure in the low-pressure chamber after loading only to the pressure required for the plasma treatment (in the order of 0.5 to 5 mbar) needs to be reduced.
  • the process gas used in the plasma treatment may comprise fluorine as an additional component.
  • fluorine as an additional component.
  • the addition of fluorine to the process gas can advantageously influence the swelling behavior of the chips or fibers under the action of moisture, ie. the swelling of the chips or fibers can be reduced under the influence of moisture. This leads to a significantly increased stability of the material plates produced in this way to the effect of moisture.
  • paraffin emulsion is added in the manufacture of chipboard to reduce undesirable swelling.
  • plasma treatment with a process gas containing fluorine the use of paraffin emulsion can be completely or at least partially dispensed with. This provides a further cost savings.
  • the duration of the plasma treatment of the chip or fiber material may preferably be 1 to 10 minutes.
  • the chip or fiber material be present in a plurality of groups before the plasma treatment, which differ depending on the size of the individual chips and fibers. Furthermore, different groups can each be plasma-treated separately and then glued before they are recombined for pressing into a material plate. In this way, it can be ensured, for example, in the production of a chipboard, that optimum operating parameters can be used for the plasma treatment both for the smaller cover shavings and for the larger middle shavings, so that the achievable glue saving can be maximized.
  • the step of plasma treatment and the step of gluing the chip or fiber material Preferably, between the step of plasma treatment and the step of gluing the chip or fiber material not more than 30 minutes, more preferably not more than 1 minutes, to ensure that the improved by the plasma treatment surface properties of the chip or fiber material are not deteriorated by too long storage times again.
  • the chip or fiber material used according to the invention may comprise wood chips and / or wood fibers and / or hemp fibers and / or straw fibers, so that not only different types of wood material o plates, such as chipboard, LDF boards, MDF boards, HDF -
  • Plates and OSB boards, but also material plates containing hemp fibers and / or straw fibers can be produced.
  • urea-formaldehyde resin or urea-5-melamine-formaldehyde resin or phenol-formaldehyde resin preferably having a solids content of 40 to 80%, can be used.
  • the invention further relates to a material plate made of chip or fiber material, in particular chipboard, LDF plate, MDF board, HDF board and OSB board, which per cubic meter of material plate not more than 50kg, preferably not more than 45kg, solid glue.
  • the chip or fiber material wood chips and / or wood fibers and / or hemp fibers o and / or straw include.
  • the size may include urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably at a solids content of 40 to 80%.
  • Fig. 1 is a block diagram for schematically explaining a method according to the invention for producing a chipboard.
  • log wood, wood chips, wood residues and the like are first fed to a conventional cutting installation in step S1.
  • step S2 the supplied wood is then processed into chips with the aid of the cutting installation, these chips are dried in a conventional dryer installation, for example in a drum dryer, to a residual moisture content of about 2% and then sieved, so that smaller chips, which are later used as cover shavings serve the chipboard, can be separated from larger chips, which will later serve as middle-layer chips of chipboard.
  • the method according to the invention does not differ from conventional production methods of material plates made of chip or fiber material, and it is also completely irrelevant to the method according to the invention how precisely the provision of dried chip or fiber material takes place. So it is also conceivable that the cutting and drying does not happen directly on site, but already dried chip or fiber material is delivered from a warehouse.
  • step S3a the top layer chips are introduced into a low-pressure chamber, which is then pumped off to a working pressure of about 0.5 to 5 mbar.
  • a plasma is ignited in the low-pressure chamber, in which case the air remaining in the low-pressure chamber is used as the process gas.
  • process gases such as argon, or / and the process gas used in each case add one or more additives, such as fluorine.
  • step S3b the middle-layer chips are likewise plasma-treated analogously to step S3a.
  • the separate plasma treatment of the top layer chips and the middle layer chips here has the advantage that on the one hand process parameters such as working pressure, treatment time and composition and / or concentration of the process gas can be tailored to the particular chip type, and on the other hand, different additives to the respective process gas can be added individually for each type of chip in appropriate composition and concentration.
  • step S3a or step S3b the cover layer chips and the middle layer chips are glued separately in step S4a or step S4b, respectively.
  • a gluing agent urea-formaldehyde resin, urea-melamine-formaldehyde resin or phenol-formaldehyde resin is used here, as is usual for conventional chipboard production methods.
  • the chips can be advantageously influenced by suitable additives in the process gas in the plasma treatment.
  • An addition of fluorine causes, for example, an advantageous effect on the swelling behavior of the chips, so that the otherwise usual addition of paraffin emulsion in the production of chipboard to reduce the swelling behavior of the finished plate can be completely or partially omitted, and thus a further cost savings can be achieved ,
  • step S5 the topcoat chips and the middle-layer chips are scattered together on a conveyor belt such that the surfaces of the formed layer consist of non-pressed, glued chips of topcoat chips, and middle-layer chips are disposed in the center of that layer.
  • the chips are finally pressed, for example, in a conventional belt press and heated to form a chipboard.
  • any possible layering and pressing process of the glued chips is conceivable, which is usually used in the production of material plates made of chip or fiber material.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Reinforced Plastic Materials (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

A method for the production of material plates made of chip- or fiber material, in particular of chipboard, LDF board, MDF board, HDF board, and OSB board, encompasses the steps: Provision (S2) of dried chip- or fiber material, Plasma treatment (S3a, S3b) of the dried chip- or fiber material, Application of glue (S4a, S4b) to the plasma treated chip- or fiber material, and Compression (S5) of the chip- or fiber material that has glue applied into material plates. The invention also relates to such a material plate.

Description

Verfahren zur Herstellung von Werkstoffplatten und Werkstoffplatte Process for the production of material plates and material plate
Beschreibungdescription
Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung von Werkstoffplatten aus Span- oder Fasermaterial, insbesondere von Spanplatten, LDF-Platten ([ow density fiberboard - niederdichte Faserplatten), MDF- Platten (rnedium density fiberboard - mitteldichte Faserplatten), HDF-Platten (high density fiberboard - hochdichte Faserplatten) und OSB-Platten (oriented Strandboard - Spanplatten aus richtungsorientiert gestreuten Spänen).The present invention relates to a method for the production of material plates made of chip or fiber material, in particular chipboard, LDF (low density fiberboard), MDF (Medium Density fiberboard), HDF (high density fiberboard - high density fiberboard) and Oriented Strandboard (OSB) boards made of directionally oriented chips.
Bei einem bekannten gattungsgemäßen Verfahren zur Herstellung von Spanplatten, werden die beispielsweise durch Zerspanen von Holz bereitgestellten Holzspäne zunächst getrocknet und anschließend nach Spangröße sortiert, beispielsweise in zwei Klassen, nämlich die größeren Mittelschichtspäne und die kleineren Deckschichtspäne, und entweder getrennt gelagert oder unmittelbar der weiteren Verarbeitung zugeführt. Üblicherweise werden die Späne dann beleimt und so auf ein Förderband gestreut, dass die Deckschichtspäne außen und die Mittelschichtspäne in der Mitte des ungepressten Spanbetts angeordnet sind, welches schließlich in einem kontinuierlichen Prozess mittels einer Bandpresse zu Platten verpresst wird.In a known generic method for the production of particleboard, the provided for example by cutting wood chips are first dried and then sorted by chip size, for example, in two classes, namely the larger middle-class chips and the smaller surface shavings, and either stored separately or directly for further processing fed. Usually, the chips are then glued and sprinkled on a conveyor belt, that the outer layer chips and the middle layer chips are arranged in the middle of the non-pressed chip bed, which is finally pressed in a continuous process by means of a belt press to plates.
Auch bei der Herstellung von Faserplatten, beispielsweise MDF- oder HDF- Platten, wird in analoger Weise vorgegangen, wobei allerdings keine Unterteilung in Deckschicht- und Mittelschichtspäne vorgenommen wird, wenn auch die Fasern üblicherweise von einer Mischung aus vorbestimmten Anteilen vorbestimmter Fasertypen gebildet werden.Also in the production of fiberboard, such as MDF or HDF plates, the procedure is analogous, although no subdivision into cover layer and middle layer chips is made, although the fibers are usually formed from a mixture of predetermined proportions of predetermined fiber types.
Herkömmlicherweise wird zur Erzielung der gewünschten mechanischen Festigkeitseigenschaften der Werkstoffplatte beispielsweise bei Spanplatten pro Kubikmeter Volumen der Werkstoffplatte etwa 90 kg flüssiger Leim benötigt, was nach dem Aushärten etwa 60 kg festem Leim entspricht. Derartige Leimmengen sind ein wichtiger Kostenfaktor bei der Herstellung von Werkstoffplatten.Conventionally, to achieve the desired mechanical strength properties of the material plate, for example, in chipboard per cubic meter volume of the material plate about 90 kg of liquid glue needed, which corresponds to about 60 kg of solid glue after curing. Such glue levels are an important cost factor in the production of material plates.
Demgegenüber ist es Aufgabe der vorliegenden Erfindung, ein Verfahren zur Herstellung von Werkstoffplatten aus Span- oder Fasermaterial bereitzustellen, das eine im Vergleich mit den herkömmlichen Verfahren kostengünstigere Herstellung ermöglicht.In contrast, it is an object of the present invention to provide a method for the production of material plates made of chip or fiber material, which enables a more cost-effective compared with the conventional method production.
Zur Lösung dieser Aufgabe stellt die vorliegende Erfindung ein Verfahren der gattungsgemäßen Art bereit, welches die Schritte umfasst: Bereitstellen von getrocknetem Span- oder Fasermaterial, Plasmabehandeln des getrockneten Span- oder Fasermaterials, Beleimen des plasmabehandelten Span- oder Fasermaterials, Verpressen des beleimten Span- oder Fasermaterials zu Werkstoffplatten.To achieve this object, the present invention provides a method of the generic type, comprising the steps of: providing dried chip or fiber material, plasma treatment of the dried chip or fiber material, gluing the plasma-treated chip or fiber material, pressing the glued chip or Fiber material to material plates.
Der entscheidende Unterschied zwischen dem erfindungsgemäßen und dem bekannten Verfahren besteht also darin, dass das getrocknete Span- oder Fasermaterial vor dem Beleimen erfindungsgemäß dem zusätzlichen Schritt einer Plasmabehandlung unterzogen wird. Bei einer solchen Plasmabehandlung wird ein Prozessgas im Zwischenraum zwischen zwei mit Hochspannung beaufschlagten Elektroden ionisiert. Die getrockneten Späne oder Fasern werden dem so gebildeten Prozessgasplasma ausgesetzt, sei es dass man sie durch das Plasma rieseln lässt oder dass man sie in loser Schüttung, bspw. auf einer Förderstrecke, durch das Plasma hindurchbewegt. In jedem Fall dringen die Ionen in Abhängigkeit von ihrer kinetischen Energie in die Oberfläche der Späne oder Fasern ein, und zwar beispielsweise bis zu 10 μm tief. Die dadurch bewirkten physikalischen und chemi- sehen Veränderungen an der Span- oder Faseroberfläche sind noch nicht geklärt. Es ist jedoch eine wissenschaftlich gesicherte Tatsache, dass eine solche Behandlung eine verbesserte Adhäsion der Oberfläche bewirkt, so dass, wie gewünscht, eine aufgetragene Leimschicht an einer derart behan- delten Span- oder Faseroberfläche besser haftet.The decisive difference between the process according to the invention and the known process therefore consists in the fact that the dried chip or fiber material according to the invention is subjected to the additional step of a plasma treatment before being glued. In such a plasma treatment, a process gas is ionized in the space between two electrodes subjected to high voltage. The dried chips or fibers are exposed to the process gas plasma thus formed, whether it is trickled through the plasma or that they are moved through the plasma in bulk, for example on a conveyor line. In any case, depending on their kinetic energy, the ions penetrate into the surface of the chips or fibers, for example up to 10 μm deep. The resulting physical and chemical changes in the chip or fiber surface have not yet been clarified. However, it is a scientifically proven fact that such a treatment causes an improved adhesion of the surface, so that, as desired, an applied layer of glue on such a treated better adhered chip or fiber surface.
Es war zwar ganz allgemein bekannt, dass sich Oberflächeneigenschaften durch eine Plasmabehandlung beeinflussen lassen. Es war jedoch nicht ohne Weiteres zu erwarten, dass sich hierdurch die Adhäsion von Leim an der plasmabehandelten Oberfläche von Spänen und Fasern beeinflussen und noch dazu verbessern lassen würde. Ferner war nicht zu erwarten, dass die sich überraschenderweise einstellende Adhäsipnsverbesserung auch über einen für die Lebensdauer der Werkstoffplatten und der aus diesen Werkstoffplatten hergestellten Produkte relevanten Zeitraum bestehen bleiben würde. Schließlich war auch nicht zu erwarten, dass die Adhäsionsverbesserung ein derartiges Ausmaß annehmen und beibehalten würde, dass die Einsparung an bei der Herstellung der Werkstoffplatten eingesetztem Leim die Investitions- und Betriebskosten für eine Plasmabehandlungs- anläge rechtfertigen würde. Es ist das Verdienst der Erfinder, sich über all diese Bedenken hinweggesetzt zu haben.Although it was generally known that surface properties can be influenced by a plasma treatment. However, it was not easy to expect that this would influence and even improve the adhesion of glue to the plasma-treated surface of chips and fibers. Furthermore, it was not to be expected that the surprisingly occurring Adhäsipnsverbesserung would remain over a relevant for the life of the material plates and the products made of these materials plates period. Finally, it was not expected that the adhesion improvement would take on and be maintained to such an extent that the saving of glue used in the manufacture of the material plates would justify the investment and operating costs of a plasma treatment plant. It is the merit of the inventors to overcome all these concerns.
Wie bereits angedeutet, ist es das Verdienst der Erfinder, herausgefunden zu haben, dass sich durch den zunächst unnötig erscheinenden, zusätz- liehen und kostenintensiven Arbeitsschritt der Plasmabehandlung bei der weiteren Verarbeitung des Span- oder Fasermaterials überraschenderweise der Vorteil ergibt, dass man beim anschließenden Beleimen der plasmabehandelten Späne bzw. Fasern mit einer deutlich geringeren Leimmenge auskommt als beim herkömmlichen Verfahren, und die nach dem erfin- dungsgemäßen Verfahren hergestellten Werkstoffplatten trotz der geringeren verwendeten Leimmenge die mechanischen Anforderungen gemäß der für die einzelnen Werkstoffplatten gültigen Industrienormen dennoch erfüllen. Da die Einsparungen an der pro Kubikmeter Werkstoffplattenmaterial einzusetzenden Leimmenge die auf die Herstellung dieses Kubikmeters Werkstoffplattenmaterial umzulegenden Investitionskosten bei Weitem überwiegen, sind die Werkstoffplatten nach dem erfindungsgemäßen Verfahren kostengünstiger herstellbar. Insbesondere haben die Erfinder festgestellt, dass pro Kubikmeter Werkstoff- platte nicht mehr als 75kg, vorzugsweise sogar nicht mehr als 67kg, flüssiger Leim verwendet zu werden braucht, was nach dem Aushärten einer Menge von nicht mehr als 50kg, vorzugsweise nicht mehr als 45kg, festem Leim entspricht. Dies kommt im Vergleich mit herkömmlichen Verfahren einer Leimeinsparung von mehr als 15%, vorzugsweise von mehr als 25%, gleich. Bei einer bevorzugten Ausführungsform der vorliegenden Erfindung wird sogar eine Leimeinsparung von etwa 30% erreicht, was der Verwendung von 63kg flüssigem Leim bzw. etwa 42kg festem Leim entspricht. Durch eine derartig hohe Leimeinsparung können die Herstellungskosten der mit dem erfindungsgemäßen Verfahren hergestellten Werkstoffplatten stark verringert werden.As already indicated, it is the merit of the inventors to have found out that surprisingly the advantage that one is on subsequent gluing by the seemingly unnecessary, additional lent and cost-intensive step of plasma treatment in the further processing of the chip or fiber material the plasma-treated chips or fibers manage with a significantly lower amount of glue than in the conventional method, and the material plates produced by the method according to the invention despite the lower amount of glue used still meet the mechanical requirements according to the industry standards valid for the individual material plates. Since the savings in the amount of glue to be used per cubic meter of material plate material far outweigh the investment costs to be allocated to the production of this cubic meter of material plate material, the material plates can be produced more economically by the method according to the invention. In particular, the inventors have found that per cubic meter of material plate not more than 75kg, preferably even not more than 67kg, liquid glue needs to be used, which after curing a quantity of not more than 50kg, preferably not more than 45kg, solid Glue corresponds. This is equal to more than 15%, preferably more than 25%, glue saving compared to conventional methods. In a preferred embodiment of the present invention, even a glue saving of about 30% is achieved, which corresponds to the use of 63kg liquid glue or about 42kg solid glue. By such a high glue saving, the manufacturing costs of the material plates produced by the method according to the invention can be greatly reduced.
Der erfindungsgemäße Schritt der Plasmabehandlung des getrockneten Span- oder Fasermaterials kann beispielsweise dadurch verwirklicht werden, dass man in einem diskontinuierlichen Verfahren jeweils eine vorbestimmte Menge von Span- oder Fasermaterial in einer Niederdruckkammer einem Niederdruckplasma aussetzt. Hierdurch kann sichergestellt werden, dass das Span- oder Fasermaterial gleichmäßig, d.h. möglichst an allen Ober- flächen sämtlicher einzelner Späne und Fasern, plasmabehandelt wird, so dass anschließend die Oberflächeneigenschaften über das gesamte Spanoder Fasermaterial homogen sind. Alternativ kann man es aber auch in einem kontinuierlichen Verfahren an einer Düse einer Vorrichtung für unter atmosphärischem Druck stehendes Plasma vorbeibewegen.The step according to the invention of the plasma treatment of the dried chip or fiber material can be realized, for example, by exposing in each case a predetermined amount of chip or fiber material in a low-pressure chamber to a low-pressure plasma in a batchwise process. This can ensure that the chip or fiber material is uniform, i. as far as possible on all surfaces of all individual shavings and fibers is plasma-treated, so that subsequently the surface properties over the entire Spanoder fiber material are homogeneous. Alternatively, however, one may also pass it in a continuous process past a nozzle of an atmospheric pressure plasma generator.
Bei beiden Verfahrensalternativen kann das bei der Plasmabehandlung verwendete Prozessgas als Hauptkomponente Sauerstoff oder/und Stickstoff oder/und Argon umfassen. Bei der Verwendung eines Niederdruckplasmas zur Plasmabehandlung kann so beispielsweise Luft als Prozessgas verwen- det werden, wodurch eine aufwendige Evakuierung der Niederdruckkammer vor dem Einleiten des Prozessgases verhindert werden kann, und der Druck in der Niederdruckkammer nach dem Beladen lediglich auf den für die Plasmabehandlung erforderlichen Druck (in der Größenordnung von 0,5 bis 5 mbar) verringert zu werden braucht.In both alternative methods, the process gas used in the plasma treatment may comprise as main component oxygen or / and nitrogen and / or argon. When using a low-pressure plasma for plasma treatment, for example, air can be used as process gas, whereby a complicated evacuation of the low-pressure chamber can be prevented before the introduction of the process gas, and the pressure in the low-pressure chamber after loading only to the pressure required for the plasma treatment (in the order of 0.5 to 5 mbar) needs to be reduced.
In Weiterbildung der Erfindung kann das bei der Plasmabehandlung verwendete Prozessgas als Zusatzkomponente Fluor umfassen. Erfindungsgemäß wurde nämlich festgestellt, dass durch die Zugabe von Fluor zum Prozessgas das Quellverhalten der Späne oder Fasern unter Feuchteeinwirkung vorteilhaft beeinflusst werden kann, d.h. das Aufquellen der Späne oder Fasern unter Feuchteeinwirkung reduziert werden kann. Dies führt zu einer deutlich erhöhten Stabilität der so hergestellten Werkstoffplatten gegenüber Feuchteeinwirkung. Herkömmlich wird bei der Herstellung von Spanplatten zur Verringerung des unerwünschten Aufquellens eine Paraffinemulsion zugegeben. Durch die Plasmabehandlung mit einem Fluor enthaltenden Prozessgas kann auf den Einsatz von Paraffinemulsion ganz oder zumindest teilweise verzichtet werden. Dies erbringt eine weitere Kostenersparnis.In a development of the invention, the process gas used in the plasma treatment may comprise fluorine as an additional component. In fact, according to the invention, it has been found that the addition of fluorine to the process gas can advantageously influence the swelling behavior of the chips or fibers under the action of moisture, ie. the swelling of the chips or fibers can be reduced under the influence of moisture. This leads to a significantly increased stability of the material plates produced in this way to the effect of moisture. Conventionally, paraffin emulsion is added in the manufacture of chipboard to reduce undesirable swelling. By plasma treatment with a process gas containing fluorine, the use of paraffin emulsion can be completely or at least partially dispensed with. This provides a further cost savings.
Die Dauer der Plasmabehandlung des Span- oder Fasermaterials kann vorzugsweise 1 bis 10 Minuten betragen. Dadurch können bei einem möglichst hohen Durchsatz an Span- oder Fasermaterial ausreichend gute Oberflächeneigenschaften der Späne oder Fasern erzielt werden.The duration of the plasma treatment of the chip or fiber material may preferably be 1 to 10 minutes. As a result, with the highest possible throughput of chip or fiber material, sufficiently good surface properties of the chips or fibers can be achieved.
In Weiterbildung der Erfindung wird vorgeschlagen, dass das Span- oder Fasermaterial vor der Plasmabehandlung in mehreren Gruppen vorliegt, die sich je nach Größe der einzelnen Späne und Fasern unterscheiden. Ferner können unterschiedlichen Gruppen jeweils separat plasmabehandelt und anschließend beleimt werden, bevor sie zum Verpressen zu einer Werkstoff- platte wieder zusammengeführt werden. Hierdurch kann beispielsweise bei der Herstellung einer Spanplatte sichergestellt werden, dass sowohl für die kleineren Deckschichtspäne, als auch für die größeren Mittelschichtspäne jeweils optimale Betriebsparameter bei der Plasmabehandlung verwendet werden können, so dass die erzielbare Leimeinsparung maximiert werden kann.In a development of the invention, it is proposed that the chip or fiber material be present in a plurality of groups before the plasma treatment, which differ depending on the size of the individual chips and fibers. Furthermore, different groups can each be plasma-treated separately and then glued before they are recombined for pressing into a material plate. In this way, it can be ensured, for example, in the production of a chipboard, that optimum operating parameters can be used for the plasma treatment both for the smaller cover shavings and for the larger middle shavings, so that the achievable glue saving can be maximized.
Vorzugsweise können zwischen dem Schritt des Plasmabehandelns und dem Schritt des Beleimens des Span- oder Fasermaterials nicht mehr als 30 Minuten, besonders bevorzugt nicht mehr als 1 Minuten, verstreichen, um sicherzustellen, dass die durch die Plasmabehandlung verbesserten Oberflächeneigenschaften des Span- oder Fasermaterials nicht durch zu lange 5 Lagerzeiten wieder verschlechtert werden.Preferably, between the step of plasma treatment and the step of gluing the chip or fiber material not more than 30 minutes, more preferably not more than 1 minutes, to ensure that the improved by the plasma treatment surface properties of the chip or fiber material are not deteriorated by too long storage times again.
Das erfindungsgemäß eingesetzte Span- oder Fasermaterial kann Holzspäne oder/und Holzfasern oder/und Hanffasern oder/und Strohfasern umfassen, so dass nicht nur unterschiedliche Typen von Holz-Werkstoff-o platten, wie beispielsweise Spanplatten, LDF-Platten, MDF-Platten, HDF-The chip or fiber material used according to the invention may comprise wood chips and / or wood fibers and / or hemp fibers and / or straw fibers, so that not only different types of wood material o plates, such as chipboard, LDF boards, MDF boards, HDF -
Platten und OSB-Platten, sondern auch Werkstoff platten, welche Hanffasern oder/und Strohfasern enthalten, hergestellt werden können.Plates and OSB boards, but also material plates containing hemp fibers and / or straw fibers can be produced.
Zum Beleimen kann beispielsweise Harnstoff-Formaldehyd-Harz oder Harn-5 stoff-Melamin-Formaldehyd-Harz oder Phenol-Formaldehydharz, vorzugsweise mit einem Feststoffgehalt von 40 bis 80%, verwendet werden.For gluing, for example, urea-formaldehyde resin or urea-5-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably having a solids content of 40 to 80%, can be used.
In einer Weiterbildung der vorliegenden Erfindung kann weiterhin vorgesehen sein, dass dem Prozessgas bei der Plasmabehandlung außer Fluoro auch noch andere Stoffe zugesetzt werden können, beispielsweise umIn a further development of the present invention, it can further be provided that other substances besides the fluorine can also be added to the process gas in the plasma treatment, for example by
Werkstoff platten mit Brandschutzeigenschaften oder/und mit antibakteriellen Eigenschaften oder/und mit einer verringerten Anfälligkeit für eine Schimmelpilz-Bildung zu erzielen. 5 Die Erfindung betrifft ferner eine Werkstoffplatte aus Span- oder Fasermaterial, insbesondere Spanplatte, LDF-Platte, MDF-Platte, HDF-Platte und OSB-Platte, welche pro KubikmeterWerkstoffplatte nicht mehr als 50kg, vorzugsweise nicht mehr als 45kg, festen Leim umfasst. Dabei kann das Span- oder Fasermaterial Holzspäne oder/und Holzfasern oder/und Hanf-o fasern oder/und Strohfasern umfassen. Ferner kann der Leim Harnstoff- Formaldehyd-Harz oder Harnstoff-Melamin-Formaldehyd-Harz oder Phenol- Formaldehydharz, vorzugsweise mit einem Feststoffgehalt von 40 bis 80%, beinhalten. Im Folgenden wird eine bevorzugte Ausführungsform der vorliegenden Erfindung anhand der beigefügten Zeichnung rein exemplarisch beschrieben. Es zeigt:Material plates with fire protection properties and / or with antibacterial properties or / and with a reduced susceptibility to mold fungus formation to achieve. The invention further relates to a material plate made of chip or fiber material, in particular chipboard, LDF plate, MDF board, HDF board and OSB board, which per cubic meter of material plate not more than 50kg, preferably not more than 45kg, solid glue. In this case, the chip or fiber material wood chips and / or wood fibers and / or hemp fibers o and / or straw include. Further, the size may include urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably at a solids content of 40 to 80%. Hereinafter, a preferred embodiment of the present invention will be described purely by way of example with reference to the accompanying drawings. It shows:
Fig. 1 ein Blockdiagramm zur schematischen Erläuterung eines erfindungsgemäßen Verfahrens zur Herstellung einer Spanplatte.Fig. 1 is a block diagram for schematically explaining a method according to the invention for producing a chipboard.
In der in Fig. 1 schematisch dargestellten bevorzugten Ausführungsform der vorliegenden Erfindung wird zunächst in Schritt S1 Rundholz, Hackgut, Holzreste und dergleichen einer herkömmlichen Zerspanungsanlage zugeführt.In the preferred embodiment of the present invention shown schematically in FIG. 1, log wood, wood chips, wood residues and the like are first fed to a conventional cutting installation in step S1.
In Schritt S2 wird dann das zugeführte Holz mit Hilfe der Zerspanungsanlage zu Spänen verarbeitet, diese Späne in einer herkömmlichen Trockneranlage, beispielsweise in einem Trommeltrockner, bis zu einer Restfeuchte von etwa 2% getrocknet und anschließend gesiebt, so dass kleinere Späne, welche später als Deckschichtspäne der Spanplatte dienen werden, von größeren Spänen, welche später als Mittelschichtspäne der Spanplatte dienen werden, getrennt werden können.In step S2, the supplied wood is then processed into chips with the aid of the cutting installation, these chips are dried in a conventional dryer installation, for example in a drum dryer, to a residual moisture content of about 2% and then sieved, so that smaller chips, which are later used as cover shavings serve the chipboard, can be separated from larger chips, which will later serve as middle-layer chips of chipboard.
In diesen beiden Schritten unterscheidet sich das erfindungsgemäße Verfahren nicht von herkömmlichen Herstellungsverfahren von Werkstoffplatten aus Span- oder Fasermaterial, und es ist für das erfindungsgemäße Verfahren auch völlig unerheblich, wie genau die Bereitstellung von getrocknetem Span- oder Fasermaterial erfolgt. So ist auch denkbar, dass die Zerspanung und Trocknung nicht unmittelbar vor Ort passiert, sondern bereits getrocknetes Span- oder Fasermaterial aus einem Lager angeliefert wird.In these two steps, the method according to the invention does not differ from conventional production methods of material plates made of chip or fiber material, and it is also completely irrelevant to the method according to the invention how precisely the provision of dried chip or fiber material takes place. So it is also conceivable that the cutting and drying does not happen directly on site, but already dried chip or fiber material is delivered from a warehouse.
In Schritt S3a werden die Deckschichtspäne in eine Niederdruckkammer eingebracht, welche dann auf einen Arbeitsdruck von etwa 0,5 bis 5 mbar abgepumpt wird. Sobald der Arbeitsdruck erreicht ist, wird in der Niederdruckkammer ein Plasma gezündet, wobei in diesem Fall die in der Niederdruckkammer verbleibende Luft als Prozessgas verwendet wird. Es ist jedoch auch möglich, andere Prozessgase, wie beispielsweise Argon, zu verwenden, oder/und dem jeweils verwendeten Prozessgas einen oder mehrere Zusatzstoffe, wie beispielsweise Fluor, zuzufügen. Die Plasmabehandlung, während der die Deckschichtspäne dem Plasma ausgesetzt sind, dauert etwa zwischen 1 und 10 Minuten.In step S3a, the top layer chips are introduced into a low-pressure chamber, which is then pumped off to a working pressure of about 0.5 to 5 mbar. As soon as the working pressure has been reached, a plasma is ignited in the low-pressure chamber, in which case the air remaining in the low-pressure chamber is used as the process gas. It is However, also possible to use other process gases, such as argon, or / and the process gas used in each case add one or more additives, such as fluorine. The plasma treatment, during which the surface layer chips are exposed to the plasma, takes approximately between 1 and 10 minutes.
In Schritt S3b werden die Mittelschichtspäne analog zu Schritt S3a ebenfalls plasmabehandelt. Die getrennte Plasmabehandlung der Deckschichtspäne und der Mittelschichtspäne hat hierbei den Vorteil, dass einerseits Prozess- parameter, wie beispielsweise Arbeitsdruck, Behandlungsdauer und Zusammensetzung und/oder Konzentration des Prozessgases, auf den jeweiligen Spänetyp individuell abgestimmt werden können, und dass andererseits unterschiedliche Zusatzstoffe dem jeweiligen Prozessgas individuell für jeden Spänetyp in geeigneter Zusammensetzung und Konzentration zugefügt werden können.In step S3b, the middle-layer chips are likewise plasma-treated analogously to step S3a. The separate plasma treatment of the top layer chips and the middle layer chips here has the advantage that on the one hand process parameters such as working pressure, treatment time and composition and / or concentration of the process gas can be tailored to the particular chip type, and on the other hand, different additives to the respective process gas can be added individually for each type of chip in appropriate composition and concentration.
Anschließend an Schritt S3a bzw. Schritt S3b werden in Schritt S4a bzw. Schritt S4b die Deckschichtspäne und die Mittelschichtspäne jeweils getrennt beleimt. Als Verleimungsmittel wird hierbei, wie auch bei herkömm- liehen Herstellungsverfahren für Spanplatten üblich, Harnstoff-Formaldehyd- Harz, Hamstoff-Melamin-Formaldehyd-Harz oder Phenol-Formaldehyd-Harz verwendet.Subsequent to step S3a or step S3b, the cover layer chips and the middle layer chips are glued separately in step S4a or step S4b, respectively. As a gluing agent, urea-formaldehyde resin, urea-melamine-formaldehyde resin or phenol-formaldehyde resin is used here, as is usual for conventional chipboard production methods.
Hierbei kann, da durch die erfindungsgemäße Plasmabehandlung der Späne die Benetzbarkeit der Span-Oberflächen verbessert wurde, etwa 30% weniger Verleimungsmittel als bei herkömmlichen Herstellungsverfahren für Spanplatten verwendet werden, ohne dass hierunter die mechanischen Festigkeitseigenschaften der fertiggestellten Spanplatte leiden würden. Während bei herkömmlichen Verfahren etwa 90kg flüssiges Verleimungs- mittel pro Kubikmeter Spanplatte benötigt wird, um Spanplatten mit den von den einschlägigen Industrienormen geforderten mechanischen Festigkeitseigenschaften herzustellen, kommt das erfindungsgemäße Verfahren idealerweise mit nur etwa 63kg flüssigem Verleimungsmittel pro Kubikmeter Werkstoffplatte aus. Diese signifikante Kostenersparnis rechtfertigt somit bereits die Zusatzkosten und den Aufwand des zusätzlichen Arbeitsschritts der Plasmabehandlung beim erfindungsgemäßen Verfahren zur Herstellung von Werkstoff platten.Here, since the wettability of the chip surfaces has been improved by the plasma treatment of chips according to the present invention, about 30% less sizing agent can be used than conventional chipboard production methods without suffering the mechanical strength properties of the finished chipboard. Whereas conventional processes require about 90 kg of liquid sizing per cubic meter of chipboard to produce chipboard having the mechanical strength properties required by the relevant industry standards, the process of the invention ideally comes with only about 63 kg of liquid sizing per cubic meter Material plate made. This significant cost savings thus justifies the additional costs and the expense of the additional operation of the plasma treatment in the inventive method for the production of material plates.
Weiterhin können durch geeignete Zusätze im Prozessgas bei der Plasmabehandlung auch andere Eigenschaften der Späne vorteilhaft beeinflusst werden. Ein Zusatz von Fluor bewirkt beispielsweise eine vorteilhafte Beeinflussung des Quellverhaltens der Späne, so dass auf den sonst üblichen Zusatz von Paraffinemulsion bei der Herstellung der Spanplatte zur Verringerung des Quellverhaltens der fertiggestellten Platte ganz oder teilweise verzichtet werden kann, und somit eine weitere Kostenersparnis erzielt werden kann.Furthermore, other properties of the chips can be advantageously influenced by suitable additives in the process gas in the plasma treatment. An addition of fluorine causes, for example, an advantageous effect on the swelling behavior of the chips, so that the otherwise usual addition of paraffin emulsion in the production of chipboard to reduce the swelling behavior of the finished plate can be completely or partially omitted, and thus a further cost savings can be achieved ,
Nach der Verleimung werden in Schritt S5 die Deckschichtspäne und die Mittelschichtspäne derart zusammen auf ein Förderband gestreut, dass die Oberflächen der gebildeten Schicht aus ungepressten, verleimten Spänen aus Deckschichtspänen bestehen, und Mittelschichtspäne in der Mitte dieser Schicht angeordnet sind. Die Späne werden schließlich beispielsweise in einer herkömmlichen Bandpresse verpresst und erwärmt, um eine Spanplatte zu bilden.After bonding, in step S5, the topcoat chips and the middle-layer chips are scattered together on a conveyor belt such that the surfaces of the formed layer consist of non-pressed, glued chips of topcoat chips, and middle-layer chips are disposed in the center of that layer. The chips are finally pressed, for example, in a conventional belt press and heated to form a chipboard.
Es ist für das erfindungsgemäße Verfahren hierbei wieder völlig unerheblich, wie die an sich bei der Herstellung von Werkstoffplatten üblichen und bekannten Schritte des Anordnens der Späne und des Verpressens imIt is for the inventive method here again completely irrelevant, as the usual in the production of material plates and known steps of arranging the chips and the pressing in
Einzelnen durchgeführt werden. Somit ist hier jedes mögliche Schicht- und Pressverfahren der verleimten Späne denkbar, das üblicherweise bei der Herstellung von Werkstoffplatten aus Span- oder Fasermaterial eingesetzt wird. Individual be carried out. Thus, any possible layering and pressing process of the glued chips is conceivable, which is usually used in the production of material plates made of chip or fiber material.

Claims

Ansprüche claims
1. Verfahren zur Herstellung von Werkstoffplatten aus Span- oder Fasermaterial, insbesondere von Spanplatten, LDF-Platte, MDF-1. Process for the production of material plates from chip or fiber material, in particular chipboard, LDF board, MDF
Platten, HDF-Platten und OSB-Platten, umfassend die Schritte:Panels, HDF panels and OSB panels, comprising the steps:
Bereitstellen (S2) von getrocknetem Span- oder Fasermaterial, Plasmabehandeln (S3a, S3b) des getrockneten Span- oder Fasermaterials, Beleimen (S4a, S4b) des plasmabehandelten Span- oderProviding (S2) dried chip or fiber material, plasma treatment (S3a, S3b) of the dried chip or fiber material, gluing (S4a, S4b) of the plasma-treated chip or fiber material
Fasermaterials undFiber material and
Verpressen (S5) des beleimten Span- oder Fasermaterials zu Werkstoffplatten.Pressing (S5) the glued chip or fiber material to material plates.
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass beim Beleimen (S4a, S4b) pro Kubikmeter Werkstoffplatte nicht mehr als 75kg, vorzugsweise nicht mehr als 67kg, flüssiger Leim, bzw. nicht mehr als 50kg, vorzugsweise nicht mehr als 45kg, fester Leim verwendet wird.2. The method according to claim 1, characterized in that during gluing (S4a, S4b) per cubic meter of material plate not more than 75kg, preferably not more than 67kg, liquid glue, or not more than 50kg, preferably not more than 45kg, solid glue is used.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das bei der Plasmabehandlung (S3a, S3b) verwendete Prozessgas als Hauptkomponente Sauerstoff oder/und Stickstoff oder/und Argon umfasst.3. The method according to claim 1 or 2, characterized in that the process gas used in the plasma treatment (S3a, S3b) as the main component oxygen or / and nitrogen and / or argon comprises.
4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass das bei der Plasmabehandlung (S3a, S3b) verwendete Prozessgas als Zusatzkomponente Fluor umfasst.4. The method according to any one of claims 1 to 3, characterized in that the process gas used in the plasma treatment (S3a, S3b) comprises fluorine as an additional component.
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass in einem diskontinuierlichen Verfahren jeweils eine vorbestimmte Menge von Span- oder Fasermaterial in einem Niederdruckplasma behandelt wird. 5. The method according to any one of claims 1 to 4, characterized in that in a batch process in each case a predetermined amount of chip or fiber material is treated in a low-pressure plasma.
6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass die Dauer der Plasmabehandlung (S3a, S3b) des Span- oder Fasermaterials 1 bis 10 Minuten beträgt.6. The method according to claim 5, characterized in that the duration of the plasma treatment (S3a, S3b) of the chip or fiber material is 1 to 10 minutes.
7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass das Span- oder Fasermaterial vor der Plasmabehandlung (S3a, S3b) in mehreren Gruppen vorliegt, die sich je nach Größe der einzelnen Späne und Fasern unterscheiden, und dass die unterschiedlichen Gruppen jeweils separat plasmabehandelt7. The method according to any one of claims 1 to 6, characterized in that the chip or fiber material before the plasma treatment (S3a, S3b) is present in several groups, which differ depending on the size of the individual chips and fibers, and that the different groups each separately plasma treated
(S3a, S3b) und anschließend beleimt (S4a, S4b) werden, bevor sie zum Verpressen (S5) zu einer Werkstoffplatte wieder zusammengeführt werden. 5 8. Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass zwischen dem Schritt des Plasmabehandeins (S3a, S3b) und dem Schritt des Beleimens (S4a, S4b) des Span- oder Fasermaterials nicht mehr als 30 Minuten, vorzugsweise nicht mehr als 1 Minuten, verstreichen. 0(S3a, S3b) and then glued (S4a, S4b) before they are brought together again for pressing (S5) to a material plate. 5. The method according to any one of claims 1 to 7, characterized in that between the step of the plasma treatment (S3a, S3b) and the step of gluing (S4a, S4b) of the chip or fiber material not more than 30 minutes, preferably not more than 1 minute, elapse. 0
9. Verfahren nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass das Span- oder Fasermaterial Holzspäne oder/und Holzfasern oder/und Hanffasern oder/und Strohfasern umfasst. 59. The method according to any one of claims 1 to 8, characterized in that the chip or fiber material comprises wood chips and / or wood fibers and / or hemp fibers and / or straw fibers. 5
10. Verfahren nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass beim Beleimen (S4a, S4b) Harnstoff- Formaldehyd-Harz oder Hamstoff-Melamin-Formaldehyd-Harz oder Phenol-Formaldehydharz, vorzugsweise mit einem Feststoffgehalt vono 40 bis 80%, verwendet wird. 10. The method according to any one of claims 1 to 9, characterized in that during gluing (S4a, S4b) urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably having a solids content vono 40 to 80%, is used.
11. Werkstoffplatte aus Span- oder Fasermaterial, insbesondere Spanplatte, LDF-Platte, MDF-Platte, HDF-Platte und OSB-Platte, beispielsweise hergestellt nach dem Verfahren gemäß einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass sie pro KubikmeterWerkstoffplatte nicht mehr als 50kg festen Leim umfasst.11. Material board made of chip or fiber material, in particular chipboard, LDF board, MDF board, HDF board and OSB board, for example produced by the method according to one of claims 1 to 10, characterized in that it no longer per cubic meter of material includes as a 50kg solid glue.
12. Werkstoffplatte nach Anspruch 11 , dadurch gekennzeichnet, dass sie pro KubikmeterWerkstoffplatte nicht mehr als 45kg festen Leim umfasst.12. Material board according to claim 11, characterized in that it comprises per cubic meter of material not more than 45kg solid glue.
13. Werkstoffplatte nach Anspruch 11 oder 12, dadurch gekennzeichnet, dass das Span- oder Fasermaterial Holzspäne oder/und Holzfasern oder/und Hanffasern oder/und Strohfasern umfasst.13. Material board according to claim 11 or 12, characterized in that the chip or fiber material comprises wood chips and / or wood fibers and / or hemp fibers and / or straw fibers.
14. Werkstoffplatte nach einem der Ansprüche 10 bis 13, dadurch gekennzeichnet, dass der Leim (S4a, S4b) Harnstoff- Formaldehyd-Harz oder Hamstoff-Melamin-Formaldehyd-Harz oder Phenol-Formaldehydharz, vorzugsweise mit einem Feststoffgehalt von14. Material board according to one of claims 10 to 13, characterized in that the glue (S4a, S4b) urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably having a solids content of
40 bis 80%, beinhaltet. 40 to 80%, includes.
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CN101505934A (en) 2009-08-12
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SI2040895T1 (en) 2013-08-30
JP2009543713A (en) 2009-12-10
AU2007276402A1 (en) 2008-01-24
MX2009000605A (en) 2009-02-12
EP2040895B1 (en) 2013-05-22
US20090317632A1 (en) 2009-12-24
UA93560C2 (en) 2011-02-25
WO2008009404A1 (en) 2008-01-24
ES2410165T3 (en) 2013-07-01
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PL2040895T3 (en) 2013-10-31

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