EP2040895B1 - Method for the production of material plates - Google Patents

Method for the production of material plates Download PDF

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Publication number
EP2040895B1
EP2040895B1 EP20070786098 EP07786098A EP2040895B1 EP 2040895 B1 EP2040895 B1 EP 2040895B1 EP 20070786098 EP20070786098 EP 20070786098 EP 07786098 A EP07786098 A EP 07786098A EP 2040895 B1 EP2040895 B1 EP 2040895B1
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Prior art keywords
chip
plasma
fibrous material
plasma treatment
boards
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German (de)
French (fr)
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EP2040895A1 (en
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Herbert Ruhdorfer
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Interglarion Ltd
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Interglarion Ltd
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Priority to SI200731265T priority Critical patent/SI2040895T1/en
Priority to PL07786098T priority patent/PL2040895T3/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/27—Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/3188—Next to cellulosic
    • Y10T428/31895—Paper or wood

Definitions

  • the present invention relates to a method according to the preamble of claim 1 for the production of material sheets of particle board or fiber material, in particular chipboard, LDF plates (l ow d ensity f iberboard - low-density fibreboard), MDF (m edium d ensity f iberboard - medium density fibreboard), HDF board (h igh d ensity f iberboard - high density fiberboard), and OSB (o riented s trand b Oard - Particle board of directionally oriented scattered chips).
  • LDF plates la ow d ensity f iberboard - low-density fibreboard
  • MDF m d ensity f iberboard - medium density fibreboard
  • HDF board h igh d ensity f iberboard - high density fiberboard
  • OSB o riented s trand b Oard - Particle board of directionally
  • the wood chips provided, for example, by cutting wood are first dried and then sorted by chip size, for example into two classes, namely the larger middle-layer chips and the smaller facing chips, and either stored separately or fed directly to further processing , Usually, the chips are then glued and sprinkled on a conveyor belt, that the outer layer chips and the middle layer chips are arranged in the middle of the non-pressed chip bed, which is finally pressed in a continuous process by means of a belt press to plates.
  • the dried chip or fiber material is subjected to the additional step of a plasma treatment prior to the gluing.
  • a plasma treatment a process gas is ionized in the space between two electrodes subjected to high voltage.
  • the dried chips or fibers are exposed to the process gas plasma thus formed, whether it is trickled through the plasma or that they are moved through the plasma in bulk, for example on a conveyor line.
  • the ions penetrate into the surface of the chips or fibers, for example up to 10 ⁇ m deep.
  • the resulting physical and chemical changes to the chip or fiber surface have not yet been clarified.
  • it is a scientifically proven fact that such treatment will result in improved surface adhesion such that, as desired, a coated size coat will be applied to such treated surface Chip or fiber surface adheres better.
  • JP-A-10-305 410 the state of the art should also be referred to JP-A-11-042611 directed.
  • the object of the invention is to develop the generic method such that the swelling of the chips or fibers is reduced by exposure to moisture.
  • the process gas used in the plasma treatment comprises fluorine as an additional component.
  • fluorine as an additional component.
  • the swelling behavior of the chips or fibers under the action of moisture can be advantageously influenced by the addition of fluorine to the process gas, ie the swelling of the chips or fibers can be reduced under the influence of moisture.
  • paraffin emulsion is added in the manufacture of chipboard to reduce undesirable swelling.
  • plasma treatment with a process gas containing fluorine the use of paraffin emulsion can be completely or at least partially dispensed with. This provides a further cost savings.
  • liquid glue needs to be used, which after curing a quantity of not more than 50kg, preferably not more than 45kg, solid glue equivalent. This is equal to more than 15%, preferably more than 25%, glue saving compared to conventional methods. In a preferred embodiment of the present invention, even a glue saving of about 30% is achieved, which corresponds to the use of 63kg liquid glue or about 42kg solid glue. By such a high glue saving, the manufacturing costs of the material plates produced by the method according to the invention can be greatly reduced.
  • the step according to the invention of the plasma treatment of the dried chip or fiber material can be realized, for example, by exposing in each case a predetermined amount of chip or fiber material in a low-pressure chamber to a low-pressure plasma in a batchwise process. This can ensure that the chip or fiber material is uniform, i. is plasma-treated as possible on all surfaces of all individual chips and fibers, so that then the surface properties over the entire chip or fiber material are homogeneous. Alternatively, however, one may also pass it in a continuous process past a nozzle of an atmospheric pressure plasma generator.
  • the process gas used in the plasma treatment may comprise as main component oxygen or / and nitrogen and / or argon.
  • air can be used as the process gas, whereby a complex evacuation of the low pressure chamber can be prevented before introducing the process gas, and the pressure in the low pressure chamber after loading only to the pressure required for the plasma treatment (in of the order of 0.5 to 5 mbar) needs to be reduced.
  • the duration of the plasma treatment of the chip or fiber material may preferably be 1 to 10 minutes.
  • the chip or fiber material be present in a plurality of groups before the plasma treatment, which differ depending on the size of the individual chips and fibers. Furthermore, different groups can each be plasma-treated separately and then glued before they are recombined for pressing into a material plate. In this way, it can be ensured, for example, in the production of a chipboard, that optimum operating parameters can be used for the plasma treatment both for the smaller cover shavings and for the larger middle shavings, so that the achievable glue saving can be maximized.
  • the step of plasma treatment and the step of gluing the chip or fiber material Preferably, between the step of plasma treatment and the step of gluing the chip or fiber material not more than 30 minutes, more preferably not more than 1 minutes, to ensure that the improved by the plasma treatment surface properties of the chip or fiber material are not deteriorated by too long storage times again.
  • the chip or fiber material used may comprise wood chips and / or wood fibers and / or hemp fibers and / or straw fibers, so that not only different types of wood material boards, such as chipboard, LDF boards, MDF boards, HDF boards and OSB -Plates, but also material plates containing hemp fibers and / or straw fibers can be produced.
  • urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin preferably having a solids content of 40 to 80%, can be used.
  • a material plate made of chip or fiber material, in particular chipboard, LDF plate, MDF board, HDF board and OSB board, produced by the method according to the invention may comprise not more than 50 kg, preferably not more than 45 kg, solid glue per cubic meter of material.
  • the chip or fiber material wood chips and / or wood fibers and / or hemp fibers and / or straw fibers include.
  • the sizing agent may include urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably at a solids content of 40 to 80%.
  • step S1 log wood, wood chips, wood residues and the like of a conventional cutting machine supplied.
  • step S2 the supplied wood is then processed into chips with the aid of the cutting installation, these chips are dried in a conventional dryer installation, for example in a drum dryer, to a residual moisture content of about 2% and then sieved, so that smaller chips, which are later used as cover shavings serve the chipboard, can be separated from larger chips, which will later serve as middle-layer chips of chipboard.
  • the method according to the invention does not differ from conventional production methods of material plates made of chip or fiber material, and it is also completely irrelevant to the method according to the invention how precisely the provision of dried chip or fiber material takes place. So it is also conceivable that the cutting and drying does not happen directly on site, but already dried chip or fiber material is delivered from a warehouse.
  • step S3a the top layer chips are introduced into a low-pressure chamber, which is then pumped off to a working pressure of about 0.5 to 5 mbar.
  • a plasma is ignited in the low-pressure chamber, in which case the air remaining in the low-pressure chamber is used as the process gas.
  • process gas comprises fluorine as an additional component.
  • step S3b the middle-layer chips are likewise plasma-treated analogously to step S3a.
  • the separate plasma treatment of the cover shavings and the middle layer shavings has the advantage that on the one hand process parameters, such as working pressure, treatment time and composition and / or concentration of the process gas, can be tailored to the particular chip type, and on the other hand different additives the respective process gas individually for each type of chip can be added in suitable composition and concentration.
  • step S3a or step S3b the cover layer chips and the middle layer chips are glued separately in step S4a or step S4b, respectively.
  • a gluing agent urea-formaldehyde resin, urea-melamine-formaldehyde resin or phenol-formaldehyde resin is used here, as is usual for conventional chipboard production methods.
  • the chips can be advantageously influenced by suitable additives in the process gas in the plasma treatment.
  • the addition of fluorine causes an advantageous influence on the swelling behavior of the chips, so that the usual addition of paraffin emulsion in the production of chipboard to reduce the swelling behavior of the finished plate can be completely or partially omitted, and thus a further cost savings can be achieved.
  • step S5 the topcoat chips and the middle-layer chips are scattered together on a conveyor belt such that the surfaces of the formed layer consist of non-pressed, glued chips of topcoat chips, and middle-layer chips are disposed in the center of that layer.
  • the chips are finally pressed, for example, in a conventional belt press and heated to form a chipboard.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Reinforced Plastic Materials (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Description

Die vorliegende Erfindung betrifft ein Verfahren gemäß dem Oberbegriff von Anspruch 1 zur Herstellung von Werkstoffplatten aus Span- oder Fasermaterial, insbesondere von Spanplatten, LDF-Platten (low density fiberboard - niederdichte Faserplatten), MDF-Platten (medium density fiberboard - mitteldichte Faserplatten), HDF-Platten (high density fiberboard - hochdichte Faserplatten) und OSB-Platten (oriented strandboard - Spanplatten aus richtungsorientiert gestreuten Spänen).The present invention relates to a method according to the preamble of claim 1 for the production of material sheets of particle board or fiber material, in particular chipboard, LDF plates (l ow d ensity f iberboard - low-density fibreboard), MDF (m edium d ensity f iberboard - medium density fibreboard), HDF board (h igh d ensity f iberboard - high density fiberboard), and OSB (o riented s trand b Oard - Particle board of directionally oriented scattered chips).

Bei einem bekannten Verfahren zur Herstellung von Spanplatten, werden die beispielsweise durch Zerspanen von Holz bereitgestellten Holzspäne zunächst getrocknet und anschließend nach Spangröße sortiert, beispielsweise in zwei Klassen, nämlich die größeren Mittelschichtspäne und die kleineren Deckschichtspäne, und entweder getrennt gelagert oder unmittelbar der weiteren Verarbeitung zugeführt. Üblicherweise werden die Späne dann beleimt und so auf ein Förderband gestreut, dass die Deckschichtspäne außen und die Mittelschichtspäne in der Mitte des ungepressten Spanbetts angeordnet sind, welches schließlich in einem kontinuierlichen Prozess mittels einer Bandpresse zu Platten verpresst wird.In a known method for producing chipboard, the wood chips provided, for example, by cutting wood are first dried and then sorted by chip size, for example into two classes, namely the larger middle-layer chips and the smaller facing chips, and either stored separately or fed directly to further processing , Usually, the chips are then glued and sprinkled on a conveyor belt, that the outer layer chips and the middle layer chips are arranged in the middle of the non-pressed chip bed, which is finally pressed in a continuous process by means of a belt press to plates.

Auch bei der Herstellung von Faserplatten, beispielsweise MDF- oder HDF-Platten, wird in analoger Weise vorgegangen, wobei allerdings keine Unterteilung in Deckschicht- und Mittelschichtspäne vorgenommen wird, wenn auch die Fasern üblicherweise von einer Mischung aus vorbestimmten Anteilen vorbestimmter Fasertypen gebildet werden.Also in the production of fiberboard, such as MDF or HDF plates, the procedure is analogous, although no subdivision into cover layer and middle layer chips is made, although the fibers are usually formed from a mixture of predetermined proportions of predetermined fiber types.

Herkömmlicherweise wird zur Erzielung der gewünschten mechanischen Festigkeitseigenschaften der Werkstoffplatte beispielsweise bei Spanplatten pro Kubikmeter Volumen der Werkstoffplatte etwa 90 kg flüssiger Leim benötigt, was nach dem Aushärten etwa 60 kg festem Leim entspricht. Derartige Leimmengen sind ein wichtiger Kostenfaktor bei der Herstellung von Werkstoffplatten.
Ein Verfahren mit den Merkmalen des Oberbegriffs des Anspruchs 1 ist aus der JP-A-08-174 517 bekannt.Conventionally, to achieve the desired mechanical strength properties of the material plate, for example, in chipboard per cubic meter volume of the material plate about 90 kg of liquid glue needed, which corresponds to about 60 kg of solid glue after curing. Such glue levels are an important cost factor in the production of material plates.
A method having the features of the preamble of claim 1 is known from JP-A-08-174 517 known.

Bei dem erfindungsgemäßen und auch bei dem aus der JP-A-08-174 517 bekannten Verfahren wird das getrocknete Span- oder Fasermaterial vor dem Beleimen dem zusätzlichen Schritt einer Plasmabehandlung unterzogen. Bei einer solchen Plasmabehandlung wird ein Prozessgas im Zwischenraum zwischen zwei mit Hochspannung beaufschlagten Elektroden ionisiert. Die getrockneten Späne oder Fasern werden dem so gebildeten Prozessgasplasma ausgesetzt, sei es dass man sie durch das Plasma rieseln lässt oder dass man sie in loser Schüttung, bspw. auf einer Förderstrecke, durch das Plasma hindurchbewegt. In jedem Fall dringen die Ionen in Abhängigkeit von ihrer kinetischen Energie in die Oberfläche der Späne oder Fasern ein, und zwar beispielsweise bis zu 10 µm tief. Die dadurch bewirkten physikalischen und chemischen Veränderungen an der Span- oder Faseroberfläche sind noch nicht geklärt. Es ist jedoch eine wissenschaftlich gesicherte Tatsache, dass eine solche Behandlung eine verbesserte Adhäsion der Oberfläche bewirkt, so dass, wie gewünscht, eine aufgetragene Leimschicht an einer derart behandelten Span- oder Faseroberfläche besser haftet.In the invention and also in the from JP-A-08-174 517 In known processes, the dried chip or fiber material is subjected to the additional step of a plasma treatment prior to the gluing. In such a plasma treatment, a process gas is ionized in the space between two electrodes subjected to high voltage. The dried chips or fibers are exposed to the process gas plasma thus formed, whether it is trickled through the plasma or that they are moved through the plasma in bulk, for example on a conveyor line. In any case, depending on their kinetic energy, the ions penetrate into the surface of the chips or fibers, for example up to 10 μm deep. The resulting physical and chemical changes to the chip or fiber surface have not yet been clarified. However, it is a scientifically proven fact that such treatment will result in improved surface adhesion such that, as desired, a coated size coat will be applied to such treated surface Chip or fiber surface adheres better.

Der Vollständigkeit halber sei zum Stand der Technik ferner auf die JP-A-10-305 410 und die JP-A-11-042611 verwiesen.For the sake of completeness, the state of the art should also be referred to JP-A-10-305 410 and the JP-A-11-042611 directed.

Aufgabe der Erfindung ist es, das gattungsgemäße Verfahren derart weiterzubilden, dass das Aufquellen der Späne oder Fasern unter Feuchteeinwirkung reduziert wird.The object of the invention is to develop the generic method such that the swelling of the chips or fibers is reduced by exposure to moisture.

Diese Aufgabe wird durch das im Anspruch 1 angegebene Verfahren gelöst.This object is achieved by the method specified in claim 1.

Danach umfasst das bei der Plasmabehandlung verwendete Prozessgas als Zusatzkomponente Fluor. Erfindungsgemäß wurde nämlich festgestellt, dass durch die Zugabe von Fluor zum Prozessgas das Quellverhalten der Späne oder Fasern unter Feuchteeinwirkung vorteilhaft beeinflusst werden kann, d.h. das Aufquellen der Späne oder Fasern unter Feuchteeinwirkung reduziert werden kann. Dies führt zu einer deutlich erhöhten Stabilität der so hergestellten Werkstoffplatten gegenüber Feuchteeinwirkung. Herkömmlich wird bei der Herstellung von Spanplatten zur Verringerung des unerwünschten Aufquellens eine Paraffinemulsion zugegeben. Durch die Plasmabehandlung mit einem Fluor enthaltenden Prozessgas kann auf den Einsatz von Paraffinemulsion ganz oder zumindest teilweise verzichtet werden. Dies erbringt eine weitere Kostenersparnis.Thereafter, the process gas used in the plasma treatment comprises fluorine as an additional component. In accordance with the invention, it has been found that the swelling behavior of the chips or fibers under the action of moisture can be advantageously influenced by the addition of fluorine to the process gas, ie the swelling of the chips or fibers can be reduced under the influence of moisture. This leads to a significantly increased stability of the material plates produced in this way to the effect of moisture. Conventionally, paraffin emulsion is added in the manufacture of chipboard to reduce undesirable swelling. By plasma treatment with a process gas containing fluorine, the use of paraffin emulsion can be completely or at least partially dispensed with. This provides a further cost savings.

In Weiterbildung der Erfindung ist vorgesehen, dass pro Kubikmeter Werkstoffplatte nicht mehr als 75kg, vorzugsweise sogar nicht mehr als 67kg, flüssiger Leim verwendet zu werden braucht, was nach dem Aushärten einer Menge von nicht mehr als 50kg, vorzugsweise nicht mehr als 45kg, festem Leim entspricht. Dies kommt im Vergleich mit herkömmlichen Verfahren einer Leimeinsparung von mehr als 15%, vorzugsweise von mehr als 25%, gleich. Bei einer bevorzugten Ausführungsform der vorliegenden Erfindung wird sogar eine Leimeinsparung von etwa 30% erreicht, was der Verwendung von 63kg flüssigem Leim bzw. etwa 42kg festem Leim entspricht. Durch eine derartig hohe Leimeinsparung können die Herstellungskosten der mit dem erfindungsgemäßen Verfahren hergestellten Werkstoffplatten stark verringert werden.In a further development of the invention provides that per cubic meter of material plate not more than 75kg, preferably even not more than 67kg, liquid glue needs to be used, which after curing a quantity of not more than 50kg, preferably not more than 45kg, solid glue equivalent. This is equal to more than 15%, preferably more than 25%, glue saving compared to conventional methods. In a preferred embodiment of the present invention, even a glue saving of about 30% is achieved, which corresponds to the use of 63kg liquid glue or about 42kg solid glue. By such a high glue saving, the manufacturing costs of the material plates produced by the method according to the invention can be greatly reduced.

Der erfindungsgemäße Schritt der Plasmabehandlung des getrockneten Span- oder Fasermaterials kann beispielsweise dadurch verwirklicht werden, dass man in einem diskontinuierlichen Verfahren jeweils eine vorbestimmte Menge von Span- oder Fasermaterial in einer Niederdruckkammer einem Niederdruckplasma aussetzt. Hierdurch kann sichergestellt werden, dass das Span- oder Fasermaterial gleichmäßig, d.h. möglichst an allen Oberflächen sämtlicher einzelner Späne und Fasern, plasmabehandelt wird, so dass anschließend die Oberflächeneigenschaften über das gesamte Span- oder Fasermaterial homogen sind. Alternativ kann man es aber auch in einem kontinuierlichen Verfahren an einer Düse einer Vorrichtung für unter atmosphärischem Druck stehendes Plasma vorbeibewegen.The step according to the invention of the plasma treatment of the dried chip or fiber material can be realized, for example, by exposing in each case a predetermined amount of chip or fiber material in a low-pressure chamber to a low-pressure plasma in a batchwise process. This can ensure that the chip or fiber material is uniform, i. is plasma-treated as possible on all surfaces of all individual chips and fibers, so that then the surface properties over the entire chip or fiber material are homogeneous. Alternatively, however, one may also pass it in a continuous process past a nozzle of an atmospheric pressure plasma generator.

Bei beiden Verfahrensalternativen kann das bei der Plasmabehandlung verwendete Prozessgas als Hauptkomponente Sauerstoff oder/und Stickstoff oder/und Argon umfassen. Bei der Verwendung eines Niederdruckplasmas zur Plasmabehandlung kann so beispielsweise Luft als Prozessgas verwendet werden, wodurch eine aufwendige Evakuierung der Niederdruckkammer vor dem Einleiten des Prozessgases verhindert werden kann, und der Druck in der Niederdruckkammer nach dem Beladen lediglich auf den für die Plasmabehandlung erforderlichen Druck (in der Größenordnung von 0,5 bis 5 mbar) verringert zu werden braucht.In both alternative methods, the process gas used in the plasma treatment may comprise as main component oxygen or / and nitrogen and / or argon. When using a low-pressure plasma for plasma treatment, for example, air can be used as the process gas, whereby a complex evacuation of the low pressure chamber can be prevented before introducing the process gas, and the pressure in the low pressure chamber after loading only to the pressure required for the plasma treatment (in of the order of 0.5 to 5 mbar) needs to be reduced.

Die Dauer der Plasmabehandlung des Span- oder Fasermaterials kann vorzugsweise 1 bis 10 Minuten betragen. Dadurch können bei einem möglichst hohen Durchsatz an Span- oder Fasermaterial ausreichend gute Oberflächeneigenschaften der Späne oder Fasern erzielt werden.The duration of the plasma treatment of the chip or fiber material may preferably be 1 to 10 minutes. As a result, with the highest possible throughput of chip or fiber material, sufficiently good surface properties of the chips or fibers can be achieved.

In Weiterbildung der Erfindung wird vorgeschlagen, dass das Span- oder Fasermaterial vor der Plasmabehandlung in mehreren Gruppen vorliegt, die sich je nach Größe der einzelnen Späne und Fasern unterscheiden. Ferner können unterschiedlichen Gruppen jeweils separat plasmabehandelt und anschließend beleimt werden, bevor sie zum Verpressen zu einer Werkstoffplatte wieder zusammengeführt werden. Hierdurch kann beispielsweise bei der Herstellung einer Spanplatte sichergestellt werden, dass sowohl für die kleineren Deckschichtspäne, als auch für die größeren Mittelschichtspäne jeweils optimale Betriebsparameter bei der Plasmabehandlung verwendet werden können, so dass die erzielbare Leimeinsparung maximiert werden kann.In a development of the invention, it is proposed that the chip or fiber material be present in a plurality of groups before the plasma treatment, which differ depending on the size of the individual chips and fibers. Furthermore, different groups can each be plasma-treated separately and then glued before they are recombined for pressing into a material plate. In this way, it can be ensured, for example, in the production of a chipboard, that optimum operating parameters can be used for the plasma treatment both for the smaller cover shavings and for the larger middle shavings, so that the achievable glue saving can be maximized.

Vorzugsweise können zwischen dem Schritt des Plasmabehandelns und dem Schritt des Beleimens des Span- oder Fasermaterials nicht mehr als 30 Minuten, besonders bevorzugt nicht mehr als 1 Minuten, verstreichen, um sicherzustellen, dass die durch die Plasmabehandlung verbesserten Oberflächeneigenschaften des Span- oder Fasermaterials nicht durch zu lange Lagerzeiten wieder verschlechtert werden.Preferably, between the step of plasma treatment and the step of gluing the chip or fiber material not more than 30 minutes, more preferably not more than 1 minutes, to ensure that the improved by the plasma treatment surface properties of the chip or fiber material are not deteriorated by too long storage times again.

Das eingesetzte Span- oder Fasermaterial kann Holzspäne oder/und Holzfasern oder/und Hanffasern oder/und Strohfasem umfassen, so dass nicht nur unterschiedliche Typen von Holz-Werkstoffplatten, wie beispielsweise Spanplatten, LDF-Platten, MDF-Platten, HDF-Platten und OSB-Platten, sondern auch Werkstoffplatten, welche Hanffasern oder/und Strohfasem enthalten, hergestellt werden können.The chip or fiber material used may comprise wood chips and / or wood fibers and / or hemp fibers and / or straw fibers, so that not only different types of wood material boards, such as chipboard, LDF boards, MDF boards, HDF boards and OSB -Plates, but also material plates containing hemp fibers and / or straw fibers can be produced.

Zum Beleimen kann beispielsweise Harnstoff-Formaldehyd-Harz oder Harnstoff-Melamin-Formaldehyd-Harz oder Phenol-Formaldehydharz, vorzugsweise mit einem Feststoffgehalt von 40 bis 80%, verwendet werden.For gluing, for example, urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably having a solids content of 40 to 80%, can be used.

In einer Weiterbildung der vorliegenden Erfindung kann weiterhin vorgesehen sein, dass dem Prozessgas bei der Plasmabehandlung außer Fluor auch noch andere Stoffe zugesetzt werden können, beispielsweise um Werkstoffplatten mit Brandschutzeigenschaften oder/und mit antibakteriellen Eigenschaften oder/und mit einer verringerten Anfälligkeit für eine Schimmelpilz-Bildung zu erzielen.In a development of the present invention, it can furthermore be provided that other substances besides the fluorine can also be added to the process gas, for example material panels with fire protection properties and / or with antibacterial properties and / or with a reduced susceptibility to mold formation to achieve.

Eine Werkstoffplatte aus Span- oder Fasermaterial, insbesondere Spanplatte, LDF-Platte, MDF-Platte, HDF-Platte und OSB-Platte, hergestellt nach dem erfindungsgemäßen Verfahren kann pro KubikmeterWerkstoffplatte nicht mehr als 50kg, vorzugsweise nicht mehr als 45kg, festen Leim umfassen. Dabei kann das Span- oder Fasermaterial Holzspäne oder/und Holzfasern oder/und Hanffasern oder/und Strohfasern umfassen. Ferner kann der Leim Hamstoff-Formaldehyd-Harz oder Hamstoff-Melamin-Formaldehyd-Harz oder Phenol-Formaldehydharz, vorzugsweise mit einem Feststoffgehalt von 40 bis 80%, beinhalten.A material plate made of chip or fiber material, in particular chipboard, LDF plate, MDF board, HDF board and OSB board, produced by the method according to the invention may comprise not more than 50 kg, preferably not more than 45 kg, solid glue per cubic meter of material. In this case, the chip or fiber material wood chips and / or wood fibers and / or hemp fibers and / or straw fibers include. Further, the sizing agent may include urea-formaldehyde resin or urea-melamine-formaldehyde resin or phenol-formaldehyde resin, preferably at a solids content of 40 to 80%.

Im Folgenden wird eine bevorzugte Ausführungsform der vorliegenden Erfindung anhand der beigefügten Zeichnung rein exemplarisch beschrieben. Es zeigt:

Fig. 1
ein Blockdiagramm zur schematischen Erläuterung eines erfindungsgemäßen Verfahrens zur Herstellung einer Spanplatte.
Hereinafter, a preferred embodiment of the present invention will be described purely by way of example with reference to the accompanying drawings. It shows:
Fig. 1
a block diagram for schematically explaining a method according to the invention for producing a chipboard.

In der in Fig. 1 schematisch dargestellten bevorzugten Ausführungsform der vorliegenden Erfindung wird zunächst in Schritt S1 Rundholz, Hackgut, Holzreste und dergleichen einer herkömmlichen Zerspanungsanlage zugeführt.In the in Fig. 1 schematically illustrated preferred embodiment of the present invention, first in step S1 log wood, wood chips, wood residues and the like of a conventional cutting machine supplied.

In Schritt S2 wird dann das zugeführte Holz mit Hilfe der Zerspanungsanlage zu Spänen verarbeitet, diese Späne in einer herkömmlichen Trockneranlage, beispielsweise in einem Trommeltrockner, bis zu einer Restfeuchte von etwa 2% getrocknet und anschließend gesiebt, so dass kleinere Späne, welche später als Deckschichtspäne der Spanplatte dienen werden, von größeren Spänen, welche später als Mittelschichtspäne der Spanplatte dienen werden, getrennt werden können.In step S2, the supplied wood is then processed into chips with the aid of the cutting installation, these chips are dried in a conventional dryer installation, for example in a drum dryer, to a residual moisture content of about 2% and then sieved, so that smaller chips, which are later used as cover shavings serve the chipboard, can be separated from larger chips, which will later serve as middle-layer chips of chipboard.

In diesen beiden Schritten unterscheidet sich das erfindungsgemäße Verfahren nicht von herkömmlichen Herstellungsverfahren von Werkstoffplatten aus Span- oder Fasermaterial, und es ist für das erfindungsgemäße Verfahren auch völlig unerheblich, wie genau die Bereitstellung von getrocknetem Span- oder Fasermaterial erfolgt. So ist auch denkbar, dass die Zerspanung und Trocknung nicht unmittelbar vor Ort passiert, sondern bereits getrocknetes Span- oder Fasermaterial aus einem Lager angeliefert wird.In these two steps, the method according to the invention does not differ from conventional production methods of material plates made of chip or fiber material, and it is also completely irrelevant to the method according to the invention how precisely the provision of dried chip or fiber material takes place. So it is also conceivable that the cutting and drying does not happen directly on site, but already dried chip or fiber material is delivered from a warehouse.

In Schritt S3a werden die Deckschichtspäne in eine Niederdruckkammer eingebracht, welche dann auf einen Arbeitsdruck von etwa 0,5 bis 5 mbar abgepumpt wird. Sobald der Arbeitsdruck erreicht ist, wird in der Niederdruckkammer ein Plasma gezündet, wobei in diesem Fall die in der Niederdruckkammer verbleibende Luft als Prozessgas verwendet wird. Es ist jedoch auch möglich, andere Prozessgase, wie beispielsweise Argon, zu verwenden, oder/und dem jeweils verwendeten Prozessgas einen oder mehrere Zusatzstoffe zuzufügen. Zumindest umfasst das Prozessgas aber als Zusatzkomponente Fluor. Die Plasmabehandlung, während der die Deckschichtspäne dem Plasma ausgesetzt sind, dauert etwa zwischen 1 und 10 Minuten.In step S3a, the top layer chips are introduced into a low-pressure chamber, which is then pumped off to a working pressure of about 0.5 to 5 mbar. As soon as the working pressure has been reached, a plasma is ignited in the low-pressure chamber, in which case the air remaining in the low-pressure chamber is used as the process gas. It is However, it is also possible to use other process gases, such as argon, or / and add one or more additives to the particular process gas used. At least, however, the process gas comprises fluorine as an additional component. The plasma treatment, during which the surface layer chips are exposed to the plasma, takes approximately between 1 and 10 minutes.

In Schritt S3b werden die Mittelschichtspäne analog zu Schritt S3a ebenfalls plasmabehandelt. Die getrennte Plasmabehandlung der Deckschichtspäne und der Mittelschichtspäne hat hierbei den Vorteil, dass einerseits Prozessparameter, wie beispielsweise Arbeitsdruck, Behandlungsdauer und Zusammensetzung und/oder Konzentration des Prozessgases, auf den jeweiligen Spänetyp individuell abgestimmt werden können, und dass andererseits unterschiedliche Zusatzstoffe dem jeweiligen Prozessgas individuell für jeden Spänetyp in geeigneter Zusammensetzung und Konzentration zugefügt werden können.In step S3b, the middle-layer chips are likewise plasma-treated analogously to step S3a. The separate plasma treatment of the cover shavings and the middle layer shavings has the advantage that on the one hand process parameters, such as working pressure, treatment time and composition and / or concentration of the process gas, can be tailored to the particular chip type, and on the other hand different additives the respective process gas individually for each type of chip can be added in suitable composition and concentration.

Anschließend an Schritt S3a bzw. Schritt S3b werden in Schritt S4a bzw. Schritt S4b die Deckschichtspäne und die Mittelschichtspäne jeweils getrennt beleimt. Als Verleimungsmittel wird hierbei, wie auch bei herkömmlichen Herstellungsverfahren für Spanplatten üblich, Hamstoff-Formaldehyd-Harz, Hamstoff-Melamin-Formaldehyd-Harz oder Phenol-Formaldehyd-Harz verwendet.Subsequent to step S3a or step S3b, the cover layer chips and the middle layer chips are glued separately in step S4a or step S4b, respectively. As a gluing agent, urea-formaldehyde resin, urea-melamine-formaldehyde resin or phenol-formaldehyde resin is used here, as is usual for conventional chipboard production methods.

Hierbei kann, da durch die erfindungsgemäße Plasmabehandlung der Späne die Benetzbarkeit der Span-Oberflächen verbessert wurde, etwa 30% weniger Verleimungsmittel als bei herkömmlichen Herstellungsverfahren für Spanplatten verwendet werden, ohne dass hierunter die mechanischen Festigkeitseigenschaften der fertiggestellten Spanplatte leiden würden. Während bei herkömmlichen Verfahren etwa 90kg flüssiges Verleimungsmittel pro Kubikmeter Spanplatte benötigt wird, um Spanplatten mit den von den einschlägigen Industrienormen geforderten mechanischen Festigkeitseigenschaften herzustellen, kommt das erfindungsgemäße Verfahren idealerweise mit nur etwa 63kg flüssigem Verleimungsmittel pro Kubikmeter Werkstoffplatte aus. Diese signifikante Kostenersparnis rechtfertigt somit bereits die Zusatzkosten und den Aufwand des zusätzlichen Arbeitsschritts der Plasmabehandlung beim erfindungsgemäßen Verfahren zur Herstellung von Werkstoffplatten.Here, since the wettability of the chip surfaces has been improved by the plasma treatment of chips according to the present invention, about 30% less sizing agent can be used than conventional chipboard production methods without suffering the mechanical strength properties of the finished chipboard. While conventional processes require about 90kg of liquid sizing per cubic meter of chipboard to produce chipboard having the mechanical strength properties required by relevant industry standards, the process of the invention ideally comes with only about 63kg of liquid sizing per cubic meter Material plate made. This significant cost saving thus already justifies the additional costs and the expense of the additional working step of the plasma treatment in the method according to the invention for the production of material plates.

Weiterhin können durch geeignete Zusätze im Prozessgas bei der Plasmabehandlung auch andere Eigenschaften der Späne vorteilhaft beeinflusst werden. Der Zusatz von Fluor bewirkt eine vorteilhafte Beeinflussung des Quellverhaltens der Späne, so dass auf den sonst üblichen Zusatz von Paraffinemulsion bei der Herstellung der Spanplatte zur Verringerung des Quellverhaltens der fertiggestellten Platte ganz oder teilweise verzichtet werden kann, und somit eine weitere Kostenersparnis erzielt werden kann.Furthermore, other properties of the chips can be advantageously influenced by suitable additives in the process gas in the plasma treatment. The addition of fluorine causes an advantageous influence on the swelling behavior of the chips, so that the usual addition of paraffin emulsion in the production of chipboard to reduce the swelling behavior of the finished plate can be completely or partially omitted, and thus a further cost savings can be achieved.

Nach der Verleimung werden in Schritt S5 die Deckschichtspäne und die Mittelschichtspäne derart zusammen auf ein Förderband gestreut, dass die Oberflächen der gebildeten Schicht aus ungepressten, verleimten Spänen aus Deckschichtspänen bestehen, und Mittelschichtspäne in der Mitte dieser Schicht angeordnet sind. Die Späne werden schließlich beispielsweise in einer herkömmlichen Bandpresse verpresst und erwärmt, um eine Spanplatte zu bilden.After bonding, in step S5, the topcoat chips and the middle-layer chips are scattered together on a conveyor belt such that the surfaces of the formed layer consist of non-pressed, glued chips of topcoat chips, and middle-layer chips are disposed in the center of that layer. The chips are finally pressed, for example, in a conventional belt press and heated to form a chipboard.

Es ist für das erfindungsgemäße Verfahren hierbei wieder völlig unerheblich, wie die an sich bei der Herstellung von Werkstoffplatten üblichen und bekannten Schritte des Anordnens der Späne und des Verpressens im Einzelnen durchgeführt werden. Somit ist hier jedes mögliche Schicht- und Pressverfahren der verleimten Späne denkbar, das üblicherweise bei der Herstellung von Werkstoffplatten aus Span- oder Fasermaterial eingesetzt wird.In this case, it is completely irrelevant to the method according to the invention how the customary and known steps of arranging the chips and of the pressing in the manufacture of material plates are carried out in detail. Thus, any possible layering and pressing process of the glued chips is conceivable, which is usually used in the production of material plates made of chip or fiber material.

Claims (9)

  1. Method for the production of material boards of chip material or fibrous material, including chipboards, LDF boards, MDF boards, HDF boards, and OSB boards, said method comprising the steps of:
    providing (S2) dried chip material or fibrous material,
    plasma-treating (S3a, S3b) the dried chip material or fibrous material,
    applying glue (S4a, S4b) to the plasma-treated chip material or plasma-treated fibrous material, and
    compressing (S5) the glued chip material or glued fibrous material to form material boards,
    characterised in that the process gas used in the plasma treatment (S3a, S3b) comprises fluorine as an additional component.
  2. Method according to claim 1,
    characterised in that, when applying glue (S4a, S4b), not more than 75 kg, preferably not more than 67 kg, of liquid glue or not more than 50 kg, preferably not more than 45 kg, of solid glue is used per cubic metre of material board.
  3. Method according to either claim 1 or claim 2,
    characterised in that the process gas used in the plasma treatment (S3a, S3b) comprises oxygen and/or nitrogen and/or argon as the main component.
  4. Method according to any of claims 1 to 3,
    characterised in that a predetermined quantity of chip material or fibrous material is treated in a batch process in a low-pressure plasma.
  5. Method according to claim 4,
    characterised in that the duration of the plasma treatment (S3a, S3b) of the chip material or fibrous material is 1 to 10 minutes.
  6. Method according to any of claims 1 to 5,
    characterised in that the chip material or fibrous material is present before the plasma treatment in a plurality of groups that differ according to the size of individual chips and fibres, and in that the different groups are in each case separately plasma-treated (S3a, S4b) and subsequently glued (S4a, S4b) before being reunited for compressing (S5) to form a material board.
  7. Method according to any of claims 1 to 6,
    characterised in that no more than 30 minutes, preferably no more than 1 minute, elapse between the plasma treatment step (S3a, S3b) and the application of glue (S4a, S4b) to the chip material or fibrous material.
  8. Method according to any of claims 1 to 7,
    characterised in that the chip material or fibrous material comprises wood chips and/or wood fibres and/or hemp fibres and/or straw fibres.
  9. Method according to any of claims 1 to 8,
    characterised in that urea formaldehyde resin or urea melamine-formaldehyde resin or phenol formaldehyde resin, preferably having a solids content of 40 to 80%, is used for the glue application.
EP20070786098 2006-07-17 2007-07-16 Method for the production of material plates Active EP2040895B1 (en)

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ES2532627T3 (en) * 2009-03-10 2015-03-30 Kronotec Ag Installation of drying wood chips to dry wood chips and corresponding procedure for drying wood chips
CN102179856B (en) * 2011-04-07 2013-02-13 云南工业大麻股份有限公司 High-intensity shaving board and manufacturing method thereof
CN102528893A (en) * 2012-03-09 2012-07-04 江西康替龙竹业有限公司 Method for preparing environment-friendly bamboo recombinant material
US20220242007A1 (en) * 2016-03-21 2022-08-04 Bondcore öU Composite wood panels with corrugated cores and method of manufacturing same
CN106142265A (en) * 2016-08-31 2016-11-23 南京苏曼等离子科技有限公司 Low resin added wooden DANFU condensation material Low Temperature Plasma Treating equipment and operational approach
DE102016220682A1 (en) * 2016-10-21 2018-04-26 Tesa Se Physical pretreatment for filament incorporation
US20230220631A1 (en) * 2020-06-07 2023-07-13 Ariel Scientific Innovations Ltd. Method of preparing plant-derived material
DE102020005513B4 (en) 2020-09-09 2022-09-01 Siempelkamp Maschinen- Und Anlagenbau Gmbh Process and device (plant) for the production of a material panel, and a material panel produced according to the process

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AU2007276402A1 (en) 2008-01-24
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RU2399484C1 (en) 2010-09-20
CN101505934A (en) 2009-08-12

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