EP2028912A2 - Cooking device assembly - Google Patents

Abstract

The arrangement has a heating arrangement (34.1) of heating units, and a heat classification unit forming heating groups that are adapted to a selection position of a preparation dish. A power arrangement (38.1) of a power unit (26) produces heating power for the heating arrangement. A heat sink unit (46) forms heat receiving regions (56, 58) for receiving heat that is produced by the power arrangement. The heat sink unit is arranged below the heating arrangement in a base attachment position and arranged between the heating arrangement and the power arrangement.

Description

The invention is based on a cooking device arrangement according to the preamble of claim 1.

There is known a cooking apparatus comprising a cooking plate for laying a preparation utensil and a set of induction coils forming a contiguous cooking area of the cooking plate. The heating of the preparation harness is carried out by means of a heating group of induction coils, which is formed depending on a selection position of the preparation dishes in the cooking area.

The object of the invention is in particular to provide a generic device with improved properties in terms of a compact design.

The object is achieved by the features of claim 1, while advantageous embodiments and modifications of the invention can be taken from the dependent claims.

The invention is based on a cooking device arrangement with a heating arrangement of heating units, a heating group formation unit which is provided to form a heating unit of heating units adapted to a selection position of a preparation tableware, and a power arrangement of power units for generating heating power for the heating arrangement.

It is proposed that the cooking device arrangement comprises a heat sink unit which forms at least a first heat absorption area for receiving a heat generated by the power arrangement and is arranged in a basic installation position below the heating arrangement. It can be achieved by a particularly compact design of Kochvorrichtungsanordnung.

By means of the heating group formation unit, a particularly flexible cooking process can be achieved. In this context, under a "voting position" in particular a position of the cooking utensil, which can be arbitrarily selected by an operator within a cohesive cooking area for heating a cooking utensil. A "cooking area for heating a cooking utensil" is to be understood in this context, in particular a range of cooking appliance, which is suitable for a cooking operation of the cooking utensil. The cooking area preferably corresponds to a portion of a cooking plate of the cooking device, which is stretched by all the heating units of the cooking device arrangement. In contrast to a cooking appliance with separate cooking zones in which a space between the cooking zones is unsuitable for cooking, the cooking area coherently constitutes a substantial part, in particular more than 50%, advantageously more than 75% and preferably more than 90% of the total surface the hotplate, which is suitable for a cooking operation, whereby a particularly high degree of flexibility in the choice of a cooking position of the cooking utensil can be achieved. The heating group formation unit is provided in particular for forming the heating group of heating units for heating the preparation tableware in a selection position of the preparation tableware in the cooking area. A position of the cooking utensil "in the cooking area" is to be understood in particular to mean a position of the cooking utensil relative to the cooking area in which the cooking utensil floor is arranged completely in the cooking area. To achieve a large cooking range, the cooker assembly preferably has at least 10, preferably at least 20 and preferably at least 40 heating units, wherein the entire set of heating units may be subdivided into a plurality of heating arrangements. With such a number of heating units, a particularly large installation space can be saved by arranging the heat sink unit provided for cooling the power arrangement below the heating arrangement. In this context, it is advantageous if the heat sink unit forms a coherent heat absorption area, which is provided for cooling of at least five power units.

In this context, a "heating unit" is to be understood as meaning, in particular, a unit which is provided for the purpose of transmitting a heat energy to a preparation tableware. For this purpose, the heating unit has at least one heating body, which is designed, for example, as an inductive heating means or as a radiation body. In a heating unit power operation, a heating unit for transmitting the heating energy is expediently supplied with electric power by means of a power unit of the power arrangement.

If the heating units have at least one inductive heating means, then the power units are preferably designed as inverters, which are provided by means of switching operations for generating an alternating current with a heating frequency for feeding into the heating units.

In this context, a "basic installation position" is to be understood in particular to mean a position of the cooking device arrangement which is present under normal or prescribed conditions of use when using a cooking device, in particular an induction hob, in which the cooking device arrangement according to the invention is used. In particular, in the basic installation position, the heating units are distributed within a horizontal plane and they are arranged in the vertical direction below a cooking plate. In particular, in the basic installation position in the arrangement of the heat sink unit "below" the heating arrangement, the heat sink unit in the vertical upward direction of the heating arrangement is at least partially covered.

A heat that is generated by the power arrangement should in particular be understood as meaning a heat that is generated by at least one power unit, in particular a plurality of power units of the power arrangement.

In a preferred embodiment of the invention it is proposed that the heat sink unit is arranged between the heating arrangement and the power arrangement, whereby an advantageous separation of the heating arrangement from the power arrangement and thereby an advantageous protection of the power arrangement by the heat sink unit can be achieved. In particular, in this arrangement, the heat sink unit may serve as an electromagnetic shield which shields power units of the power assembly from a heater field generated by the heater assembly. The arrangement of the heat sink unit "between" the heating arrangement and the power arrangement should in particular be understood as an arrangement in which there is at least one straight segment connecting a point of the power arrangement to a point of the heating arrangement which intersects the heat sink unit between the points. In particular, this straight segment has a vertical component in the basic installation position.

Advantageously, advantageous cooling of the heating arrangement can be achieved in a compact manner if the cooling body unit forms a second heat absorption area for cooling the heating arrangement. In particular, the second heat receiving area is formed at least by a portion of a side of the heat sink unit, which faces a cooking plate in a basic installation position of the cooking device arrangement.

Particularly advantageously, the first heat receiving area and the second heat receiving area are formed at least as partial areas of at least two mutually adjacent sides of the heat sink unit, whereby a particularly simple design can be achieved. The heat sink unit is preferably cuboidal.

In an advantageous development of the invention it is proposed that the first heat absorption area is arranged on a shell side of the heat sink unit, whereby a heat dissipation over a large cooling surface can be achieved. In this embodiment, power units of the power arrangement are preferably arranged laterally of the heat sink unit. In this context, a "shell side" of the heat sink unit should be understood as meaning, in particular, a side of the heat sink unit that is different from the top side and the bottom side of the heat sink unit. In particular, a shell side adjoins the upper side and / or the underside of the heat sink unit and is preferably vertically aligned in a basic installation position of the cooking device arrangement. Here, an "upper side" or a "lower side" of the heat sink unit corresponds to one side, in particular a side oriented horizontally in a basic installation position of the cooking device arrangement, which faces or faces away from a cooking plate.

In a preferred embodiment of the invention, it is proposed that at least the first heat absorption area is designed as a contact cooling surface for at least one power unit, whereby an effective cooling can be achieved. A "contact cooling surface" is to be understood in particular as a surface which is provided for conducting a heat absorbed by a power unit present on the surface. In order to achieve a particularly effective heat dissipation, advantageously at least one power unit, in particular at least a substantial part of the power arrangement, is applied to a contact cooling surface.

A particularly high space savings can be achieved if the power arrangement has two rows of power units, which are arranged on both sides of the heat sink unit. A "series" of power units may, in particular, be understood to mean a set of at least three heating units, which are arranged following one another along a common row axis.

A simple construction and a high cooling effect can also be achieved if the heat sink unit is formed as a one-piece heat sink. Particularly advantageous is the one-piece heat sink for cooling a power arrangement of at least five, preferably at least ten power units provided.

The cooling effect can be further increased if the heat sink unit forms at least one heat removal channel. Particularly advantageously, the power units are arranged outside a heat removal channel and are preferably separated from the heat removal channel by means of a subregion of the heat sink unit.

Advantageously, the heat sink unit forms a portion which serves as a protection means for protecting at least a portion of the power assembly against an electromagnetic field, which structurally simple high protection of power electronics can be achieved. In particular, the subregion serves as an electromagnetic shield for shielding power units of the power arrangement from a heating field generated by heating units of the heating arrangement. This can be achieved particularly easily if the heat sink unit is arranged between the heating arrangement and the power arrangement. An "electromagnetic field" can be understood in this context as a magnetic and / or electrical field. The portion of the heat sink unit may in particular be made of a non-magnetic material, e.g. a non-ferromagnetic material, whereby a magnetic shield can be advantageously achieved by this portion.

In an advantageous embodiment of the invention it is proposed that the heat sink unit is used for fastening the heating arrangement and the power arrangement, whereby it is possible to dispense with additional fastening elements during assembly of the cooking apparatus arrangement. For this purpose, the heat sink unit expediently forms a fastening interface for fastening the heating arrangement and the power arrangement.

Furthermore, a particularly simple assembly can be achieved if the cooking device arrangement has a carrier body for carrying the heating arrangement, which is fastened to the heat sink unit.

The cooking device arrangement according to the invention is suitable with a compact design, in particular for cooling a large number of power units. In this connection, an effective heating operation with a high number of power units and effective cooling can be achieved if a heating unit of the heating arrangement is assigned in each case a different power unit of the power arrangement.

It is also proposed that the cooking device arrangement has at least one printed circuit board arranged below the heat sink unit in a basic installation position for connection to power units of the power arrangement, whereby a compact construction and an advantageous protection of the printed circuit board can be achieved.

Furthermore, a simple assembly of the cooking device arrangement can be achieved if the power arrangement is subdivided into groups of at least four power units, each of which is connected to a common circuit board, each of which is different for the groups.

In this context, a cost-effective embodiment can also be achieved if a group is assigned to a different group control unit for controlling the group.

Further advantages emerge from the following description of the drawing. In the drawings, embodiments of the invention are shown. The drawing, the description and the claims contain numerous features in combination. The person skilled in the art will expediently also consider the features individually and combine them into meaningful further combinations.

Fig. 1

ein Induktionskochfeld mit einer Kochplatte und einem Satz von Heizeinheiten und zwei auf der Kochplatte angeordnete Kochge- schirre,

Fig. 2

eine Heizanordnung von Heizeinheiten, eine Leistungsanordnung von Leistungseinheiten und eine Kühlkörpereinheit in einer Ansicht von oben,

Fig. 3

die Kühlkörpereinheit aus Figur 2 in einer perspektivischen An- sicht,

Fig. 4

die Anordnung der Heizanordnung, der Leistungsanordnung und der Kühlkörpereinheit in einem Montagegehäuse und unterhalb der Kochplatte in einer Schnittansicht,

Fig. 5

eine Heizeinheit und eine Leistungseinheit mit Schaltmitteln in ei- ner schematischen Darstellung,

Fig. 6

eine Anordnung von Leiterplatten, an welchen die Leistungsanord- nung aus Figur 2 angeschlossen ist und

Fig. 7

eine alternative Ausführung der Heizanordnung mit ebenen Spi- ralwicklungen.

Show it:

Fig. 1

an induction hob with a cooking plate and a set of heating units and two cooking utensils arranged on the cooking plate,

Fig. 2

a heating arrangement of heating units, a power unit arrangement of power units and a heat sink unit in a top view,

Fig. 3

the heat sink unit FIG. 2 in a perspective view,

Fig. 4

the arrangement of the heating arrangement, the power arrangement and the heat sink unit in a mounting housing and below the cooking plate in a sectional view,

Fig. 5

a heating unit and a power unit with switching means in a schematic representation,

Fig. 6

an arrangement of printed circuit boards on which the Leistungsanord- tion from FIG. 2 is connected and

Fig. 7

an alternative embodiment of the heating arrangement with plane spiral windings.

FIG. 1 shows a trained as induction cooktop cooking device 10 in a view from above. The cooking apparatus 10 includes a mounting frame 12 for attachment to a countertop, a cook top 14 for placing cookware, and a control panel 16 for starting, stopping, and adjusting a cooking operation. The cooking plate 14 is bounded by the mounting frame and the control panel 16. The cooking device 10 is formed substantially square with a side length of about 60 cm. On the cooking plate 14, two prepared as a pot preparation harnesses 18, 20 are arranged, which are each shown schematically by a solid circle. The cooking device 10 has a cooking device assembly disposed below the cooking plate 14. To perform a cooking operation of the cooking apparatus 10, the cooker assembly is provided with a set of heating units 22. These each comprise an induction coil designed as heating means 24, which in FIG. 1 is shown schematically by a dashed rectangle. In an operation of a heating unit 22 is formed by the heating means 24 as a magnetic alternating field Heating signal generated, which has a heating frequency, for example, is 25 kHz. The heating signal induces electrical currents in the metallic bottom of the cooking utensils 18, 20. These electric currents heat up a food in the cooking utensils 18, 20. A heating means 24 in operation of the corresponding heating unit 22 is supplied to generate the heating signal with an alternating electrical current, which oscillates with the heating frequency. In order to generate this alternating current and to supply the heating means 24 with a heating power, the cooking appliance arrangement is provided with power units 26 designed as inverters, which in FIG. 2 are shown.

The cooking apparatus 10 is provided for heating the cooking utensils 18, 20 by means of a group operation of the heating units 22. For this purpose, the heating units 22 with a in FIG. 5 provided sensor means 25 can be detected by means of which it can be detected whether the corresponding heating means 24 is at least partially covered by one of the preparation harnesses 18, 20. This sensor means 25 may in particular be formed by a heating means 24. Heating groups 28, 30 are formed by heating units 22, each associated with one of the preparation utensils 18, 20, by means of a grouping process which is not described in more detail. If an operator starts a cooking operation of the cooking device 10 by means of the control panel 16, this cooking operation is carried out by means of the heating units 22 of both heating groups 28, 30, while the further heating units 22 which do not belong to any of the heating groups 28, 30, remain undriven. If the operator adjusts one of the preparation utensils 18, 20 on the cooking plate 14 or if he places another cookware on the hotplate 14, corresponding heating groups of heating units 22 are adapted or newly formed on the basis of the new arrangement of objects to be heated relative to the heating means 24. The grouping processes for forming the heating groups 28, 30 are carried out by means of a in FIG. 1 Dashed line, formed as a microprocessor heating group formation unit 32 of the cooking device assembly, which forms the adapted to a selection position of the preparation of dishes 18 and 20 heating group 28 and 30 respectively. The entire group of heating units 22, which has a number N of heating units 22, is subdivided into n groups each having a heating arrangement 34.1 to 34.n of N / n heating units 22. Here, a simple construction can be achieved if the number N is an even number. In the present case, the entire group of heating units 22 is subdivided into four heating arrangements 34.1 to 34.4 each having twelve heating units 22. The entire set of heating units 24 the cooker assembly is further arranged in a matrix arrangement. In this example, the array has six rows and eight columns. Further embodiments of the matrix arrangement with further combinations of row and column numbers are conceivable. The heating arrangements 34.1 to 34.4 in this case correspond in each case to two adjacent matrix columns of the matrix arrangement.

FIG. 2 shows the Kochvorrichtungsanordnung the cooking device 10 and in particular the heating assembly 34.1 of twelve heating units 22 in a view from above. The following text, which is limited to the description of the heating arrangement 34.1, also applies to the other heating arrangements 34.2, 34.3, 34.4 application. The heating units 22 of the heating arrangement 34.1 each have one of the induction coils designed as heating means 24, which consists of two partial windings, which are shown schematically in the figure as solid rectangles. These partial windings are wound around a common axis, which is aligned parallel to the cooking plate 14. As described above, in a heating operation of a heating group 28 and 30, the heating units 22 constituting these heating groups 28 and 30, respectively, are supplied with an alternating current generated by power units 26, whereby the heating units 22 are supplied with heating power. In the example considered, each heating unit 22 is assigned a power unit 26. In this case, an alternating current for feeding a respective different heating unit 22 is generated by the power units 26. In one embodiment, it is conceivable that a power unit 26 is assigned to a plurality of heating units 22. The power units 26, which are arranged in the figure below the heating arrangement 34.1 (see also FIG. 4 ) and therefore shown in dashed lines, are each designed as an inverter. These power units 26 generate an alternating current with the heating frequency during operation of the respective heating unit 22 by means of switching processes which are effected by switching means 36 ( FIG. 5 ). These switching means 36 are designed as semiconductor switches, in particular as switching transistors. In this example, the power units 26 each comprise a pair of switching means 36 implemented as IGBTs (Insulated-Gate Bipolar Transistor or Bipolar Transistor). Alternative embodiments of the switching means 36, such as as FET transistors (field effect transistors), are also conceivable. A representation of a power unit 26, which has the switching means 36, formed as an induction coil heating means 24 and one of the sensor means 25, the FIG. 5 be removed. The entire group of power units 26 of the cooking apparatus 10, a number N of power units 26 is subdivided into n groups each having a power arrangement 38.1 to 38.n, which has a number of N / n power units 26. In the example considered, the cooking device 10 four power arrangements 38.1 to 38.4, of which a power arrangement 38.1 in FIG. 2 is shown. For a description of the further power arrangements 38.2 to 38.4, which are not shown in the figures, reference is made to the description of the power arrangement 38.1. The power arrangement 38.1 has two rows 40, 42 of power units 26, which are aligned parallel to each other. In this case, the power units 26 are arranged following one another in a row 40 or 42 along a straight line whose orientation 44 is in particular parallel to an edge of the cooking plate 14.

During operation of a heating unit 22, heat is generated by the corresponding power unit 26, in particular by losses of its switching means 36. In a group operation of heating units 22, the heat generated by an operating heating group 28 or 30 of heating units 22 is dissipated in order to avoid overheating of the cooking device 10. In order to avoid damage to the cooking device electronics, in particular the temperature of the cooking device 10 is to be maintained below the value of 125 ° C. For this purpose, the in FIG. 2 Cooker assembly shown provided with a heat sink unit 46 which is disposed below the heating assembly 34.1. This arrangement of the heat sink unit 46 below the heating arrangement 34.1 is realized in a basic installation position of the cooking device arrangement. In this basic installation position, the cooker assembly is mounted in the cooking apparatus 10, which is available for use by an end user under proper conditions with the cooking plate 14 horizontally aligned for placement of cookware. The heat sink unit 46 is covered by the heating arrangement 34.1 in a direction 48 perpendicular to the cooking plate 14 upwards, ie towards the cooking plate 14, this direction 48 corresponds in the basic installation position of the vertical direction (see FIG. 4 ). For each additional power arrangement 38.2, 38.3, 38.4, a respective heat sink unit 46 is provided, reference being made to the description of the heat sink unit 46 assigned to the power arrangement 38.1 for the description of these further heat sink units 46.

The following description, regarding the heat sink unit 46, further relates to FIGS FIG. 2 as well as on the FIG. 3 which this heat sink unit 46 in a perspective View represents. The heat sink unit 46 is a heat sink made of a heat conducting material and integrally executed heat sink. A "heat-conducting material" should be understood as meaning a material which has a specific thermal conductivity λ with a value of at least 50 W / (m K). In particular, the heat sink unit 46 is made of aluminum in the considered embodiment. The heat sink unit 46 is parallelepiped-shaped and its longitudinal direction is parallel to the column direction of the matrix arrangement of heating units 22. In particular, the longitudinal direction of the heat sink unit 46 corresponds to the orientation 44 of the rows 40, 42 of the power arrangement 38.1. An orientation of the heat sink unit 46 parallel to the row direction of the matrix arrangement is also conceivable. The heat sink unit 46 has an upper side 50, which in the basic installation position FIG. 1 the bottom of the cooking plate 14 faces and extends parallel to this bottom. In the basic installation position, the upper side 50 is aligned horizontally. The heat sink unit 46 further has two shell sides 52, 54 which adjoin the top 50 and are aligned parallel to the alignment 44 of the rows 40, 42. In the basic installation position, the shell sides 52, 54 are vertically aligned (see also FIG. 4 ). Again FIG. 2 can be removed, the rows 40, 42 of power units 26 are arranged on both sides of the heat sink unit 46.

The heat sink unit 46 serves to cool the rows 40, 42 of the power arrangement 38.1. For this purpose, the shell sides 52, 54 form with their surface in each case a heat receiving area 56 or 58, which is provided for receiving a heat generated by power units 26 of the series 40 and 42, respectively. These heat receiving areas 56, 58 are each formed as a contiguous, over the entire shell side 52 and 54 extending heat receiving surface. The power units 26 of the series 40 and 42, respectively, face the heat receiving area 56 and 58, respectively. By this is meant in particular that the projection of the power units 26 in a direction perpendicular to the shell side 52 and 54 on the shell side 52 and 54 out in the heat receiving region 56 and 58 is arranged, as by dashed rectangles in FIG. 3 is indicated schematically. In the example considered, the heat receiving areas 56, 58 are formed as contact cooling surfaces. In this case, the power units 26 of the rows 40, 42 abut the heat receiving areas 56 and 58, wherein heat can be dissipated by means of heat conduction from a contact point at which a power unit 26 contacts the respective heat receiving area 56 or 58. In a further embodiment This can be done indirectly by the power units 26 are arranged with a small distance to the heat receiving area 56 and 58 respectively. Furthermore, it is conceivable to use a heat-conducting agent, such as a thermal compound, for connecting the power units 26 to the heat-absorbing area 56 or 58, respectively.

In a group operation of the heating units 22, the in FIG. 1 shown entire set of heating units 22 among the heating groups 28, 30 and the remaining, idle remaining heating units 22 divided. As a result of the large heat absorption areas 56 and 58 extending over the entire length of the rows 40, 42, heat generated by the operated power units 26 assigned to the heating groups 28, 30 can be dissipated via areas of the heat sink unit 46 facing the power units 26 that have been driven are. In this case, in a group operation of the heating units 22, a fast and effective temperature compensation between regions of the heat sink unit 46 can be achieved, corresponding to the heating groups 28, 30 on the one hand and undriven heating units 22 on the other.

The upper side 50 of the heat sink unit 46 also forms a further heat absorption area 60, which serves to cool the heating arrangement 34.1 of heating units 22. This heat receiving area 60 is arranged in the basic installation position below the heating arrangement 34.1. The heat receiving areas 56, 58, 60 are formed by the sides of the heat sink unit 46 adjacent to each other. The top 50 continues in the longitudinal direction of the heat sink unit 46 and on both sides of the heat receiving area 60 as a web formed as a portion 62, below which a fan 64 can be arranged. The underside 66 of the heat sink unit 46, which is opposite the top 50, adjacent to the shell sides 52, 54 and facing away from the cooking plate 14 in the basic installation position, further comprises ribs 68, which heat removal channels 70 form (see also FIG. 4 ). Through these heat removal channels 70, which extend in the main extension direction of the heat sink unit 46, a particularly effective temperature compensation between regions of the heat sink unit 46 can be achieved.

In FIG. 4 is a sectional view through a part of the cooking device arrangement FIG. 2 shown along the line IV-IV. The heating means 24 of the heating arrangement 34.1 and the heat sink unit 46 can be seen. The heat sink unit 46 forms, as described above, with their shell sides 52, 54, the heat receiving areas 56 and 58, which serve on both sides of the heat sink unit 46 in each case for cooling a row 40 or 42 of power units 26. Furthermore, the upper side 50, above which the heating means 24 designed as induction coils are arranged, and the ribs 68 forming the heat removal channels 70 can be seen. The cooker assembly is disposed below the cooking plate 14. In this case, the heating arrangement 34.1 faces the cooking plate 14 and is arranged above the heat sink unit 46. The heat sink unit 46 is disposed between the heater assembly 34 and the power assembly 38.1, each between the heater assembly 34 and a row 40 and 42 of power units 26, respectively. As a result of this relative arrangement of the heat sink unit 46, the heating arrangement 34.1 and the power arrangement 38.1, partial areas 84, 86 of the heat sink unit 46, which are covered in the basic installation position by heating means 24 in an upward vertical direction, serve as electromagnetic shielding for protecting power units 26 from one of the heating means 24 generated heating field.

Below the heat sink unit 46, a circuit board 72 is further arranged, to which power units 26 of the rows 40 and 42 are connected. The cooker assembly has a set of three printed circuit boards 72 associated with the power assembly 38. The power arrangement 38.1 is subdivided into g groups with a number of N / (ng) power units 26 each. In the exemplary embodiment considered, the power arrangement 38.1 with twelve power units 26 is subdivided into three groups of four power units 26 each. The power units 26 of a group are each connected to a common circuit board 72, which is different for the groups. Thus, a power arrangement is assigned a number g, three printed circuit boards 72 in the considered case. The printed circuit boards 72, which are associated with the power arrangement 38.1 and are arranged in the basic installation position below the heat sink unit 46, are in FIG FIG. 6 shown. To each circuit board 72 four power units 26 are connected. Furthermore, each group of power units 26 is assigned a respectively different group control unit 74, which serves to control the corresponding group of power units 26 and which is arranged on the corresponding circuit board 72. In a further embodiment, a group control unit 74 may be assigned to a different number of power units 26. It is also conceivable that each power unit 26 is controlled in each case by a different control unit. The arrangement of the printed circuit boards 72 below the heat sink unit 46 and in particular below the heat removal channels 70 can advantageously maintain a circulating cooling air flow in the heat removal channels 70 can be achieved by means of the printed circuit boards 72.

The heat sink unit 46 further forms a fastening interface for fastening the power arrangement 38.1 and the heating arrangement 34.1. The cooking device arrangement has a carrier body 76 which serves to support the heating arrangement 34.1. This carrier body 76, which is also in FIG. 2 is to be seen, is formed as a support matrix made of plastic, having the receiving areas 78, in which the heating means 24 and the partial windings of the heating means 24 are inserted and which is placed on the top 50 of the heat sink unit 46. The carrier body 76 is held on the heat sink unit 46, for example by producing a force and / or positive connection. The printed circuit boards 72 are further attached to the heat sink unit 46 by means of schematically illustrated fasteners 80. The heat sink unit 46, the carrier body 76, which carries the heating arrangement 34.1, and the printed circuit boards 72, to which the power arrangement 38.1 is connected, form a building module, which is inserted coherently during the assembly of the cooking appliance 10 into a mounting housing 82, which in a known manner is attached to the hotplate 14. Here, this structural module is held on the mounting housing 82 by means of an attachment of the heat sink unit 46 to this mounting housing 82. In this way, a particularly simple installation and easy separation of the building module from the mounting housing 82 can be achieved only by the dissolution of the heat sink unit 46 of the mounting housing 82.

FIG. 7 shows an alternative embodiment of the heating assembly 34.1 in the view of FIG. 2 , In this embodiment, the heating means 24 of the heating units 22 are formed as a planar spiral winding, the winding plane in the basic installation position parallel to the cooking plate 14, that is aligned horizontally. These heating means 24 are placed in particular directly on the upper side 50 of the heat sink unit 46, whereby cooling of the heating units 22 by heat removal from a contact point at which a heating means 24, the heat sink unit 46 contacted directly, can be achieved by means of heat conduction. In one embodiment, these heating means 24 may be accommodated in a carrier body fastened to the heat sink unit 46.

reference numeral

10

cooking apparatus

12

mounting frame

14

hotplate

16

Control panel

18

preparation utensils

20

preparation utensils

22

heating unit

24

heating

25

sensor means

26

power unit

28

heating group

30

heating group

32

Heizgruppenbildungseinheit

34

heating arrangement

36

switching means

38

power device

40

line

42

line

44

alignment

46

Heatsink unit

48

direction

50

top

52

Shellside

54

Shellside

56

Heat absorption area

58

Heat absorption area

60

Heat absorption area

62

subregion

64

Fan

66

bottom

68

ribs

70

Heat dissipation channel

72

circuit board

74

Group controller

76

support body

78

reception area

80

fastener

82

mounting housing

84

subregion

86

subregion

Claims (15)

Cooking device arrangement with at least one heating arrangement (34.1) of heating units (22), a heating group formation unit (32) which is provided to form a heating unit (28, 30) of heating units (22) adapted to a selection position of a preparation tableware (18, 20) and a power arrangement (38.1) of power units (26) for generating heating power for the heating arrangement (34.1), characterized by a heat sink unit (46) having at least a first heat receiving area (56, 58) for receiving one of the power arrangement (38.1). generated heat and is arranged in a basic installation position below the heating arrangement (34.1). Cooking device arrangement according to claim 1, characterized in that the heat sink unit (46) between the heating arrangement (34.1) and the power arrangement (38.1) is arranged. Cooking device arrangement according to claim 1 or 2, characterized in that the heat sink unit (46) forms a second heat receiving area (60) for cooling the heating arrangement (34.1). Cooking device arrangement according to one of the preceding claims, characterized in that the first heat receiving region (56, 58) on a shell side (52, 54) of the heat sink unit (46) is arranged. Cooking device arrangement according to one of the preceding claims, characterized in that at least the first heat receiving area (56, 58) is designed as a contact cooling surface for at least one power unit (26). Cooking device arrangement according to one of the preceding claims, characterized in that the power arrangement (38.1) has two rows (40, 42) of power units (26), which are arranged on both sides of the heat sink unit (46). Cooking device arrangement according to one of the preceding claims, characterized in that the heat sink unit (46) is formed as a one-piece heat sink. Cooking device arrangement according to one of the preceding claims, characterized in that the heat sink unit (46) forms at least one heat removal channel (70). Heating device arrangement according to one of the preceding claims, characterized in that the heat sink unit (46) forms a partial region (84, 86) which serves as protection means for protecting at least a part of the power arrangement (38.1) against an electromagnetic field. Cooking device arrangement according to one of the preceding claims, characterized in that the heat sink unit (46) serves for fastening the heating arrangement (34.1) and the power arrangement (38.1). Cooking device arrangement according to one of the preceding claims, characterized by a carrier body (76) for supporting the heating arrangement (34.1), which is fastened to the heat sink unit (46). Cooking device arrangement according to one of the preceding claims, characterized in that a heating unit (22) of the heating arrangement (34.1) is assigned in each case a different power unit (26) of the power arrangement (38.1). Cooking device arrangement according to one of the preceding claims, characterized by at least one printed circuit board (72) arranged below the heat sink unit (46) in a basic installation position for connection to power units (26) of the power arrangement (38.1). Cooking device arrangement according to one of the preceding claims, characterized in that the power arrangement (38.1) is subdivided into groups of at least four power units (26), each of which is connected to a common printed circuit board (72) which is different in each case for the groups. Cooking device arrangement according to claim 14, characterized in that each group is assigned a different group control unit (74) for controlling the group.

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