EP2016809B1 - Cold plasma hand set for plasma treatment of surfaces - Google Patents

Cold plasma hand set for plasma treatment of surfaces Download PDF

Info

Publication number
EP2016809B1
EP2016809B1 EP07724599.1A EP07724599A EP2016809B1 EP 2016809 B1 EP2016809 B1 EP 2016809B1 EP 07724599 A EP07724599 A EP 07724599A EP 2016809 B1 EP2016809 B1 EP 2016809B1
Authority
EP
European Patent Office
Prior art keywords
plasma
coil
capacitor
nozzle
generator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP07724599.1A
Other languages
German (de)
French (fr)
Other versions
EP2016809A2 (en
Inventor
Rüdiger FOEST
Klaus-Dieter Weltmann
Manfred Stieber
Eckhard Kindel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leibniz Institut fuer Plasmaforschung und Technologie eV
Original Assignee
Neoplas GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neoplas GmbH filed Critical Neoplas GmbH
Priority to PL07724599T priority Critical patent/PL2016809T3/en
Publication of EP2016809A2 publication Critical patent/EP2016809A2/en
Application granted granted Critical
Publication of EP2016809B1 publication Critical patent/EP2016809B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/26Plasma torches
    • H05H1/30Plasma torches using applied electromagnetic fields, e.g. high frequency or microwave energy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/26Plasma torches
    • H05H1/32Plasma torches using an arc
    • H05H1/34Details, e.g. electrodes, nozzles
    • H05H1/36Circuit arrangements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2240/00Testing
    • H05H2240/10Testing at atmospheric pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2240/00Testing
    • H05H2240/20Non-thermal plasma
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2245/00Applications of plasma devices
    • H05H2245/30Medical applications
    • H05H2245/36Sterilisation of objects, liquids, volumes or surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2245/00Applications of plasma devices
    • H05H2245/40Surface treatments

Definitions

  • the invention relates to a plasma tool for the plasma-assisted treatment, modification and coating of inner and outer surfaces of materials in air by means of a cold plasma jet according to the preamble of claim 1.
  • WO 03/026365 A1 a device is described which allows to generate by means of microwaves a plasma, wherein the in WO 03/026365 described device allows, despite any pressure fluctuations in the process gas to produce a stable plasma flame.
  • Another plasma generator which produces a plasma with high temperatures, is described in the German patent application 1 639 257 described. It is a high-frequency plasma jet generator with a cylindrical tube, on one end side of which to gas to be ionized and at the other end side of the generated plasma flows out, an induction coil whose one end is connected to ground and the other end is connected to a high-frequency generator. Between the two ends of the coil, a tap is arranged. The high-frequency voltage generated in the induction coil is higher than the excitation voltage.
  • the tube in the area of the plasma outlet is made of metal and placed on the high-voltage end of the induction coil. The tube is concentrically and electrically isolated surrounded by a metallic housing. Due to the special arrangement, the gas discharge between the two adjacent ends of tube and housing takes place due to a capacitive coupling between these two components.
  • this generator is not suitable for the generation of a cold normal pressure plasma at least due to its electrode shape.
  • Low-temperature plasmas are also already known and have been used successfully in numerous surface treatment applications for the purpose of surface activation (changes in the adhesion properties, hydrophobization, hydrophilization) of etching, of polymerization, of layer deposition, of cleaning and of germ reduction.
  • low-pressure plasmas have been used to date for these processes, in which the radicals, excited atoms, ions, electrons and UV radiation required for these applications can be generated to a defined extent by the selection of suitable process parameters.
  • Low-pressure plasma processes are not suitable for numerous industrial processes in which a corresponding surface modification is required, both for cost reasons and for procedural reasons.
  • US 6,958,063 and US 6,262,523 are arrangements based on the RF excitation of normal pressure plasmas.
  • US 2002/122896 will be different Arrangements for producing normal pressure plasmas based on RF excited discharges in tubes of insulating material are described.
  • plasmas of this type are used for argon plasma coagulation ( US 4,781,175 . US 4,060,088 . DE 19513338 ), for coatings on artificial implants to increase their biocompatibility, for the control of cell adhesion to surfaces, for the sterilization of medical instruments ( M. Laroussi: IEEE Trans. Plasma Sci. 30 4 (2002), 1409 ) and for the treatment of biological cells and tissues ( E. Stoffels et al .: Plasma Sources Sci. Technol., 11 (2002), 383 ) used.
  • Matchbox High-frequency operated plasma reactors require a matching network (matchbox) for maximum power transmission from their RF generator.
  • An often used circuit in the Matchbox is the n - circuit. It consists of two capacitors C1 and C2 and a coil (s. Fig. 1 ).
  • capacitors with air as a dielectric are used, which occupy a large volume. Since the current transport at these frequencies takes place mainly on the surface of an electrical conductor (skin effect), the coil and all other electrical leads consist of a relatively thick metal wire with high electrical conductivity on the surface (silver wire, silver-plated copper wire). As a result, such a matchbox is generally very voluminous.
  • the matchbox To ignite and maintain a gas discharge in the plasma reactor, high voltages are needed. These are achieved in the matchbox by the fact that the coil and the capacitor C2 form a series resonant circuit, which must be matched to the particular frequency of the RF generator used. To prevent losses, the supply line Z2 should consist of an unshielded cable and should be kept as short as possible. As a result, the matchbox and the plasma reactor actually form a relatively rigid, unwieldy unit. If you want to realize a handy plasma nozzle as a plasma reactor, which can be performed for example by a robot, such a bulky plasma reactor is useless.
  • the invention is therefore based on the object to realize a handy plasma nozzle, which can also be performed by hand and / or by robots.
  • the plasma tool according to the invention for the generation of a cold plasma jet comprises a plasma nozzle with a hollow body for the supply of a process gas or a process gas mixture, a Frequency generator and consisting of at least one coil and a capacitor C2 and optionally a capacitor C1 matching network for generating the required voltage and is characterized in that the matching network at least the coil and the capacitor C2 are integrated into the plasma nozzle.
  • the matching network integrates the coil L and the capacitor C2 into the plasma nozzle.
  • the capacitor C1 of the matching network can be arranged directly on or in the frequency generator and is advantageously arranged there.
  • the plasma nozzle contains a capillary made of insulating material and the coil is arranged around this capillary.
  • the matching network (matchbox) consists of a coil and two capacitors C1 and C2 with their connections.
  • the coil and the capacitor C2 are integrated in the plasma nozzle and the capacitor C1 is arranged directly on or in the generator.
  • capacitors C1 and C2 can be made up of several partial capacitors and that capacitors constructed from partial capacitors are also referred to as C1 and C2 in the context of this invention.
  • a plasma nozzle into which at least one coil and a capacitor C2 are integrated. These can, as described above and in the embodiments resp. the figures shown to be installed.
  • Described but not the subject of the present invention is a frequency generator, in which either a capacitor suitable as capacitor C1 of a matching network capacitor integrated or mounted directly on the output of the generator.
  • both capacitors C1 and C2 can be dispensed with, so that apart from a part of the lines of the matching network in the plasma nozzle only the coil remains, which together with that through the electrodes E1 and E2 formed capacitor forms a series resonant circuit.
  • the resonance state can be adjusted by varying the generator frequency.
  • a plasma nozzle according to the invention generally comprises a body side, ie on the plasma respectively. the nozzle facing away from the plasma nozzle, with a hollow body connected to a process gas supply.
  • This hollow body is preferably made of insulating material.
  • the coil forming part of the matching network is arranged around a part of this hollow body.
  • the dimensions of the hollow body, or these dimensions together with another body, preferably an insulating body, are to be chosen such that the coil with the desired winding diameter can be arranged thereon.
  • This coil must - if the hollow body or other body on which it is arranged, not made of insulating material, be self-insulated.
  • This coil is connected to the nozzle side with an electrode E1 and optionally a variable capacitor C2.
  • the electrode E1 may optionally be a ring electrode arranged around the insulating hollow body or a rod electrode arranged in the hollow body.
  • the capacitor C2 and the coil are connected in series, so that it can adjust the voltage required at a given frequency.
  • the capacitor C2 On the side facing away from the coil, the capacitor C2 is connected to the grounded housing.
  • a ring electrode E2 which is connected to the grounded housing.
  • This housing has feeds for the electric current and feed openings for the process gas and a discharge opening for the plasma within the second electrode E2.
  • the connecting line between the electrode E1 and the capacitor C2 is usually on the coil side on the housing shielding insulation and in turn provided with an insulating layer.
  • Suitable insulating materials are plastic, quartz glass, ceramics, etc., which may be used singly or in combination.
  • a material with high conductivity is preferred at least on the surface, such as silver-plated copper wire or pure silver wire.
  • FIG. 1 Illustrated embodiments of the prior art relate in particular to commercially available RF generators with a fixed frequency.
  • the in FIG. 2 2 the matching network, the matchbox, has been separated, with the capacitor C1 in the RF generator and capacitor C2 and the coil integrated into the plasma nozzle.
  • a simplification and thus a more cost-effective variant of the combination RF generator - plasma nozzle results in the transition to lower frequencies (eg 3 MHz) and when using a generator with variable frequency.
  • the resonance state is adjusted by varying the generator frequency.
  • Fig. 4 an embodiment for a plasma nozzle with a capacitively coupled capillary discharge 1 is shown.
  • Two metallic ring electrodes 2, 3 are mounted at a suitable distance on a hollow body made of insulating material (dielectric) 4.
  • the hollow body 4 enclosing insulator 5, a coil 6 is wound, which is connected at one end to the RF electrode 3 and at the other end to the RF input 7 of the plasma nozzle.
  • the RF electrode 3 is connected to the grounded case 8 via a rotary air capacitor C2.
  • the process gas 9 preferably noble gas
  • Both electrodes 2 and 3 and the dielectric 4 form a capacitance (a few pF), the parallel to C2.
  • the coil 6 forms a series resonant circuit with these capacitances and can be adjusted via C2 to maximum voltage at the electrode 3. If a sufficiently high voltage at the electrode 3 has been reached via the calibration with C2, the electric field built up between the electrodes 3 and 2 leads to a capillary discharge whose plasma is driven outward by the gas flow 9 and forms a jet plasma 10. In order to keep the voltage drop across the capacitor, formed by the electrode 3, the dielectric 4 and the plasma inside the capillary, small, a dielectric with the highest possible dielectric constant should be selected.
  • a further embodiment of a plasma nozzle with a capillary discharge 1 is shown.
  • the RF energy is coupled via a rod electrode 3 into the capillary discharge.
  • the rod electrode should be made of low work function materials to minimize the voltage needed for capillary discharge. She should also be pointed forward, so as to achieve a high field strength. Between the tip and the grounded electrode 2, at sufficiently high voltages, a capillary discharge is formed, the plasma of which is in turn blown outward by the gas flow.
  • Fig. 6 a modified variant of the plasma nozzle is shown.
  • the discharge is again generated between the electrodes 2 and 3 and enters the atmosphere through a slot.
  • a slot of 0.8 mm width and 4 cm length can be generated with this arrangement, a linearly expanded plasma of 4 cm width.
  • insulating material such as, for example, plastic, Quartz glass, ceramics, etc. (referred to in the above description as "plasma nozzle") by means of an RF discharge generated by a nozzle, directed normal pressure jet plasma with the desired properties (for example, non-thermal, floating, homogeneous and reactive) to which the The surface to be treated is exposed at a suitable distance from the nozzle in order to achieve its desired physicochemical change.
  • the conditions in the jet plasma region can be changed by changing the geometrical arrangements and the dimensions inside the plasma nozzle, by using other process gases, their admixtures and flow velocities, by the arrangement and choice of the electrodes, by the kind of ignition and / or by variation of the electrical Parameters of the discharge are controlled.

Description

Diese Anmeldung beansprucht die Priorität der deutschen Patentanmeldung Nr. 10 2006 019 664.3 , die am 27. April 2006 eingereicht wurde.This application claims the priority of the German patent application no. 10 2006 019 664.3 filed on April 27, 2006.

Technisches GebietTechnical area

Die Erfindung betrifft ein Plasmawerkzeug zur plasmagestützten Behandlung, Modifizierung und Beschichtung innerer und äußerer Oberflächen von Materialien an Luft mittels eines kalten Plasmastrahls entsprechend dem Oberbegriff des Anspruches 1.The invention relates to a plasma tool for the plasma-assisted treatment, modification and coating of inner and outer surfaces of materials in air by means of a cold plasma jet according to the preamble of claim 1.

Stand der TechnikState of the art

Die Plasmatechnologie, insbesondere bei hohen Temperaturen und hohen Gasdrucken, ist schon lange bekannt und vielfach beschrieben, z.B. in US 3, 648,015 , US 4,626,648 , DE 41 08 499 A1 und DE 101 40 298 B4 .The plasma technology, especially at high temperatures and high gas pressures, has long been known and described many times, eg in US Pat. No. 3,648,015 . US 4,626,648 . DE 41 08 499 A1 and DE 101 40 298 B4 ,

In WO 03/026365 A1 wird eine Vorrichtung beschrieben, die es gestattet, mittels Mikrowellen ein Plasma zu erzeugen, wobei es die in WO 03/026365 beschriebene Vorrichtung gestattet, trotz allfälliger Druckschwankungen im Prozessgas, eine stabile Plasmaflamme zu erzeugen.In WO 03/026365 A1 a device is described which allows to generate by means of microwaves a plasma, wherein the in WO 03/026365 described device allows, despite any pressure fluctuations in the process gas to produce a stable plasma flame.

Ein weiterer Plasmagenerator, der ein Plasma mit hohen Temperaturen erzeugt, wird in der deutschen Auslegeschrift 1 639 257 beschrieben. Dabei handelt es sich um einen Hochfrequenz-Plasmastrahlgenerator mit einem zylindrischen Rohr, an dessen einer Stirnseite das zu ionisierende Gas zu- und an dessen anderer Stirnseite das erzeugte Plasma ausströmt, einer Induktionsspule, deren eines Ende an Masse liegt und dessen anderes Ende mit einem Hochfrequenzgenerator verbunden ist. Zwischen den beiden Enden der Spule ist ein Abgriff angeordnet. Die in der Induktionsspule erzeugte Hochfrequenzspannung ist höher als die Erregerspannung. Das Rohr im Bereich des Plasma-Austritts ist aus Metall und an das auf Hochspannung liegende Ende der Induktionsspule gelegt. Das Rohr ist konzentrisch und elektrisch isoliert von einem metallischen Gehäuse umgeben. Durch die spezielle Anordnung findet die Gasentladung zwischen den beiden benachbarten Enden von Rohr und Gehäuse auf Grund einer kapazitiven Kopplung zwischen diesen beiden Bauteilen statt.Another plasma generator, which produces a plasma with high temperatures, is described in the German patent application 1 639 257 described. It is a high-frequency plasma jet generator with a cylindrical tube, on one end side of which to gas to be ionized and at the other end side of the generated plasma flows out, an induction coil whose one end is connected to ground and the other end is connected to a high-frequency generator. Between the two ends of the coil, a tap is arranged. The high-frequency voltage generated in the induction coil is higher than the excitation voltage. The tube in the area of the plasma outlet is made of metal and placed on the high-voltage end of the induction coil. The tube is concentrically and electrically isolated surrounded by a metallic housing. Due to the special arrangement, the gas discharge between the two adjacent ends of tube and housing takes place due to a capacitive coupling between these two components.

Dieser Generator ist aber für die Erzeugung eines kalten Normaldruckplasmas mindestens aufgrund seiner Elektrodenform nicht geeignet.However, this generator is not suitable for the generation of a cold normal pressure plasma at least due to its electrode shape.

Auch Niedertemperatur-Plasmen sind bereits bekannt und werden erfolgreich in zahlreichen Anwendungen zur Behandlung von Oberflächen zum Zweck der Oberflächenaktivierung (Veränderungen der Adhäsionseigenschaften, Hydrophobierung, Hydrophilierung) des Ätzens, der Polymerisation, zur Schichtabscheidung, zur Reinigung sowie zur Keimreduzierung eingesetzt. Allerdings wurden bisher für diese Prozesse vorrangig Niederdruckplasmen genutzt, in denen die für diese Anwendungen erforderlichen Radikale, angeregten Atome, Ionen, Elektronen sowie UV-Strahlung durch die Wahl geeigneter Prozessparameter in definiertem Maße erzeugt werden können. Niederdruckplasma-Verfahren sind jedoch sowohl aus Kostengründen als auch aus verfahrenstechnischen Gründen für zahlreiche industrielle Prozesse, bei denen eine entsprechende Oberflächenmodifikation erforderlich ist, nicht geeignet.Low-temperature plasmas are also already known and have been used successfully in numerous surface treatment applications for the purpose of surface activation (changes in the adhesion properties, hydrophobization, hydrophilization) of etching, of polymerization, of layer deposition, of cleaning and of germ reduction. However, low-pressure plasmas have been used to date for these processes, in which the radicals, excited atoms, ions, electrons and UV radiation required for these applications can be generated to a defined extent by the selection of suitable process parameters. Low-pressure plasma processes, however, are not suitable for numerous industrial processes in which a corresponding surface modification is required, both for cost reasons and for procedural reasons.

Ein Normaldruck-Plasmaverfahren, das bei relativ tiefer Temperatur Wasserdampf zu ionisieren vermag, ist in EP 0 124 623 beschrieben. Dieses Verfahren ist aber in der industriellen Fertigung kaum einsetzbar.A normal pressure plasma process that ionizes water vapor at a relatively low temperature can, is in EP 0 124 623 described. However, this method is hardly applicable in industrial production.

Um plasmatechnologische Verfahren der Oberflächenbehandlung für potenzielle Anwender aus diesen Bereichen der Industrie nutzbar zu machen, müssen geeignete nichtthermische Normaldruck-Plasmaverfahren entwickelt werden, die wesentlich kostengünstiger sind und sich in entsprechende Fertigungsstrecken integrieren lassen. Eine wesentliche Voraussetzung für die Anwendbarkeit von Normaldruck-Plasmenverfahren für diesen Anwendungsbereich ist die Erzeugung homogener Plasmen. Eine Möglichkeit, die erforderliche Homogenität zu erreichen, besteht darin, durch eine gerichtete Strömung des Arbeitsgases (Prozessgases) einen Plasmastrahl außerhalb des Entladungsraumes zu erzeugen.In order to make use of plasma technological surface treatment techniques for potential users of these industrial sectors, it is necessary to develop suitable non-thermal normal pressure plasma processes which are much less expensive and can be integrated into corresponding production lines. An essential requirement for the applicability of atmospheric pressure plasmas for this application is the generation of homogeneous plasmas. One way to achieve the required homogeneity is to generate a plasma jet outside the discharge space by a directed flow of the working gas (process gas).

Alle bekannten Arten von Entladungsplasmen, die unter Normaldruck-Bedingungen generiert werden, wie beispielsweise RF-Bogenentladungen, Funken-, Korona- und Barrierenentladungen, können durch die Realisierung geeigneter Prozessgasströmungen zur Erzeugung anisothermer Normaldruck-Strahlplasmen verwendet werden. Auf dieser Grundlage erzeugte Strahlplasmen sind Gegenstand verschiedener Patentschriften. So wird beispielsweise in der Patentschrift DE 3733492 eine Vorrichtung zur Erzeugung eines Strahlplasmas mittels Koronaentladung vorgestellt, die zur Plasmabehandlung von Oberflächen geeignet ist. Dabei wird ein Gasstrom durch eine Koronaentladungsstrecke zwischen einer stabförmigen Innen- und einer rohrförmigen Außenelektrode durchgeleitet. In der Patentschrift DE 19532412 wird ein Verfahren zur Plasmabehandlung von Oberflächen beschrieben, das auf der Erzeugung eines Plasmastrahls durch Bogenentladung mit nichtübertragenem Lichtbogen basiert. Gegenstand der Patenschriften US 6,194,036 , US 6,958,063 und US 6,262,523 sind Anordnungen auf der Grundlage der RF-Anregung von Normaldruck-Plasmen. In einem weiteren Patentdokument ( US 2002/122896 ) werden verschiedene Anordnungen zur Erzeugung von Normaldruck-Plasmen auf der Grundlage von RF-angeregten Entladungen in Röhrchen aus Isoliermaterial beschrieben. Im Bereich der Medizin werden Plasmen dieser Art für die Argon-Plasma-Koagulation ( US 4,781,175 , US 4,060,088 , DE 19513338 ), für Beschichtungen auf künstlichen Implantaten zur Erhöhung ihrer Biokompatibilität, zur Steuerung der Zelladhäsion auf Oberflächen, zur Entkeimung medizinischer Instrumente ( M. Laroussi: IEEE Trans. Plasma Sci. 30 4 (2002), 1409 ) sowie zur Behandlung biologischer Zellen und Gewebe ( E. Stoffels et al.: Plasma Sources Sci. Technol., 11 (2002), 383 ) eingesetzt.All known types of discharge plasmas generated under normal pressure conditions, such as RF arc discharges, spark, corona, and barrier discharges, can be used to produce anisotropic normal pressure jet plasmas by implementing suitable process gas flows. Beamplasmas produced on this basis are the subject of various patents. For example, in the patent DE 3733492 a device for generating a jet plasma by corona discharge presented, which is suitable for the plasma treatment of surfaces. In this case, a gas stream is passed through a corona discharge gap between a rod-shaped inner and a tubular outer electrode. In the patent DE 19532412 A method of surface plasma treatment based on the generation of a plasma arc by non-transferred arc discharge is described. Subject of the patent documents US 6,194,036 . US 6,958,063 and US 6,262,523 are arrangements based on the RF excitation of normal pressure plasmas. In another patent document ( US 2002/122896 ) will be different Arrangements for producing normal pressure plasmas based on RF excited discharges in tubes of insulating material are described. In the field of medicine, plasmas of this type are used for argon plasma coagulation ( US 4,781,175 . US 4,060,088 . DE 19513338 ), for coatings on artificial implants to increase their biocompatibility, for the control of cell adhesion to surfaces, for the sterilization of medical instruments ( M. Laroussi: IEEE Trans. Plasma Sci. 30 4 (2002), 1409 ) and for the treatment of biological cells and tissues ( E. Stoffels et al .: Plasma Sources Sci. Technol., 11 (2002), 383 ) used.

Die bisher in der Fach- bzw. Patentliteratur beschriebenen Anordnungen und Verfahren zur Oberflächenbehandlung mittels Normaldruck-Plasma sind Lösungen für eingeschränkte Aufgabenbereiche, die sich aufgrund ihrer speziellen Konstruktion und Arbeitsweise nicht bzw. nur bedingt an die Erfordernisse anderer Anwendungen anpassen lassen. Da die Aufgaben und Zielstellungen der Plasmabehandlung von Oberflächen sehr vielfältig sind, ist eine Lösung anzustreben, die eine derartige Adaption an unterschiedliche Erfordernisse hinsichtlich des zu behandelnden Materials oder Produktes bzw. des gewünschten Effektes auf der zu behandelnden Oberfläche ermöglicht. Anordnungen zur Erzeugung von Normaldruck-Plasmen auf der Grundlage von RF-angeregten Entladungen haben den Vorteil, dass sie einerseits bei festen Frequenzen betrieben werden können(13,56 MHz, 27,12 MHz, 40,68 MHz), die für industrielle Anwendungen freigegeben sind, und andererseits bei kleineren Spannungen erzeugt werden können. Sie haben allerdings auch einen wesentlichen Nachteil, der im Folgenden erläutert werden soll.The arrangements and methods for surface treatment by means of normal pressure plasma described hitherto in the technical or patent literature are solutions for limited tasks, which can not or only partially be adapted to the requirements of other applications due to their special construction and operation. Since the tasks and objectives of the plasma treatment of surfaces are very diverse, a solution is to be sought, which allows such an adaptation to different requirements with regard to the material or product to be treated or the desired effect on the surface to be treated. Arrangements for generating normal pressure plasmas based on RF-excited discharges have the advantage that they can be operated at fixed frequencies (13.56 MHz, 27.12 MHz, 40.68 MHz), which are released for industrial applications and on the other hand can be generated at lower voltages. However, they also have a significant disadvantage, which will be explained below.

Hochfrequenzbetriebene Plasmareaktoren benötigen zur maximalen Leistungsübertragung aus dem sie speisenden RF-Generator ein Anpassungsnetzwerk (Matchbox). Eine oft verwendete Schaltungsform in der Matchbox ist die n - Schaltung. Sie besteht aus zwei Kondensatoren C1 und C2 und einer Spule (s. Fig. 1). Um die Verluste in der Matchbox niedrig zu halten, werden Kondensatoren mit Luft als Dielektrikum verwendet, die ein großes Volumen einnehmen. Da der Stromtransport bei diesen Frequenzen in der Hauptsache auf der Oberfläche eines elektrischen Leiters erfolgt (Skineffekt), bestehen die Spule und alle anderen elektrischen Zuführungen aus einem relativ dicken Metalldraht mit hoher elektrischer Leitfähigkeit auf der Oberfläche (Silberdraht, versilberter Kupferdraht). Dadurch bedingt ist eine solche Matchbox im Allgemeinen sehr voluminös. Zur Zündung und Aufrechterhaltung einer Gasentladung in dem Plasmareaktor werden hohe Spannungen benötigt. Diese werden in der Matchbox erreicht und zwar dadurch, dass die Spule und der Kondensator C2 einen Reihenresonanzkreis bilden, der auf die jeweilig verwendete Frequenz des RF-Generators abgestimmt sein muss. Zur Verhinderung von Verlusten sollte die Zuleitung Z2 aus einer ungeschirmten Leitung bestehen und so kurz wie möglich gehalten werden. Dadurch bilden die Matchbox und der Plasmareaktor faktisch eine relativ starre, unhandliche Einheit. Will man als Plasmareaktor eine handliche Plasmadüse realisieren, die beispielsweise durch einen Roboter geführt werden kann, so ist ein derart unhandlicher Plasmareaktor unbrauchbar.High-frequency operated plasma reactors require a matching network (matchbox) for maximum power transmission from their RF generator. An often used circuit in the Matchbox is the n - circuit. It consists of two capacitors C1 and C2 and a coil (s. Fig. 1 ). In order to keep losses in the matchbox low, capacitors with air as a dielectric are used, which occupy a large volume. Since the current transport at these frequencies takes place mainly on the surface of an electrical conductor (skin effect), the coil and all other electrical leads consist of a relatively thick metal wire with high electrical conductivity on the surface (silver wire, silver-plated copper wire). As a result, such a matchbox is generally very voluminous. To ignite and maintain a gas discharge in the plasma reactor, high voltages are needed. These are achieved in the matchbox by the fact that the coil and the capacitor C2 form a series resonant circuit, which must be matched to the particular frequency of the RF generator used. To prevent losses, the supply line Z2 should consist of an unshielded cable and should be kept as short as possible. As a result, the matchbox and the plasma reactor actually form a relatively rigid, unwieldy unit. If you want to realize a handy plasma nozzle as a plasma reactor, which can be performed for example by a robot, such a bulky plasma reactor is useless.

Der Erfindung liegt deshalb die Aufgabe zugrunde, eine handliche Plasmadüse zu realisieren, die auch von Hand und/oder durch Roboter geführt werden kann.The invention is therefore based on the object to realize a handy plasma nozzle, which can also be performed by hand and / or by robots.

Darstellung der ErfindungPresentation of the invention

Im Rahmen der vorliegenden Erfindung wurde nun gefunden, dass eine sehr handliche Plasmadüse erhalten werden kann, wenn auf ein Anpassungsnetzwerk in Form einer separaten Matchbox verzichtet wird. Erfindungsgemäß werden deshalb die Spule und der Kondensator C2 in die Plasmadüse integriert. Ein allenfalls benötigter Kondensator C1 kann irgendwo zwischen dem Generator und der Plasmadüse angeordnet sein, vorzugsweise aber wird der Kondensator C1 unmittelbar am Generator außerhalb (kurze Zuleitung) oder direkt innerhalb positioniert. Dadurch werden folgende Verbesserungen erreicht:

  1. 1. Die Zuleitung Z1 (Koaxialkabel) vom Generator zur Plasmadüse kann wesentlich flexibler und länger gestaltet werden als dies für die Zuleitung Z2 gemäss Stand der Technik jemals möglich gewesen wäre.
  2. 2. Änderungen in der Länge der Zuleitung Z1 sind mit Änderungen in der Kabelkapazität verbunden, die durch Änderung von C1 kompensiert werden können.
  3. 3. Die Zuleitung Z2 wird durch das Spulenende zur Elektrode E1 gebildet und kann deshalb extrem kurz gestaltet werden.
  4. 4. Die zwischen den Elektroden E1 und E2 gebildete Kapazität liegt parallel zu C2. Änderungen dieser Kapazität durch Toleranzen in der Herstellung der Plasmadüse oder bei Zündung des Plasmas können durch Veränderung von C2 kompensiert werden, so dass die Resonanzbedingung erhalten bleibt.
  5. 5. Durch die sehr kurze Zuleitung Z2 wird automatisch die Gesamtkapazität, gebildet aus der Kapazität C2 und der Kapazität zwischen E1 und E2, klein gehalten, so dass die Induktivität L entsprechend der Festfrequenz maximal gewählt werden kann und somit eine hohe Güte des Reihenresonanzkreises (Erzeugung einer hohen Spannungsüberhöhung) erreicht werden kann.
In the context of the present invention, it has now been found that a very handy plasma nozzle can be obtained if an adaptation network in the form of a separate matchbox is dispensed with. Therefore, according to the invention, the coil and the capacitor C2 are integrated into the plasma nozzle. A possibly required capacitor C1 may be located anywhere between the generator and the plasma nozzle, but preferably the capacitor C1 is positioned directly on the generator outside (short lead) or directly inside. This achieves the following improvements:
  1. 1. The supply line Z1 (coaxial cable) from the generator to the plasma nozzle can be made much more flexible and longer than would ever have been possible for the lead Z2 according to the prior art.
  2. 2. Changes in the length of lead Z1 are associated with changes in the cable capacitance, which can be compensated by changing C1.
  3. 3. The supply line Z2 is formed by the coil end to the electrode E1 and can therefore be made extremely short.
  4. 4. The capacitance formed between the electrodes E1 and E2 is parallel to C2. Changes in this capacity due to tolerances in the production of the plasma nozzle or upon ignition of the plasma can be compensated for by changing C2, so that the resonance condition is maintained.
  5. 5. Due to the very short supply line Z2, the total capacity, formed by the capacitance C2 and the capacitance between E1 and E2, is automatically kept small so that the inductance L can be maximally selected according to the fixed frequency and thus a high quality of the series resonant circuit (generation a high voltage overshoot) can be achieved.

Das erfindungsgemässe Plasmawerkzeug für die Erzeugung eines kalten Plasmastrahls umfasst eine Plasmadüse mit einem Hohlkörper für die Zuführung eines Prozessgases oder eines Prozessgasgemisches, einen Frequenzgenerator und ein aus mindestens einer Spule und einem Kondensator C2 und gegebenenfalls einem Kondensator C1 bestehendes Anpassungsnetzwerk zur Erzeugung der benötigten Spannung und ist dadurch gekennzeichnet, dass vom Anpassungsnetzwerk mindestens die Spule und der Kondensator C2 in die Plasmadüse integriert sind.The plasma tool according to the invention for the generation of a cold plasma jet comprises a plasma nozzle with a hollow body for the supply of a process gas or a process gas mixture, a Frequency generator and consisting of at least one coil and a capacitor C2 and optionally a capacitor C1 matching network for generating the required voltage and is characterized in that the matching network at least the coil and the capacitor C2 are integrated into the plasma nozzle.

Insbesondere bei einer Plasmadüse, die mit einem Festfrequenz-RF-Generator (13.56 MHz; 27.12 MHz; 40.68 MHz) betrieben wird, sind vom Anpassungsnetzwerk die Spule L und der Kondensator C2 in die Plasmadüse integriert.In particular, in a plasma nozzle operated with a fixed frequency RF generator (13.56 MHz, 27.12 MHz, 40.68 MHz), the matching network integrates the coil L and the capacitor C2 into the plasma nozzle.

Der Kondensator C1 des Anpassungsnetzwerks kann direkt an oder im Frequenzgenerator angeordnet sein und er ist vorteilhafterweise dort angeordnet.The capacitor C1 of the matching network can be arranged directly on or in the frequency generator and is advantageously arranged there.

In einer speziellen Ausführungsform enthält die Plasmadüse eine Kapillare aus isolierendem Material und die Spule ist um diese Kapillare herum angeordnet.In a specific embodiment, the plasma nozzle contains a capillary made of insulating material and the coil is arranged around this capillary.

In einer speziell bevorzugten Ausführungsform, in der der Frequenzgenerator ein Hochfrequenzgenerator ist, besteht das Anpassungsnetzwerk (Matchbox) aus einer Spule und zwei Kondensatoren C1 und C2 mit deren Verbindungen. Die Spule und der Kondensator C2 sind in die Plasmadüse integriert und der Kondensator C1 ist direkt am oder im Generator angeordnet.In a particularly preferred embodiment in which the frequency generator is a high frequency generator, the matching network (matchbox) consists of a coil and two capacitors C1 and C2 with their connections. The coil and the capacitor C2 are integrated in the plasma nozzle and the capacitor C1 is arranged directly on or in the generator.

Obschon diese Beschreibung lediglich zwei Kondensatoren C1 und C2 nennt, wird hier klar festgehalten, dass die Kondensatoren C1 und C2 aus mehreren Teilkondensatoren aufgebaut sein können und dass solche aus Teilkondensatoren aufgebaute Kondensatoren im Rahmen dieser Erfindung ebenfalls als C1 und C2 bezeichnet werden.Although this description only mentions two capacitors C1 and C2, it is clearly stated here that the capacitors C1 and C2 can be made up of several partial capacitors and that capacitors constructed from partial capacitors are also referred to as C1 and C2 in the context of this invention.

Ebenfalls Gegenstand der vorliegenden Erfindung ist eine Plasmadüse, in die mindestens eine Spule und ein Kondensator C2 integriert sind. Diese können, wie oben beschrieben und in den Ausführungsbeispielen resp. den Figuren gezeigt, eingebaut sein.Likewise provided by the present invention is a plasma nozzle into which at least one coil and a capacitor C2 are integrated. These can, as described above and in the embodiments resp. the figures shown to be installed.

Beschrieben aber nicht Gegenstand der vorliegenden Erfindung ist ein Frequenzgenerator, in den entweder ein als Kondensator C1 eines Anpassungsnetzwerkes geeigneter Kondensator integriert oder unmittelbar am Ausgang des Generators montiert ist.Described but not the subject of the present invention is a frequency generator, in which either a capacitor suitable as capacitor C1 of a matching network capacitor integrated or mounted directly on the output of the generator.

Wie bereits oben beschrieben, bezieht sich die Ausführungsform mit einem Kondensator C1 und einem Kondensator C2 insbesondere auf kommerziell erhältliche RF-Generatoren mit einer Festfrequenz, wie sie z.B. in Deutschland von der Post für technische Belange freigegeben sind. Eine Vereinfachung und damit auch kostengünstigere Variante der Kombination RF-Generator - Plasmadüse ergibt sich beim Übergang zu niedrigeren Frequenzen (z.B. 3 MHz) und bei Verwendung eines Generators mit variabler Frequenz. Bei einer solchen Ausführungsform, die nicht Gegenstand der vorliegenden Erfindung ist, können beide Kondensatoren C1 und C2 entfallen, so dass sich vom Anpassungsnetzwerk in der Plasmadüse neben einem Teil der Leitungen nur noch die Spule befindet, die zusammen mit dem durch die Elektroden E1 und E2 gebildeten Kondensator einen Reihenschwingkreis bildet. In dieser Ausführungsform kann der Resonanzzustand durch Variation der Generatorfrequenz eingestellt werden.As already described above, the embodiment with a capacitor C1 and a capacitor C2 relates in particular to commercially available RF generators having a fixed frequency, as described e.g. in Germany are released by the post office for technical concerns. A simplification, and therefore cheaper, of the combination RF generator - plasma nozzle results in the transition to lower frequencies (e.g., 3 MHz) and using a variable frequency generator. In such an embodiment, which is not the subject of the present invention, both capacitors C1 and C2 can be dispensed with, so that apart from a part of the lines of the matching network in the plasma nozzle only the coil remains, which together with that through the electrodes E1 and E2 formed capacitor forms a series resonant circuit. In this embodiment, the resonance state can be adjusted by varying the generator frequency.

Eine erfindungsgemässe Plasmadüse umfasst im allgemeinen einen körperseitig, d.h. auf der dem Plasma resp. der Düse abgewandten Seite der Plasmadüse, mit einer Prozessgaszuführung verbundenen Hohlkörper. Dieser Hohlkörper besteht vorzugsweise aus Isoliermaterial. In einer besonders platzsparenden Variante ist die einen Teil des Anpassungsnetzwerkes bildende Spule um einen Teil dieses Hohlkörpers herum angeordnet. Die Abmessungen des Hohlkörpers, oder diese Abmessungen zusammen mit einem weiteren Körper, vorzugsweise einem Isolierkörper, sind derart zu wählen, dass die Spule mit gewünschtem Windungsdurchmesser darauf angeordnet werden kann. Diese Spule muss - sofern der Hohlkörper oder weitere Körper, auf dem sie angeordnet ist, nicht aus Isoliermaterial besteht, selbst isoliert sein. Diese Spule ist düsenseitig mit einer Elektrode E1 und gegebenenfalls einem variablen Kondensator C2 verbunden. Die Elektrode E1 kann wahlweise eine um den isolierenden Hohlkörper herum angeordnete Ringelektrode oder eine in dem Hohlkörper angeordnete Stabelektrode sein. Der Kondensator C2 und die Spule sind in Reihe geschaltet, so dass sich damit die bei gegebener Frequenz benötigte Spannung einstellen lässt. Auf der der Spule abgewandten Seite ist der Kondensator C2 mit dem geerdeten Gehäuse verbunden. In einem für die Plasmaerzeugung geeigneten Abstand von der ersten Elektrode E1 und am düsenseitigen Ende des Hohlkörpers auf diesem angeordnet ist eine Ringelektrode E2, die mit dem geerdeten Gehäuse verbunden ist. Dieses Gehäuse weist Zuführungen für den elektrischen Strom und Zuführungsöffnungen für das Prozessgas auf sowie eine Austrittsöffnung für das Plasma innerhalb der zweiten Elektrode E2. Zwischen der Spule und dem geerdeten Gehäuse ist eine weitere Isolierschicht vorhanden, die insbesondere bei geringem Zwischenraum zwischen der Spule und dem Gehäuse wichtig ist. Die Verbindungsleitung zwischen der Elektrode E1 und dem Kondensator C2 liegt üblicherweise spulenseitig auf der das Gehäuse abschirmenden Isolierung auf und ist ihrerseits mit einer Isolierschicht versehen.A plasma nozzle according to the invention generally comprises a body side, ie on the plasma respectively. the nozzle facing away from the plasma nozzle, with a hollow body connected to a process gas supply. This hollow body is preferably made of insulating material. In a particularly space-saving variant, the coil forming part of the matching network is arranged around a part of this hollow body. The dimensions of the hollow body, or these dimensions together with another body, preferably an insulating body, are to be chosen such that the coil with the desired winding diameter can be arranged thereon. This coil must - if the hollow body or other body on which it is arranged, not made of insulating material, be self-insulated. This coil is connected to the nozzle side with an electrode E1 and optionally a variable capacitor C2. The electrode E1 may optionally be a ring electrode arranged around the insulating hollow body or a rod electrode arranged in the hollow body. The capacitor C2 and the coil are connected in series, so that it can adjust the voltage required at a given frequency. On the side facing away from the coil, the capacitor C2 is connected to the grounded housing. In a suitable for plasma generation distance from the first electrode E1 and arranged at the nozzle end of the hollow body thereon is a ring electrode E2, which is connected to the grounded housing. This housing has feeds for the electric current and feed openings for the process gas and a discharge opening for the plasma within the second electrode E2. Between the coil and the grounded housing there is a further insulating layer, which is important in particular with a small clearance between the coil and the housing. The connecting line between the electrode E1 and the capacitor C2 is usually on the coil side on the housing shielding insulation and in turn provided with an insulating layer.

Für die Erzeugung eines kalten Plasmas ist es wichtig, dass die beiden Elektroden E1 und E2 gut gegeneinander isoliert sind. Dadurch wird die Ausbildung einer Bogenentladung verhindert, die zu einer ungewollten Aufheizung des Plasmas führen würde.For the generation of a cold plasma, it is important that the two electrodes E1 and E2 are well insulated from each other. As a result, the formation of an arc discharge is prevented, which would lead to an unwanted heating of the plasma.

Beispiele für geeignete Isoliermaterialien sind Kunststoff, Quarzglas, Keramik etc., die einzeln oder in Kombination verwendet werden können.Examples of suitable insulating materials are plastic, quartz glass, ceramics, etc., which may be used singly or in combination.

Da der Strom in der Spule primär über die Oberfläche fliesst, ist ein Material mit hoher Leitfähigkeit zumindest an der Oberfläche bevorzugt, wie versilberter Kupferdraht oder reiner Silberdraht.Since the current in the coil flows primarily over the surface, a material with high conductivity is preferred at least on the surface, such as silver-plated copper wire or pure silver wire.

Kurze Beschreibung der ZeichnungenBrief description of the drawings

Weitere Ausgestaltungen, Vorteile und Anwendungen der Erfindung ergeben sich aus den abhängigen Ansprüchen und aus der nun folgenden Beschreibung anhand der Figuren.

  • Figur 1 zeigt die generelle Beschaltung eines RF-betriebenen, kapazitiv gekoppelten Plasmawerkzeuges, wobei Figur 1a) den Plasmareaktor allgemein und Figur 1b) die Plasmadüse darstellen.
  • Figur 2 zeigt eine erfindungsgemäße Ausführungsform, bei der die Spule L und der Kondensator C2 in den Generator resp. die Düse integriert sind.
  • Figur 3 zeigt eine weitere nicht unter den Gegenstand der Erfindung fallende Ausführungsform mit einem Generator mit variabler Frequenz, bei der die Kondensatoren C1 und C2 entfallen können.
  • Figur 4 zeigt eine erfindungsgemässe Plasmadüse mit RF-Ringelektrode.
  • Figur 5 zeigt eine erfindungsgemässe Plasmadüse mit RF-Stabelektrode.
  • Figur 6 zeigt eine erfindungsgemässe Plasma-Breitstrahldüse mit RF-Ringelektrode.
Further embodiments, advantages and applications of the invention will become apparent from the dependent claims and from the following description with reference to FIGS.
  • FIG. 1 shows the general wiring of an RF-powered capacitively coupled plasma tool, wherein FIG. 1a ) the plasma reactor in general and FIG. 1b ) represent the plasma nozzle.
  • FIG. 2 shows an embodiment of the invention, in which the coil L and the capacitor C2 in the generator resp. the nozzle are integrated.
  • FIG. 3 shows another not falling under the subject invention embodiment with a generator with variable frequency, in which the capacitors C1 and C2 may be omitted.
  • FIG. 4 shows a plasma nozzle according to the invention with RF ring electrode.
  • FIG. 5 shows a plasma nozzle according to the invention with RF rod electrode.
  • FIG. 6 shows a plasma broad-jet nozzle according to the invention with RF ring electrode.

FigurenlegendeFigure Legend

Die Bezugszeichen in den Figuren haben allgemein die folgende Bedeutung:

1
Kapillarentladung
2
Elektrode
3
RF-Elektrode
4
Hohlkörper (Kapillare), vorzugsweise aus Isoliermaterial
5
Isolierkörper
6
Spule (auch als L bezeichnet)
7
RF-Eingang
8
Gehäuse
9
Prozessgas
10
Strahlplasma / Plasmazone
11
RF Generator
12
Matchbox
13
Plasmareaktor
14
Plasmadüse (Plasmareaktor)
The reference numbers in the figures generally have the following meaning:
1
capillary discharge
2
electrode
3
RF electrode
4
Hollow body (capillary), preferably made of insulating material
5
insulator
6
Coil (also referred to as L)
7
RF input
8th
casing
9
process gas
10
Jet plasma / plasma zone
11
RF generator
12
Matchbox
13
plasma reactor
14
Plasma nozzle (plasma reactor)

Weg(e) zur Ausführung der ErfindungWay (s) for carrying out the invention

Die in Figur 1 dargestellten Ausführungsformen des Stands der Technik beziehen sich insbesondere auf kommerziell erhältliche RF-Generatoren mit einer Festfrequenz.In the FIG. 1 Illustrated embodiments of the prior art relate in particular to commercially available RF generators with a fixed frequency.

In der erfindungsgemässen Ausführungsform, die in Figur 2 dargestellt ist, wurde das Anpassungsnetzwerk, die Matchbox, aufgetrennt, wobei der Kondensator C1 im RF-Generator und der Kondensator C2 sowie die Spule in die Plasmadüse integriert wurden. Eine Vereinfachung und damit auch eine kostengünstigere Variante der Kombination RF-Generator - Plasmadüse ergibt sich beim Übergang zu niedrigeren Frequenzen (z.B. 3 MHz) und bei Verwendung eines Generators mit variabler Frequenz. Diese Variante, bei der beide Kondensatoren C1 und C2 entfallen können, so dass sich in der Plasmadüse nur noch die Spule befindet, die zusammen mit dem durch die Elektroden E1 und E2 gebildeten Kondensator einen Reihenschwingkreis bildet, und die nicht Gegenstand der vorliegenden Erfindung ist, ist in Figur 3 dargestellt. In dieser Ausführungsform wird der Resonanzzustand durch Variation der Generatorfrequenz eingestellt.In the inventive embodiment, the in FIG. 2 2, the matching network, the matchbox, has been separated, with the capacitor C1 in the RF generator and capacitor C2 and the coil integrated into the plasma nozzle. A simplification and thus a more cost-effective variant of the combination RF generator - plasma nozzle results in the transition to lower frequencies (eg 3 MHz) and when using a generator with variable frequency. This variant, in which both capacitors C1 and C2 can be omitted, so that in the plasma nozzle only the coil is still, which forms a series resonant circuit together with the capacitor formed by the electrodes E1 and E2, and which is not the subject of the present invention, is in FIG. 3 shown. In this embodiment, the resonance state is adjusted by varying the generator frequency.

In Fig. 4 ist ein Ausführungsbeispiel für eine Plasmadüse mit einer kapazitiv gekoppelten Kapillarentladung 1 gezeigt. Zwei metallische Ringelektroden 2, 3 sind in geeignetem Abstand auf einem Hohlkörper aus Isoliermaterial (Dielektrikum) 4 angebracht. Auf einen, den Hohlkörper 4 umschließenden Isolierkörper 5, ist eine Spule 6 gewickelt, die an einem Ende mit der RF-Elektrode 3 und an dem anderen Ende mit dem RF-Eingang 7 der Plasmadüse verbunden ist. Die RF-Elektrode 3 ist über einen Luft-Drehkondensator C2 mit dem geerdeten Gehäuse 8 verbunden. Über den Hohlkörper 4 wird das Prozessgas 9 (bevorzugt Edelgas) der Entladungszone zwischen den beiden Elektroden 2 und 3 zugeführt. Beide Elektroden 2 und 3 sowie das Dielektrikum 4 bilden eine Kapazität (einige pF), die parallel zu C2 liegt. Die Spule 6 bildet mit diesen Kapazitäten einen Reihenresonanzkreis und kann über C2 auf maximale Spannung an der Elektrode 3 abgeglichen werden. Ist über den Abgleich mit C2 eine ausreichend hohe Spannung an der Elektrode 3 erreicht worden, führt das zwischen den Elektroden 3 und 2 aufgebaute elektrische Feld zu einer Kapillarentladung, deren Plasma durch den Gasstrom 9 nach außen getrieben wird und ein Strahlplasma 10 bildet. Um den Spannungsabfall über dem Kondensator, gebildet aus der Elektrode 3, dem Dielektrikum 4 und dem Plasma innerhalb der Kapillare, klein zu halten, sollte ein Dielektrikum mit möglichst hoher Dielektrizitätskonstante gewählt werden.In Fig. 4 an embodiment for a plasma nozzle with a capacitively coupled capillary discharge 1 is shown. Two metallic ring electrodes 2, 3 are mounted at a suitable distance on a hollow body made of insulating material (dielectric) 4. On one, the hollow body 4 enclosing insulator 5, a coil 6 is wound, which is connected at one end to the RF electrode 3 and at the other end to the RF input 7 of the plasma nozzle. The RF electrode 3 is connected to the grounded case 8 via a rotary air capacitor C2. Via the hollow body 4, the process gas 9 (preferably noble gas) is fed to the discharge zone between the two electrodes 2 and 3. Both electrodes 2 and 3 and the dielectric 4 form a capacitance (a few pF), the parallel to C2. The coil 6 forms a series resonant circuit with these capacitances and can be adjusted via C2 to maximum voltage at the electrode 3. If a sufficiently high voltage at the electrode 3 has been reached via the calibration with C2, the electric field built up between the electrodes 3 and 2 leads to a capillary discharge whose plasma is driven outward by the gas flow 9 and forms a jet plasma 10. In order to keep the voltage drop across the capacitor, formed by the electrode 3, the dielectric 4 and the plasma inside the capillary, small, a dielectric with the highest possible dielectric constant should be selected.

Geeignete Abmessungen und Materialien für die in Figur 4 beschriebene Ausführungsform sind:Suitable dimensions and materials for the embodiment described in FIG. 4 are:

  • Breite der metallischen Ringelektroden: 5mmWidth of metallic ring electrodes: 5mm
  • Abstand der metallischen Ringelektroden: 5 mmDistance between the metallic ring electrodes: 5 mm
  • Material der metallischen Ringelektroden: EdelstahlMaterial of metallic ring electrodes: stainless steel
  • Dimensionen des Hohlkörper aus Isoliermaterial (Kapillare): Außendurchmesser 3mm, Innendurchmesser 1mmDimensions of the hollow body made of insulating material (capillary): outer diameter 3mm, inner diameter 1mm
  • Gasstrom: 2 bis 10 slm (Standard Liter pro Minute).Gas flow: 2 to 10 slm (standard liters per minute).
  • Beispiele für Prozessgase: Edelgase, wie Argon und HeliumExamples of process gases: noble gases, such as argon and helium
  • Beispiele für Beimengungen zu Prozessgasen: Stickstoff, SauerstoffExamples of additions to process gases: nitrogen, oxygen
  • Dielektrikum mit möglichst hoher Dielektrizitätskonstante, z.B. QuarzglasDielectric with the highest possible dielectric constant, e.g. quartz glass
Werte, die für einen RF-Generator mit einer Festfrequenz von z.B. 27,12 MHz geeignet/bevorzugt sind:Values suitable for an RF generator with a fixed frequency of e.g. 27.12 MHz suitable / preferred are:

  • Stärke der durch beide Elektroden 2 und 3 sowie das Dielektrikum 4 gebildeten und parallel zu C2 liegenden Kapazität: einige pFThe strength of the capacitance formed by both electrodes 2 and 3 as well as the dielectric 4 and lying parallel to C2: a few pF
  • Induktivität der Spule 1.9 µHInductance of the coil 1.9 μH
  • Kondensator C2: Abstimmbar im Bereich von 5 bis 30 pF.Capacitor C2: Tunable in the range of 5 to 30 pF.
  • Kondensator C1: 350 pFCapacitor C1: 350 pF

In Fig. 5 ist ein weiteres Ausführungsbeispiel einer Plasmadüse mit einer Kapillarentladung 1 gezeigt. Im Gegensatz zu der oben beschriebenen Variante wird hier die RF-Energie über eine Stabelektrode 3 in die Kapillarentladung eingekoppelt. Die Stabelektrode sollte aus Materialien mit geringer Austrittsarbeit bestehen, um so den Spannungsbedarf für die Kapillarentladung niedrig zu halten. Ebenfalls sollte sie nach vorn spitz verlaufen, um so eine hohe Feldstärke zu erreichen. Zwischen der Spitze und der geerdeten Elektrode 2 bildet sich bei genügend hohen Spannungen eine Kapillarentladung aus, deren Plasma wiederum durch den Gasstrom nach außen geblasen wird.In Fig. 5 a further embodiment of a plasma nozzle with a capillary discharge 1 is shown. In contrast to the variant described above, here the RF energy is coupled via a rod electrode 3 into the capillary discharge. The rod electrode should be made of low work function materials to minimize the voltage needed for capillary discharge. She should also be pointed forward, so as to achieve a high field strength. Between the tip and the grounded electrode 2, at sufficiently high voltages, a capillary discharge is formed, the plasma of which is in turn blown outward by the gas flow.

Wesentliche Dimensionen/Materialien, die in dieser Ausführungsform anders sind als in der oben und in Figur 4 beschriebenen, sind:Essential dimensions / materials other than those described in the above and in FIG. 4 in this embodiment are:

  • Hohlkörper aus Isoliermaterial (Kapillare) 4: Außendurchmesser 6mm, Innendurchmesser 2mm.Hollow body made of insulating material (capillary) 4: outer diameter 6mm, inner diameter 2mm.
  • Abstand Spitze der Stabelektrode zum Ende der Kapillare 4: 1mmDistance tip of the rod electrode to the end of the capillary 4: 1mm
  • Durchmesser der Stabelektrode: 1mmDiameter of the stick electrode: 1mm
  • Material der Stabelektrode: Wolfram.Material of the rod electrode: Tungsten.

In Fig. 6 ist eine modifizierte Variante der Plasmadüse gezeigt. Die Entladung wird wiederum zwischen den Elektroden 2 und 3 erzeugt und tritt durch einen Schlitz in die Atmosphäre ein. Bei einem Schlitz von 0,8 mm Breite und 4 cm Länge kann mit dieser Anordnung ein linear ausgedehntes Plasma von 4 cm Breite erzeugt werden.In Fig. 6 a modified variant of the plasma nozzle is shown. The discharge is again generated between the electrodes 2 and 3 and enters the atmosphere through a slot. With a slot of 0.8 mm width and 4 cm length can be generated with this arrangement, a linearly expanded plasma of 4 cm width.

In allen beschriebenen Beispielen wird in einem von einem Prozessgas durchströmten Hohlkörper aus Isoliermaterial, wie beispielsweise Kunststoff, Quarzglas, Keramik etc.(in der obigen Beschreibung als "Plasmadüse" bezeichnet) mittels einer RF-Entladung ein durch eine Düse ausströmendes, gerichtetes Normaldruck-Strahlplasma mit den angestrebten Eigenschaften (beispielsweise nichtthermisch, potentialfrei, homogen und reaktiv) erzeugt, dem die zu behandelnde Oberfläche in geeignetem Abstand von der Düse ausgesetzt wird, um deren gewünschte physikalisch-chemische Veränderung zu erzielen. Die Bedingungen im Strahlplasma-Bereich können durch Änderung der geometrische Anordnungen und der Abmessungen innerhalb der Plasmadüse, durch die Verwendung anderer Prozessgase, deren Beimengungen und Strömungsgeschwindigkeiten, durch die Anordnung und Wahl der Elektroden, durch die Art der Zündung und/oder durch Variation der elektrischen Parameter der Entladung gesteuert werden.In all examples described, in a hollow body through which a process gas flows, insulating material, such as, for example, plastic, Quartz glass, ceramics, etc. (referred to in the above description as "plasma nozzle") by means of an RF discharge generated by a nozzle, directed normal pressure jet plasma with the desired properties (for example, non-thermal, floating, homogeneous and reactive) to which the The surface to be treated is exposed at a suitable distance from the nozzle in order to achieve its desired physicochemical change. The conditions in the jet plasma region can be changed by changing the geometrical arrangements and the dimensions inside the plasma nozzle, by using other process gases, their admixtures and flow velocities, by the arrangement and choice of the electrodes, by the kind of ignition and / or by variation of the electrical Parameters of the discharge are controlled.

Die physikalischen Grundlagen für die Wahl der Dimensionen innerhalb der Düse sowie die Festlegung geeigneter Betriebsbedingungen sind dem Fachmann auf dem Gebiet der Plasmatechnologie bekannt.The physical principles for the choice of dimensions within the nozzle as well as the definition of suitable operating conditions are known to those skilled in the field of plasma technology.

Während in der vorliegenden Anmeldung bevorzugte Ausführungen der Erfindung beschrieben sind, ist klar darauf hinzuweisen, dass die Erfindung nicht auf diese Beschränkt ist und in auch anderer Weise innerhalb des Umfangs der folgenden Ansprüche ausgeführt werden kann.While preferred embodiments of the invention are described in the present application, it is to be understood that the invention is not limited thereto and may be embodied otherwise within the scope of the following claims.

Claims (10)

  1. Plasma tool for generating a cold plasma beam with a plasma nozzle comprising a hollow body (4) for supplying process gas, a frequency generator and an adjustment circuit for generating the required voltage comprising a coil (6), a capacitor (C2) and if necessary a capacitor (C1), characterized in that the coil (6) and the condenser (C2) of the adjustment circuit are integrated into the plasma nozzle.
  2. Plasma tool according to claim 1, with a plasma nozzle comprising two electrodes, E1 and E2, wherein the electrode E1 is optionally a ring electrode arranged around an isolating hollow body or a rod electrode arranged inside the hollow body and the electrode E2 is a ring electrode arranged at the nozzle-sided end of the hollow body (4) and on it at a distance which is appropriate for plasma generation, being connected to the grounded casing.
  3. Plasma tool according to one of the preceding claims, characterized in that the adjustment circuit comprises a capacitor C1 and in that the capacitor C1 of the adjustment circuit is arranged directly on or inside the frequency generator.
  4. Plasma tool according to one of the preceding claims, characterized in that the coil (6) is arranged around the hollow body (4) and preferably lies on this hollow body or on an isolating body (5) additionally surrounding this hollow body.
  5. Plasma tool according to one of the preceding claims, characterized in that the generator is a fixed frequency RF generator, in that the adjustment circuit consists of a coil (6) and two capacitors C1 and
    C2 with their connections and in that the coil (6) and the capacitor C2 are integrated in the plasma nozzle and in that the capacitor C1 is arranged on or inside the generator.
  6. Plasma tool according to one of the preceding claims, characterized in that the frequency generator is a generator which is adjustable with respect to frequency and the adjustment circuit consists of a coil (6) with connections, wherein the coil (6) is integrated into the plasma nozzle.
  7. Plasma tool according to one of the preceding claims, characterized in that the adjustment circuit consists of a coil (6), the connections and either capacitor C1 or capacitor C2.
  8. Plasma tool according to one of the preceding claims, characterized in that the plasma nozzle is dimensioned in such a way that it can be held in one hand during its use, particularly a plasma nozzle with the following dimensions:
    Diameter: 2 cm,
    Length: 17 cm,
    Length of the plasma zone: up to 1 cm.
  9. Plasma tool according to one of the preceding claims, characterized in that the hollow body consists of isolating material.
  10. Plasma nozzle, particularly a plasma nozzle for manual operation, characterized in that it comprises the coil (6) and the capacitor C2 of an adjustment circuit as described in one of the preceding claims.
EP07724599.1A 2006-04-27 2007-04-26 Cold plasma hand set for plasma treatment of surfaces Active EP2016809B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL07724599T PL2016809T3 (en) 2006-04-27 2007-04-26 Cold plasma hand set for plasma treatment of surfaces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006019664.3A DE102006019664B4 (en) 2006-04-27 2006-04-27 Cold plasma hand-held device for the plasma treatment of surfaces
PCT/EP2007/003669 WO2007124910A2 (en) 2006-04-27 2007-04-26 Cold plasma implement for plasma treatment of surfaces

Publications (2)

Publication Number Publication Date
EP2016809A2 EP2016809A2 (en) 2009-01-21
EP2016809B1 true EP2016809B1 (en) 2015-07-01

Family

ID=38472082

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07724599.1A Active EP2016809B1 (en) 2006-04-27 2007-04-26 Cold plasma hand set for plasma treatment of surfaces

Country Status (6)

Country Link
EP (1) EP2016809B1 (en)
DE (1) DE102006019664B4 (en)
ES (1) ES2548096T3 (en)
PL (1) PL2016809T3 (en)
PT (1) PT2016809E (en)
WO (1) WO2007124910A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018005328U1 (en) 2018-11-14 2018-12-12 Gesellschaft zur Förderung von Medizin-, Bio- und Umwelttechnologien e.V. LED radiation device for the prevention of wound infections and for the healing of wounds and wound infections

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9472382B2 (en) 2007-04-23 2016-10-18 Plasmology4, Inc. Cold plasma annular array methods and apparatus
US9656095B2 (en) 2007-04-23 2017-05-23 Plasmology4, Inc. Harmonic cold plasma devices and associated methods
US10039927B2 (en) 2007-04-23 2018-08-07 Plasmology4, Inc. Cold plasma treatment devices and associated methods
DE102008008614A1 (en) 2008-02-12 2009-08-13 Leibniz-Institut für Plasmaforschung und Technologie e.V. Plama device for the selective treatment of electroporated cells
DE102008025483A1 (en) * 2008-05-28 2009-12-10 Siemens Aktiengesellschaft Surfaces treatment device for use in plasma surface treatment plant to treat surface of workpiece, has shielding grid that is arranged between workpiece and nozzle, where workpiece with to-be-treated-surface rests on carrier
DE102009028190A1 (en) 2009-08-03 2011-02-10 Leibniz-Institut für Plasmaforschung und Technologie e.V. Cold plasma beam producing device i.e. plasma hand-held device, for microplasma treatment of materials for e.g. cosmetic purpose, has high frequency-generator, coil, body and high voltage-electrode integrally arranged in metal housing
WO2011015538A1 (en) 2009-08-03 2011-02-10 Leibniz-Institut Für Plasmaforschung Und Technologie E. V. Device for generating a non-thermal atmospheric pressure plasma
DE102009047220A1 (en) * 2009-11-27 2011-06-01 Leibniz-Institut für Plasmaforschung und Technologie e.V. Apparatus and method for generating a pulsed anisothermic atmospheric pressure plasma
RU2473318C2 (en) * 2010-03-23 2013-01-27 Российская академия сельскохозяйственных наук Государственное научное учреждение Всероссийский научно-исследовательский институт электрификации сельского хозяйства Российской академии сельскохозяйственных наук (ГНУ ВИЭСХ Россельхозакадемии) Device of plasma tissue coagulation
CN102307426A (en) * 2011-06-24 2012-01-04 北京大学 Plasma generating device
WO2013040481A1 (en) 2011-09-15 2013-03-21 Cold Plasma Medical Technologies, Inc. Cold plasma sterilization devices and associated methods
DE102011087159B3 (en) * 2011-11-25 2013-03-28 Mtu Aero Engines Gmbh Priming preparation for cold gas spraying and cold gas spraying device
DE102012025082B3 (en) * 2012-08-31 2014-01-16 NorthCo Ventures GmbH & Co. KG Device for treatment of biological tissue with low pressure plasma, has transformer for generating high-frequency electromagnetic field and probe electrically coupled with transformer
WO2014093513A1 (en) 2012-12-11 2014-06-19 Cold Plasma Medical Technologies, Inc. Method and apparatus for cold plasma food contact surface sanitation
WO2014106258A1 (en) 2012-12-31 2014-07-03 Cold Plasma Medical Technologies, Inc. Cold plasma electroporation of medication and associated methods
DE102014213967A1 (en) * 2014-07-17 2016-01-21 NorthCo Ventures GmbH & Co. KG Apparatus for the Hydophilization of Dental Implants
DE102015101315B3 (en) 2015-01-29 2016-04-21 Inp Greifswald E.V. Plasma treatment apparatus and method for plasma treatment
US11490947B2 (en) 2015-05-15 2022-11-08 Clear Intradermal Technologies, Inc. Tattoo removal using a liquid-gas mixture with plasma gas bubbles
JP2018520817A (en) 2015-05-15 2018-08-02 クリアイット エルエルシーClearit, Llc Tattoo removal system and method using low temperature plasma
US11102877B2 (en) 2015-09-30 2021-08-24 Chiscan Holdings, L.L.C. Apparatus and methods for deactivating microorganisms with non-thermal plasma
US10194672B2 (en) 2015-10-23 2019-02-05 NanoGuard Technologies, LLC Reactive gas, reactive gas generation system and product treatment using reactive gas
EP3795105A1 (en) * 2016-02-26 2021-03-24 Chiscan Holdings, LLC Non-thermal plasma emitters and devices for controlling
WO2017197071A1 (en) 2016-05-12 2017-11-16 EP Technologies LLC Methods and systems for trans-tissue substance delivery using plasmaporation
US10692704B2 (en) 2016-11-10 2020-06-23 Gojo Industries Inc. Methods and systems for generating plasma activated liquid
CZ2016790A3 (en) * 2016-12-14 2018-06-27 Masarykova Univezita A method for generating plasma in a plasma nozzle at atmospheric pressure and regulating the intensities of the E and H electromagnetic field and the transmission and regulation of the active power flow from a radio frequency source to the plasma nozzle plasma and a device for its implementation
DE202017101912U1 (en) 2017-03-31 2017-07-17 Leibniz-Institut für Plasmaforschung und Technologie e.V. Portable, tool-less mountable plasma treatment system
KR20210104780A (en) 2018-12-19 2021-08-25 클리어잇 엘엘씨 Tattoo Removal Systems and Methods Using an Applied Electric Field
NL2022938B1 (en) * 2019-04-12 2020-10-20 Vitalfluid B V Plasma activated fluid processing system
US10925144B2 (en) 2019-06-14 2021-02-16 NanoGuard Technologies, LLC Electrode assembly, dielectric barrier discharge system and use thereof
EP3849282A1 (en) * 2020-01-09 2021-07-14 terraplasma emission control GmbH Plasma discharge system and method of using the same
US11896731B2 (en) 2020-04-03 2024-02-13 NanoGuard Technologies, LLC Methods of disarming viruses using reactive gas
EP4162776A1 (en) * 2020-06-08 2023-04-12 Chiscan Holdings, LLC Apparatus and methods for deactivating microorganisms with non-thermal plasma
DE102022205543A1 (en) 2022-05-31 2023-11-30 neoplas med GmbH DEVICE FOR GUIDING PLASMA JET-GENERATED SPECIES
WO2023232669A1 (en) 2022-05-31 2023-12-07 neoplas med GmbH Device for guiding plasma-jet-generated species

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1222243A (en) * 1967-07-05 1971-02-10 Kearns Tribune Corp Generating plasma
US3648015A (en) * 1970-07-20 1972-03-07 Thomas E Fairbairn Radio frequency generated electron beam torch
US4060088A (en) * 1976-01-16 1977-11-29 Valleylab, Inc. Electrosurgical method and apparatus for establishing an electrical discharge in an inert gas flow
JPS5987042A (en) * 1982-11-10 1984-05-19 Takeshige Abe Generation of ionized gas
US4626648A (en) * 1985-07-03 1986-12-02 Browning James A Hybrid non-transferred-arc plasma torch system and method of operating same
US4781175A (en) * 1986-04-08 1988-11-01 C. R. Bard, Inc. Electrosurgical conductive gas stream technique of achieving improved eschar for coagulation
DE3733492A1 (en) * 1987-10-03 1989-04-13 Ahlbrandt System Gmbh Device for treating surfaces by means of an ionised gas stream
DE4108499A1 (en) * 1991-03-15 1992-09-17 Igenwert Gmbh METHOD AND DEVICE FOR PRODUCING A HIGH PRESSURE PLASMA
US5249575A (en) * 1991-10-21 1993-10-05 Adm Tronics Unlimited, Inc. Corona discharge beam thermotherapy system
DE19513338A1 (en) * 1995-04-12 1996-10-17 Erbe Elektromedizin Argon gas coagulation supply system for medical endoscopy in operating theatre
DE19532412C2 (en) * 1995-09-01 1999-09-30 Agrodyn Hochspannungstechnik G Device for surface pretreatment of workpieces
US6194036B1 (en) * 1997-10-20 2001-02-27 The Regents Of The University Of California Deposition of coatings using an atmospheric pressure plasma jet
DE19839826A1 (en) * 1998-09-01 2000-03-02 Karl Fastenmeier High-frequency device for generating a plasma arc for the treatment of human tissue
US6262523B1 (en) * 1999-04-21 2001-07-17 The Regents Of The University Of California Large area atmospheric-pressure plasma jet
US6958063B1 (en) * 1999-04-22 2005-10-25 Soring Gmbh Medizintechnik Plasma generator for radio frequency surgery
US20020122896A1 (en) * 2001-03-02 2002-09-05 Skion Corporation Capillary discharge plasma apparatus and method for surface treatment using the same
DE10140298B4 (en) * 2001-08-16 2005-02-24 Mtu Aero Engines Gmbh Method for plasma welding
DE50208353D1 (en) * 2001-08-28 2006-11-16 Jeng-Ming Wu PLASMABRENNER WITH MICROWAVE EXCITEMENT

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018005328U1 (en) 2018-11-14 2018-12-12 Gesellschaft zur Förderung von Medizin-, Bio- und Umwelttechnologien e.V. LED radiation device for the prevention of wound infections and for the healing of wounds and wound infections

Also Published As

Publication number Publication date
WO2007124910A3 (en) 2009-03-26
PL2016809T3 (en) 2015-12-31
PT2016809E (en) 2015-10-14
ES2548096T3 (en) 2015-10-13
EP2016809A2 (en) 2009-01-21
DE102006019664B4 (en) 2017-01-05
DE102006019664A1 (en) 2007-10-31
WO2007124910A2 (en) 2007-11-08

Similar Documents

Publication Publication Date Title
EP2016809B1 (en) Cold plasma hand set for plasma treatment of surfaces
EP1109503B1 (en) High-frequency device for generating a plasma arc for the treatment of biological tissue
EP1230414B1 (en) Method and device for plasma coating surfaces
EP2462785B1 (en) Device for generating a non-thermal atmospheric pressure plasma
EP1994807B1 (en) Apparatus for producing a plasma jet
DE69926356T2 (en) THE METHOD FOR GENERATING A PHYSICALLY AND CHEMICALLY ACTIVE ENVIRONMENT THROUGH A PLASMASTRAY AND PLASMASTRAY
EP1053660B1 (en) Device for producing a free cold non-thermal plasma beam
EP0740926A2 (en) Arc generating electrosurgical instrument
DE102009028190A1 (en) Cold plasma beam producing device i.e. plasma hand-held device, for microplasma treatment of materials for e.g. cosmetic purpose, has high frequency-generator, coil, body and high voltage-electrode integrally arranged in metal housing
WO2009127297A1 (en) Device for generating an atmospheric pressure plasma
EP2130414B1 (en) Device and method for generating a plasma beam
EP0881865A2 (en) Device for producing a plurality of low temperature plasma jets
EP1872637A1 (en) Plasma coating device and method
EP1421832A1 (en) Plasma burner with microwave stimulation
DE4337119C2 (en) VHF plasma source
EP1704756B1 (en) Plasma treatment of large-scale components
DE102020100872B4 (en) Resonator and power oscillator for the construction of an integrated plasma source and their use
DE102012004034A1 (en) High frequency plasma ignition head for use in high frequency plasma radiator for e.g. igniting low pressure plasma in laboratory, has ignition unit exhibiting high resistive input impedance in ignition state and specific electrical length
EP3747241A1 (en) Atmospheric plasma jet having a straight cannula tube
EP2142679B1 (en) Method for the plasma-assisted surface treatment of large-volume components
DE102013106315B4 (en) Method and apparatus for generating a physical plasma
DE10320805A1 (en) Device for processing cylindrical substrates, such as wires and cables, comprises a process chamber, and a dielectric barrier arranged between an electrode and a lead functioning as the counter electrode
EP3253184B1 (en) Multi frequency plasma generating device and associated method
DE4404077C2 (en) Arrangement and method for plasma-assisted machining of workpieces
EP2127503B1 (en) Apparatus and method for plasma-assisted coating and surface treatment of voluminous parts

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20081125

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

R17D Deferred search report published (corrected)

Effective date: 20090326

17Q First examination report despatched

Effective date: 20090730

DAX Request for extension of the european patent (deleted)
REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502007014013

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H05H0001000000

Ipc: H05H0001240000

RIC1 Information provided on ipc code assigned before grant

Ipc: H05H 1/24 20060101AFI20141119BHEP

Ipc: H05H 1/36 20060101ALI20141119BHEP

Ipc: H05H 1/30 20060101ALI20141119BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20150107

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 734613

Country of ref document: AT

Kind code of ref document: T

Effective date: 20150715

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502007014013

Country of ref document: DE

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: E. BLUM AND CO. AG PATENT- UND MARKENANWAELTE , CH

RAP2 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: LEIBNIZ-INSTITUT FUER PLASMAFORSCHUNG UND TECHNOLO

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2548096

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20151013

REG Reference to a national code

Ref country code: PT

Ref legal event code: SC4A

Free format text: AVAILABILITY OF NATIONAL TRANSLATION

Effective date: 20150915

REG Reference to a national code

Ref country code: AT

Ref legal event code: HC

Ref document number: 734613

Country of ref document: AT

Kind code of ref document: T

Owner name: LEIBNIZ-INSTITUT FUER PLASMAFORSCHUNG UND TECH, DE

Effective date: 20150921

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: PL

Ref legal event code: T3

REG Reference to a national code

Ref country code: FR

Ref legal event code: CD

Owner name: LEIBNIZ-INSTITUT FUR PLASMAFORSCHUNG UND TECHN, DE

Effective date: 20151204

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151002

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151101

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502007014013

Country of ref document: DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

REG Reference to a national code

Ref country code: SK

Ref legal event code: T3

Ref document number: E 20130

Country of ref document: SK

26N No opposition filed

Effective date: 20160404

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160426

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160426

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

Free format text: REGISTERED BETWEEN 20170601 AND 20170607

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 12

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20070426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150701

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20230315

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20230417

Year of fee payment: 17

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230601

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PT

Payment date: 20230422

Year of fee payment: 17

Ref country code: IT

Payment date: 20230428

Year of fee payment: 17

Ref country code: FR

Payment date: 20230417

Year of fee payment: 17

Ref country code: ES

Payment date: 20230517

Year of fee payment: 17

Ref country code: DE

Payment date: 20230418

Year of fee payment: 17

Ref country code: CZ

Payment date: 20230417

Year of fee payment: 17

Ref country code: CH

Payment date: 20230502

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SK

Payment date: 20230418

Year of fee payment: 17

Ref country code: PL

Payment date: 20230413

Year of fee payment: 17

Ref country code: FI

Payment date: 20230417

Year of fee payment: 17

Ref country code: AT

Payment date: 20230414

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20230420

Year of fee payment: 17