EP1990822A1 - Flat display - Google Patents
Flat display Download PDFInfo
- Publication number
- EP1990822A1 EP1990822A1 EP07714937A EP07714937A EP1990822A1 EP 1990822 A1 EP1990822 A1 EP 1990822A1 EP 07714937 A EP07714937 A EP 07714937A EP 07714937 A EP07714937 A EP 07714937A EP 1990822 A1 EP1990822 A1 EP 1990822A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sealing member
- glass
- flat display
- glass substrates
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/18—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/18—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
- H01J17/183—Seals between parts of vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/86—Vessels; Containers; Vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
Definitions
- the present invention relates to a flat display, such as a field emission display (hereinafter referred to as FED) and a plasma display panel (hereinafter, PDP).
- FED field emission display
- PDP plasma display panel
- frit glass is used as an adhesive for bonding inorganic material, such as glass, ceramics and metal.
- the frit glass is used as a sealing member of FEDs and PDPs in which a panel is formed of two glass substrates bonded with each other, a firm bonding-strength is required of the frit glass. This is because the inside the panel of an FED or a PDP has to be kept in conditions of reduced pressure or high vacuum. Frit glass seals the periphery of the panel to avoid entry of outside air into inside the panel.
- Frit glass seals the periphery of the panel to avoid entry of outside air into inside the panel.
- poor bonding-strength of frit glass can cause a crack between the frit glass and the glass substrates. Through the crack, outside air comes into the interior of the panel, causing lighting failure in a partial area-in the entire area, at worst-of the panel. In the case of FEDs where the inside of the panel is kept under high vacuum, the worst case often results.
- a PDP has a front substrate and a back substrate.
- the front substrate contains the following components:
- the back substrate contains the following components:
- the front substrate and the back substrate are located with the electrode-formed planes of each substrate disposed in face-to-face arrangement.
- the two substrates are hermetically sealed on the periphery with a sealing member.
- the discharge space which is divided by the barrier ribs, is filled with a discharge gas of Ne - Xe with a charge pressure ranging from 53 kPa to 80 kPa (i.e., from 400 Torr to 600 Torr).
- the materials constituting a PDP are mainly formed of glasses with a low melting point. To form these materials, printing and firing processes are repeatedly carried out. Because of repeated cycles of printing and firing, the materials used in later processes have to be formed of glasses with lower softening point than that in former processes. That is, when such materials are formed one after another, there is a need to control a softening point of each material in a broad range of temperature.
- lead glass is a material that offers an easy control of softening point. This is why the lead glass has been popularly used for PDPs.
- Frit glass which is a sealing material used in the final process of manufacturing PDPs, has the lowest softening point; and accordingly, high in lead content. Under the circumstances, development of lead-free frit glass has become necessary.
- Japanese Patent Unexamined Publication No. 2004-238273 discloses a bismuth (Bi)-based glass composition as a lead-free material.
- Bi-based frit glass can cause a crack between the frit glass and the glass substrates in the drop impact.
- the flat display of the present invention has a pair of glass substrates oppositely disposed at intervals and a sealing member disposed on the periphery of the glass substrates.
- the glass substrates contain silicon, whereas the sealing member contains bismuth.
- the flat display contains an intermediate layer disposed at the interface between the glass substrates and the sealing member.
- the intermediate layer has a silicon-content lower than the glass substrates.
- the flat display offers high strength in the sealing section and therefore offers highly reliable performance.
- a flat display of the first exemplary embodiment is described hereinafter with reference to Figs. 1 through 3 .
- the description of the embodiment will be made on a PDP as an example of flat displays.
- Fig. 1 and Fig. 2 are perspective views of a PDP; the former shows the structure of the PDP, and the latter shows its appearance.
- Fig. 3 is a section view taken along the line 3 - 3 in Fig. 2 , which shows the essential part of the PDP.
- the PDP contains a pair of glass-made substrates (i.e., front substrate 1 and back substrate 2). The two substrates are oppositely disposed at intervals so as to form discharge space 93 therebetween.
- Front substrate 1 has glass substrate 4 and a plurality of display electrodes on glass substrate 4.
- Each of the display electrodes is formed of pairs of scan electrodes 5 and sustain electrodes 6 in parallel with each other.
- Scan electrodes 5 and sustain electrodes 6 are generally formed of a combination of a transparent conductive film and a bus electrode film that carries electricity to the transparent conductive film.
- the transparent conductive film an indium tin oxide (ITO)-film and a tin oxide (SnO 2 )-film are employed.
- the bus electrode film a silver-made film and a film with three-layered structure of Cr/Cu/Cr are employed.
- Dielectric layer 7 is covered with dielectric layer 7 that is disposed almost over glass substrate 4.
- Dielectric layer 7 is further covered with protection layer 98.
- Dielectric layer 7 has a thickness ranging from 30 ⁇ m to 50 ⁇ m, and protection layer 98 has a thickness ranging from 0.5 ⁇ m to 2 ⁇ m.
- Dielectric layer 7 is formed through the process below: preparing paste including dielectric glass-powder (where, the paste is typically formed of bismuth-based material [Bi-Zn-B-Si-O], zinc/boric-acid-based material [Zn-B-Si-O] and lead-based material [Pb-B-Si-O]); coating the paste on glass substrate 4 by printing and then firing it.
- Protection layer 98 is made of a multi-crystal magnesium oxide (MgO) film that is resistant to sputtering to protect dielectric layer 7 from damage caused by discharge. Protection layer 98 is formed by commonly used thin-film forming methods, such as electron beam deposition, chemical vapor deposition (CVD) and sputtering.
- MgO multi-crystal magnesium oxide
- Front substrate 1 further contains black shielding layer 9 between the display electrodes formed of scan electrodes 5 and sustain electrodes 6.
- back substrate 2 has glass substrate 90 and a plurality of data electrodes 12 formed on glass substrate 90.
- Data electrodes 12 are covered with insulating layer 11 that is disposed almost all over glass substrate 90.
- Barrier ribs 13 are formed into stripes or a grid on insulating layer 11 to divide discharge space 93 into a plurality of discharge cells.
- Insulating layer 11 has a thickness ranging from 5 ⁇ m to 20 ⁇ m. Insulating layer 11 is formed of a material and by a process similar to those of dielectric layer 7 of front substrate 1.
- Such structured front substrate 1 and back substrate 2 are oppositely located via discharge space 93 in a manner that the display electrodes (i.e., scan electrodes 5 and sustain electrodes 6) and data electrodes 12 are placed in an orthogonal arrangement.
- Discharge space 93 is sealed with sealing member 16 formed on peripheral section 15 of front substrate 1 and back substrate 2.
- Discharge space 93 is filled with discharge gas, for example, a gas mixture of neon (Ne) and xenon (Xe). A PDP is thus completed.
- Discharge space 93 is sealed with sealing member 16 through the following steps: mixing glass frit powder that contains bismuth (Bi) as a main component, resin and a solvent to prepare paste; applying the paste to peripheral section 15 of front substrate 1 or back substrate 2 by screen printing or an injection method; heating the paste until a temperature that melts away resin and putting together the two substrates; and bonding the two substrates by heating the paste on peripheral section 15 until a temperature that softens the glass powder.
- Bismuth (Bi) bismuth
- Acrylic resin, ethylcellulose and nitrocellulose are employed for the resin used for the paste of sealing member 16.
- Isoamyl acetate, terpineol are employed for the solvent.
- sealing member 16 should preferably be determined between 50 wt% and 80 wt%. This is because of the constraint described earlier-a member to be formed in later stage of the manufacturing process has no ill effect on a member formed in earlier stage of the process.
- sealing member 16 contains silicon (Si) and oxygen (O) to maintain characteristics as glass, and further contains boron (B), zinc (Zn), aluminum (Al).
- sealing member 16 contains ceramic powder and glass with a high softening point formed of Al-Si-Mg-O-based material, which is known as filler. Such a filler is included in sealing member 16 in a range of 5 wt% to 20 wt%.
- an intermediate layer is disposed at an interface between glass substrate 4 of front substrate 1 and sealing member 16, and an interface between glass substrate 90 of back substrate 2 and sealing member 16.
- the intermediate layer has a silicon-content lower than glass substrates 4 and 90.
- dielectric layer 7 and protection layer 98 as the intermediate layer, are disposed at an interface between glass substrate 4 and sealing member 16.
- Dielectric layer 7 is made of glass with a low melting point
- protection layer 98 is made of a crystalline oxide film.
- insulating layer 11 as the intermediate layer is disposed at an interface between glass substrate 90 and sealing member 16.
- Insulating layer 11 is made of glass with a low melting point.
- the intermediate layer is formed on all over glass substrates 4 and 90.
- the inventor prepared a PDP having the structure of the embodiment and a comparative PDP where sealing member 16 makes directly contact with glass substrates 4 and 90. After being packed, the two PDPs underwent a drop impact test. The test samples were prepared more than 30 for each.
- sealing member 16 of the PDP of the embodiment had no problem.
- some samples had a crack between sealing member 16 and glass substrate 4, 90.
- the inventor observed each section of the interface between sealing member 16 and glass substrates 4, 90 by a transmission electron microscope (TEM).
- TEM transmission electron microscope
- EDS energy dispersive X-ray spectroscopy
- dispersion of Si into sealing member 16 was not found at the interface between sealing member 16 and protection layer 98; on the other hand, at the interface between sealing member 16 and insulating layer 11, the Si-dispersion was observed no more than 10 nm.
- Si contained in glass substrates 4 and 90 has dispersed into sealing member 16 as deep as 100 nm from each section of the interface between sealing member 16 and glass substrates 4, 90.
- sealing member 16 has a view that the following contributes to decrease in strength of sealing member 16 in the comparative PDP.
- Si-dispersion into Bi-contained sealing member 16 increases, sealing member 16 is prone to get harder. That is, the inventor makes the inference that sealing member 16 disposed around the interface, due to increased Si-content on the interface and the adjacent area, becomes harder and therefore brittle. In other words, protecting sealing member 16 from Si-dispersion is critical to enhancing reliability of sealing member 16 that contains Bi.
- protection layer 98 serves as an intermediate layer with a low Si-content. Even in the case where Si is added as dopant to control electron emission characteristic of MgO, the Si-content of protection layer 98 does not go beyond 1%. The Si-content of protection layer 98 is so low that sealing member 16 has no Si-dispersion from protection layer 98. Similarly, insulating layer 11-although it contains Si as a nature of glass material-has a low Si-content not greater than half of that of glass substrates 4 and 90. Glass substrates 4 and 90, which contain Si as a main component, usually have an Si-content ranging from 20 wt% to 30 wt%.
- insulating layer 11 has a thickness ranging from 5 ⁇ m to 20 ⁇ m
- protection layer 98 has a thickness ranging from 0.5 ⁇ m to 2 ⁇ m. Having a proper thickness may be an advantageous factor.
- the reinforced sealing section allows the flat display to have high reliability.
- protection layer 98 and insulating layer 11, both of which constitutes the PDP serve as an intermediate layer to prevent Si-dispersion into the interface between sealing member 16 and glass substrates 4, 90. That is, there is no need to have another step for forming the intermediate layer, simplifying the manufacturing process.
- an intermediate layer is additionally disposed between sealing member 16 and glass substrates 4, 90, the following are important in designing the layer from the aforementioned analysis;
- Fig. 4 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with the embodiment.
- the PDP of the second embodiment differs from that of the first embodiment in that protection layer 98 does not extend inside peripheral section 15 on which sealing member 16 is applied, as shown in Fig. 4 .
- dielectric layer 7 is disposed as an intermediate layer.
- insulating layer 11 is disposed as an intermediate layer.
- the PDP of the second embodiment also underwent the drop impact test as with the case in the first embodiment. According to the test result, no problem occurred in sealing member 16 in the PDPs.
- the inventor observed each interface between sealing member 16 and dielectric layer 17, and between sealing member 16 and insulating layer 11 to check for Si-dispersion into sealing member 16. The result showed that the both side of sealing member 16 had Si-dispersion of not more than 10 nm.
- dielectric layer 7 is made of glass and therefore contains Si, the Si-content of the layer is lower than half that of a glass substrate predominantly composed of Si. It is conceivable that the low content of Si contributes to less Si-dispersion into sealing member 16.
- dielectric layer 7 and insulating layer 11 can be a multi-layered structure having different composition.
- the layer arrangement should be determined in a manner that a layer with a lower Si-content is located closer to sealing member 16.
- Employing the structure above allows a flat display to have a reinforced sealing section, providing performance with high reliability.
- Fig. 5 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with the third exemplary embodiment.
- the PDP of the third embodiment differs from that of the first embodiment in that protection layer 98 and dielectric layer 11 do not extend inside peripheral section 15 on which sealing member 16 is applied, as shown in Fig. 5 .
- dielectric layer 7 is disposed as an intermediate layer. That is, the intermediate layer is formed on at least one of the interfaces between glass substrate 4 and sealing member 16, and between glass substrate 90 and sealing member 16.
- the PDP of the third embodiment also underwent the drop impact test as with the case in the first embodiment. According to the test result, the strength of the PDP proved somewhat inferior to that of the first embodiment; one or two defective PDPs were found in ten thousand PDPs in an actual transportation test. In conclusion, it satisfactorily maintains a proper level in practical use.
- Fig. 6 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with the fourth exemplary embodiment.
- the PDP of the fourth embodiment differs from that of the first embodiment in that dielectric layer 7 and insulating layer 11 extend inside peripheral section 15 on which sealing member 16 is applied so as to exceed 50 % of the section.
- the PDP of the fourth embodiment also underwent the drop impact test as with the case in the first embodiment. The test result showed that such structured PDP-where the area of dielectric layer 7 and insulating layer 11 in peripheral section 15 exceeds 50 % of the total area of peripheral section 15 (as a total area of each peripheral section of front substrate 1 and back substrate 2)-had substantially no problem in the actual transportation test.
- the inventor has a conclusion that dielectric layer 7, insulating layer 11 and sealing member 16 disposed between glass substrates 4 and 90 of the PDP structured above maintain a bonding strength at a satisfactory level.
- Fig. 7 is a section view showing the essential part of another structure of a PDP as a flat display in accordance with the fourth exemplary embodiment.
- Fig. 8 is a section view along the line 8 - 8 in Fig. 2 , showing the essential part of still another structure of a PDP as a flat display in accordance with the fourth exemplary embodiment.
- scan electrodes 5, sustain electrodes 6 and shielding layer 9 are omitted from the drawings above.
- dielectric layer 7 as an intermediate layer is formed on peripheral section 15 on glass substrate 4 so as to exceed 50 % of peripheral section 15 on which sealing member 16 is applied; and at the same time, protection layer 98 as an intermediate layer is formed on peripheral section 15 on glass substrate 4 so as to extend inside peripheral section 15 on which sealing member 16 is applied.
- Fig. 8 shows a section taken along the line 8 - 8 in Fig. 2
- dielectric layer 7 and insulating layer 11 as an intermediate layer are formed on peripheral section 15 on glass substrates 4, 90 so as to exceed 50 % of peripheral section 15 on which sealing member 16 is applied; and at the same time, protection layer 98 as an intermediate layer is formed on peripheral section 15 on glass substrate 4 so as to extend inside peripheral section 15 on which sealing member 16 is applied.
- the inventor has a conclusion that dielectric layer 7, insulating layer 11 and sealing member 16 disposed between glass substrates 4 and 90 of the PDP structured above maintain a bonding strength at a satisfactory level. As a result of the drop impact test on the PDP structured above, the structure achieved a satisfactory bonding strength in an actual transportation test as the practical use.
- a display device employing an electron-emitting element will be described as a flat display of the fifth exemplary embodiment.
- Fig. 9 is a perspective view showing an appearance of a display device employing an electron-emitting element.
- Fig. 10 is a section view, taken along the line 10 - 10 in Fig. 9 , showing the essential part of the structure of the display device employing an electron-emitting element.
- Front substrate 21 has glass substrate 24; anode electrode 25 laid over glass substrate 24; and phosphor layer 26 laid over anode electrode 25.
- Anode electrode 25 is made of a transparent conductive film, such as an ITO-film and an SnO 2 -film.
- back substrate 22 has glass substrate 27 and cathode electrode 28 on glass substrate 27.
- Cathode electrode 28 is made of a metallic thin film.
- cathode electrode 28 electron-emitting element array 29 is formed.
- FIG. 10 shows an example where the structure employs a spint-type cold cathode.
- Front substrate 21 and back substrate 22 are oppositely located and bonded with each other at sealing section 31 on peripheral section 30 of the structure.
- Sealing section 31 has frame 32 that is made of glass material having a characteristics the same as the glass substrate.
- Frame 32 keeps a distance of a few millimeters between front substrate 21 and back substrate 22.
- sealing member 33 containing Bi is formed between frame 32 and each of glass substrates 24 and 27.
- intermediate layer 34 is formed at least between sealing member 33 and glass substrates 24, 27.
- Intermediate layer 34 is made of low-melting glass.
- Intermediate layer 34 has an Si-content lower than glass substrates 24, 27 and a thickness of 0.1 ⁇ m or greater.
- the inventor prepared display devices employing an electron-emitting element shown in Fig. 9 with no intermediate layer 34, and carried out the drop impact test, as with in the first exemplary embodiment.
- the result showed that some samples had a crack between sealing member 33 and glass substrate 24 or glass substrate 27 and by which leak occurred.
- the display devices employing an electron-emitting element of the fifth embodiment had no leak.
- Forming intermediate layer 34 between frame 32 and sealing member 33 enhances bonding strength of sealing section 31.
- the cold cathode method and the structure of a display device above are described by way of example and without limitation the present invention is also applicable to a display device having a grid electrode.
- the flat display of the present invention has a sealing section with reinforced bonding strength, providing the structure with high reliability.
- the present invention enhances reliability of a flat display.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
Abstract
Description
- The present invention relates to a flat display, such as a field emission display (hereinafter referred to as FED) and a plasma display panel (hereinafter, PDP).
- In general, frit glass is used as an adhesive for bonding inorganic material, such as glass, ceramics and metal. When the frit glass is used as a sealing member of FEDs and PDPs in which a panel is formed of two glass substrates bonded with each other, a firm bonding-strength is required of the frit glass. This is because the inside the panel of an FED or a PDP has to be kept in conditions of reduced pressure or high vacuum. Frit glass seals the periphery of the panel to avoid entry of outside air into inside the panel. When the panel suffers vibration or drop impact during transport, poor bonding-strength of frit glass can cause a crack between the frit glass and the glass substrates. Through the crack, outside air comes into the interior of the panel, causing lighting failure in a partial area-in the entire area, at worst-of the panel. In the case of FEDs where the inside of the panel is kept under high vacuum, the worst case often results.
- Hereinafter, the structure of a PDP as a flat display will be described. A PDP has a front substrate and a back substrate.
- The front substrate contains the following components:
- a glass substrate made of sodium borosilicate glass by a float method;
- display electrodes having transparent electrodes and bus electrodes arranged in stripes on one principal plane of the glass substrate;
- a dielectric layer that is disposed over the display electrodes and serves as a capacitor; and
- a protection layer that is made of magnesium oxide (MgO) and is disposed over the dielectric layer.
- On the other hand, the back substrate contains the following components:
- a glass substrate;
- data electrodes arranged in stripes on one principal plane of the glass substrate;
- an insulating layer disposed over the data electrodes;
- barrier ribs, which are formed on the insulating layer, divides a discharge space into a plurality of discharge cells; and
- phosphor layers, which are formed between the barrier ribs, emit light in red, green and blue.
- The front substrate and the back substrate are located with the electrode-formed planes of each substrate disposed in face-to-face arrangement. The two substrates are hermetically sealed on the periphery with a sealing member. After that, the discharge space, which is divided by the barrier ribs, is filled with a discharge gas of Ne - Xe with a charge pressure ranging from 53 kPa to 80 kPa (i.e., from 400 Torr to 600 Torr). Through the process above, the panel is completed.
- In a PDP with the structure above, selective application of image signal voltage to the display electrodes causes discharge. The discharge generates ultraviolet light, which excites the phosphor layers responsible for emitting red, green and blue. This allows the panel to provide full color display
- The materials constituting a PDP are mainly formed of glasses with a low melting point. To form these materials, printing and firing processes are repeatedly carried out. Because of repeated cycles of printing and firing, the materials used in later processes have to be formed of glasses with lower softening point than that in former processes. That is, when such materials are formed one after another, there is a need to control a softening point of each material in a broad range of temperature. Among the glasses with a low melting point, lead glass is a material that offers an easy control of softening point. This is why the lead glass has been popularly used for PDPs.
- In recent years, however, under growing concern about environmental protection, studies show that lead is hazardous to human and environment. Manufacturers have perceived these as problems and sought substitutes for lead glass. Frit glass, which is a sealing material used in the final process of manufacturing PDPs, has the lowest softening point; and accordingly, high in lead content. Under the circumstances, development of lead-free frit glass has become necessary. Japanese Patent Unexamined Publication No.
2004-238273 - The flat display of the present invention has a pair of glass substrates oppositely disposed at intervals and a sealing member disposed on the periphery of the glass substrates. The glass substrates contain silicon, whereas the sealing member contains bismuth. The flat display contains an intermediate layer disposed at the interface between the glass substrates and the sealing member. The intermediate layer has a silicon-content lower than the glass substrates.
- Having the structure above, the flat display offers high strength in the sealing section and therefore offers highly reliable performance.
-
- Fag. 1 is a perspective view showing the structure of a PDP as a flat display in accordance with a first exemplary embodiment of the present invention.
-
Fig. 2 is a perspective view showing an appearance of the PDP as a flat display in accordance with the first exemplary embodiment. -
Fig. 3 is a section view showing the essential part of the structure of the PDP as a flat display in accordance with the first exemplary embodiment. -
Fig. 4 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with a second exemplary embodiment. -
Fig. 5 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with a third exemplary embodiment. -
Fig. 6 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with a fourth exemplary embodiment. -
Fig. 7 is a section view showing the essential part of another structure of a PDP as a flat display in accordance with the fourth exemplary embodiment. -
Fig. 8 is a section view showing the essential part of still another structure of a PDP as a flat display in accordance with the fourth exemplary embodiment. -
Fig. 9 is a perspective view showing an appearance of a display device using an electron-emitting element as a flat display in accordance with a fifth exemplary embodiment. -
Fig. 10 is a section view showing the essential part of the structure of the display device using an electron-emitting element as a flat display in accordance with the fifth exemplary embodiment. -
- 1, 21
- front substrate
- 2, 22
- back substrate
- 4, 24, 27, 90
- glass substrate
- 5
- scan electrode
- 6
- sustain electrode
- 7
- dielectric layer
- 9
- shielding layer
- 11
- insulating layer
- 12
- data electrode
- 13
- barrier rib
- 14, 26
- phosphor layer
- 15, 30
- peripheral section
- 16, 33
- sealing member
- 25
- anode electrode
- 28
- cathode electrode
- 29
- electron-emitting element array
- 31
- sealing section
- 32
- frame
- 34
- intermediate layer
- 93
- discharge space
- 98
- protection layer
- The exemplary embodiments of the present invention are described hereinafter with reference to the accompanying drawings.
- A flat display of the first exemplary embodiment is described hereinafter with reference to
Figs. 1 through 3 . The description of the embodiment will be made on a PDP as an example of flat displays. -
Fig. 1 andFig. 2 are perspective views of a PDP; the former shows the structure of the PDP, and the latter shows its appearance.Fig. 3 is a section view taken along the line 3 - 3 inFig. 2 , which shows the essential part of the PDP. As is shown inFig. 1 , the PDP contains a pair of glass-made substrates (i.e.,front substrate 1 and back substrate 2). The two substrates are oppositely disposed at intervals so as to formdischarge space 93 therebetween. -
Front substrate 1 hasglass substrate 4 and a plurality of display electrodes onglass substrate 4. Each of the display electrodes is formed of pairs ofscan electrodes 5 and sustainelectrodes 6 in parallel with each other.Scan electrodes 5 and sustainelectrodes 6 are generally formed of a combination of a transparent conductive film and a bus electrode film that carries electricity to the transparent conductive film. As for the transparent conductive film, an indium tin oxide (ITO)-film and a tin oxide (SnO2)-film are employed. As for the bus electrode film, a silver-made film and a film with three-layered structure of Cr/Cu/Cr are employed. -
Scan electrodes 5 and sustainelectrodes 6 are covered withdielectric layer 7 that is disposed almost overglass substrate 4.Dielectric layer 7 is further covered withprotection layer 98.Dielectric layer 7 has a thickness ranging from 30 µm to 50 µm, andprotection layer 98 has a thickness ranging from 0.5µm to 2 µm.Dielectric layer 7 is formed through the process below: preparing paste including dielectric glass-powder (where, the paste is typically formed of bismuth-based material [Bi-Zn-B-Si-O], zinc/boric-acid-based material [Zn-B-Si-O] and lead-based material [Pb-B-Si-O]); coating the paste onglass substrate 4 by printing and then firing it.Protection layer 98 is made of a multi-crystal magnesium oxide (MgO) film that is resistant to sputtering to protectdielectric layer 7 from damage caused by discharge.Protection layer 98 is formed by commonly used thin-film forming methods, such as electron beam deposition, chemical vapor deposition (CVD) and sputtering. -
Front substrate 1 further containsblack shielding layer 9 between the display electrodes formed ofscan electrodes 5 and sustainelectrodes 6. - On the other hand, back
substrate 2 hasglass substrate 90 and a plurality ofdata electrodes 12 formed onglass substrate 90.Data electrodes 12 are covered with insulatinglayer 11 that is disposed almost all overglass substrate 90.Barrier ribs 13 are formed into stripes or a grid on insulatinglayer 11 to dividedischarge space 93 into a plurality of discharge cells. Insulatinglayer 11 has a thickness ranging from 5 µm to 20 µm. Insulatinglayer 11 is formed of a material and by a process similar to those ofdielectric layer 7 offront substrate 1.Phosphor layer 14, which is responsible for emitting three colors (red, green and blue) for full color display, is disposed on the surface of insulatinglayer 11 and on the side surface ofbarrier ribs 13. - Such structured
front substrate 1 andback substrate 2 are oppositely located viadischarge space 93 in a manner that the display electrodes (i.e.,scan electrodes 5 and sustain electrodes 6) anddata electrodes 12 are placed in an orthogonal arrangement.Discharge space 93 is sealed with sealingmember 16 formed onperipheral section 15 offront substrate 1 andback substrate 2.Discharge space 93 is filled with discharge gas, for example, a gas mixture of neon (Ne) and xenon (Xe). A PDP is thus completed. -
Discharge space 93 is sealed with sealingmember 16 through the following steps: mixing glass frit powder that contains bismuth (Bi) as a main component, resin and a solvent to prepare paste; applying the paste toperipheral section 15 offront substrate 1 orback substrate 2 by screen printing or an injection method; heating the paste until a temperature that melts away resin and putting together the two substrates; and bonding the two substrates by heating the paste onperipheral section 15 until a temperature that softens the glass powder. - Acrylic resin, ethylcellulose and nitrocellulose are employed for the resin used for the paste of sealing
member 16. Isoamyl acetate, terpineol are employed for the solvent. - The Bi-content of sealing
member 16 should preferably be determined between 50 wt% and 80 wt%. This is because of the constraint described earlier-a member to be formed in later stage of the manufacturing process has no ill effect on a member formed in earlier stage of the process. Other than Bi, sealingmember 16 contains silicon (Si) and oxygen (O) to maintain characteristics as glass, and further contains boron (B), zinc (Zn), aluminum (Al). In addition, to increase strength of itself, sealingmember 16 contains ceramic powder and glass with a high softening point formed of Al-Si-Mg-O-based material, which is known as filler. Such a filler is included in sealingmember 16 in a range of 5 wt% to 20 wt%. - According to the structure of the embodiment, an intermediate layer is disposed at an interface between
glass substrate 4 offront substrate 1 and sealingmember 16, and an interface betweenglass substrate 90 ofback substrate 2 and sealingmember 16. The intermediate layer has a silicon-content lower thanglass substrates Fig. 3 ,dielectric layer 7 andprotection layer 98, as the intermediate layer, are disposed at an interface betweenglass substrate 4 and sealingmember 16.Dielectric layer 7 is made of glass with a low melting point, andprotection layer 98 is made of a crystalline oxide film. On the other hand, insulatinglayer 11, as the intermediate layer is disposed at an interface betweenglass substrate 90 and sealingmember 16. Insulatinglayer 11 is made of glass with a low melting point. The intermediate layer is formed on all overglass substrates - Next will be described the effect obtained by the PDP as a flat display of the first exemplary embodiment.
- The inventor prepared a PDP having the structure of the embodiment and a comparative PDP where sealing
member 16 makes directly contact withglass substrates - The result of the test showed that sealing
member 16 of the PDP of the embodiment had no problem. In the comparative PDP, however, some samples had a crack between sealingmember 16 andglass substrate - To track down the cause of difference in strength between the two PDPs, the inventor observed each section of the interface between sealing
member 16 andglass substrates member 16 by an energy dispersive X-ray spectroscopy (EDS) method. According to the observation result of the PDP of the embodiment, dispersion of Si into sealingmember 16 was not found at the interface between sealingmember 16 andprotection layer 98; on the other hand, at the interface between sealingmember 16 and insulatinglayer 11, the Si-dispersion was observed no more than 10 nm. In contrast, in the observation result of the comparative PDP, Si contained inglass substrates member 16 as deep as 100 nm from each section of the interface between sealingmember 16 andglass substrates - Studying the result above, the inventor has a view that the following contributes to decrease in strength of sealing
member 16 in the comparative PDP. As the Si-dispersion into Bi-contained sealingmember 16 increases, sealingmember 16 is prone to get harder. That is, the inventor makes the inference that sealingmember 16 disposed around the interface, due to increased Si-content on the interface and the adjacent area, becomes harder and therefore brittle. In other words, protecting sealingmember 16 from Si-dispersion is critical to enhancing reliability of sealingmember 16 that contains Bi. - According to the PDP of the first exemplary embodiment,
protection layer 98 serves as an intermediate layer with a low Si-content. Even in the case where Si is added as dopant to control electron emission characteristic of MgO, the Si-content ofprotection layer 98 does not go beyond 1%. The Si-content ofprotection layer 98 is so low that sealingmember 16 has no Si-dispersion fromprotection layer 98. Similarly, insulating layer 11-although it contains Si as a nature of glass material-has a low Si-content not greater than half of that ofglass substrates Glass substrates layer 11 contributes to a minimized Si-dispersion into sealingmember 16. According to the PDP of the embodiment, insulatinglayer 11 has a thickness ranging from 5 µm to 20 µm, andprotection layer 98 has a thickness ranging from 0.5 µm to 2 µm. Having a proper thickness may be an advantageous factor. - According to the PDP of the embodiment, as described above, the reinforced sealing section allows the flat display to have high reliability. Besides, in the embodiment,
protection layer 98 and insulatinglayer 11, both of which constitutes the PDP, serve as an intermediate layer to prevent Si-dispersion into the interface between sealingmember 16 andglass substrates member 16 andglass substrates - the intermediate layer has a silicon-content lower than the glass substrates; and
- the intermediate layer has a thickness of at least 0.1 µm (100 nm).
- Next will be described the structure in accordance with the second exemplary embodiment.
-
Fig. 4 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with the embodiment. The PDP of the second embodiment differs from that of the first embodiment in thatprotection layer 98 does not extend insideperipheral section 15 on which sealingmember 16 is applied, as shown inFig. 4 . At the interface betweenglass substrate 4 offront substrate 1 and sealingmember 16,dielectric layer 7 is disposed as an intermediate layer. At the interface betweenglass substrate 90 ofback substrate 2 and sealingmember 16, insulatinglayer 11 is disposed as an intermediate layer. - The PDP of the second embodiment also underwent the drop impact test as with the case in the first embodiment. According to the test result, no problem occurred in sealing
member 16 in the PDPs. The inventor observed each interface between sealingmember 16 and dielectric layer 17, and between sealingmember 16 and insulatinglayer 11 to check for Si-dispersion into sealingmember 16. The result showed that the both side of sealingmember 16 had Si-dispersion of not more than 10 nm. Althoughdielectric layer 7 is made of glass and therefore contains Si, the Si-content of the layer is lower than half that of a glass substrate predominantly composed of Si. It is conceivable that the low content of Si contributes to less Si-dispersion into sealingmember 16. In the PDP of the second embodiment, as shown inFig, 4 ,dielectric layer 7 and insulatinglayer 11 can be a multi-layered structure having different composition. In this case, to minimize the Si-dispersion, the layer arrangement should be determined in a manner that a layer with a lower Si-content is located closer to sealingmember 16. Employing the structure above allows a flat display to have a reinforced sealing section, providing performance with high reliability. -
Fig. 5 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with the third exemplary embodiment. The PDP of the third embodiment differs from that of the first embodiment in thatprotection layer 98 anddielectric layer 11 do not extend insideperipheral section 15 on which sealingmember 16 is applied, as shown inFig. 5 . At the interface betweenglass substrate 4 offront substrate 1 and sealingmember 16,dielectric layer 7 is disposed as an intermediate layer. That is, the intermediate layer is formed on at least one of the interfaces betweenglass substrate 4 and sealingmember 16, and betweenglass substrate 90 and sealingmember 16. - The PDP of the third embodiment also underwent the drop impact test as with the case in the first embodiment. According to the test result, the strength of the PDP proved somewhat inferior to that of the first embodiment; one or two defective PDPs were found in ten thousand PDPs in an actual transportation test. In conclusion, it satisfactorily maintains a proper level in practical use.
-
Fig. 6 is a section view showing the essential part of the structure of a PDP as a flat display in accordance with the fourth exemplary embodiment. The PDP of the fourth embodiment differs from that of the first embodiment in thatdielectric layer 7 and insulatinglayer 11 extend insideperipheral section 15 on which sealingmember 16 is applied so as to exceed 50 % of the section. The PDP of the fourth embodiment also underwent the drop impact test as with the case in the first embodiment. The test result showed that such structured PDP-where the area ofdielectric layer 7 and insulatinglayer 11 inperipheral section 15 exceeds 50 % of the total area of peripheral section 15 (as a total area of each peripheral section offront substrate 1 and back substrate 2)-had substantially no problem in the actual transportation test. The inventor has a conclusion thatdielectric layer 7, insulatinglayer 11 and sealingmember 16 disposed betweenglass substrates -
Fig. 7 is a section view showing the essential part of another structure of a PDP as a flat display in accordance with the fourth exemplary embodiment.Fig. 8 is a section view along the line 8 - 8 inFig. 2 , showing the essential part of still another structure of a PDP as a flat display in accordance with the fourth exemplary embodiment. For convenience sake,scan electrodes 5, sustainelectrodes 6 andshielding layer 9 are omitted from the drawings above. The distinctive feature of the PDP shown inFig. 7 is thatdielectric layer 7 as an intermediate layer is formed onperipheral section 15 onglass substrate 4 so as to exceed 50 % ofperipheral section 15 on which sealingmember 16 is applied; and at the same time,protection layer 98 as an intermediate layer is formed onperipheral section 15 onglass substrate 4 so as to extend insideperipheral section 15 on which sealingmember 16 is applied. - The distinctive feature of still another PDP is that, as is in
Fig. 8 that shows a section taken along the line 8 - 8 inFig. 2 ,dielectric layer 7 and insulatinglayer 11 as an intermediate layer are formed onperipheral section 15 onglass substrates peripheral section 15 on which sealingmember 16 is applied; and at the same time,protection layer 98 as an intermediate layer is formed onperipheral section 15 onglass substrate 4 so as to extend insideperipheral section 15 on which sealingmember 16 is applied. The inventor has a conclusion thatdielectric layer 7, insulatinglayer 11 and sealingmember 16 disposed betweenglass substrates - Here in the embodiment, a display device employing an electron-emitting element will be described as a flat display of the fifth exemplary embodiment.
Fig. 9 is a perspective view showing an appearance of a display device employing an electron-emitting element.Fig. 10 is a section view, taken along the line 10 - 10 inFig. 9 , showing the essential part of the structure of the display device employing an electron-emitting element. - In the display device employing the electron-emitting element, as is shown in
Figs. 9 and 10 ,front substrate 21 and backsubstrate 22, both of which are made of glass, are oppositely disposed via vacuum space 23 therebetween.Front substrate 21 hasglass substrate 24;anode electrode 25 laid overglass substrate 24; andphosphor layer 26 laid overanode electrode 25.Anode electrode 25 is made of a transparent conductive film, such as an ITO-film and an SnO2-film. On the other hand, backsubstrate 22 hasglass substrate 27 andcathode electrode 28 onglass substrate 27.Cathode electrode 28 is made of a metallic thin film. Oncathode electrode 28, electron-emittingelement array 29 is formed.Fig. 10 shows an example where the structure employs a spint-type cold cathode.Front substrate 21 and backsubstrate 22 are oppositely located and bonded with each other at sealingsection 31 onperipheral section 30 of the structure. Sealingsection 31 hasframe 32 that is made of glass material having a characteristics the same as the glass substrate.Frame 32 keeps a distance of a few millimeters betweenfront substrate 21 and backsubstrate 22. Further, sealingmember 33 containing Bi is formed betweenframe 32 and each ofglass substrates - In a display device employing an electron-emitting element,
intermediate layer 34 is formed at least between sealingmember 33 andglass substrates Intermediate layer 34 is made of low-melting glass.Intermediate layer 34 has an Si-content lower thanglass substrates - For comparison purposes, the inventor prepared display devices employing an electron-emitting element shown in
Fig. 9 with nointermediate layer 34, and carried out the drop impact test, as with in the first exemplary embodiment. The result showed that some samples had a crack between sealingmember 33 andglass substrate 24 orglass substrate 27 and by which leak occurred. In contrast, the display devices employing an electron-emitting element of the fifth embodiment had no leak. - Forming
intermediate layer 34 betweenframe 32 and sealingmember 33 enhances bonding strength of sealingsection 31. - The cold cathode method and the structure of a display device above are described by way of example and without limitation the present invention is also applicable to a display device having a grid electrode.
- As described above, the flat display of the present invention has a sealing section with reinforced bonding strength, providing the structure with high reliability.
- The present invention enhances reliability of a flat display.
Claims (11)
- A flat display comprising:a pair of silicon-contained glass substrates oppositely disposed at intervals therebetween; anda bismuth-contained sealing member disposed on a periphery of the pair of glass substrates,wherein, an intermediate layer whose silicon-content is lower than that of the glass substrate is disposed at an interface between the glass substrates and the sealing member.
- A flat display comprising:a front substrate further including:a glass substrate on which display electrodes are formed;a dielectric layer disposed on the glass substrate so as to cover the display electrodes; anda protection layer disposed on the dielectric layer; anda back substrate disposed opposite to the front substrate, the back substrate further including:a glass substrate to be paired with the glass substrate of the front substrate;an data electrode disposed on the glass substrate; andan insulating layer that covers the data electrodes; anda bismuth-contained sealing member for sealing a periphery of the front substrate and the back substrate,wherein, an intermediate layer whose silicon-content is lower than that of the glass substrates is disposed at an interface between the glass substrates and the sealing member.
- The flat display of claim 1 or claim 2, wherein the intermediate layer has a thickness of at least 0.1 µm.
- The flat display of claim 1 or claim 2, wherein the intermediate layer is formed on an entire surface of the glass substrates.
- The flat display of claim 1 or claim 2, wherein the intermediate layer is formed on the glass substrates so as to occupy at least 50 % of an area where the sealing member is applied.
- The flat display of claim 1 or claim 2, wherein the intermediate layer is made of a glass with a low melting point or a crystalline oxide film.
- The flat display of claim 1 or claim 2, wherein the intermediate layer is made of a glass with a low melting point and has a silicon-content not greater than half of that of the glass substrates.
- The flat display of claim 1 or claim 2, wherein the sealing member contains bismuth as a main component.
- The flat display of claim 1 or claim 2, wherein the intermediate layer is formed on at least one of two interfaces between the sealing member and the pair of glass substrates.
- The flat display of claim 2, wherein the intermediate layer is the dielectric layer or the protection layer of the front substrate.
- The flat display of claim 2, wherein the intermediate layer is the insulating layer of the back substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2006051733 | 2006-02-28 | ||
PCT/JP2007/053505 WO2007099902A1 (en) | 2006-02-28 | 2007-02-26 | Flat display |
Publications (2)
Publication Number | Publication Date |
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EP1990822A1 true EP1990822A1 (en) | 2008-11-12 |
EP1990822A4 EP1990822A4 (en) | 2010-03-03 |
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ID=38459009
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Application Number | Title | Priority Date | Filing Date |
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EP07714937A Withdrawn EP1990822A4 (en) | 2006-02-28 | 2007-02-26 | Flat display |
Country Status (5)
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EP (1) | EP1990822A4 (en) |
JP (1) | JP4508282B2 (en) |
KR (1) | KR100947142B1 (en) |
CN (1) | CN101341569B (en) |
WO (1) | WO2007099902A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2120251A4 (en) * | 2008-03-10 | 2010-05-05 | Panasonic Corp | Plasma display panel |
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JP2003128434A (en) * | 2001-10-19 | 2003-05-08 | Matsushita Electric Ind Co Ltd | Plasma display panel and method for manufacturing the same and glass composition |
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JP2004284934A (en) * | 2002-04-24 | 2004-10-14 | Central Glass Co Ltd | Lead-free low-melting point glass |
US20050209084A1 (en) * | 2004-03-22 | 2005-09-22 | Tatsuya Takaya | Glass for display substrate |
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JP3547461B2 (en) * | 1993-08-24 | 2004-07-28 | 富士通株式会社 | Plasma display panel and method of manufacturing the same |
JP4557314B2 (en) * | 1996-02-15 | 2010-10-06 | 旭硝子株式会社 | Sealing composition and sealing low melting point glass |
JPH10283936A (en) * | 1997-03-31 | 1998-10-23 | Mitsubishi Electric Corp | Gas discharge display device |
JPH10275563A (en) * | 1997-03-31 | 1998-10-13 | Mitsubishi Electric Corp | Plasma display panel |
JPH1140064A (en) * | 1997-07-25 | 1999-02-12 | Hitachi Ltd | Gas electric discharge display panel and display device using the same |
US6255239B1 (en) * | 1998-12-04 | 2001-07-03 | Cerdec Corporation | Lead-free alkali metal-free glass compositions |
JP4313067B2 (en) | 2002-03-29 | 2009-08-12 | パナソニック株式会社 | Bismuth glass composition, and magnetic head and plasma display panel using the same as sealing member |
CN1180999C (en) * | 2002-09-26 | 2004-12-22 | 北京亚康特种玻璃有限责任公司 | Electronic component seal glass |
US7102287B2 (en) * | 2002-11-18 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel and manufacturing method therefor |
JP2005174856A (en) * | 2003-12-15 | 2005-06-30 | Toshiba Corp | Sealant and image display device using the same |
JP2005314136A (en) * | 2004-04-27 | 2005-11-10 | Matsushita Electric Ind Co Ltd | Sealing material for air tightly sealing and glass paste composition |
-
2007
- 2007-02-26 KR KR1020087013811A patent/KR100947142B1/en not_active IP Right Cessation
- 2007-02-26 WO PCT/JP2007/053505 patent/WO2007099902A1/en active Application Filing
- 2007-02-26 CN CN2007800008459A patent/CN101341569B/en not_active Expired - Fee Related
- 2007-02-26 JP JP2008502762A patent/JP4508282B2/en not_active Expired - Fee Related
- 2007-02-26 EP EP07714937A patent/EP1990822A4/en not_active Withdrawn
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US6803723B1 (en) * | 1999-10-19 | 2004-10-12 | Matsushita Electric Industrial Co., Ltd. | Plasma display and method for producing the same |
JP2003128434A (en) * | 2001-10-19 | 2003-05-08 | Matsushita Electric Ind Co Ltd | Plasma display panel and method for manufacturing the same and glass composition |
JP2004284934A (en) * | 2002-04-24 | 2004-10-14 | Central Glass Co Ltd | Lead-free low-melting point glass |
US20050209084A1 (en) * | 2004-03-22 | 2005-09-22 | Tatsuya Takaya | Glass for display substrate |
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Also Published As
Publication number | Publication date |
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KR20080077155A (en) | 2008-08-21 |
EP1990822A4 (en) | 2010-03-03 |
CN101341569A (en) | 2009-01-07 |
WO2007099902A1 (en) | 2007-09-07 |
JPWO2007099902A1 (en) | 2009-07-16 |
JP4508282B2 (en) | 2010-07-21 |
KR100947142B1 (en) | 2010-03-12 |
CN101341569B (en) | 2010-04-14 |
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