JP2007257982A - Plasma display panel - Google Patents

Plasma display panel Download PDF

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JP2007257982A
JP2007257982A JP2006080301A JP2006080301A JP2007257982A JP 2007257982 A JP2007257982 A JP 2007257982A JP 2006080301 A JP2006080301 A JP 2006080301A JP 2006080301 A JP2006080301 A JP 2006080301A JP 2007257982 A JP2007257982 A JP 2007257982A
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sealing member
plasma display
display panel
glass
panel
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Koji Akiyama
浩二 秋山
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel in which a sealing portion is hardly peeled at the interface and has a high adhesive strength even if bismuth or tin-phosphoric acid based frit is used as a sealing member. <P>SOLUTION: In this plasma display panel, a pair of glass substrates 4, 9 are disposed in opposed positions to each other with a discharge space 14 in between them, and are sealed with a sealing member 16. The sealing member 16 is made of a material including bismuth or phosphorous, and the pair of glass substrates 4, 9 have, at least either side, a convexo-concave portion 17 in a region where the sealing member 16 is arranged. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明はプラズマディスプレイパネル(以下、PDPと略す)に関するものである。   The present invention relates to a plasma display panel (hereinafter abbreviated as PDP).

ガラス、セラミックス、金属などの無機素材を接着する材料としてフリットガラス(以下、フリットと略す)が使用されている。中でも2枚のガラス基板を張り合わせた構造からなるPDPの場合は、パネル内部を減圧にしているため、封止部材として用いられるフリットには高い接着強度が要求される。またPDPにおいて、一般的にフリットは後述のようにパネルの周辺部に配置され、外気がパネル内に侵入するのを防ぐ役割を担っている。このフリットの接着強度が低いと、輸送時の振動や落下衝撃などで、フリットとガラス基板の界面に亀裂が入り(界面剥離)、大気がパネル内に侵入してパネルの一部が点灯しなくなったり、ひどい場合は全く点灯しなくなったりする。   Frit glass (hereinafter abbreviated as frit) is used as a material for bonding inorganic materials such as glass, ceramics, and metals. In particular, in the case of a PDP having a structure in which two glass substrates are bonded to each other, the inside of the panel is decompressed, and therefore, a high adhesive strength is required for a frit used as a sealing member. In the PDP, frit is generally arranged at the peripheral portion of the panel as described later, and plays a role of preventing outside air from entering the panel. If the adhesive strength of this frit is low, the frit and glass substrate will crack due to vibration or drop impact during transportation (interfacial delamination), and air will enter the panel and part of the panel will not light up. Or in severe cases it may not light up at all.

PDPは、ガス放電によって発生した紫外線によって蛍光体を励起発光させ、画像表示するディスプレイである。このPDPを構成する部材には、主として低融点ガラスが多く使用されており、これらの部材の形成は印刷、焼成プロセスの繰り返しにより行われる。このような印刷、焼成の繰り返しによる製造プロセスであるが故に、後の工程で形成される部材になればなるほど使用される低融点ガラスの軟化点は、先に形成されるものよりも低くなるように調整されている。このように複数の低融点ガラスの部材を順に形成する場合、広い温度範囲で軟化点の調整が必要になり、これが容易であるという理由から、PDPにおいては上記の低融点ガラスとして鉛ガラスが多く使用されてきた。   The PDP is a display that displays an image by exciting and emitting phosphors with ultraviolet rays generated by gas discharge. The members constituting this PDP are mainly made of low-melting glass, and these members are formed by repeating printing and firing processes. Because it is a manufacturing process by repeating such printing and baking, the softening point of the low melting point glass used as it becomes a member formed in a later step is lower than that formed earlier. Has been adjusted. Thus, when forming a plurality of low melting point glass members in order, it is necessary to adjust the softening point in a wide temperature range. For this reason, in PDP, there are many lead glasses as the above low melting point glass. Have been used.

しかし近年、人体に対する鉛の毒性や環境汚染が問題視されるようになり、鉛ガラスに代わる材料の検討がなされている。   However, in recent years, toxicity of lead to human bodies and environmental pollution have been considered as problems, and materials that replace lead glass have been studied.

PDPプロセスの最後に使用される封止部材としてのフリットは、最も軟化点が低いため鉛含有量も多く、鉛ガラスを使用しないフリットの開発が急務である。鉛を使用しないフリット材料としては、ビスマス(Bi)系ガラス、あるいは錫−リン酸系ガラスがある(特許文献1参照)。
特開2004−238273号公報
Since the frit as a sealing member used at the end of the PDP process has the lowest softening point and a high lead content, it is urgent to develop a frit that does not use lead glass. As a frit material not using lead, there is bismuth (Bi) glass or tin-phosphate glass (see Patent Document 1).
JP 2004-238273 A

鉛を含まないBi系あるいは錫−リン酸系フリットの課題は、従来の鉛を含むフリットと比較して、ガラス基板との接着強度が低く、剥離試験では界面剥離を生じ易いことである。フリットが界面剥離し易くなると、上記のように輸送時の振動や衝撃によってフリットとガラス基板間の接着不良が発生し易くなり、この場合パネル内に大気が混入し、動作不良を起こすことになる。   The problem with Bi-based or tin-phosphate-based frit that does not contain lead is that the adhesion strength to the glass substrate is lower than that of conventional frit containing lead, and interfacial peeling is likely to occur in the peel test. If the frit is easily peeled off at the interface, the adhesion between the frit and the glass substrate is likely to occur due to vibration and impact during transportation as described above. In this case, air enters the panel and causes malfunction. .

本発明は、上記の課題を解決するためになされたものであって、その目的は、Bi系あるいは錫−リン酸系フリットを封止部材として使用しても、輸送時の振動や衝撃に対して界面剥離が生じ難く、接着強度を高めた封止部を有するPDPを提供することである。   The present invention has been made in order to solve the above-described problems. The object of the present invention is to prevent vibration and impact during transportation even when a Bi-based or tin-phosphate-based frit is used as a sealing member. Therefore, it is an object of the present invention to provide a PDP having a sealing portion in which interfacial peeling hardly occurs and the adhesive strength is increased.

上記目的を達するために本発明の請求項1に記載した発明は、放電空間を設けて対向配置し、封止部材によって接着した2枚のガラス基板を備え、前記封止部材がビスマスまたはリンを含む材料から構成され、前記2枚のガラス基板の少なくとも一方の前記封止部材の配置位置に凹凸部を設けたことを特徴とし、これによって封止部の接着強度を高める。   In order to achieve the above object, the invention described in claim 1 of the present invention is provided with two glass substrates that are arranged to face each other with a discharge space and bonded by a sealing member, and the sealing member contains bismuth or phosphorus. It is comprised from the material which contains, The uneven | corrugated | grooved part was provided in the arrangement position of the said sealing member of at least one of the said 2 glass substrate, and this raises the adhesive strength of a sealing part.

本発明の請求項2に記載した発明は、前記2枚のガラス基板の少なくとも一方に前記放電空間を形成するための隔壁を設け、前記隔壁を前記封止部材の配置位置に形成することによって凹凸部を形成したことを特徴とする。   According to a second aspect of the present invention, a partition for forming the discharge space is provided on at least one of the two glass substrates, and the partition is formed at the position where the sealing member is disposed. A part is formed.

本発明の請求項3に記載した発明は、前記封止部材の配置位置に設けられた凹凸部が、ガラス基板の少なくとも長辺部に設けたことを特徴とする。   The invention described in claim 3 of the present invention is characterized in that the concavo-convex portion provided at the arrangement position of the sealing member is provided on at least the long side portion of the glass substrate.

本発明の請求項4に記載した発明は、前記封止部材の配置位置に設けられた凹凸部が、前記封止部材よりビスマス含有量が少ない材料で構成されたことを特徴とする。   The invention described in claim 4 of the present invention is characterized in that the concavo-convex portion provided at the arrangement position of the sealing member is made of a material having a smaller bismuth content than the sealing member.

本発明によれば、Bi系あるいは錫−リン酸系フリットを封止部材として使用しても、輸送時の振動や衝撃に対して界面剥離が生じ難く、接着強度を高めた封止部を有するPDPを提供することができる。   According to the present invention, even when Bi-based or tin-phosphate-based frit is used as a sealing member, interface peeling hardly occurs due to vibration or impact during transportation, and the sealing portion has an increased adhesive strength. A PDP can be provided.

以下、本発明の実施の形態によるPDPについて、図1〜図7を参照しながら説明するが、本発明の実施の形態はこれに限定されるものではない。   Hereinafter, a PDP according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7, but the embodiment of the present invention is not limited to this.

(実施の形態1)
本発明の実施の形態1によるPDPの構造について図1〜図5を参照しながら説明する。
(Embodiment 1)
The structure of the PDP according to the first embodiment of the present invention will be described with reference to FIGS.

図1は本発明の実施の形態1によるPDPの外観図で、図2はこのPDPの中央部を断面で示した斜視図である。また図3は本発明の実施の形態1によるPDPの断面図を示し、図3(a)は図1のA−A断面図、図3(b)は図1のB−B断面図である。また図4は本発明の実施の形態1によるPDPの背面板コーナー部を拡大して示し、図1のC部の拡大図に相当する。また図5は本発明を実施していないPDPの断面図を示し、図5(a)は図1のA−A断面図、図5(b)は図1のB−B断面図である。   FIG. 1 is an external view of a PDP according to Embodiment 1 of the present invention, and FIG. 2 is a perspective view showing a central portion of the PDP in cross section. 3 shows a cross-sectional view of the PDP according to the first embodiment of the present invention, FIG. 3 (a) is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 (b) is a cross-sectional view taken along line BB in FIG. . FIG. 4 is an enlarged view of a corner portion of the back plate of the PDP according to the first embodiment of the present invention, and corresponds to an enlarged view of a portion C in FIG. 5 shows a cross-sectional view of a PDP not carrying out the present invention, FIG. 5 (a) is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 5 (b) is a cross-sectional view taken along the line BB in FIG.

図1、図2に示すように、パネル1はガラス製の前面板2と背面板3とを、対向配置することにより構成されている。前面板2は、ガラス基板4上に表示電極を構成する走査電極5と維持電極6とが互いに平行に対をなして複数形成されている。通常これらの電極5,6は、透明導電膜とバス電極の2種類の膜で構成される。また透明導電膜の材料としてはITO膜やネサ(SnO2)膜などが使用され、バス電極の材料としては銀膜やCr/Cu/Crの3層構造膜などが使用される。そして、走査電極5および維持電極6上に誘電体層7(厚み:30μm〜50μm)が形成され、さらに誘電体層7上には保護層8(厚み:0.5μm〜2μm)が形成されている。 As shown in FIGS. 1 and 2, the panel 1 is configured by arranging a glass front plate 2 and a back plate 3 so as to face each other. The front plate 2 includes a plurality of scan electrodes 5 and sustain electrodes 6 that form display electrodes on a glass substrate 4 in pairs in parallel with each other. Usually, these electrodes 5 and 6 are composed of two types of films, a transparent conductive film and a bus electrode. An ITO film or a Nesa (SnO 2 ) film is used as the material for the transparent conductive film, and a silver film or a three-layer structure film of Cr / Cu / Cr is used as the material for the bus electrode. A dielectric layer 7 (thickness: 30 μm to 50 μm) is formed on scan electrode 5 and sustain electrode 6, and protective layer 8 (thickness: 0.5 μm to 2 μm) is further formed on dielectric layer 7. Yes.

誘電体層7は、誘電体用ガラス粉末を含むペーストを印刷法により塗布し、焼成することによって形成されており、使用される材料としてはビスマス系材料(Bi−Zn−B−Si−O系)や亜鉛硼酸系(Zn−B−Si−O)、鉛系材料(Pb−B−Si−O)などがある。保護層8は、放電による損傷から誘電体層7を保護するためのもので、対スパッタ性に優れた多結晶MgO(酸化マグネシウム)膜で構成されている(厚み:500−1000nm)。その成膜方法としては、電子ビーム蒸着法やCVD法、スパッタ法など一般的な薄膜形成手法が使用される。   The dielectric layer 7 is formed by applying a paste containing glass powder for dielectric by a printing method and baking it, and a bismuth-based material (Bi-Zn-B-Si-O-based) is used as a material to be used. ), Zinc borate (Zn—B—Si—O), lead-based materials (Pb—B—Si—O), and the like. The protective layer 8 is for protecting the dielectric layer 7 from damage due to electric discharge, and is composed of a polycrystalline MgO (magnesium oxide) film having excellent anti-sputtering properties (thickness: 500-1000 nm). As a film forming method, a general thin film forming method such as an electron beam evaporation method, a CVD method, or a sputtering method is used.

次に背面板3について説明する。背面板3は、ガラス基板9上に複数のデータ電極10が設けられ、そのデータ電極10上に各部位の絶縁を目的として絶縁体層11(厚み:5μm〜20μm)が設けられ、さらに、その絶縁体層11上には井桁状、あるいはストライプ状の隔壁12が設けられている(各図ではストライプ状の隔壁を示す)。隔壁12は感光性ガラスペーストを塗布、パターン露光、現像、焼成によって、またはガラスペースト塗布後サンドブラスト工法によって形成される。隔壁12を構成する材料は、例えばZn−B−Si−O系、Si−Li−O系ガラス、Bi−Si−B−O系ガラスである。絶縁体層11についても、前面板2側の誘電体層7と同様な材料およびプロセスにより形成され、絶縁体層11の表面および隔壁12の側面には蛍光体層13が形成されている。蛍光体層13は、カラー表示のための3色(赤:R、緑:G、青:B)の蛍光体が1対の隔壁12で形成される1つの溝毎に塗り分けられている。   Next, the back plate 3 will be described. The back plate 3 is provided with a plurality of data electrodes 10 on a glass substrate 9, and an insulator layer 11 (thickness: 5 μm to 20 μm) is provided on the data electrode 10 for the purpose of insulating each part. On the insulator layer 11, a grid-like or striped partition wall 12 is provided (in each figure, a stripe-shaped partition wall is shown). The partition wall 12 is formed by applying a photosensitive glass paste, pattern exposure, development, and baking, or by sandblasting after applying the glass paste. The material which comprises the partition 12 is Zn-B-Si-O type | system | group, Si-Li-O type | system | group glass, Bi-Si-BO type | system | group glass, for example. The insulator layer 11 is also formed by the same material and process as the dielectric layer 7 on the front plate 2 side, and the phosphor layer 13 is formed on the surface of the insulator layer 11 and the side surfaces of the partition walls 12. In the phosphor layer 13, phosphors of three colors (red: R, green: G, blue: B) for color display are coated in each groove formed by a pair of partition walls 12.

上記のように形成した前面板2と背面板3は、その間に放電空間14を形成し、かつ走査電極5および維持電極6とデータ電極10とが互いに直交するように対向配置される。そして前面板2もしくは背面板3の封止部材配置位置15に塗布した封止部材16によって接着される。放電空間14には、放電ガスとして、例えばネオン(Ne)とキセノン(Xe)の混合ガスが封入されている。   The front plate 2 and the back plate 3 formed as described above form a discharge space 14 therebetween, and the scan electrode 5, the sustain electrode 6 and the data electrode 10 are arranged to face each other. And it adhere | attaches with the sealing member 16 apply | coated to the sealing member arrangement position 15 of the front plate 2 or the back plate 3. FIG. For example, a mixed gas of neon (Ne) and xenon (Xe) is sealed in the discharge space 14 as a discharge gas.

ここで封着部材16はBiを含有するガラス粉末を樹脂と溶剤にて混練したペーストから成っている。そして上記の接着工程としては封止部材16をスクリーン印刷もしくはインジェクション法により、封止部材配置位置15に塗布し、樹脂成分を除去できる程度に加熱後、前面板2と背面板3を重ね合わせ、ガラス粉末が軟化する温度に加熱して接合することによって成される。このとき封止部材配置位置15は一般的に、前面板2、背面板3の周辺部に位置している。   Here, the sealing member 16 is made of a paste obtained by kneading glass powder containing Bi with a resin and a solvent. And as said adhesion process, the sealing member 16 is apply | coated to the sealing member arrangement position 15 by screen printing or the injection method, and after heating to such an extent that a resin component can be removed, the front plate 2 and the back plate 3 are overlapped, It is formed by heating and bonding to a temperature at which the glass powder softens. At this time, the sealing member arrangement position 15 is generally located in the periphery of the front plate 2 and the back plate 3.

またペーストに使用される樹脂は、アクリル樹脂、エチルセルロース、ニトロセルロースなどであり、溶剤としては酢酸イソアミル、ターピネオールなどが使用される。   Resins used for the paste are acrylic resin, ethyl cellulose, nitrocellulose and the like, and isoamyl acetate, terpineol and the like are used as the solvent.

封止部材16におけるBi含有量は、先に形成した部材に影響を与えないように、50〜80wt%に設定されるのが望ましい。尚、封止部材16には、Biの他にガラスの特性を維持するためにシリコン(Si)や酸素(O)が必ず含まれており、この他にもホウ素(B)、亜鉛(Zn)、アルミニウム(Al)などの元素が適宜混合されている。また、封止部材16にはそれ自身の強度を高めるために、重量比で5〜20wt%の範囲内でフィラーと呼ばれるAl−Si−Mg−O系材料からなる軟化点の高いガラスやセラミックス粉末が混合されている。   The Bi content in the sealing member 16 is desirably set to 50 to 80 wt% so as not to affect the previously formed member. In addition to Bi, silicon (Si) and oxygen (O) are always included in the sealing member 16 in addition to Bi, and boron (B) and zinc (Zn) are also included. Further, elements such as aluminum (Al) are appropriately mixed. Further, the sealing member 16 has a high softening point glass or ceramic powder made of an Al—Si—Mg—O-based material called a filler within a range of 5 to 20 wt% by weight in order to increase its own strength. Are mixed.

本発明では図3および図4に示すように、背面板3の封止部材配置位置15には、隔壁12の形成時に隔壁の一部として凹凸部17を形成している。   In the present invention, as shown in FIGS. 3 and 4, an uneven portion 17 is formed as a part of the partition wall at the sealing member arrangement position 15 of the back plate 3 when the partition wall 12 is formed.

一方、比較のために、図5に示すように封止部材配置位置15に凹凸部17を形成しないパネル501を作製した。但し、凹凸部17を除いて、パネル501の他の構成や材料は本発明のパネル1と同様の構成とした。   On the other hand, for comparison, a panel 501 in which the uneven portion 17 was not formed at the sealing member arrangement position 15 as shown in FIG. However, except for the concavo-convex portion 17, other configurations and materials of the panel 501 were the same as those of the panel 1 of the present invention.

これらのパネル1,501に対し、前面板2および背面板3を引っ張り、封止部材配置位置15の剥離強度試験を実施した(各パネルにおいて、30枚以上実施)。この結果、パネル501はパネル1に対して僅かな力で封止部材16と前面板2、背面板3との界面剥離を生じた。これは、パネル輸送時の振動や衝撃によって封止部材16が前面板2あるいは背面板3との界面部分にクラックが入り易くなっていることを示唆する。   The front plate 2 and the back plate 3 were pulled on these panels 1 and 501 and the peel strength test at the sealing member arrangement position 15 was performed (30 or more sheets were performed on each panel). As a result, the panel 501 caused interface peeling between the sealing member 16 and the front plate 2 and the back plate 3 with a slight force with respect to the panel 1. This suggests that the sealing member 16 is likely to crack at the interface with the front plate 2 or the back plate 3 due to vibration or impact during panel transportation.

上記の強度差を生じた原因は推測であるが、Bi系封止部材はガラス基板との接着強度が低いが、本発明のように少なくとも基板のいずれか一方に凹凸部を設けることにより、封止部材と基板との接着面積が増加して接着強度が改善したものと考えられる。   Although the cause of the above difference in strength is speculated, the Bi-based sealing member has a low adhesive strength with the glass substrate, but by providing an uneven portion on at least one of the substrates as in the present invention, sealing is achieved. It is considered that the bonding area between the stop member and the substrate is increased and the bonding strength is improved.

(実施の形態2)
本発明の実施の形態2によるPDPの構造について図6、図7を参照しながら説明する。
(Embodiment 2)
The structure of the PDP according to the second embodiment of the present invention will be described with reference to FIGS.

図6は本発明の実施の形態2によるPDPの断面図を示し、図6(a)は図1のA−A断面図、図6(b)は図1のB−B断面図である。また図7は本発明を実施していないPDPの断面図を示し、図7(a)は図1のA−A断面図、図7(b)は図1のB−B断面図である。   6 shows a cross-sectional view of a PDP according to Embodiment 2 of the present invention, FIG. 6 (a) is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 6 (b) is a cross-sectional view taken along the line BB in FIG. 7 shows a cross-sectional view of a PDP not carrying out the present invention. FIG. 7 (a) is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 7 (b) is a cross-sectional view taken along the line BB in FIG.

本発明の実施の形態2では、実施の形態1で作製したパネル1において、図6に示すように封止部材16を形成する封止部材配置位置15において保護層8や誘電体層7,11を形成していないパネル601を作製した。また、図7に示すように比較のために凹凸部17を設けていないパネル701も作製した。これらのパネルについて実施の形態1と同様に剥離強度試験を行った結果、パネル701はパネル601に対して僅かな力で封止部材16と前面板2、背面板3との界面剥離を生じた。   In the second embodiment of the present invention, in the panel 1 produced in the first embodiment, the protective layer 8 and the dielectric layers 7 and 11 are formed at the sealing member arrangement position 15 where the sealing member 16 is formed as shown in FIG. A panel 601 in which no is formed was manufactured. In addition, as shown in FIG. 7, a panel 701 without the uneven portion 17 was also prepared for comparison. As a result of performing a peel strength test on these panels in the same manner as in the first embodiment, the panel 701 caused interface peeling between the sealing member 16 and the front plate 2 and the back plate 3 with a slight force with respect to the panel 601. .

上記の強度差を生じた原因は、実施の形態1と同様に、Bi系封止部材はガラス基板との接着強度が低いが、本発明のように少なくとも基板のいずれか一方に凹凸部を設けることにより、封止部材と基板との接着面積が増加して接着強度が改善したものと考えられる。   The cause of the above difference in strength is that, as in the first embodiment, the Bi-based sealing member has a low adhesive strength with the glass substrate, but at least one of the substrates is provided with an uneven portion as in the present invention. Thus, it is considered that the bonding area between the sealing member and the substrate is increased, and the bonding strength is improved.

以下、その他の実施の形態について述べる。   Other embodiments will be described below.

上記実施の形態において、凹凸部17を構成する材料にBi系ガラスを使用する場合は、Bi含有量が少なくとも50wt%未満にすること、あるいは封止部材のBi含有量よりも低くなることが好ましい。でなければ、凹凸部17とガラス基板4,9との接着強度が低下し、上記のような封止部の接着強度向上の効果が薄れてしまう。   In the said embodiment, when using Bi-type glass for the material which comprises the uneven | corrugated | grooved part 17, it is preferable that Bi content shall be at least less than 50 wt%, or it becomes lower than Bi content of a sealing member. . Otherwise, the adhesive strength between the concavo-convex portion 17 and the glass substrates 4 and 9 is lowered, and the effect of improving the adhesive strength of the sealing portion as described above is diminished.

また、封止部材に使用する材料としては、上記のBi系ガラスの他に、Sn−P−O系ガラス、Zn−Sn−P−O系ガラスでも同様な効果があることを確認した。   Moreover, as a material used for a sealing member, it confirmed that the same effect was obtained also in Sn-PO glass and Zn-Sn-PO glass other than said Bi glass.

上記実施の形態において、凹凸部17を封止部材配置位置15の全域に設けたが、この実施の形態に限らず、封止部材配置位置15の一部に凹凸部17を設けるだけでも効果は得られる。特に、パネル501、パネル701の剥離試験で弱かったのは長辺側であったことから、長辺側のみに凹凸部17を形成してもパネル1、パネル601と同様の接着強度向上の効果が得られる。   In the above embodiment, the concavo-convex portion 17 is provided in the entire region of the sealing member arrangement position 15. However, the present invention is not limited to this embodiment. can get. In particular, since it was the long side that was weak in the peeling test of the panel 501 and the panel 701, even if the uneven portion 17 is formed only on the long side, the effect of improving the adhesive strength similar to the panel 1 and the panel 601 is achieved. Is obtained.

パネルの構造は上記実施の形態に示したものに限られるわけではなく、例えば井桁状の隔壁を備えたものであってもよい。さらに、図3、図4および図6で短辺側の封止部材配置位置15の凸部の数を2〜3本としているが、これは便宜上のものであり、本数はこれに限るものでない。   The structure of the panel is not limited to that shown in the above embodiment, and for example, it may be provided with a grid-like partition wall. Further, in FIGS. 3, 4, and 6, the number of convex portions at the short-side sealing member arrangement position 15 is two to three, but this is for convenience and the number is not limited thereto. .

また、上記実施の形態において、凹凸部17を隔壁12の形成と同時に形成したが、前面板2の誘電体層7を使って、封止部材配置位置15に誘電体の厚み分の凹凸を形成しても同様な効果が得られる。   In the above embodiment, the concavo-convex portion 17 is formed at the same time as the formation of the partition wall 12. However, the same effect can be obtained.

以上から分かるように、本発明のPDPは封止部の強度が高く、信頼性に優れる。   As can be seen from the above, the PDP of the present invention has high sealing portion strength and excellent reliability.

以上のように、本発明によれば接着強度を高めた封止部を有するPDPを得ることができる有用な発明である。   As described above, according to the present invention, it is a useful invention capable of obtaining a PDP having a sealing portion with increased adhesive strength.

本発明の実施の形態1によるプラズマディスプレイパネルの外観図1 is an external view of a plasma display panel according to Embodiment 1 of the present invention. 同プラズマディスプレイパネルの中央部を断面で示した斜視図The perspective view which showed the central part of the plasma display panel in the section 同プラズマディスプレイパネルの断面図を示し、(a)は図1のA−A断面図、(b)は図1のB−B断面図2A and 2B are cross-sectional views of the plasma display panel, in which FIG. 1A is a cross-sectional view taken along the line A-A in FIG. 1, and FIG. 同プラズマディスプレイパネルの背面板コーナー部を拡大して示し、図1のC部の拡大図1 is an enlarged view of the corner portion of the back plate of the plasma display panel, and is an enlarged view of portion C of FIG. 本発明を実施していないプラズマディスプレイパネルの断面図を示し、(a)は図1のA−A断面図、(b)は図1のB−B断面図1A and 1B are cross-sectional views of a plasma display panel not implementing the present invention, wherein FIG. 1A is a cross-sectional view taken along line AA in FIG. 1 and FIG. 1B is a cross-sectional view taken along line BB in FIG. 本発明の実施の形態2によるプラズマディスプレイパネルの断面図を示し、(a)は図1のA−A断面図、(b)は図1のB−B断面図2A and 2B are cross-sectional views of a plasma display panel according to Embodiment 2 of the present invention, in which FIG. 1A is a cross-sectional view taken along line AA in FIG. 1 and FIG. 1B is a cross-sectional view taken along line BB in FIG. 本発明を実施していないプラズマディスプレイパネルの断面図を示し、(a)は図1のA−A断面図、(b)は図1のB−B断面図1A and 1B are cross-sectional views of a plasma display panel not implementing the present invention, wherein FIG. 1A is a cross-sectional view taken along line AA in FIG. 1 and FIG. 1B is a cross-sectional view taken along line BB in FIG.

符号の説明Explanation of symbols

1,601 プラズマディスプレイパネル(パネル)
2 前面板
3 背面板
4,9 ガラス基板
7 誘電体層
8 保護層
11 絶縁体層
15 封止部材配置位置
16 封止部材
17 凹凸部
1,601 Plasma display panel (panel)
2 Front plate 3 Back plate 4, 9 Glass substrate 7 Dielectric layer 8 Protective layer 11 Insulator layer 15 Sealing member arrangement position 16 Sealing member 17 Concavity and convexity

Claims (4)

放電空間を設けて対向配置し、封止部材によって接着した2枚のガラス基板を備え、前記封止部材がビスマスまたはリンを含む材料から構成され、前記2枚のガラス基板の少なくとも一方の前記封止部材の配置位置に凹凸部を設けたことを特徴とするプラズマディスプレイパネル。 Disposed to provide a discharge space, and provided with two glass substrates bonded by a sealing member, the sealing member is made of a material containing bismuth or phosphorus, and the sealing of at least one of the two glass substrates A plasma display panel characterized in that an uneven portion is provided at a position where the stop member is arranged. 前記2枚のガラス基板の少なくとも一方に前記放電空間を形成するための隔壁を設け、前記隔壁を前記封止部材の配置位置に形成することによって凹凸部を形成したことを特徴とする請求項1に記載のプラズマディスプレイパネル。 2. An uneven portion is formed by providing a partition wall for forming the discharge space on at least one of the two glass substrates, and forming the partition wall at a position where the sealing member is disposed. 2. A plasma display panel according to 1. 前記封止部材の配置位置に設けられた凹凸部が、ガラス基板の少なくとも長辺部に設けたことを特徴とする請求項1に記載のプラズマディスプレイパネル。 The plasma display panel according to claim 1, wherein the uneven portion provided at the arrangement position of the sealing member is provided on at least a long side portion of the glass substrate. 前記封止部材の配置位置に設けられた凹凸部が、前記封止部材よりビスマス含有量が少ない材料で構成されたことを特徴とする請求項1に記載のプラズマディスプレイパネル。 2. The plasma display panel according to claim 1, wherein the concavo-convex portion provided at the position where the sealing member is disposed is made of a material having a lower bismuth content than the sealing member.
JP2006080301A 2006-03-23 2006-03-23 Plasma display panel Pending JP2007257982A (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10139478A (en) * 1996-02-15 1998-05-26 Asahi Glass Co Ltd Composition for sealing
JP2000315457A (en) * 1999-04-30 2000-11-14 Ulvac Japan Ltd Manufacture of plasma display device, and rear panel
JP2003045342A (en) * 2001-08-01 2003-02-14 Nippon Electric Glass Co Ltd Rib material for plasma display panel
JP2003142009A (en) * 2001-11-06 2003-05-16 Matsushita Electric Ind Co Ltd Plasma display device
JP2004238273A (en) * 2002-03-29 2004-08-26 Matsushita Electric Ind Co Ltd Bismuth-based glass composition, and magnetic head and plasma display panel using it as sealing member
JP2004327390A (en) * 2003-04-28 2004-11-18 Fujitsu Ltd Display device and manufacturing method of display device
JP2005158336A (en) * 2003-11-21 2005-06-16 Fujitsu Hitachi Plasma Display Ltd Plasma display panel and its manufacturing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10139478A (en) * 1996-02-15 1998-05-26 Asahi Glass Co Ltd Composition for sealing
JP2000315457A (en) * 1999-04-30 2000-11-14 Ulvac Japan Ltd Manufacture of plasma display device, and rear panel
JP2003045342A (en) * 2001-08-01 2003-02-14 Nippon Electric Glass Co Ltd Rib material for plasma display panel
JP2003142009A (en) * 2001-11-06 2003-05-16 Matsushita Electric Ind Co Ltd Plasma display device
JP2004238273A (en) * 2002-03-29 2004-08-26 Matsushita Electric Ind Co Ltd Bismuth-based glass composition, and magnetic head and plasma display panel using it as sealing member
JP2004327390A (en) * 2003-04-28 2004-11-18 Fujitsu Ltd Display device and manufacturing method of display device
JP2005158336A (en) * 2003-11-21 2005-06-16 Fujitsu Hitachi Plasma Display Ltd Plasma display panel and its manufacturing method

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