EP1933609A4 - SUBSTRATE STRUCTURE - Google Patents
SUBSTRATE STRUCTUREInfo
- Publication number
- EP1933609A4 EP1933609A4 EP06714109A EP06714109A EP1933609A4 EP 1933609 A4 EP1933609 A4 EP 1933609A4 EP 06714109 A EP06714109 A EP 06714109A EP 06714109 A EP06714109 A EP 06714109A EP 1933609 A4 EP1933609 A4 EP 1933609A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0047—Casings being rigid plastic containers having conductive particles, fibres or mesh embedded therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005250200 | 2005-08-30 | ||
PCT/JP2006/302969 WO2007026439A1 (ja) | 2005-08-30 | 2006-02-20 | 基板構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1933609A1 EP1933609A1 (en) | 2008-06-18 |
EP1933609A4 true EP1933609A4 (en) | 2011-01-05 |
Family
ID=37808543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06714109A Withdrawn EP1933609A4 (en) | 2005-08-30 | 2006-02-20 | SUBSTRATE STRUCTURE |
Country Status (6)
Country | Link |
---|---|
US (1) | US7969741B2 (ja) |
EP (1) | EP1933609A4 (ja) |
JP (1) | JP4795355B2 (ja) |
KR (1) | KR20080039507A (ja) |
CN (1) | CN101273674A (ja) |
WO (1) | WO2007026439A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5504683B2 (ja) * | 2009-04-27 | 2014-05-28 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
JP5436557B2 (ja) * | 2009-07-17 | 2014-03-05 | パナソニック株式会社 | 電子モジュールおよびその製造方法 |
JP2011054640A (ja) * | 2009-08-31 | 2011-03-17 | Funai Electric Co Ltd | シールドパッケージ基板 |
US8988628B2 (en) * | 2011-06-23 | 2015-03-24 | Apple Inc. | Coated chassis for liquid crystal display |
US9244215B2 (en) * | 2011-09-09 | 2016-01-26 | Apple Inc. | Chassis for display backlight |
JP6035015B2 (ja) * | 2011-09-09 | 2016-11-30 | ソニー株式会社 | 回路基板 |
KR101450950B1 (ko) * | 2011-10-04 | 2014-10-16 | 엘지디스플레이 주식회사 | 드라이버 패키지 |
TWI528149B (zh) * | 2011-12-14 | 2016-04-01 | 英特爾股份有限公司 | 具有熱解決方案之裝置及具有熱解決方案之方法 |
JP2014045042A (ja) * | 2012-08-24 | 2014-03-13 | Fujitsu Ltd | 実装構造および電子機器 |
EP2704536B1 (en) * | 2012-08-31 | 2015-12-16 | Harman Becker Automotive Systems GmbH | Method for producing a circuit board system |
DE102013213233A1 (de) * | 2013-07-05 | 2015-01-08 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zum Herstellen eines Gehäuses mit einer Schirmung vor elektrischer und/oder magnetischer Strahlung und Gehäuse mit Schirmung vor elektrischer und/oder magnetischer Strahlung |
US9247034B2 (en) * | 2013-08-22 | 2016-01-26 | Asia Vital Components Co., Ltd. | Heat dissipation structure and handheld electronic device with the heat dissipation structure |
US9576930B2 (en) * | 2013-11-08 | 2017-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thermally conductive structure for heat dissipation in semiconductor packages |
JP6623513B2 (ja) * | 2013-12-03 | 2019-12-25 | 東洋インキScホールディングス株式会社 | 電子素子およびシート材 |
CN105830135B (zh) * | 2013-12-25 | 2019-06-04 | 京瓷株式会社 | 电子设备 |
JP6949865B2 (ja) * | 2015-12-14 | 2021-10-13 | エイ・ケイ・スタンピング・カンパニー・インコーポレイテッドA.K. Stamping Company, Inc. | マルチピースシールド |
EP4325264A3 (en) | 2016-04-13 | 2024-05-22 | TactoTek Oy | Illuminated multilayer structure with embedded light sources |
JP2018098927A (ja) * | 2016-12-14 | 2018-06-21 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
US10802198B1 (en) * | 2019-03-29 | 2020-10-13 | Dura Operating, Llc | Structural support elements of light guide and electrical housing |
US11089673B2 (en) * | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
US20220418082A1 (en) * | 2021-06-24 | 2022-12-29 | Samsung Electronics Co., Ltd. | Electronic device including a structure for guiding an arrangement position of an electronic component |
KR20230000137A (ko) * | 2021-06-24 | 2023-01-02 | 삼성전자주식회사 | 전자 부품의 배치 위치를 가이드하기 위한 구조를 포함하는 전자 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10104584A (ja) * | 1996-09-27 | 1998-04-24 | Kyocera Corp | 液晶表示装置 |
US20040214496A1 (en) * | 2003-04-25 | 2004-10-28 | Cateron Corp. | Material having characteristics of high thermal conductivity and electromagnetic interference resistance |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03241669A (ja) | 1990-02-20 | 1991-10-28 | Yuasa Battery Co Ltd | 非水溶液電池とその集合電池 |
US5991155A (en) * | 1996-12-13 | 1999-11-23 | Mitsubishi Denki Kabushiki Kaisha | Heat sink assembly including flexible heat spreader sheet |
JP3241669B2 (ja) | 1998-11-09 | 2001-12-25 | 埼玉日本電気株式会社 | Icパッケージの補強構造 |
JP3387439B2 (ja) | 1999-03-12 | 2003-03-17 | 松下電器産業株式会社 | 面照明装置及びこの面照明装置を用いた表示装置及びこの表示装置を用いた携帯機器 |
US7088333B1 (en) | 1999-03-12 | 2006-08-08 | Matsushita Electric Industrial Co., Ltd. | Surface lighting device and portable terminal using the same |
JP2001024312A (ja) | 1999-07-13 | 2001-01-26 | Taiyo Yuden Co Ltd | 電子装置の製造方法及び電子装置並びに樹脂充填方法 |
US20010019379A1 (en) * | 2000-01-31 | 2001-09-06 | Takayuki Ishihara | Front light type liquid crystal display |
KR100784804B1 (ko) | 2001-05-07 | 2007-12-14 | 삼성전자주식회사 | 액정 표시 장치 및 제조 방법 |
JP2004031651A (ja) | 2002-06-26 | 2004-01-29 | Sony Corp | 素子実装基板及びその製造方法 |
US6940712B2 (en) * | 2002-07-17 | 2005-09-06 | International Business Machines Corporation | Electronic device substrate assembly with multilayer impermeable barrier and method of making |
WO2004088404A1 (ja) | 2003-03-31 | 2004-10-14 | Sanyo Electric Co., Ltd. | 液晶表示装置 |
US7292441B2 (en) * | 2003-11-25 | 2007-11-06 | Advanced Energy Technology Inc. | Thermal solution for portable electronic devices |
US7760290B2 (en) * | 2005-04-08 | 2010-07-20 | Bong Sup Kang | Multi-reflecting device and backlight unit and display device having multi-reflecting architecture |
-
2006
- 2006-02-20 US US12/065,177 patent/US7969741B2/en not_active Expired - Fee Related
- 2006-02-20 JP JP2007533117A patent/JP4795355B2/ja not_active Expired - Fee Related
- 2006-02-20 CN CNA2006800353346A patent/CN101273674A/zh active Pending
- 2006-02-20 EP EP06714109A patent/EP1933609A4/en not_active Withdrawn
- 2006-02-20 KR KR1020087007028A patent/KR20080039507A/ko not_active Application Discontinuation
- 2006-02-20 WO PCT/JP2006/302969 patent/WO2007026439A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10104584A (ja) * | 1996-09-27 | 1998-04-24 | Kyocera Corp | 液晶表示装置 |
US20040214496A1 (en) * | 2003-04-25 | 2004-10-28 | Cateron Corp. | Material having characteristics of high thermal conductivity and electromagnetic interference resistance |
Non-Patent Citations (1)
Title |
---|
See also references of WO2007026439A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP4795355B2 (ja) | 2011-10-19 |
US7969741B2 (en) | 2011-06-28 |
EP1933609A1 (en) | 2008-06-18 |
JPWO2007026439A1 (ja) | 2009-03-26 |
US20100020497A1 (en) | 2010-01-28 |
CN101273674A (zh) | 2008-09-24 |
KR20080039507A (ko) | 2008-05-07 |
WO2007026439A1 (ja) | 2007-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20080328 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB |
|
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: PANASONIC CORPORATION |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20101206 |
|
17Q | First examination report despatched |
Effective date: 20110720 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20111201 |