Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
  • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
  • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
  • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
  • H01L2224/321—Disposition
  • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
  • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked

Definitions

• the invention relates to a method for depositing electronic components, in particular semiconductor chips according to the preamble of claim 1.
• a method for depositing electronic components for example, in the manufacture of semiconductor devices in Chipmontageautomaten (so-called Diebondern) the unhoused chip from the silicon wafer (wafer) and then picked deposited or bonded to corresponding substrates. After the bonding process, further process steps, such as B. curing, wire bonding, melting of solder joints, encapsulation, singulation, etc.
• connection process determines whether the chip must be turned before placement (flip-chip applications) or not (non-flip applications). Turning of the chip is expressly understood below not a relative movement with respect. A spatial axis or spatial plane, but a turning with respect to the original bearing side. In the case of non-flip applications, the chip is not turned around and, after being picked up by the wafer film, transported directly in one step to the substrate, whereby the pickup tool is simultaneously used as a bonding tool. The support side with which the chip was glued onto the wafer film is then also the side with which the chip is glued onto the substrate.
• a known device of this type is described for example in EP 1049140 Bl or by the company magazine "newsline 1/2002" the applicant (machine type "EasyLine”) become known.
• the chip is deposited with its structure side after turning on the substrate, ie the support te, with which the chip was adhered to the wafer, after placing then the side facing away from the substrate.
• the present invention relates to a mounting method in which the chip is not turned.
• the picking of the chips takes place after the singulation process (sawing saws), in which the silicon wafer was glued onto a film and then the individual chips are separated from one another (see also FIG. 1a).
• the circuits or contact points (structure side) of the chips are located on the opposite side of the support side.
• the detachment process of the chip from the wafer film is usually carried out today with the help of needles.
• the wafer film rests on a support surface. This is provided with openings, so that the film can be sucked by vacuum and thus fixed on the support.
• a bearing surface is also referred to as a vacuum chuck.
• a stamped with an array of needles stamp is now brought from behind to the wafer, and it may be only a single needle with very small chip dimensions.
• the entire unit of vacuum chuck and movable needles is termed "ejection unit.”
• ejection unit The entire unit of vacuum chuck and movable needles.
• the wafer foil is intentionally pierced with pointed needles or the wafer tape is made with round needles
• the chip is also lifted and separated from the wafer film After a selectable wait time, the separation is complete and the chip can be removed with a pickup tool and then fed to the substrate.
• the position (position and angle) of the chip on the wafer accurately measured before the chip is picked from the wafer.
• the measurement result is compared with a desired position and when a difference is detected, a correction can be made, be it by post-correction of the position and / or the angle of the wafer table or the position and / or the angle of the pickup tool.
• FIGS. 1 b and 1 c illustrate the measurement or the measurability of the recorded chips in flip-chip applications (FIG. 1 b) and in non-flip applications (FIG. 1 c).
• the measurement after receiving the chip 6 of the wafer film with a corresponding camera 27 from the bottom is relatively easy, because after turning (flip process), the structure side 16 or that with solder balls (bumps) is oriented down and not from the pickup - tool 28 is touched or covered.
• This site is therefore metrologically and spatially easy and freely accessible.
• the pickup tool 28 detects the chip 6 on the structure side 16, which apparently obscures the field of view for a camera.
• the receiving tool completely covers the structure side.
• a mere position detection with respect to the chip edges from below without consideration of the circuit structure is insufficient.
• FIG. 10a shows such a multichip Package consisting of a first chip 20 and a second chip 21, which is heated according to the prior art exclusively via a heater 19 at the storage station 14 from below.
• the last deposited second chip 21 or the adhesive film 23 is shown to be heated only poorly or delayed because of the poor thermal conductivity of the substrate and adhesive film.
• a better separation between the picking process and the depositing process is to be achieved in order to realize different process requirements.
• the storage of the component on an intermediate station and the local determination of the actual position with a monitoring device solves two different problems in a simple manner.
• the exact position of the chip can be determined again after it has been detached from the wafer film, and from the same perspective as before on the wafer film, namely taking into account the surface structure.
• the recording of the chip from the intermediate station is possible with very high accuracy, since no more adhesive forces must be overcome and no shifts or twists can take place through the wafer more. In this way, the transfer fee Process of the film-related positional error of the chip to be post-corrected before filing on the substrate again.
• the transport of the component takes place over the entire transport route by two separate tools, so that different process conditions at the supply station and at the storage station do not influence each other. In particular, completely different temperatures can prevail there. But other deviations in the process conditions would be conceivable such. B. different forces when depositing or different pressure conditions in the storage station, etc.
• the actual position of the component is determined on the storage station before recording with a first monitoring device and at least the actual position of the substrate at the storage station before filing with a second monitoring device and if deviations be corrected between the determined actual values and a predetermined target position of the component on the substrate, wherein the actual position of the component is detected on the intermediate station with a third monitoring device, the measurement data for the position correction of the component are used.
• An acceleration of the working process takes place when the primary tool and the secondary tool move such that in each case a component is picked up by the supply station and by the intermediate station and deposited on the substrate or on the intermediate station.
• the two tools can move synchronously or asynchronously.
• the primary tool could move relatively slowly against the intermediate station, while the secondary tool would not move until shortly before the intervention. driving the primary tool in a rapid movement to the storage station.
• the primary tool and the secondary tool can each move linearly on the transport path, wherein the tools are displaceable along a guide, for example.
• the course of the transport path is dependent on the relative position of the storage station to the storage station, and it would thus also quite curved, especially circular transport routes conceivable.
• the supply station or the storage station must each be arranged on a horizontal plane.
• the monitoring devices are preferably cameras whose fields of vision are directed to the supply station or to the intermediate station or to the storage station. Since these fields are interrupted by one of the tools depending on the operating state, the measuring process must be carried out at an appropriate time.
• the third monitoring device is preferably activated when the primary tool and the secondary tool release the field of view to the intermediate station after placing a component.
• the secondary tool and optionally also the deposition station are heated.
• the intermediate station is provided with a heating device or if the component is heated at the intermediate station.
• process steps could be performed, such as cooling, refining, decontamination, etc.
• the intermediate station is preferably displaceable in two spatial axes and / or rotatably mounted about a spatial axis. Such storage can also serve the position correction.
• the intermediate station can also be designed as a buffer memory for the components with a plurality of storage positions. Thus, the intermediate station could for example be designed as a carousel with several storage positions in the peripheral region.
• the primary tool could be temporarily turned off, for example, to load a new wafer frame, while the secondary tool continues to work continuously and picks up the chips from the buffer memory.
• the inventive method and the device according to the invention can be used for the processing of various electronic components. However, they are particularly suitable for mounting semiconductor chips which are received by a wafer film and which have a structure side on the side facing away from the support side, wherein the subdivided wafer on a wafer table in at least two spatial axes is displaceable and wherein the individual semiconductor chips with an ejection unit be detached from the wafer foil.
• FIG. 1 a shows a simplified illustration of a subdivided wafer on a wafer film with an enlarged semiconductor chip
• FIG. 1 b shows a turned chip on a picking tool with the support side upwards with a view of the structure side from below according to the prior art
• FIG. 1c shows an unturned chip with the support side downwards or structure side upward according to the prior art
• FIG. 2 is a highly schematic representation of an apparatus according to the invention in various operating states
• Figure 10a is a schematic representation of the assembly of stacked and 10b th chips according to the prior art ( Figure 10a) and according to the invention ( Figure 10b).
• FIG. 1 a per se known arrangement is shown, in which a semiconductor wafer 17 is adhesively bonded to a wafer foil 24, which in turn is stretched in a wafer frame 25.
• the individual semiconductor chips 6 of the wafer are already separated by sawing, which is indicated by the intersecting lines.
• Each chip 6 has a support side 15 with which it adheres to the wafer foil before detachment.
• the separation of the chips by sawing or the detachment process from the wafer film with the aid of needles and other auxiliaries are already sufficiently known to the person skilled in the art.
• each individual chip 6 of the wafer can be positioned over the ejection unit.
• a linear slide guide 3 Arranged above the wafer table 7 in the example is a linear slide guide 3, on which a primary tool 4 and a secondary tool 12 are mounted linearly displaceable. Each tool has a suction needle 5 or 13 for receiving and holding a chip 6. The tools or the suction needles can be lowered vertically for receiving a chip.
• a deposition station 14 on which a substrate 9 can be placed, is arranged approximately in the same horizontal plane.
• the substrate 9 may be, for example, an endless belt, a leadframe or even a circuit board or the like, which are transported on step by step.
• an intermediate station 10 is arranged, which serves the clipboard of a chip 6.
• a chip 6 picked up by the wafer foil 24 thus lays on the substrate until it reaches its final position
• the intermediate station 10 is here arranged on half of the transport route.
• the transport path T could also be divided in a different ratio, in particular if the transport path is not generally linear, but is guided partly curved or circular arc.
• the primary tool 4 can cover half the transport distance T / 2 from the weighing stage 7 to the intermediate station 10, while the secondary tool 12 can also cover half the transport distance T / 2 from the intermediate station 10 to the storage station 14, synchronously or asynchronously with the Primary Tool 4.
• the required drives for moving the tools along the carriage guide 3 or for the required strokes and the position measuring systems are not shown here.
• a first camera 1 is arranged, with the aid of which the actual position of a chip 6 can be determined prior to recording.
• a second camera 2 is disposed above the storage station, with which the exact position of the substrate 9 can be determined.
• a third camera 11 is arranged above the intermediate station 10 in order to determine the position of a chip deposited there.
• the cameras do not have to be located exactly above the individual workstations. It is sufficient if the fields of view of the cameras are directed to these workstations, the cameras themselves, for example, could also be placed laterally.
• the individual cameras are in operative connection with a control device 26, in which the determined actual values are compared with prescribed desired values. When a deviation is detected, corrections are made so that each chip is deposited on the substrate 9 as exactly as possible at a predefined location.
• both the chip 6 from the wafer 17 and the chip 6 'from the intermediate station 10 are accommodated, and the measurement of the substrate 9 is completed.
• the wafer table 7 is repositioned so that a new chip 6 "is provided for the next shot.
• the two tools 4 and 12 have each covered half the transport distance and reached their controlled workstations, namely on the one hand, the intermediate station 10 and on the other hand, the storage station 14. At least now, by means of the first camera 1 of the newly positioned chip 6 '' on the wafer table 7 are measured.
• the chip 6 is deposited on the intermediate station 10 and the chip 6 'on the substrate 9.
• the chip 6 is preferably held for the temporary placement by means of vacuum, while the chip 6 'is bonded to the substrate.
• the secondary tool 12 When depositing the chip 6 'any position errors are corrected by the secondary tool 12 or by fine correction of the substrate layer.
• Figure 7 shows how the two tools 4 and 12 and their suction needles 5 and 13 are raised again, so that the return movement can begin in the direction of arrow b.
• This return movement is shown in Figure 8, wherein in an intermediate position in which neither of the two tools 4 and 12 crosses the image field of the third camera 11, the position of the deposited chip 6 is measured on the intermediate station 10.
• the two tools 4 and 12 have again assumed their original starting position, in which on the one hand the new chip 6 "on the wafer table 7 and on the other hand the interposed chip 6 can be received at the intermediate station, so that the cycle begins again.
• FIG. 10b shows a secondary tool 12, which is provided with an additional heating device 18.
• a heating device 19 could also be provided at the deposition station 14, so that a substrate 9 can be heated both from below via the substrate support and from above via the bonding tool.
• This arrangement is suitable for the assembly of stacked chips, in which a first chip 20 is fixed with an adhesive film 22 under the action of heat on the substrate 9. On the first chip, a second chip 21 is placed using a further adhesive film 23.
• the secondary tool 12 comes namely only with the intermediate station 10, but never with the supply station 7 in thermal contact.
• the heating from above with the secondary tool also has the advantage that bulges of the chip are avoided, as they can only occur from below at the storage station during heating.
• a heater on the secondary tool pressure and heat simultaneously, which has an advantageous effect on the bonding process.
• the storage station, the intermediate station and the storage station need not necessarily be arranged on the same or on parallel planes.
• the intermediate station 10 it would be conceivable, for example, for the intermediate station 10 to be designed to be movable in order to receive a component from the primary tool in a first operating position and to deliver a component to the secondary tool in a second operating position.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Applications Claiming Priority (1)

Publications (1)

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ID=35432668

Family Applications (1)

Country Status (3)

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Family Cites Families (5)

• 2005
  • 2005-09-16 EP EP05787205A patent/EP1925023A1/de not_active Withdrawn
  • 2005-09-16 WO PCT/EP2005/054632 patent/WO2007033701A1/de active Application Filing
• 2006
  • 2006-08-29 TW TW095131726A patent/TW200729388A/zh unknown

Non-Patent Citations (1)

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