EP1922426A1 - Procede de fabrication et d'utilisation d'un demi-produit a base de nickel presentant une texture cubique de recristallisation - Google Patents
Procede de fabrication et d'utilisation d'un demi-produit a base de nickel presentant une texture cubique de recristallisationInfo
- Publication number
- EP1922426A1 EP1922426A1 EP06725088A EP06725088A EP1922426A1 EP 1922426 A1 EP1922426 A1 EP 1922426A1 EP 06725088 A EP06725088 A EP 06725088A EP 06725088 A EP06725088 A EP 06725088A EP 1922426 A1 EP1922426 A1 EP 1922426A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- semi
- finished product
- nickel
- producing
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 239000011265 semifinished product Substances 0.000 title claims abstract description 29
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 26
- 238000001953 recrystallisation Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 238000000137 annealing Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 239000002887 superconductor Substances 0.000 claims abstract description 6
- 230000004927 fusion Effects 0.000 claims abstract description 3
- 238000004663 powder metallurgy Methods 0.000 claims abstract description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 238000005551 mechanical alloying Methods 0.000 claims description 2
- 238000005272 metallurgy Methods 0.000 claims description 2
- 239000013067 intermediate product Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000004332 silver Substances 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005482 strain hardening Methods 0.000 description 5
- 238000005097 cold rolling Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019582 Cr V Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/248—Thermal after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
Definitions
- the invention relates to a process for the production of nickel-based semi-finished products in strip or flat wire form with a recrystallization cube texture and the use of the semifinished product produced.
- the semifinished product can be used in particular as a substrate for physico-chemical coatings with a high degree of microstructural alignment.
- Such supports are suitable, for example, as substrates for ceramic coatings as used in the field of high temperature superconductivity. In this case, they are used in superconducting magnets, transformers, motors, tomographs or superconducting current paths.
- Ni alloys with Mo and W (DE 100 05 861 C1). It has also been proposed to add such Ni alloys up to a maximum of 0.3 atom% Ag (DE 103 42 965.4).
- Recrystallization is formed, have a structure with equiaxed grains, that is, based on the band level, they are about the same length and width.
- grain extension in the longitudinal direction should be advantageous for current transport in superconductivity and result in higher transmittable currents (Hammerl, H. et al., Eur. Phys. Journal B (2002) 299-301).
- Recrystallized nickel or its cubic texture alloys have grains which are approximately the same lengthwise in the longitudinal direction as in the transverse direction,
- Nickel after cold working and recrystallization annealing, tends strongly to form a coarse grain structure, which is detrimental to obtaining the high grade cube texture.
- Ni-tapes tend in the recrystallization heat treatment, especially at higher temperatures (800 to 115o C 0) strongly to the formation of grain boundaries trenches,
- Grain boundary trench substrate material is poorly suited as a substrate for epitaxial layer depositions, for example for buffer layers and
- the semi-finished product should have an elongated grain shape with stable cube texture, and the expanded grain should remain intact even after further thermal treatment at high temperatures for the purpose of oxide layer growth.
- the method according to the invention is characterized in that initially a starting semi-finished product is produced by fusion metallurgy or powder metallurgy involving mechanical alloying, which consists of technically pure Ni or a Ni alloy, wherein an Ag addition in the microalloying range of at least 10 atomic ppm and a maximum of 1000 atomic ppm is contained.
- This starting semifinished product is processed by means of a hot forming with subsequent cold working of> 50% thickness reduction to tape or flat wire with an intermediate dimension.
- the semifinished product is annealed in the temperature range between 500 0 C and 85O 0 C annealed, the higher temperatures are used for the higher Ag contents, and then quenched. Subsequently, this intermediate is highly> 80% cold formed. Finally, a recrystallizing annealing treatment to achieve a complete cube texture is performed.
- the final recrystallization annealing treatment is carried out depending on the alloy content in the nickel at temperatures of 500 0 C to 1200 0 C, preferably at 85O 0 C.
- the semifinished product may advantageously be heat treated after or during the recrystallizing annealing for the purpose of growing a cube-textured NiO layer having a texture content of> 90% in an oxidizing atmosphere.
- Ni alloy is used for the starting semi-finished product, which still contains Mo and / or W as alloying elements in addition to the Ag addition.
- the formation of a high-grade cube texture is favored.
- the expanded metal strip allows the growth of a highly cube textured NiO layer, which also has elongated grains.
- the semifinished product can be used as a substrate for physico-chemical coatings with a high degree of microstructural orientation, in particular for producing wire-shaped or ribbon-shaped high-temperature superconductors.
- Fig. 1 shows the stretched structure of nickel with 0.01 atom% of silver after hot rolling at 85O 0 C and then cold rolling with a thickness reduction of 85% and a tempering treatment with partial recrystallization at 55O 0 C for 30 min (longitudinal grinding, etched) ,
- Fig. 2 shows elongated grains on the surface of a 80 micron thick band of nickel with 0.025 atom% of silver, which was subjected to an intermediate annealing at 65O 0 C for 30 minutes at 3 mm thickness, then was strongly cold formed at 80 microns thick and was finally annealed at 55O 0 C for 30 min (scanning electron micrograph).
- Fig. 3 shows elongated grains with dice layer on the surface of an 80 micron thick band of nickel with 0.025 atom% of silver after a
- Fig. 4 shows elongated grains with cube layer of nickel oxide on the surface of a 80 micron thick strip of nickel with 0.025 atom% of silver after an intermediate annealing at 65O 0 C over 30 min at 3 mm thickness, followed by strong cold forming at 80 microns thickness, the Texture annealing at 55O 0 C over 30 min and the oxidation in oxygen at
- Example 1 Technically pure nickel, for example having a purity of 99.9 atomic percent nickel, is poured into a mold while 0.025 atomic percent silver is added. The ingot is rolled at 85O 0 C to the square dimension (22 x 22) mm 2 , homogenizing annealed and quenched. Subsequently, the square material is machined to obtain a defect-free surface for subsequent cold working by rolling. The cold rolling is first carried out with a rolling degree of over 50 percent thickness reduction of 20 mm to 3 mm thickness, in this case, 85% thickness reduction. The subsequent tempering at 65O 0 C for 30 min causes recrystallization with a proportion of elongated grains.
- Fig. 1 shows a typical microstructure (nickel with 0.01 atomic percent silver). This structure with elongated grains serves as
- Example 2 Technically pure nickel, for example having a purity of 99.9 atomic percent nickel, is melted by adding 0.01 atomic percent silver in a vacuum induction furnace and poured into a mold. The ingot is rolled at 900 ° C. to the square dimension (22 ⁇ 22) mm 2 , homogenized and quenched. Subsequently, the square material is machined to obtain a defect-free surface for subsequent cold working by rolling. Cold rolling is carried out with a rolling degree of over 50 percent thickness reduction, in this case 85%. The resulting nickel strip has a thickness of 3 mm. It is subsequently annealed min at 65O 0 C for 30 and quenched in water. The recrystallization produces a proportion of elongated grains.
- the resulting nickel oxide layer has a structure with elongated grains, with a share of the cube layer of 97% (FIG. 4). The proportion of small-angle grain boundaries is 96%. This texture is rotated 45 ° from the texture of the nickel strip.
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Conductive Materials (AREA)
- Metal Rolling (AREA)
- Powder Metallurgy (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005013368A DE102005013368B3 (de) | 2005-03-16 | 2005-03-16 | Verfahren zur Herstellung und Verwendung von Halbzeug auf Nickelbasis mit Rekristallisationswürfeltextur |
PCT/EP2006/060774 WO2006097501A1 (fr) | 2005-03-16 | 2006-03-15 | Procede de fabrication et d'utilisation d'un demi-produit a base de nickel presentant une texture cubique de recristallisation |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1922426A1 true EP1922426A1 (fr) | 2008-05-21 |
EP1922426B1 EP1922426B1 (fr) | 2014-06-11 |
Family
ID=36089154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06725088.6A Not-in-force EP1922426B1 (fr) | 2005-03-16 | 2006-03-15 | Procede de fabrication et d'utilisation d'un demi-produit a base de nickel presentant une texture cubique de recristallisation |
Country Status (7)
Country | Link |
---|---|
US (1) | US8465605B2 (fr) |
EP (1) | EP1922426B1 (fr) |
JP (1) | JP5074375B2 (fr) |
KR (1) | KR20070112282A (fr) |
CN (1) | CN100523239C (fr) |
DE (1) | DE102005013368B3 (fr) |
WO (1) | WO2006097501A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100400700C (zh) * | 2007-03-29 | 2008-07-09 | 上海大学 | 提高690合金材料耐腐蚀性能的工艺方法 |
JP5330725B2 (ja) * | 2008-03-31 | 2013-10-30 | 古河電気工業株式会社 | 超電導線材用基板およびその製造方法 |
DE102008001005B4 (de) | 2008-04-04 | 2011-06-22 | Karlsruher Institut für Technologie, 76131 | Verfahren zur Herstellung eines Schichtverbundes mit epitaktisch gewachsenen Schichten aus einem magnetischen Formgedächtnis-Material und Schichtverbund mit epitaktischen Schichten aus einem magnetischen Formgedächtnis-Material sowie dessen Verwendung |
DE102010031058A1 (de) * | 2010-07-07 | 2012-01-12 | Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. | Metallischer Profildraht mit Rekristallisationswürfeltextur und Verfahren zu dessen Herstellung |
KR101804132B1 (ko) | 2013-06-07 | 2017-12-04 | 파우데엠 메탈스 게엠베하 | 금속 필름의 제조 방법 |
EP3004408B1 (fr) | 2013-06-07 | 2017-08-09 | VDM Metals International GmbH | Procédé de production d'une feuille de métal |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58177434A (ja) * | 1982-04-10 | 1983-10-18 | Tohoku Metal Ind Ltd | 耐摩耗性高透磁率磁性合金 |
US5741377A (en) * | 1995-04-10 | 1998-04-21 | Martin Marietta Energy Systems, Inc. | Structures having enhanced biaxial texture and method of fabricating same |
US5964966A (en) * | 1997-09-19 | 1999-10-12 | Lockheed Martin Energy Research Corporation | Method of forming biaxially textured alloy substrates and devices thereon |
US6458223B1 (en) * | 1997-10-01 | 2002-10-01 | American Superconductor Corporation | Alloy materials |
DK1208244T3 (da) * | 1999-04-03 | 2004-09-20 | Leibniz Inst Fuer Festkoerper | Metallisk materiale på nikkelbasis og fremgangsmåde til fremstilling deraf |
US6617283B2 (en) * | 2001-06-22 | 2003-09-09 | Ut-Battelle, Llc | Method of depositing an electrically conductive oxide buffer layer on a textured substrate and articles formed therefrom |
JP2005002408A (ja) * | 2003-06-11 | 2005-01-06 | Hitachi Ltd | 耐食性皮膜、海水用機器及び耐食性皮膜の形成方法 |
DE10342965A1 (de) * | 2003-09-10 | 2005-06-02 | Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. | Halbzeug auf Nickelbasis mit einer Rekristallisationswürfeltextur und Verfahren zu dessen Herstellung |
JP5432863B2 (ja) * | 2010-08-25 | 2014-03-05 | 住友電気工業株式会社 | 膜形成用配向基板および超電導線材 |
-
2005
- 2005-03-16 DE DE102005013368A patent/DE102005013368B3/de not_active Expired - Fee Related
-
2006
- 2006-03-15 CN CNB2006800084763A patent/CN100523239C/zh not_active Expired - Fee Related
- 2006-03-15 US US11/886,348 patent/US8465605B2/en not_active Expired - Fee Related
- 2006-03-15 JP JP2008501312A patent/JP5074375B2/ja not_active Expired - Fee Related
- 2006-03-15 KR KR1020077023661A patent/KR20070112282A/ko not_active Ceased
- 2006-03-15 EP EP06725088.6A patent/EP1922426B1/fr not_active Not-in-force
- 2006-03-15 WO PCT/EP2006/060774 patent/WO2006097501A1/fr active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2006097501A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2006097501A1 (fr) | 2006-09-21 |
JP5074375B2 (ja) | 2012-11-14 |
KR20070112282A (ko) | 2007-11-22 |
JP2008533301A (ja) | 2008-08-21 |
DE102005013368B3 (de) | 2006-04-13 |
CN100523239C (zh) | 2009-08-05 |
US20090008000A1 (en) | 2009-01-08 |
US8465605B2 (en) | 2013-06-18 |
EP1922426B1 (fr) | 2014-06-11 |
CN101142331A (zh) | 2008-03-12 |
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