EP1922177A1 - Cooling body for an electronic housing - Google Patents
Cooling body for an electronic housingInfo
- Publication number
- EP1922177A1 EP1922177A1 EP06777993A EP06777993A EP1922177A1 EP 1922177 A1 EP1922177 A1 EP 1922177A1 EP 06777993 A EP06777993 A EP 06777993A EP 06777993 A EP06777993 A EP 06777993A EP 1922177 A1 EP1922177 A1 EP 1922177A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- profile
- heat sink
- housing
- slabs
- circular saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 10
- 239000004411 aluminium Substances 0.000 abstract 1
- 238000003801 milling Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011440 grout Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P13/00—Making metal objects by operations essentially involving machining but not covered by a single other subclass
- B23P13/04—Making metal objects by operations essentially involving machining but not covered by a single other subclass involving slicing of profiled material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the invention relates to a method for producing a heat sink with cooling fins for an electronics housing, in particular for the automotive sector.
- Housing concepts which place high demands on the three-dimensional flexibility of the housing or which have to be adapted to very specific premises are usually implemented by means of aluminum die-cast or plastic housings. If a good heat transfer from the housing is to be made possible, then a sealed housing system should be developed completely out of die-cast aluminum parts or only in parts made of plastic.
- DE 100 14 459 A1 discloses a heat sink with a housing for a heat-dissipating electronic circuit, in which at least the sidewall fertilize the housing made of plastic and are firmly connected by injecting the upper portion of the heat sink with this.
- the heat sink itself basically addition of any heat-conducting material, is expediently an aluminum die-cast part or a Aluminiumf baypressteil.
- DE 198 15 110 A1 discloses a heat removal arrangement with a heat sink for dissipating heat from a housing containing electrical components with an electrically conductive surface, which has a mechanical connection between the heat sink and the housing, which is provided by an overlying layer.
- An electrically conductive connection between the heat sink and the housing is effected by a connecting member which is in communication with the electrically conductive surface region of the heat sink and the housing.
- the housing has two housing plastic shells and a cooling body arranged in the housing, which is fixedly connected to one of the two housing plastic shells by molding a part of the heat sink and which has a non-molded portion as a component mounting surface, whereby for the mounted there components the housing acts as a heat sink.
- the heat sink is designed as an aluminum die casting or Aluminiumf baypressteil.
- a disadvantage of the prior art is that the heat transfer value for heat sink made of die-cast aluminum is not optimal and that a matched to the respective requirements flexible shaping of the heat sink in an embodiment of injection molding is not possible.
- the alternative use of extruded aluminum profiles and the resulting from this implementation cost advantages over die-cast aluminum conceptions for specific premises could not be realized so far, since process-related no cross-structures to Extrudierraum can be produced kontenabel. Proceeding from this, the present invention has the object to provide a heat sink which is easy to produce, which has a better heat transfer value compared to the prior art, can be made flexible in terms of its three-dimensional shape and allows easy to handle seal between the housing and heat sink and is inexpensive.
- the inventive method for producing a heat sink with cooling fins for an electronics housing comprises the steps of: producing extruded profile slabs with parallel cooling fins; side by side align the profile slabs to a surface with parallel cooling fins; Cutting the profile slabs to length using a profile circular saw with stepped profile.
- Heat sinks made of extruded aluminum have an approx. 30% better heat transfer value than heat sinks made of die-cast aluminum.
- the production method according to the invention offers the possibility of varying the design and the number of cooling fins in such a way that they can be adapted to the respective requirements, ie the cooling fins can be made longer, thinner and closer to one another or with microprofiles.
- step profiles are formed transversely to the extrusion direction, which have a flat flange structure, which serves as a sealing interface to the heat sink surrounding housing.
- the advantage of the profile circular saw lies in the fact that a large number of heat sinks can be inexpensively created by a simple method step, which is normally provided in the case of extruded components with flange planes transverse to the extruder. direction could only be generated by a chipping process. This is usually an individual process that is excluded for high volumes for cost reasons.
- the step “cutting to length” also carries out the step "making cross-section on the extruding part". The procedure is thus shorter.
- profile slabs are used with parallel to the cooling ribs arranged flange-like profiling. This results in a total of a heat sink, which has on all four peripheral sides of a circumferential profile, whereby a simple seal between the housing and heat sink is possible.
- the profile slabs are deflected to heat sinks in different sizes, so that it is possible to provide individually molded housing with matching heat sinks.
- the profile slabs of a heat conductive material such as extruded aluminum, which has a particularly good heat transfer value in extruded form.
- a profiled circular saw which enables a variable composition of the circular reamer blades, so that the flange-like profile running transversely to the extrusion direction, which serves as a sealing interface between the housing and the heat sink, is adapted individually to the conditions in the housing can. Due to the individual composition of the circular cutting blades of the profile circular saw no individually manufactured tools must be created. In addition, there are no delays in the manufacturing process, since the replacement of the circular saw blades can be made without problems.
- the method according to the invention also affords the advantage that the cutting and profile step can be carried out in one work step, so that the process flow is also simplified and overall is more cost-effective.
- the present invention advantageously provides a production process for a heat sink made of extruded aluminum, which is so variable in terms of the shape of the heat sink that the individual requirements in the electronics housing with regard to dissipated heat, sealing between housing and heat sink and size of the heat sink are taken into account can. It is particularly suitable for applications in the automotive sector.
- FIG. 1 is an exploded view of an electronics housing, in which the heat sink installation conditions are illustrated using an example of housing.
- FIG. 2 is a perspective view of a heat sink according to the invention in the mounted state;
- FIG. 3 is a sectional view of the heat sink according to the invention in the mounted state
- FIG. 4 is a sectional view of the electronics housing with the heat sink according to the invention.
- FIG. 5 is a sectional view of a circular saw during the sawing process by a profile slab.
- FIG. 6 is a perspective view of the profile slabs according to FIG. 5 after the sawing process
- FIG. 7 shows a perspective view of a sawing process of profile slabs arranged next to one another with a circular saw
- FIG. 8 is a sectional view of a profile circular saw during the sawing process by a profile slab.
- FIG. 9 is a perspective view of the profile slabs according to FIG. 8 after the sawing process.
- FIG. 10 is a perspective view of a sawing process of side-by-side profile slabs with a profile circular saw;
- Fig. 11 is a perspective view of the profile circular saw.
- Fig. 12 is a perspective view of a sawing process by a hollow profile slab.
- the electronics housing 1 shows an exploded view of an electronics housing with a heat sink 2.
- the electronics housing 1 is preferably formed in two parts and has an upper housing surface. Part 3 and a lower housing part 4.
- a preferably rectangular recess 5 is arranged, in which the heat sink 2 superimposed.
- the heat sink 2 has mutually parallel cooling fins 6 and sealing interfaces on all four sides of the circumference.
- electrical carrier components such as. B. printed circuit boards 7 are arranged in the electronics housing 1 arranged.
- FIG. 2 shows in a perspective view the heat sink 2 according to the invention in the assembled state.
- the heat sink 2 supports in the recess 5 of the upper housing part 3, wherein the cooling fins 6 of the heat sink 2 protrude from the upper housing part 3.
- Fig. 3 shows a sectional view of the heat sink 2 in the mounted state.
- the heat sink 2 is designed such that it preferably has circumferential profiles 8 on the sides running parallel and transversely to the cooling fins 6.
- the circumferential profiles 8 are designed such that they protrude laterally over the region 9 in which the cooling ribs 6 are arranged. This results in an easily accessible sealing option with a sealant 10 z. B. on potting or with a dispensed seal between the heat sink 2 and the housing upper part 3 on the parallel and transverse to the cooling fins 6 extending sides of the peripheral profile. 8
- FIG. 4 shows a further possibility of enabling a secure seal between the housing upper part 3 and the cooling body 2.
- FIG. 5 shows a sectional view of a circular saw 12 during the sawing process by means of a profile slab 13.
- Fig. 6 shows in a perspective view of the profile slab 13 of FIG. 5 after the sawing process.
- the heat sink 2 separated by the sawing process from the profile slab 13 has the circumferential profiles 8 running parallel to the cooling ribs 6.
- FIG. 7 shows a perspective view of a sawing process of profile slabs 13 arranged next to one another with a circular saw 12.
- Fig. 9 shows in a perspective view of the profile slab 13 of FIG. 8 after the sawing process.
- the heat sink 2 separated by the sawing process from the profile slab has circumferential profiles 8, 17 on all four peripheral surfaces.
- FIG. 10 shows a perspective view of a sawing operation of profile slabs 13 arranged next to one another with a profile circular saw 14.
- the profiled circular saw 14 has a large milling blade 15, on whose sides two smaller milling blades 16 are arranged.
- the milling blades 15, 16 of the profile circular saw 14 can be individually matched to the requirement profile, put together, ie, in terms of their diameter and their profile.
- FIG. 12 shows a perspective view of a sawing process through a hollow profile slab 19.
- the method according to the invention is suitable for both full and hollow profiles.
- the present invention advantageously provides a production process for a heat sink (2) made of extruded aluminum, which with regard to the shape of the heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005043055A DE102005043055B3 (en) | 2005-09-09 | 2005-09-09 | Electronics housing cooling body with cooling fins, useful in automobiles, is produced inexpensively from extruded profiled slabs, specifically of aluminum, by cutting to length using profiled circular saw |
PCT/EP2006/064691 WO2007028672A1 (en) | 2005-09-09 | 2006-07-26 | Cooling body for an electronic housing |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1922177A1 true EP1922177A1 (en) | 2008-05-21 |
Family
ID=37106919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06777993A Withdrawn EP1922177A1 (en) | 2005-09-09 | 2006-07-26 | Cooling body for an electronic housing |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090083980A1 (en) |
EP (1) | EP1922177A1 (en) |
JP (1) | JP2009508328A (en) |
DE (1) | DE102005043055B3 (en) |
WO (1) | WO2007028672A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009147107A (en) * | 2007-12-14 | 2009-07-02 | Toyota Motor Corp | Cooling fin and manufacturing method of the cooling fin |
JP4992808B2 (en) * | 2008-04-16 | 2012-08-08 | トヨタ自動車株式会社 | Manufacturing method of heat exchanger |
JP5149845B2 (en) * | 2009-03-19 | 2013-02-20 | 三協立山株式会社 | Fin processing method for heat sink made of extruded aluminum material |
DE102009059010A1 (en) * | 2009-12-17 | 2011-06-22 | Phoenix Contact GmbH & Co. KG, 32825 | module unit |
WO2011086165A1 (en) | 2010-01-14 | 2011-07-21 | Johnson Controls Gmbh | Vehicle seat having a movable backrest part |
ITBO20120618A1 (en) * | 2012-11-09 | 2014-05-10 | Mecc Al S R L A Socio Unico | PROCEDURE FOR THE REALIZATION OF A SINK AND SINK WHEN OBTAINED |
CN109848652A (en) * | 2019-02-22 | 2019-06-07 | 中国电子科技集团公司第四十三研究所 | A kind of processing method of titanium alloy encapsulating housing |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3576200A (en) * | 1969-02-26 | 1971-04-27 | Heinemann Saw Corp | Circular saw |
DE3334165C2 (en) * | 1983-09-21 | 1996-09-26 | Prototyp Werke Gmbh | Cutting device for honeycomb lightweight structures |
JPS6131707U (en) * | 1984-07-28 | 1986-02-26 | 株式会社 桑原製作所 | Mortise machine |
US4787147A (en) * | 1986-08-28 | 1988-11-29 | Wiley Edward R | Quick change mechanism for diamond arbor circular saw blades and other spinning disc devices using radially sliding locks |
JPH0683243U (en) * | 1993-04-30 | 1994-11-29 | 久保金属株式会社 | IC heat sink automatic processing equipment |
GB9310993D0 (en) * | 1993-05-27 | 1993-07-14 | Redpoint Limited | A process and an apparatus for forming a profiled element |
JPH1199408A (en) * | 1997-06-13 | 1999-04-13 | Osaka Diamond Ind Co Ltd | Combined cutting tool |
TW361780U (en) * | 1997-11-11 | 1999-06-11 | Hon Hai Prec Ind Co Ltd | Holding fixtures for the blades of ventilation equipment |
JPH11254230A (en) * | 1998-03-06 | 1999-09-21 | Furukawa Electric Co Ltd:The | Method for cutting aluminum alloy plate |
DE19815110B4 (en) * | 1998-04-03 | 2004-12-30 | Knürr AG | heat dissipation arrangement |
DE10014459C2 (en) * | 2000-03-23 | 2002-04-25 | Alutec Metallwaren Gmbh & Co | Process for producing a body with domes by extrusion |
US6434005B1 (en) * | 2000-10-27 | 2002-08-13 | Vlt Corporation | Power converter packaging |
JP2002368468A (en) * | 2001-06-07 | 2002-12-20 | Matsushita Electric Ind Co Ltd | Heat sink, its manufacturing method and cooler using the same |
JP2003031979A (en) * | 2001-07-12 | 2003-01-31 | Auto Network Gijutsu Kenkyusho:Kk | Control unit and manufacturing method therefor |
JP2003188321A (en) * | 2001-12-18 | 2003-07-04 | Furukawa Electric Co Ltd:The | Heat sink |
US20030183369A1 (en) * | 2002-04-02 | 2003-10-02 | John Makaran | Heat sink and method of removing heat from power electronics components |
DE10247828B4 (en) * | 2002-10-14 | 2005-03-03 | Siemens Ag | Heat dissipating and radiating plastic housing with cooling / support ribs and molded heat sink and method for its production |
-
2005
- 2005-09-09 DE DE102005043055A patent/DE102005043055B3/en not_active Expired - Fee Related
-
2006
- 2006-07-26 WO PCT/EP2006/064691 patent/WO2007028672A1/en active Application Filing
- 2006-07-26 US US12/066,273 patent/US20090083980A1/en not_active Abandoned
- 2006-07-26 EP EP06777993A patent/EP1922177A1/en not_active Withdrawn
- 2006-07-26 JP JP2008529575A patent/JP2009508328A/en not_active Ceased
Non-Patent Citations (1)
Title |
---|
See references of WO2007028672A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE102005043055B3 (en) | 2006-12-21 |
US20090083980A1 (en) | 2009-04-02 |
JP2009508328A (en) | 2009-02-26 |
WO2007028672A1 (en) | 2007-03-15 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20080129 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: CONTINENTAL AUTOMOTIVE GMBH |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: ZICH, ROBIN Inventor name: PFEUFFER, VIKTOR Inventor name: SMIRRA, KARL |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: ZICH, ROBIN Inventor name: PFEUFFER, VIKTOR Inventor name: SMIRRA, KARL |
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17Q | First examination report despatched |
Effective date: 20090113 |
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GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: F28F 3/04 20060101ALN20090513BHEP Ipc: B23P 15/26 20060101ALI20090513BHEP Ipc: H01L 21/48 20060101ALI20090513BHEP Ipc: H01L 23/367 20060101ALN20090513BHEP Ipc: B23P 13/04 20060101AFI20090513BHEP |
|
RTI1 | Title (correction) |
Free format text: HEAT SINK FOR AN ELECTRONIC HOUSING |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20091023 |