WO2007028672A1 - Cooling body for an electronic housing - Google Patents
Cooling body for an electronic housing Download PDFInfo
- Publication number
- WO2007028672A1 WO2007028672A1 PCT/EP2006/064691 EP2006064691W WO2007028672A1 WO 2007028672 A1 WO2007028672 A1 WO 2007028672A1 EP 2006064691 W EP2006064691 W EP 2006064691W WO 2007028672 A1 WO2007028672 A1 WO 2007028672A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- profile
- heat sink
- housing
- slabs
- circular saw
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P13/00—Making metal objects by operations essentially involving machining but not covered by a single other subclass
- B23P13/04—Making metal objects by operations essentially involving machining but not covered by a single other subclass involving slicing of profiled material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the invention relates to a method for producing a heat sink with cooling fins for an electronics housing, in particular for the automotive sector.
- Housing concepts which place high demands on the three-dimensional flexibility of the housing or which have to be adapted to very specific premises are usually implemented by means of aluminum die-cast or plastic housings. If a good heat transfer from the housing is to be made possible, then a sealed housing system should be developed completely out of die-cast aluminum parts or only in parts made of plastic.
- DE 100 14 459 A1 discloses a heat sink with a housing for a heat-dissipating electronic circuit, in which at least the sidewall fertilize the housing made of plastic and are firmly connected by injecting the upper portion of the heat sink with this.
- the heat sink itself basically addition of any heat-conducting material, is expediently an aluminum die-cast part or a Aluminiumf baypressteil.
- DE 198 15 110 A1 discloses a heat removal arrangement with a heat sink for dissipating heat from a housing containing electrical components with an electrically conductive surface, which has a mechanical connection between the heat sink and the housing, which is provided by an overlying layer.
- An electrically conductive connection between the heat sink and the housing is effected by a connecting member which is in communication with the electrically conductive surface region of the heat sink and the housing.
- the housing has two housing plastic shells and a cooling body arranged in the housing, which is fixedly connected to one of the two housing plastic shells by molding a part of the heat sink and which has a non-molded portion as a component mounting surface, whereby for the mounted there components the housing acts as a heat sink.
- the heat sink is designed as an aluminum die casting or Aluminiumf baypressteil.
- a disadvantage of the prior art is that the heat transfer value for heat sink made of die-cast aluminum is not optimal and that a matched to the respective requirements flexible shaping of the heat sink in an embodiment of injection molding is not possible.
- the alternative use of extruded aluminum profiles and the resulting from this implementation cost advantages over die-cast aluminum conceptions for specific premises could not be realized so far, since process-related no cross-structures to Extrudierraum can be produced kontenabel. Proceeding from this, the present invention has the object to provide a heat sink which is easy to produce, which has a better heat transfer value compared to the prior art, can be made flexible in terms of its three-dimensional shape and allows easy to handle seal between the housing and heat sink and is inexpensive.
- the inventive method for producing a heat sink with cooling fins for an electronics housing comprises the steps of: producing extruded profile slabs with parallel cooling fins; side by side align the profile slabs to a surface with parallel cooling fins; Cutting the profile slabs to length using a profile circular saw with stepped profile.
- Heat sinks made of extruded aluminum have an approx. 30% better heat transfer value than heat sinks made of die-cast aluminum.
- the production method according to the invention offers the possibility of varying the design and the number of cooling fins in such a way that they can be adapted to the respective requirements, ie the cooling fins can be made longer, thinner and closer to one another or with microprofiles.
- step profiles are formed transversely to the extrusion direction, which have a flat flange structure, which serves as a sealing interface to the heat sink surrounding housing.
- the advantage of the profile circular saw lies in the fact that a large number of heat sinks can be inexpensively created by a simple method step, which is normally provided in the case of extruded components with flange planes transverse to the extruder. direction could only be generated by a chipping process. This is usually an individual process that is excluded for high volumes for cost reasons.
- the step “cutting to length” also carries out the step "making cross-section on the extruding part". The procedure is thus shorter.
- profile slabs are used with parallel to the cooling ribs arranged flange-like profiling. This results in a total of a heat sink, which has on all four peripheral sides of a circumferential profile, whereby a simple seal between the housing and heat sink is possible.
- the profile slabs are deflected to heat sinks in different sizes, so that it is possible to provide individually molded housing with matching heat sinks.
- the profile slabs of a heat conductive material such as extruded aluminum, which has a particularly good heat transfer value in extruded form.
- a profiled circular saw which enables a variable composition of the circular reamer blades, so that the flange-like profile running transversely to the extrusion direction, which serves as a sealing interface between the housing and the heat sink, is adapted individually to the conditions in the housing can. Due to the individual composition of the circular cutting blades of the profile circular saw no individually manufactured tools must be created. In addition, there are no delays in the manufacturing process, since the replacement of the circular saw blades can be made without problems.
- the method according to the invention also affords the advantage that the cutting and profile step can be carried out in one work step, so that the process flow is also simplified and overall is more cost-effective.
- the present invention advantageously provides a production process for a heat sink made of extruded aluminum, which is so variable in terms of the shape of the heat sink that the individual requirements in the electronics housing with regard to dissipated heat, sealing between housing and heat sink and size of the heat sink are taken into account can. It is particularly suitable for applications in the automotive sector.
- FIG. 1 is an exploded view of an electronics housing, in which the heat sink installation conditions are illustrated using an example of housing.
- FIG. 2 is a perspective view of a heat sink according to the invention in the mounted state;
- FIG. 3 is a sectional view of the heat sink according to the invention in the mounted state
- FIG. 4 is a sectional view of the electronics housing with the heat sink according to the invention.
- FIG. 5 is a sectional view of a circular saw during the sawing process by a profile slab.
- FIG. 6 is a perspective view of the profile slabs according to FIG. 5 after the sawing process
- FIG. 7 shows a perspective view of a sawing process of profile slabs arranged next to one another with a circular saw
- FIG. 8 is a sectional view of a profile circular saw during the sawing process by a profile slab.
- FIG. 9 is a perspective view of the profile slabs according to FIG. 8 after the sawing process.
- FIG. 10 is a perspective view of a sawing process of side-by-side profile slabs with a profile circular saw;
- Fig. 11 is a perspective view of the profile circular saw.
- Fig. 12 is a perspective view of a sawing process by a hollow profile slab.
- the electronics housing 1 shows an exploded view of an electronics housing with a heat sink 2.
- the electronics housing 1 is preferably formed in two parts and has an upper housing surface. Part 3 and a lower housing part 4.
- a preferably rectangular recess 5 is arranged, in which the heat sink 2 superimposed.
- the heat sink 2 has mutually parallel cooling fins 6 and sealing interfaces on all four sides of the circumference.
- electrical carrier components such as. B. printed circuit boards 7 are arranged in the electronics housing 1 arranged.
- FIG. 2 shows in a perspective view the heat sink 2 according to the invention in the assembled state.
- the heat sink 2 supports in the recess 5 of the upper housing part 3, wherein the cooling fins 6 of the heat sink 2 protrude from the upper housing part 3.
- Fig. 3 shows a sectional view of the heat sink 2 in the mounted state.
- the heat sink 2 is designed such that it preferably has circumferential profiles 8 on the sides running parallel and transversely to the cooling fins 6.
- the circumferential profiles 8 are designed such that they protrude laterally over the region 9 in which the cooling ribs 6 are arranged. This results in an easily accessible sealing option with a sealant 10 z. B. on potting or with a dispensed seal between the heat sink 2 and the housing upper part 3 on the parallel and transverse to the cooling fins 6 extending sides of the peripheral profile. 8
- FIG. 4 shows a further possibility of enabling a secure seal between the housing upper part 3 and the cooling body 2.
- FIG. 5 shows a sectional view of a circular saw 12 during the sawing process by means of a profile slab 13.
- Fig. 6 shows in a perspective view of the profile slab 13 of FIG. 5 after the sawing process.
- the heat sink 2 separated by the sawing process from the profile slab 13 has the circumferential profiles 8 running parallel to the cooling ribs 6.
- FIG. 7 shows a perspective view of a sawing process of profile slabs 13 arranged next to one another with a circular saw 12.
- Fig. 9 shows in a perspective view of the profile slab 13 of FIG. 8 after the sawing process.
- the heat sink 2 separated by the sawing process from the profile slab has circumferential profiles 8, 17 on all four peripheral surfaces.
- FIG. 10 shows a perspective view of a sawing operation of profile slabs 13 arranged next to one another with a profile circular saw 14.
- the profiled circular saw 14 has a large milling blade 15, on whose sides two smaller milling blades 16 are arranged.
- the milling blades 15, 16 of the profile circular saw 14 can be individually matched to the requirement profile, put together, ie, in terms of their diameter and their profile.
- FIG. 12 shows a perspective view of a sawing process through a hollow profile slab 19.
- the method according to the invention is suitable for both full and hollow profiles.
- the present invention advantageously provides a production process for a heat sink (2) made of extruded aluminum, which with regard to the shape of the heat sink
Abstract
The invention relates to a method for producing a cooling body comprising cooling ribs for an electronic housing, in particular, for the automotive industry. The inventive method comprises the following steps: extruded profile slabs (13, 19) comprising cooling ribs (6), which extend in a parallel manner, are produced; the profile slabs (13, 19) are arranged next to each other in relation to the surface which comprises cooling ribs (6) which are arranged in a parallel manner; the profile slabs (13, 19) are cut to length by means of a profile circular saw (14) having step profiles. Said invention is advantageous for the first time in that the production process for producing a cooling body (2) from extruded aluminium, is variable in relation to the shape of the cooling body (2) such that the individual requirements in the electronic housing (1) in relation to heat which is to be withdrawn, sealing between the housing (1) and cooling body, (2) and size of the cooling body (2) are taken into account. It is particularly suitable for use in the automotive industry.
Description
Beschreibungdescription
Kühlkörper für ElektronikgehäuseHeat sink for electronics housing
Die Erfindung betrifft ein Verfahren zur Herstellung eines Kühlkörpers mit Kühlrippen für ein Elektronikgehäuse, insbesondere für den Automobilbereich.The invention relates to a method for producing a heat sink with cooling fins for an electronics housing, in particular for the automotive sector.
Gehäusekonzepte, die hohe Anforderungen an die dreidimensio- nale Formflexibilität des Gehäuses stellen oder an sehr spezifische Räumlichkeiten angepasst werden müssen, werden in der Regel durch abgespritzte Aluminium-Druckguss- oder Kunststoffgehäuse umgesetzt. Soll eine gute Wärmeübertragung aus dem Gehäuse heraus ermöglicht werden, sollte ein abgedichte- tes Gehäusesystem komplett aus Aluminium-Druckgussteilen oder nur in Teilbereichen aus Kunststoff ausgebildet entwickelt werden.Housing concepts which place high demands on the three-dimensional flexibility of the housing or which have to be adapted to very specific premises are usually implemented by means of aluminum die-cast or plastic housings. If a good heat transfer from the housing is to be made possible, then a sealed housing system should be developed completely out of die-cast aluminum parts or only in parts made of plastic.
Um eine Randdichtheit vom Kühlkörper zum umgebenen Kunst- stoffgehäuse zu erzeugen, muss eine mit z. B. Vergussmittel oder mit einer dispensten oder angespritzten Dichtung abdichtbare Bauteilkonfiguration für beide abzudichtenden Teile gegeben sein. Eine hierfür geeignete Teilegeometrie weist flanschartige Umfangsflächen auf, welche dann leicht mit ei- ner geeigneten Abdichtkonfiguration zu versehen sind. Solch eine dichtungsgeeignete Konfiguration ist für das Kunststoffgehäuse und für den Kühlkörper bei einem jeweiligen Spritzgusskonzept relativ leicht zu verwirklichen.In order to produce an edge seal from the heat sink to the surrounding plastic housing, one with z. B. grout or be given with a dispensten or molded seal sealable component configuration for both parts to be sealed. A part geometry suitable for this purpose has flange-like peripheral surfaces, which are then easily provided with a suitable sealing configuration. Such a sealable configuration is relatively easy to implement for the plastic housing and for the heat sink in a respective Spritzgusskonzept.
Um einen Kühlkörper so auszubilden, dass eine möglichst große Gestaltungsvielfalt mit Blick auf das Gehäuse zur Aufnahme einer Schaltung möglich ist, ist aus der DE 100 14 459 Al ein Kühlkörper mit einem Gehäuse für eine Wärme abgebende elektronische Schaltung bekannt, bei dem zumindest die Seitenwan- düngen des Gehäuses aus Kunststoff bestehen und durch Um- spritzen des oberen Abschnitts des Kühlkörpers fest mit diesem verbunden sind. Durch diesen Aufbau wird eine Trennung der Funktionen erreicht. Der Kühlkörper selbst besteht grund-
sätzlich aus einem beliebigen Wärme leitenden Material, zweckmäßig ist ein Aluminiumdruckgussteil oder ein Aluminiumfließpressteil .In order to design a heat sink in such a way that the greatest possible design diversity is possible with regard to the housing for accommodating a circuit, DE 100 14 459 A1 discloses a heat sink with a housing for a heat-dissipating electronic circuit, in which at least the sidewall fertilize the housing made of plastic and are firmly connected by injecting the upper portion of the heat sink with this. By this construction, a separation of the functions is achieved. The heat sink itself basically addition of any heat-conducting material, is expediently an aluminum die-cast part or a Aluminiumfließpressteil.
Aus der DE 198 15 110 Al geht eine Wärmeabführordnung mit einem Kühlkörper zum Abführen von Wärme aus einem elektrische Komponenten enthaltenden Gehäuse mit elektrisch leitfähiger Oberfläche hervor, die eine mechanische Verbindung zwischen dem Kühlkörper und dem Gehäuse aufweist, die von einer KIe- berschicht bereitgestellt wird. Eine elektrisch leitfähige Verbindung zwischen dem Kühlkörper und dem Gehäuse erfolgt durch ein Verbindungsglied, welches mit dem elektrisch leitfähigen Oberflächenbereich des Kühlkörpers und dem Gehäuse in Verbindung steht.DE 198 15 110 A1 discloses a heat removal arrangement with a heat sink for dissipating heat from a housing containing electrical components with an electrically conductive surface, which has a mechanical connection between the heat sink and the housing, which is provided by an overlying layer. An electrically conductive connection between the heat sink and the housing is effected by a connecting member which is in communication with the electrically conductive surface region of the heat sink and the housing.
Die DE 102 47 828 Al beschreibt ein Wärme ableitendes und Wärme ausstrahlendes Gehäuse aus Kunststoff mit umspritztem Kühlkörper. Das Gehäuse weist zwei Gehäuse-Kunststoffschalen und einen im Gehäuse angeordneten Kühlkörper auf, welcher mit einer der beiden Gehäuse-Kunststoffschalen durch Umspritzen eines Teils des Kühlkörpers fest verbunden ist und welcher einen nicht umspritzten Abschnitt als Bauelemente- Montagefläche aufweist, wodurch für die dort montierten Bauelemente das Gehäuse als Wärmesenke wirkt. Dabei ist der Kühlkörper als Aluminiumdruckgussteil bzw. Aluminiumfließpressteil ausgebildet.DE 102 47 828 A1 describes a heat dissipating and heat radiating plastic housing with molded heat sink. The housing has two housing plastic shells and a cooling body arranged in the housing, which is fixedly connected to one of the two housing plastic shells by molding a part of the heat sink and which has a non-molded portion as a component mounting surface, whereby for the mounted there components the housing acts as a heat sink. In this case, the heat sink is designed as an aluminum die casting or Aluminiumfließpressteil.
Nachteilig am Stand der Technik ist, dass der Wärmedurchgangswert für Kühlkörper aus Aluminiumdruckguss nicht optimal ist und dass eine auf die jeweiligen Anforderungen abgestimmte flexible Formgebung des Kühlkörpers bei einer Ausführung aus Spritzguss nicht möglich ist. Die alternative Verwendung von extrudierten Aluminiumprofilen und die sich aus dieser Verwirklichung ergebenden Kostenvorteile gegenüber Aluminium- druckguss-Konzeptionen für spezifische Räumlichkeiten konnte bisher nicht verwirklicht werden, da prozessbedingt keine Querstrukturen zur Extrudierrichtung kontengünstig herstellbar sind.
Hiervon ausgehend liegt der vorliegenden Erfindung die Aufgabe zugrunde, einen einfach herstellbaren Kühlkörper zu schaffen, der einen im Vergleich zum Stand der Technik besseren Wärmedurchgangswert aufweist, hinsichtlich seiner dreidimen- sionalen Ausformung flexibel gestaltet werden kann und eine einfach handhabbare Abdichtung zwischen Gehäuse und Kühlkörper ermöglicht und dabei kostengünstig ist.A disadvantage of the prior art is that the heat transfer value for heat sink made of die-cast aluminum is not optimal and that a matched to the respective requirements flexible shaping of the heat sink in an embodiment of injection molding is not possible. The alternative use of extruded aluminum profiles and the resulting from this implementation cost advantages over die-cast aluminum conceptions for specific premises could not be realized so far, since process-related no cross-structures to Extrudierrichtung can be produced kontengünstig. Proceeding from this, the present invention has the object to provide a heat sink which is easy to produce, which has a better heat transfer value compared to the prior art, can be made flexible in terms of its three-dimensional shape and allows easy to handle seal between the housing and heat sink and is inexpensive.
Diese Aufgabe wird durch ein Verfahren zur Herstellung eines Kühlkörpers mit den Verfahrensschritten gemäß Patentanspruch 1 gelöst. Vorteilhafte Aus- und Weiterbildungen des Verfahrens, welche einzeln oder in Kombination miteinander eingesetzt werden können, sind der Gegenstand der abhängigen Ansprüche .This object is achieved by a method for producing a heat sink with the method steps according to claim 1. Advantageous embodiments and further developments of the method, which can be used individually or in combination with each other, are the subject of the dependent claims.
Das erfindungsgemäße Verfahren zur Herstellung eines Kühlkörpers mit Kühlrippen für ein Elektronikgehäuse, insbesondere für den Automobilbereich, umfasst die Schritte: Herstellen von extrudierten Profilbrammen mit parallel zueinander ver- laufenden Kühlrippen; nebeneinander ausrichten der Profilbrammen zu einer Fläche mit parallel angeordneten Kühlrippen; Ablängen der Profilbrammen mittels einer Profilkreissäge mit Stufenprofil. Kühlkörper aus extrudiertem Aluminium weisen einen ca. 30 % besseren Wärmedurchgangswert auf als Kühlkör- per aus Aluminiumdruckguss . Zudem bietet das erfindungsgemäße Herstellungsverfahren die Möglichkeit, die Ausgestaltung und die Anzahl der Kühlrippen so zu variieren, dass sie auf die jeweiligen Anforderungen abgestimmt werden können, d. h., die Kühlrippen können länger, dünner und näher beieinander lie- gend oder mit Mikroprofilierungen ausgeformt werden. Durch das Ablängen der Profilbrammen mit einer Profilkreissäge werden quer zur Extrudierrichtung Stufenprofile ausgeformt, die eine ebene Flanschstruktur aufweisen, die als Dichtungsschnittstelle zum Kühlkörper umgebenden Gehäuse dient. Der Vorteil der Profilkreissäge liegt darin, dass durch einen einfachen Verfahrensschritt kostengünstig eine hohe Stückzahl an Kühlkörpern geschaffen werden kann, die normalerweise bei extrudierten Bauteilen mit Flanschebenen quer zur Extrudier-
richtung nur durch einen zerspannenden Vorgang erzeugt werden könnte. Dies ist in der Regel ein Individualprozess, der für hohe Stückzahlen aus Kostengründen ausgeschlossen ist. Durch das erfindungsgemäße Verfahren wird durch den Verfahrens- schritt "Ablängen" auch der Schritt "Querprofil herstellen am Extrudierteil" vorgenommen. Der Verfahrensablauf ist somit kürzer .The inventive method for producing a heat sink with cooling fins for an electronics housing, in particular for the automotive sector, comprises the steps of: producing extruded profile slabs with parallel cooling fins; side by side align the profile slabs to a surface with parallel cooling fins; Cutting the profile slabs to length using a profile circular saw with stepped profile. Heat sinks made of extruded aluminum have an approx. 30% better heat transfer value than heat sinks made of die-cast aluminum. In addition, the production method according to the invention offers the possibility of varying the design and the number of cooling fins in such a way that they can be adapted to the respective requirements, ie the cooling fins can be made longer, thinner and closer to one another or with microprofiles. By cutting the profile slabs with a profiled circular saw, step profiles are formed transversely to the extrusion direction, which have a flat flange structure, which serves as a sealing interface to the heat sink surrounding housing. The advantage of the profile circular saw lies in the fact that a large number of heat sinks can be inexpensively created by a simple method step, which is normally provided in the case of extruded components with flange planes transverse to the extruder. direction could only be generated by a chipping process. This is usually an individual process that is excluded for high volumes for cost reasons. By means of the method according to the invention, the step "cutting to length" also carries out the step "making cross-section on the extruding part". The procedure is thus shorter.
Vorzugsweise werden Profilbrammen mit parallel zu den Kühl- rippen angeordneter flanschartiger Profilierung verwendet. Daraus ergibt sich insgesamt ein Kühlkörper, der an allen vier Umfangsseiten eine Umfangsprofilierung aufweist, wodurch eine einfache Abdichtung zwischen Gehäuse und Kühlkörper ermöglicht wird.Preferably, profile slabs are used with parallel to the cooling ribs arranged flange-like profiling. This results in a total of a heat sink, which has on all four peripheral sides of a circumferential profile, whereby a simple seal between the housing and heat sink is possible.
Es ist bevorzugt, Profilbrammen mit einer unterschiedlichen Anzahl an Kühlrippen zu extrudieren, so dass unterschiedliche Anforderungsprofile an die Kühlintensität erfüllt werden können. Die Ausgestaltung der Kühlkörper bzw. der Kühlrippen kann somit variiert werden und individuell auf die im Elektronikgehäuse herrschenden Bedingungen abgestimmt werden.It is preferred to extrude profile slabs with a different number of cooling ribs, so that different requirement profiles of the cooling intensity can be met. The design of the heat sink or the cooling fins can thus be varied and tailored to the conditions prevailing in the electronics housing conditions.
Durch das erfindungsgemäße Verfahren ist es möglich, Kühlkörper mit unterschiedlicher Geometrie hinsichtlich der Länge, der Breite und der Profiltiefe herzustellen, so dass eine Anpassung an die im Gehäuse geforderten Bedingungen problemlos möglich ist.By the method according to the invention, it is possible to produce heat sinks with different geometry in terms of length, width and profile depth, so that an adaptation to the conditions required in the housing is possible without any problem.
Vorzugsweise werden die Profilbrammen zu Kühlkörpern in un- terschiedlicher Größe abgelenkt, so dass es möglich ist, individuell ausgeformte Gehäuse mit passenden Kühlkörpern zu versehen.Preferably, the profile slabs are deflected to heat sinks in different sizes, so that it is possible to provide individually molded housing with matching heat sinks.
Vorzugsweise werden die Profilbrammen aus einem Wärme leiten- den Material wie z. B. Aluminium extrudiert, das in extru- dierter Form einen besonders guten Wärmedurchgangswert aufweist .
Es ist bevorzugt, den Ablängenvorgang mit einer Profilkreissäge durchzuführen, die eine variable Zusammenstellung der Kreisfräseblätter ermöglicht, so dass das quer zur Extrudier- richtung verlaufende flanschartige Profil, das als Abdich- tungsschnittstelle zwischen Gehäuse und Kühlkörper dient, individuell auf die Bedingungen im Gehäuse abgestimmt werden kann. Durch die individuelle Zusammenstellung der Kreisfräseblätter der Profilkreissäge müssen keine einzeln angefertigten Werkzeuge geschaffen werden. Zudem entstehen keine Verzö- gerungen im Herstellungsprozess, da der Austausch der Kreissägeblätter ohne Probleme vorgenommen werden kann.Preferably, the profile slabs of a heat conductive material such. For example, extruded aluminum, which has a particularly good heat transfer value in extruded form. It is preferable to carry out the cutting operation with a profiled circular saw, which enables a variable composition of the circular reamer blades, so that the flange-like profile running transversely to the extrusion direction, which serves as a sealing interface between the housing and the heat sink, is adapted individually to the conditions in the housing can. Due to the individual composition of the circular cutting blades of the profile circular saw no individually manufactured tools must be created. In addition, there are no delays in the manufacturing process, since the replacement of the circular saw blades can be made without problems.
Durch das erfindungsgemäße Verfahren ergibt sich des Weiteren vorteilhaft, dass der Abläng- und Profilschritt in einem Ar- beitsschritt durchgeführt werden kann, so dass auch der Prozessablauf vereinfacht wird und insgesamt kostengünstiger ist .The method according to the invention also affords the advantage that the cutting and profile step can be carried out in one work step, so that the process flow is also simplified and overall is more cost-effective.
Die vorliegende Erfindung schafft erstmals vorteilhaft einen Herstellungsprozess für einen Kühlkörper aus extrudiertem A- luminium, der hinsichtlich der Ausformung des Kühlkörpers so variabel ist, dass die individuellen Anforderungen im Elektronikgehäuse bezüglich abzuführender Wärme, Abdichtung zwischen Gehäuse und Kühlkörper und Größe des Kühlkörpers be- rücksichtigt werden können. Sie eignet sich insbesondere für Anwendungen im Automobilbereich.For the first time, the present invention advantageously provides a production process for a heat sink made of extruded aluminum, which is so variable in terms of the shape of the heat sink that the individual requirements in the electronics housing with regard to dissipated heat, sealing between housing and heat sink and size of the heat sink are taken into account can. It is particularly suitable for applications in the automotive sector.
Weitere Vorteile und Ausführungen der Erfindung werden nachfolgend anhand von Ausführungsbeispielen sowie anhand der Zeichnung erläutert.Further advantages and embodiments of the invention will be explained below with reference to embodiments and with reference to the drawing.
Dabei zeigen schematisch:Here are shown schematically:
Fig. 1 in einer Explosionsdarstellung ein Elektronikgehäuse, in der die Kühlkörpereinbauverhältnisse anhand eines Beispielgehäuses verdeutlicht werden;
Fig. 2 in einer perspektivischen Darstellung einen erfindungsgemäßen Kühlkörper im montierten Zustand;Figure 1 is an exploded view of an electronics housing, in which the heat sink installation conditions are illustrated using an example of housing. FIG. 2 is a perspective view of a heat sink according to the invention in the mounted state; FIG.
Fig. 3 eine Schnittdarstellung des erfindungsgemäßen Kühlkör- pers im montierten Zustand;3 is a sectional view of the heat sink according to the invention in the mounted state;
Fig. 4 eine Schnittdarstellung des Elektronikgehäuses mit erfindungsgemäßen Kühlkörper;4 is a sectional view of the electronics housing with the heat sink according to the invention;
Fig. 5 eine Schnittdarstellung einer Kreissäge beim Sägevorgang durch eine Profilbramme;5 is a sectional view of a circular saw during the sawing process by a profile slab.
Fig. 6 in einer perspektivischen Darstellung die Profilbrammen nach Fig. 5 nach dem Sägevorgang;FIG. 6 is a perspective view of the profile slabs according to FIG. 5 after the sawing process; FIG.
Fig. 7 eine perspektivische Darstellung eines Sägevorgangs von nebeneinander angeordneten Profilbrammen mit einer Kreissäge;7 shows a perspective view of a sawing process of profile slabs arranged next to one another with a circular saw;
Fig. 8 eine Schnittdarstellung einer Profilkreissäge beim Sägevorgang durch eine Profilbramme;8 is a sectional view of a profile circular saw during the sawing process by a profile slab.
Fig. 9 in einer perspektivischen Darstellung die Profilbrammen nach Fig. 8 nach dem Sägevorgang;FIG. 9 is a perspective view of the profile slabs according to FIG. 8 after the sawing process; FIG.
Fig. 10 eine perspektivische Darstellung eines Sägevorgangs von nebeneinander angeordneten Profilbrammen mit einer Profilkreissäge;10 is a perspective view of a sawing process of side-by-side profile slabs with a profile circular saw;
Fig. 11 eine perspektivische Darstellung der Profilkreissäge undFig. 11 is a perspective view of the profile circular saw and
Fig. 12 eine perspektivische Darstellung eines Sägevorgangs durch eine Hohlprofilbramme.Fig. 12 is a perspective view of a sawing process by a hollow profile slab.
Fig. 1 zeigt in einer Explosionsdarstellung ein Elektronikgehäuse mit einem Kühlkörper 2. Das Elektronikgehäuse 1 ist vorzugsweise zweiteilig ausgeformt und weist ein Gehäuseober-
teil 3 und ein Gehäuseunterteil 4 auf. Im Gehäuseoberteil 3 ist eine vorzugsweise rechteckige Ausnehmung 5 angeordnet, in der der Kühlkörper 2 lagert. Der Kühlkörper 2 weist parallel zueinander angeordnete Kühlrippen 6 und Dichtschnittstellen auf allen vier Umfangsseiten auf. Im Elektronikgehäuse 1 sind elektrische Trägerkomponenten, wie z. B. Leiterplatten 7 angeordnet .1 shows an exploded view of an electronics housing with a heat sink 2. The electronics housing 1 is preferably formed in two parts and has an upper housing surface. Part 3 and a lower housing part 4. In the upper housing part 3, a preferably rectangular recess 5 is arranged, in which the heat sink 2 superimposed. The heat sink 2 has mutually parallel cooling fins 6 and sealing interfaces on all four sides of the circumference. In the electronics housing 1 are electrical carrier components, such as. B. printed circuit boards 7 are arranged.
Fig. 2 zeigt in einer perspektivischen Darstellung den erfin- dungsgemäßen Kühlkörper 2 im montierten Zustand. Der Kühlkörper 2 lagert in der Ausnehmung 5 des Gehäuseoberteils 3, wobei die Kühlrippen 6 des Kühlkörpers 2 aus dem Gehäuseoberteil 3 hervorragen.FIG. 2 shows in a perspective view the heat sink 2 according to the invention in the assembled state. The heat sink 2 supports in the recess 5 of the upper housing part 3, wherein the cooling fins 6 of the heat sink 2 protrude from the upper housing part 3.
Fig. 3 zeigt in einer Schnittdarstellung den Kühlkörper 2 im montierten Zustand. Der Kühlkörper 2 ist in diesem Ausführungsbeispiel so konzipiert, dass er vorzugsweise an den parallel und quer zu den Kühlrippen 6 verlaufenden Seiten Um- fangsprofile 8 aufweist. Die Umfangsprofile 8 sind so ausge- bildet, dass sie seitlich über dem Bereich 9, in welchem die Kühlrippen 6 angeordnet sind, hervorstehen. Daraus ergibt sich eine leicht zugängliche Abdichtungsmöglichkeit mit einer Dichtmasse 10 z. B. auf Vergussbasis oder mit einer dispens- ten Dichtung zwischen dem Kühlkörper 2 und dem Gehäuseober- teil 3 an den parallel und quer zu den Kühlrippen 6 verlaufenden Seiten des Umfangsprofils 8.Fig. 3 shows a sectional view of the heat sink 2 in the mounted state. In this exemplary embodiment, the heat sink 2 is designed such that it preferably has circumferential profiles 8 on the sides running parallel and transversely to the cooling fins 6. The circumferential profiles 8 are designed such that they protrude laterally over the region 9 in which the cooling ribs 6 are arranged. This results in an easily accessible sealing option with a sealant 10 z. B. on potting or with a dispensed seal between the heat sink 2 and the housing upper part 3 on the parallel and transverse to the cooling fins 6 extending sides of the peripheral profile. 8
In Fig. 4 ist eine weitere Möglichkeit dargestellt, eine sichere Abdichtung zwischen dem Gehäuseoberteil 3 und dem Kühl- körper 2 zu ermöglichen. Dabei wird die Dichtmasse 10 aufFIG. 4 shows a further possibility of enabling a secure seal between the housing upper part 3 and the cooling body 2. In this case, the sealant 10 on
Auflageflächen 11 aufgetragen, die sich aus dem Umfangsprofil 8 ergeben. Es können hier z. B. auch eine Einlegedichtung o- der eine angespritzte Dichtung zwischen Auflagefläche 11 und einer umlaufenden Schulter 3a des Gehäuseoberteils 3 plat- ziert werden. Diese Auflageflächen 11 verlaufen parallel und quer zu den Kühlrippen 6 des Kühlkörpers 2 und werden durch das Gehäuseoberteil 3 beaufschlagt. Die Dichtwirkung ist dadurch begünstigt, dass zwischen Gehäuseoberteil 3 und Gehäu-
seunterteil 4 beim Zusammenbau ein Anpressdruck herrscht, der die Verteilung der Dichtmasse 10 und damit die Dichtwirkung begünstigt .Placed bearing surfaces 11, resulting from the circumferential profile 8. It can here z. B. an insert seal o- a molded seal between bearing surface 11 and a peripheral shoulder 3a of the housing upper part 3 are placed. These bearing surfaces 11 extend parallel and transversely to the cooling ribs 6 of the heat sink 2 and are acted upon by the upper housing part 3. The sealing effect is favored by the fact that between housing upper part 3 and housing seunterteil 4 during assembly, a contact pressure prevails, which favors the distribution of the sealant 10 and thus the sealing effect.
Fig. 5 zeigt in einer Schnittdarstellung eine Kreissäge 12 beim Sägevorgang durch eine Profilbramme 13.5 shows a sectional view of a circular saw 12 during the sawing process by means of a profile slab 13.
Fig. 6 zeigt in einer perspektivischen Darstellung die Profilbramme 13 nach Fig. 5 nach dem Sägevorgang. Der durch den Sägevorgang von der Profilbramme 13 abgetrennte Kühlkörper 2 weist die parallel zu den Kühlrippen 6 verlaufenden Umfangs- profilierungen 8 auf.Fig. 6 shows in a perspective view of the profile slab 13 of FIG. 5 after the sawing process. The heat sink 2 separated by the sawing process from the profile slab 13 has the circumferential profiles 8 running parallel to the cooling ribs 6.
Fig. 7 zeigt eine perspektivische Darstellung eines Sägevor- gangs von nebeneinander angeordneten Profilbrammen 13 mit einer Kreissäge 12.7 shows a perspective view of a sawing process of profile slabs 13 arranged next to one another with a circular saw 12.
Fig. 8 zeigt in einer Schnittdarstellung eine Profilkreissäge 14 beim Sägevorgang durch eine Profilbramme 13. Durch die Verwendung der Profilkreissäge 14 mit einem mittig angeordneten Fräseblatt 15 und zwei seitlich zum Fräseblatt 15 angeordneten Fräsenblättern 16 werden beim Sägevorgang Kühlkörper 2 geschaffen, die auch quer zur Extrudierrichtung eine Um- fangsprofilierung 17 aufweisen.By the use of the profile circular saw 14 with a centrally located milling blade 15 and two side of the milling blade 15 arranged Fräsenblättern 16 are created during the sawing heat sink 2, which is also transverse to the extrusion direction have a circumferential profiling 17.
Fig. 9 zeigt in einer perspektivischen Darstellung die Profilbramme 13 nach Fig. 8 nach dem Sägevorgang. Der durch den Sägevorgang von der Profilbramme abgetrennte Kühlkörper 2 weist an allen vier Umfangsflächen Umfangsprofilierungen 8, 17 auf.Fig. 9 shows in a perspective view of the profile slab 13 of FIG. 8 after the sawing process. The heat sink 2 separated by the sawing process from the profile slab has circumferential profiles 8, 17 on all four peripheral surfaces.
Fig. 10 zeigt eine perspektivische Darstellung eines Sägevorgangs von nebeneinander angeordneten Profilbrammen 13 mit einer Profilkreissäge 14.10 shows a perspective view of a sawing operation of profile slabs 13 arranged next to one another with a profile circular saw 14.
Fig. 11 zeigt eine perspektivische Darstellung der Profilkreissäge 14. Die Profilkreissäge 14 weist ein großes Fräseblatt 15 auf, an dessen Seiten zwei kleinere Fräseblätter 16
angeordnet sind. Die Fräseblätter 15, 16 der Profilkreissäge 14 können individuell auf das Anforderungsprofil abgestimmt, zusammengestellt werden, d.h., hinsichtlich ihres Durchmessers und ihres Profils. Dazu dient ein Achsenelement 18, auf welches die Fräseblätter 15, 16 aufgesteckt und befestigt werden.11 shows a perspective view of the profiled circular saw 14. The profiled circular saw 14 has a large milling blade 15, on whose sides two smaller milling blades 16 are arranged. The milling blades 15, 16 of the profile circular saw 14 can be individually matched to the requirement profile, put together, ie, in terms of their diameter and their profile. The purpose of an axle element 18, on which the cutter blades 15, 16 attached and secured.
Fig. 12 zeigt eine perspektivische Darstellung eines Sägevorgangs durch eine Hohlprofilbramme 19. Das erfindungsgemäße Verfahren ist sowohl für Voll- als auch für Hohlprofile geeignet .12 shows a perspective view of a sawing process through a hollow profile slab 19. The method according to the invention is suitable for both full and hollow profiles.
Die vorliegende Erfindung schafft erstmals vorteilhaft einen Herstellungsprozess für einen Kühlkörper (2) aus extrudiertem Aluminium, der hinsichtlich der Ausformung des KühlkörpersFor the first time, the present invention advantageously provides a production process for a heat sink (2) made of extruded aluminum, which with regard to the shape of the heat sink
(2) so variabel ist, dass die individuellen Anforderungen im Elektronikgehäuse (1) bezüglich abzuführender Wärme, Abdichtung zwischen Gehäuse (1) und Kühlkörper (2) und Größe des Kühlkörpers (2) berücksichtigt werden können. Sie eignet sich insbesondere für Anwendungen im Automobilbereich.
(2) is so variable that the individual requirements in the electronics housing (1) with respect to dissipated heat, sealing between the housing (1) and heat sink (2) and size of the heat sink (2) can be considered. It is particularly suitable for applications in the automotive sector.
Claims
1. Verfahren zur Herstellung eines Kühlkörpers (2) mit Kühlrippen (6) für ein Elektronikgehäuse (1) , insbesondere für den Automobilbereich, mit den Schritten:1. A method for producing a heat sink (2) with cooling fins (6) for an electronics housing (1), in particular for the automotive sector, with the steps:
- Herstellen von extrudierten Profilbrammen (13, 19) mit parallel zueinander verlaufenden Kühlrippen (6);- Producing extruded profile slabs (13, 19) with mutually parallel cooling ribs (6);
- Nebeneinander Ausrichten der Profilbrammen (13, 19) zu einer Fläche mit parallel angeordneten Kühlrippen (6); - Ablängen der Profilbrammen (13, 19) mittels einer Profilkreissäge (14) mit Stufenprofil.- Side-by-side alignment of the profile slabs (13, 19) to a surface with parallel cooling fins (6); - Cutting the profile slabs (13, 19) by means of a profile circular saw (14) with stepped profile.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass Profilbrammen (13, 19) mit parallel zu den Kühlrippen (6) angeordneter flanschartiger Profilierung (8) verwendet werden.2. The method according to claim 1, characterized in that profile slabs (13, 19) with parallel to the cooling fins (6) arranged flange-like profiling (8) are used.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass Profilbrammen (13, 19) mit einer unterschiedlichen Anzahl an Kühlrippen (6) extrudiert werden.3. The method according to claim 1 or 2, characterized in that profile slabs (13, 19) are extruded with a different number of cooling fins (6).
4. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Kühlkörper (2) mit einer unterschiedlichen Geometrie hinsichtlich der Länge, der Breite und der Profiltiefe hergestellt werden.4. The method according to any one of the preceding claims, characterized in that the heat sink (2) are made with a different geometry in terms of length, width and tread depth.
5. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Profilbrammen (13, 19) zu Kühlkörpern (2) in unterschiedlicher Größe abgelenkt werden.5. The method according to any one of the preceding claims, characterized in that the profile slabs (13, 19) are deflected to heat sinks (2) in different sizes.
6. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Profilbrammen (13, 19) aus Aluminium extrudiert werden.6. The method according to any one of the preceding claims, characterized in that the profile slabs (13, 19) are extruded from aluminum.
7. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der mittels Profilkreissäge (14) durchgeführte Ablängvorgang mit einer Profilkreissäge (14) durchgeführt wird, die eine variable Zusammenstellung der Kreisfräseblätter ermöglicht.7. The method according to any one of the preceding claims, characterized in that the means of profile circular saw (14) performed cutting with a profile circular saw (14) carried out, which allows a variable composition of the Kreisfräseblätter.
Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Abläng- und Profilschritt in einem Arbeitsschritt durchgeführt wird. Method according to one of the preceding claims, characterized in that the cutting and profile step is carried out in one step.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008529575A JP2009508328A (en) | 2005-09-09 | 2006-07-26 | Heat sink for electronics casing |
US12/066,273 US20090083980A1 (en) | 2005-09-09 | 2006-07-26 | Cooling Body for Electronics Housing |
EP06777993A EP1922177A1 (en) | 2005-09-09 | 2006-07-26 | Cooling body for an electronic housing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005043055.4 | 2005-09-09 | ||
DE102005043055A DE102005043055B3 (en) | 2005-09-09 | 2005-09-09 | Electronics housing cooling body with cooling fins, useful in automobiles, is produced inexpensively from extruded profiled slabs, specifically of aluminum, by cutting to length using profiled circular saw |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007028672A1 true WO2007028672A1 (en) | 2007-03-15 |
Family
ID=37106919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/064691 WO2007028672A1 (en) | 2005-09-09 | 2006-07-26 | Cooling body for an electronic housing |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090083980A1 (en) |
EP (1) | EP1922177A1 (en) |
JP (1) | JP2009508328A (en) |
DE (1) | DE102005043055B3 (en) |
WO (1) | WO2007028672A1 (en) |
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JP2009147107A (en) * | 2007-12-14 | 2009-07-02 | Toyota Motor Corp | Cooling fin and manufacturing method of the cooling fin |
JP5149845B2 (en) * | 2009-03-19 | 2013-02-20 | 三協立山株式会社 | Fin processing method for heat sink made of extruded aluminum material |
DE102009059010A1 (en) | 2009-12-17 | 2011-06-22 | Phoenix Contact GmbH & Co. KG, 32825 | module unit |
ITBO20120618A1 (en) * | 2012-11-09 | 2014-05-10 | Mecc Al S R L A Socio Unico | PROCEDURE FOR THE REALIZATION OF A SINK AND SINK WHEN OBTAINED |
CN109848652A (en) * | 2019-02-22 | 2019-06-07 | 中国电子科技集团公司第四十三研究所 | A kind of processing method of titanium alloy encapsulating housing |
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Also Published As
Publication number | Publication date |
---|---|
DE102005043055B3 (en) | 2006-12-21 |
US20090083980A1 (en) | 2009-04-02 |
EP1922177A1 (en) | 2008-05-21 |
JP2009508328A (en) | 2009-02-26 |
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