EP1894149A1 - Dispositif transportable comprenant deux cavites pour deux supports de donnees - Google Patents
Dispositif transportable comprenant deux cavites pour deux supports de donneesInfo
- Publication number
- EP1894149A1 EP1894149A1 EP06755966A EP06755966A EP1894149A1 EP 1894149 A1 EP1894149 A1 EP 1894149A1 EP 06755966 A EP06755966 A EP 06755966A EP 06755966 A EP06755966 A EP 06755966A EP 1894149 A1 EP1894149 A1 EP 1894149A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- cavity
- circular hole
- thickness
- portable device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
- G06K19/041—Constructional details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
- G06K19/041—Constructional details
- G06K19/042—Constructional details the record carrier having a form factor of a credit card and including a small sized disc, e.g. a CD or DVD
- G06K19/044—Constructional details the record carrier having a form factor of a credit card and including a small sized disc, e.g. a CD or DVD comprising galvanic contacts for contacting an integrated circuit chip thereon
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
- G06K19/083—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention concerns a portable device for carrying data. More specifically, the invention concerns a device comprising two data carriers that are used in two different types of reader.
- WO 2004/006179 reveals a divisible portable device comprising an optical data carrier and an integrated circuit.
- This device is realized as a polycarbonate CD type optical disk, in compliance with a known technique, which is subsequently machined to create a cavity intended to receive a chip card module on the one hand and to shape it like a chip card with at least one break line on the other.
- the card thus created comprises a square or rectangular optical disk after separation along the break line and a chip that can be used as a SIM format card.
- moulding cards in transparent polycarbonate comprising at least two zones separated by a break line is a known technique.
- a cavity is moulded in one of the zones to receive a module and a centering hole is moulded in another zone that constitutes an optical disk.
- a disk in reflecting material is then stuck in a centered manner around the centering hole and a protection label is stuck over the assembly.
- the invention proposes a new manufacturing method for a chip card including an optical disk.
- the disk is manufactured separately and is then assembled in a card realized in more traditional materials for card manufacturing and hence less expensive and easier to implement.
- the invention is a portable device with two cavities.
- a first cavity is sized into said body for receiving an electronic module.
- a second cavity is sized into said body for receiving an optical disk.
- the body may be made in two layers fixed one to each other.
- a first layer is made in a first material having a first thickness, said first layer comprising the first cavity and a first circular hole.
- a second layer is made in a second material having a second thickness and with one face stuck to a face of the first layer.
- the second layer comprises a second circular hole whose diameter is inferior to that of the first circular hole and which is centered on the same axis. After the first and second layers have been stuck the first circular hole forms the second cavity.
- the invention is a portable device that comprises a card-like body, a module and an optical disk.
- the card-like body has a first cavity and a second cavity.
- the module includes an integrated circuit, said module being positioned in the first cavity.
- the optical disk has an outer diameter corresponds to a diameter of the second cavity.
- the card-like body may be made in two layers.
- a first layer is made in a first material having a first thickness, said first layer comprising the first cavity and a first circular hole, the module being stuck to the first layer.
- a second layer is made in a second material having a second thickness and with one face stuck to a face of the first layer.
- the second layer comprises a second circular hole whose diameter is inferior to that of the first circular hole and which is centered on the same axis, a face of the optical disk being stuck to the second layer in the second cavity defined by the first circular hole and the second layer.
- the device may include at least one break line positioned between the first cavity and the second cavity.
- the first cavity of the first layer may be open on the face in contact with the second layer and the second layer may include an opening crossed by the module.
- the invention is a manufacturing process for a portable device with two cavities.
- Said process comprises the manufacturing steps of a first and second layer and the positioning and sticking of the first and second layers.
- the manufacturing of the first layer using a first material is realized to obtain a first thickness, as said first layer comprises a first cavity and a first circular hole.
- the manufacturing of the second layer using a second material is realized to obtain a second thickness, as the second layer comprises a second circular hole with a diameter that is inferior to that of the first circular hole and centered on the same axis.
- the positioning and sticking of the first layer on the second layer occurs in such a way that the first circular hole, which is obturated at least partly by the second layer, forms a second cavity.
- the process may include manufacturing steps for a module, for the manufacturing of a disk, for the positioning of the disk and module.
- the manufacturing of the module includes an integrated circuit.
- the manufacturing of the optical disk preferably occurs to obtain a disk whose thickness is equal to the first thickness and whose outer diameter corresponds to the diameter of the first circular hole.
- the positioning of the disk occurs in the second cavity and the sticking of the disk occurs on the second layer.
- the positioning of the module occurs in the first cavity and the sticking of the module occurs on the first layer.
- the manufacturing of the first layer occurs by moulding.
- an opening can be realized, intended to be opposite the first cavity of the first layer.
- a pre-cutting of the device in order to realize at least one break line allowing to separate the part comprising the module from the part comprising the disk, said pre-cutting step can be realized by means of laser cutting.
- Figure 1 represents a first example of the device according to the invention in exploded view.
- Figure 2 represents the device in figure 1 in cross section
- Figure 3 represents a variant of a device according to the invention in cross section and Figure 4 represents a front view of the device in figure 3.
- Figure 1 shows a first manufacturing mode of a portable device according to the invention in exploded view.
- Figure 2 shows the same device in cross cutting plane allowing to see the structure of the assembled device.
- the same references are used for the same elements.
- the drawings were not made to scale to better show certain details.
- the portable device is an ISO format chip card.
- the portable device comprises a first layer 1 , a second layer 2, a module 3 and an optical disk 4.
- the first and second layers 2 and 3 can be realized in different manners by machining or by moulding by using various materials such as e.g. PVC or ABS.
- Optical disk 4 is realized in polycarbonate but its circular shape allows to use a manufacturing process known for the realization of optical disks.
- Module 3 is a known chip card module realized according to a known technique. According to a preferred manufacturing process, ABS injection moulding in a suitable mould is realized to obtain first layer 1. Moulding allows to obtain first layer 1 , e.g. with the dimensions of an ISO type card with a length of 85.6 mm and a width of 54 mm.
- the layer is provided on the one hand with a cavity 11 and on the other with a circular hole 12.
- Cavity 11 is intended to receive module 3.
- the circular hole is intended to receive disk 5.
- Injection moulding allows to achieve greater precision in respect of the size of circular hole 12 for it to correspond as closely as possible to the size of disk 4. For instance the diameter of circular hole 12 and of disk 4 is of 53 mm for a card width of 54 mm.
- optical disk 4 and first layer 1 will have the same thickness, e.g. 600 ⁇ m. Such a thickness allows to use a DVD type optical disk. The use of a DVD disk allows to finally obtain a card that is compatible with card format ISO 7816. A CD format disk could be used but is thicker and hence not compatible with the ISO format and allows to store less data than a DVD of the same diameter.
- the second layer 2 is a finer layer that may e.g. be in ABS or in PVC. In a preferred manufacturing process, it will be realized by machining using for instance cutting drawing process. Before cutting it is possible to print this layer using a known printing technique.
- the cutting of the second layer 2 allows to cut said layer to the ISO format and to realise an opening 21 and a circular hole 22. Opening 21 is situated opposite cavity 11 of first layer 1 and of circular hole 22 and is concentric to circular hole 12 of first layer 1 when the two layers are assembled. Opening 21 is of the same shape and size as the connector of module 3.
- Circular hole 22 is of the same size as the hole situated in disk 4 to drive its rotation in a disk reader.
- the thickness of second layer 2 is inferior to 200 ⁇ m so that the addition of a layer of glue between the first and second layer for the assembly of the first and second layer allows to obtain a thickness of approximately 800 ⁇ m after sticking.
- the assembly thus obtained is an ISO format chip card which also has a DVD type optical disk.
- the DVD disk is not centered in respect of the card and the use of the card thus formed in a disk reader is a source of vibrations. To remedy these vibrations, it must be possible to separate the module from the disk.
- break line 40 is formed on the card. The break line is e.g. realized after the assembly of the card by pre-cutting a dotted line on the card by means of a laser.
- the card can be used as an ISO format chip card as long as the disk has not been separated. Then, to use the disk optimally a user may break the card and obtain a balanced disk carrier that can be used in a disk reader.
- Figures 3 and 4 show a manufacturing variant in which the ISO format chip card is separated from a rectangular part 50 that behaves as a balanced disk and also as plug 51 , e.g. with a SIM card format with a length of 25 mm and a width of 15 mm.
- This example comprises three break lines 40, 41 and 42 that are realized during the moulding of the first layer 1.
- the break lines correspond to bevelled grooves that weaken the card, as the thickness of break lines 40, 41 and 42 is inferior to the thickness of the first layer.
- module 3 is stuck on the same side as disk 4. Consequently, it is no longer necessary to make an opening in the second layer 2 opposite cavity 11. Moreover, cavity 11 may be connecting as second layer 2 ensures the closing of said cavity. The assembly of this card occurs as stated above.
- the card body is made in a single material layer.
- the card body is then moulding of machining a conventional plastic layer, for example PVC, to obtain a first cavity for receiving the electronic module and a second cavity for receiving the optical disk.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06755966A EP1894149A1 (fr) | 2005-06-24 | 2006-06-23 | Dispositif transportable comprenant deux cavites pour deux supports de donnees |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05291372A EP1739601A1 (fr) | 2005-06-24 | 2005-06-24 | Dispositif portable comprenant deux cavités pour deux supports de données utilisables dans deux lecteurs differents, et methode pour le fabriquer |
EP06755966A EP1894149A1 (fr) | 2005-06-24 | 2006-06-23 | Dispositif transportable comprenant deux cavites pour deux supports de donnees |
PCT/IB2006/001754 WO2006136942A1 (fr) | 2005-06-24 | 2006-06-23 | Dispositif transportable comprenant deux cavites pour deux supports de donnees |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1894149A1 true EP1894149A1 (fr) | 2008-03-05 |
Family
ID=35207520
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05291372A Withdrawn EP1739601A1 (fr) | 2005-06-24 | 2005-06-24 | Dispositif portable comprenant deux cavités pour deux supports de données utilisables dans deux lecteurs differents, et methode pour le fabriquer |
EP06755966A Withdrawn EP1894149A1 (fr) | 2005-06-24 | 2006-06-23 | Dispositif transportable comprenant deux cavites pour deux supports de donnees |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05291372A Withdrawn EP1739601A1 (fr) | 2005-06-24 | 2005-06-24 | Dispositif portable comprenant deux cavités pour deux supports de données utilisables dans deux lecteurs differents, et methode pour le fabriquer |
Country Status (2)
Country | Link |
---|---|
EP (2) | EP1739601A1 (fr) |
WO (1) | WO2006136942A1 (fr) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9000256A (nl) * | 1990-02-01 | 1991-09-02 | Jan Essebaggers | Informatiedrager in de vorm van een credit card. |
AU6682700A (en) * | 1999-07-10 | 2001-01-30 | Karl-Heinz Schoppe | Optical data carrier in the form of a disk |
DE19943092A1 (de) * | 1999-09-09 | 2001-03-15 | Orga Kartensysteme Gmbh | Datenträger mit Halbleiterschaltkreis und abtrennbarem optischen Speichermedium |
ATE275754T1 (de) * | 1999-09-10 | 2004-09-15 | Internat Consulting S R L | Datenspeichervorrichtung |
FR2815161B1 (fr) * | 2000-10-06 | 2003-05-23 | Philippe Pierre Simon | Procede de fabrication de carte cederom mixte memoire active et adaptateur permettant la lecture sur les lecteurs de carte a puce portatifs |
EP1380990A1 (fr) | 2002-07-09 | 2004-01-14 | SCHLUMBERGER Systèmes | Support de données inséré dans un autre support de données d'un type différent |
WO2005031716A2 (fr) * | 2003-10-02 | 2005-04-07 | Tele-Cd Company A/S | Carte porteuse a disque optique et puce micro-electronique |
-
2005
- 2005-06-24 EP EP05291372A patent/EP1739601A1/fr not_active Withdrawn
-
2006
- 2006-06-23 WO PCT/IB2006/001754 patent/WO2006136942A1/fr not_active Application Discontinuation
- 2006-06-23 EP EP06755966A patent/EP1894149A1/fr not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO2006136942A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP1739601A1 (fr) | 2007-01-03 |
WO2006136942A1 (fr) | 2006-12-28 |
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Legal Events
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Effective date: 20080416 |
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Owner name: GEMALTO SA |
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