EP1887648A1 - MIkrowellenstruktur mit Gehäuse - Google Patents

MIkrowellenstruktur mit Gehäuse Download PDF

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Publication number
EP1887648A1
EP1887648A1 EP06300862A EP06300862A EP1887648A1 EP 1887648 A1 EP1887648 A1 EP 1887648A1 EP 06300862 A EP06300862 A EP 06300862A EP 06300862 A EP06300862 A EP 06300862A EP 1887648 A1 EP1887648 A1 EP 1887648A1
Authority
EP
European Patent Office
Prior art keywords
housing
substrate layer
microwave structure
pieces
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06300862A
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English (en)
French (fr)
Inventor
Simon Neil Batchelor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel Lucent SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Priority to EP06300862A priority Critical patent/EP1887648A1/de
Publication of EP1887648A1 publication Critical patent/EP1887648A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines

Definitions

  • the present invention relates generally to the field of microwave constructions, and more particularly to microwave printed transmission line structures enclosed within a housing.
  • Micro strip lines and strip lines are generally used for microwave integrated circuits e.g. micro strip lines and strip lines, each type having its advantages with respect to the others.
  • Suspended substrate line technology is also among the principal transmission media used in the microwave and millimetre-wave bands.
  • Most of the micro strip components, such as power dividers, filters, directional couplers and multiplexers are manufactured in suspended substrate line form. Covering the basic micro strip configuration with metal top and side plates leads to a shielded micro strip structure within a housing. The main purposes of the housing or package are to provide mechanical strength, electromagnetic shielding and also protection of the micro strip structure from moisture, humidity, dust and other outside agents.
  • FIG 7 of said document a number of metallic strips 46, 50 are shown disposed on a suspended substrate 48, such as a printed circuit board (PCB) and enclosed within a housing 12 constructed of an electrically conductive material such as copper.
  • the PCB has a dielectric constant greater than the air of the internal environment above and below the substrate 48.
  • Figure 9 shows the filter in the form of microstrip construction, the substrate 56 being supported on the bottom wall 18 of the housing 12.
  • a problem with the known shielded microwave structures of the prior art is that the substrate has to be manually mounted and secured on the housing metal structure e.g. by way of screws or clamp devices. Further the prior art housing and/or the substrate need to be provided with a support element or structure so that the substrate can be suspended. These disadvantages greatly increase the assembly time and manufacturing costs of the structure.
  • the object is achieved according to the invention by a microwave structure according to claim 1 and a method for manufacturing a microwave structure according to claims 8 or 9.
  • the main idea behind the invention is to make the housing of the microwave structure of a plastic material and embed the microwave structure substrate in the housing piece or manufacture the substrate as an integral part of the plastic housing.
  • the housing comprises at least two pieces, which are assembled together, and the substrate layer of the microwave structure is embedded in one of said housing plastic pieces or is manufactured as an integral part of one of said plastic pieces.
  • the substrate can be embedded in a housing assembly piece for example during the injection moulding process of said piece or be made as an integral part of one housing assembly piece when said piece is moulded.
  • the interior walls of the housing are covered of an electrical conductive material in order to provide shielding and a ground conductor for the microwave structure.
  • the microwave structure of the invention can be implemented as a microstrip construction in which the substrate is located directly on a metal or metal-plated plastic wall in the interior space of the housing or as a suspended substrate structure in which the substrate is located within the housing so that there is a gap between the substrate and the walls of the housing above and below that substrate layer.
  • the suspended substrate microwave structure is mirrored in both sides of the substrate layer so that the signal does not propagate in the plastic substrate, thus reducing signal loss.
  • the microwave structure disclosed herein has the advantage that it can be manufactured without human intervention since there is no need to mount and secure the substrate layer of the microwave structure to the housing as part of a different or extra assembly step. Manufacturing effort and assembly time are therefore reduced. Also advantageous is the fact that when the substrate layer is manufactured as part of the housing, the metal conductors can be printed directly on said plastic substrate and there is no need to use PCB substrate structures. Furthermore, component count and material costs are also advantageously reduced.
  • Fig. 1 shows a cross sectional view of the microwave structure enclosed within a housing according to a first generalization of the invention.
  • Fig. 2 is a cross sectional view of the microwave structure enclosed within a housing according to a second generalization of the invention.
  • Fig. 3 shows a cross sectional view of the microwave structure enclosed within a housing according to a first embodiment example of the invention.
  • Fig. 4 is a cross sectional view of a microwave structure enclosed within a housing according to a second embodiment example of the invention.
  • Fig. 5 shows a cross sectional view of a microwave structure enclosed within a housing according to a third embodiment example of the invention.
  • Fig. 6 shows a cross sectional view of a microwave structure enclosed within a housing according to a fourth embodiment example of the invention.
  • Fig. 7 is a cross sectional view of a microwave structure enclosed within a housing according to a third generalization of the invention.
  • Fig. 8 is a cross sectional view of the microwave structure enclosed within the housing according to a fourth generalization of the invention.
  • Figure 1 shows a first simplified embodiment of a microwave structure according to the invention comprising a number of printed conductor strips C disposed on a substrate layer 2 and said microwave structure being enclosed within a housing 1 comprising a top wall T, a bottom wall B and four side walls W (two of them not shown in the figure).
  • the structure of the housing 1 can be imagined as a box.
  • the housing 1 and the substrate layer 2 are made of plastic, and the substrate 2 constitutes the same piece and is implemented in the same production step, e.g. by injection moulding, of one piece of the housing 1.
  • the conductor strips C are disposed on the substrate layer 2 and the surface of the walls in the interior I of the housing which do not constitute the substrate layer 2 are plated with an electrically conductive material.
  • the space in the interior I of the housing above and below the substrate layer 2 is filled with air but could be filled with another kind of dielectric.
  • the substrate 2 is a plastic layer moulded with one housing piece that is not plated and acts as a dielectric for the conductor strips C.
  • the dielectric constant of the substrate 2 is greater than the dielectric constant of the element filling the interior space I. While the substrate layer 2 is made of the same material as one piece of the housing 1 it is also possible that in a subsequent production step the substrate layer 2 is treated with a suitable process, e.g. particle bombardment or chemical deposition, in order to increase its dielectric constant.
  • FIG. 2 shows a second simplified embodiment of a microwave structure according to the invention comprising a number of printed conductor strips C disposed on a substrate layer 2' and said microwave structure being enclosed within a housing 1 comprising a top wall T, a bottom wall B and four side walls W (two of them not shown in the figure).
  • the housing 1 and the substrate layer 2' are different pieces or are made of different materials and the substrate piece is embedded in at least one part of the housing pieces.
  • the housing 1 may be for example of plastic and the substrate 2' be a conventional PCB substrate which is embedded in one or more of the side walls W during the plastic injection moulding step of the manufacturing process.
  • the surface of the walls in the interior I of the housing that is, the interior surface of the housing that does not constitute the substrate layer 2', are plated with an electrical conductive material.
  • the space in the interior I of the housing above and below the substrate layer 2' is filled with air but could be filled with another kind of dielectric.
  • the substrate layer 2' may already contain the conductor strips C disposed on it when embedded in one housing piece but it is also possible that only the pure dielectric material is embedded in the housing piece during the plastic injection moulding step of the housing and in a subsequent production process the conductor strips C be disposed on the substrate layer 2'. Again it is also possible that the substrate layer 2' is treated with a suitable process, e.g. particle bombardment or chemical deposition, in order to increase its dielectric constant.
  • a suitable process e.g. particle bombardment or chemical deposition
  • Figures 1 and 2 show a suspended substrate microwave structure the person skilled in the art would also be able to derive that they are also valid for a micro strip implementation in which the substrate layer 2, 2' is not suspended within the housing 1, that is, the substrate layer 2, 2' being, or resting over, one of the walls T, B or W of the housing.
  • the housing 1 of Figures 1 and 2 is not made of just one piece of plastic material, since there is a need for an opening in order to access the interior space I of the housing in order to plate the interior walls and/or place the conductor strips C on the substrate layer 2, 2'.
  • the housing 1 may be made of at least two pieces of plastic material that are assembled together.
  • the substrate layer 2 of Figure 1 may be then part of one of the at least two pieces of the housing and the substrate layer 2' of Figure 2 may be then embedded in one of the at least two pieces of the housing constituents.
  • Figures 3 to 6 show embodiment examples of how the housing 1 of the microwave structure of Figure 1 and 2 may be constructed.
  • FIG 3 shows an embodiment example of the of a microwave structure according to the invention comprising a number of printed conductor strips C disposed on a substrate layer 2' and said microwave structure being enclosed within a housing 1 comprising a top wall lid T, a bottom wall lid B and four side walls chassis W (two walls not shown in the figure).
  • the housing 1 may be made of more than one piece.
  • a first piece P1 comprises a four side walls chassis W
  • a second piece P2 comprises a top wall lid T
  • a third piece P3 comprises a bottom wall lid B. All the pieces P1, P2, P3 are assembled together to form the housing 1.
  • the top and the bottom wall lid T, B may be made of metal or be also plastic moulded as the side walls chassis W and then plated at least in the surface facing the interior I of the housing.
  • the side walls chassis W is adapted to receive the top and the bottom wall lid T, B and there is also provided a sealing mechanism (not shown) so that the lids and the chassis seal down fully and correctly.
  • the sealing mechanism shall be designed in such a way that it provides very good metal-to-metal contact in order to avoid the generation of passive intermodulation within the microwave structure.
  • Such sealing mechanism may include, for example, screws, glue or heat bonding techniques.
  • the first piece P1 or side walls chassis W is made of more than one piece and the side walls being also assembled as independent pieces of the housing.
  • the substrate layer 2' is embedded in the first housing piece P1 according to the example of Figure 2 e.g. during the injection moulding process of the first piece P1. Now the independent substrate layer 2' is located in the housing directly over the bottom wall B in the form of a micro strip construction, but it is understood that the substrate layer can be located directly over and parallel to any of the interior surfaces of the walls T, W, B of the housing 1.
  • Figure 4 shows another embodiment example of the of a microwave structure according to the invention comprising a number of printed conductor strips C disposed on a substrate layer 2 and said microwave structure being enclosed within a housing 1 comprising a top wall lid T, a bottom wall B and four side walls W (two walls not shown in the figure).
  • the housing 1 is made of more than one piece.
  • a first piece P1 comprises three side walls W, a bottom wall B and a substrate layer 2
  • a second piece P2 comprises a top wall lid T
  • a third piece P3 comprises one side wall W. All the pieces P1, P2, P3 are assembled together to form a microwave structure shown in Figure 1.
  • the top wall lid T may be made of metal or be also plastic moulded as the side walls chassis W and then plated at least in the surface facing the interior I of the housing.
  • the substrate layer 2 is an integral part of the first housing piece P1 created during the injection moulding process of the first piece P1.
  • first piece P1 and the second piece P2 are moulded together forming only one piece, and thus only two pieces of the housing shall be assembled together as shown in Figure 5.
  • Figure 5 shows the alternative in which a side wall W1 is moulded together with the substrate layer 2 as one piece P2.
  • Figure 6 shows still another assembly alternative in which the substrate layer 2 is moulded together with the side walls chassis W as one piece P1.
  • the microwave structure according to the invention comprises as few pieces as possible that shall be assembled. It has also to be understood that only some of the pieces of the housing, and at least the one comprising the substrate layers 2, 2', shall be made of plastic and the other pieces can be made of another material such as metal.
  • FIG. 7 shows a third simplified embodiment of a microwave structure according to the invention comprising a number of printed conductor strips C and C' disposed on a suspended substrate layer 2 and said microwave structure being enclosed within a housing 1 comprising a top wall T, a bottom wall B and four side walls W (two of them not shown in the figure).
  • the printed conductor strips C and C' are disposed in opposite sides of a suspended substrate layer 2 in a mirrored manner. Due to the fact that the suspended substrate microwave structure is mirrored the signal does not propagate in the plastic substrate, thus reducing the signal loss due to losses caused by the signal propagating in the plastic substrate.
  • FIG. 7 only shows a simplified structure of the housing 1 it is understood that the housing 1 and the substrate layer 2 can be implemented according to the examples shown in figures 3 to 6.
  • the substrate layer may be an integral part of one piece of the housing 1 as explained in the examples of figures 1, 4, 5 and 6 or be an independent element that is embedded in one piece of the housing 1 as explained in the examples of figures 2 and 3.
  • Figure 8 shows a fourth simplified embodiment of a microwave structure according to the invention comprising a number of printed conductor strips C and C' disposed on a suspended substrate layer 2 and said microwave structure being enclosed within a housing 1 comprising a top wall T, a bottom wall B and four side walls W (two of them not shown in the figure).
  • At least one of the housing walls T, B or W comprises a wall projection TW, BW extending to the interior space I of the housing 1.
  • These wall projections TW, BW provide electrical isolation between branches of the microwave structure.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
EP06300862A 2006-08-08 2006-08-08 MIkrowellenstruktur mit Gehäuse Withdrawn EP1887648A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06300862A EP1887648A1 (de) 2006-08-08 2006-08-08 MIkrowellenstruktur mit Gehäuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06300862A EP1887648A1 (de) 2006-08-08 2006-08-08 MIkrowellenstruktur mit Gehäuse

Publications (1)

Publication Number Publication Date
EP1887648A1 true EP1887648A1 (de) 2008-02-13

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EP06300862A Withdrawn EP1887648A1 (de) 2006-08-08 2006-08-08 MIkrowellenstruktur mit Gehäuse

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106410348A (zh) * 2016-10-21 2017-02-15 昆山立讯射频科技有限公司 功率分配器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281934A (en) 1992-04-09 1994-01-25 Trw Inc. Common input junction, multioctave printed microwave multiplexer
US5801605A (en) 1996-08-26 1998-09-01 Microphase Corporation Distributed TEM filter with interdigital array of resonators
US20030206074A1 (en) 2002-05-01 2003-11-06 Stephan Heisen Tuning arrangement for a microwave device
US20050190009A1 (en) 2004-02-26 2005-09-01 Perkins Thomas O. Method and apparatus for rapid prototyping of monolithic microwave integrated circuits

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281934A (en) 1992-04-09 1994-01-25 Trw Inc. Common input junction, multioctave printed microwave multiplexer
US5801605A (en) 1996-08-26 1998-09-01 Microphase Corporation Distributed TEM filter with interdigital array of resonators
US20030206074A1 (en) 2002-05-01 2003-11-06 Stephan Heisen Tuning arrangement for a microwave device
US20050190009A1 (en) 2004-02-26 2005-09-01 Perkins Thomas O. Method and apparatus for rapid prototyping of monolithic microwave integrated circuits

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RUXTON J; VAHLDIECK R: "A wideband finline power divider in a metallized plastic housing: design and performance", 1987 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, vol. 1, 9 June 1987 (1987-06-09) - 11 June 1987 (1987-06-11), New York, NY, USA, pages 215 - 218, XP002418755 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106410348A (zh) * 2016-10-21 2017-02-15 昆山立讯射频科技有限公司 功率分配器

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