EP1874982B1 - Method for electrodeposition of bronzes - Google Patents

Method for electrodeposition of bronzes Download PDF

Info

Publication number
EP1874982B1
EP1874982B1 EP06750231.0A EP06750231A EP1874982B1 EP 1874982 B1 EP1874982 B1 EP 1874982B1 EP 06750231 A EP06750231 A EP 06750231A EP 1874982 B1 EP1874982 B1 EP 1874982B1
Authority
EP
European Patent Office
Prior art keywords
thioether
electrolyte
tin
thiobis
ion concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP06750231.0A
Other languages
German (de)
French (fr)
Other versions
EP1874982A1 (en
EP1874982A4 (en
Inventor
Katrin Zschintzsch
Joachim Heyer
Marlies Kleinfeld
Stefan Schafer
Ortrud Steinius
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of EP1874982A1 publication Critical patent/EP1874982A1/en
Publication of EP1874982A4 publication Critical patent/EP1874982A4/en
Application granted granted Critical
Publication of EP1874982B1 publication Critical patent/EP1874982B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Definitions

  • This invention concerns a method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.
  • acid electrolytes and methods for deposition of qualitatively high grade tin or tin alloys with a higher deposition rate are known from EP 1 111 097 A2 and US 6,176,996 B1 .
  • electrolytes that contain at least two divalent metal salts of an organic sulfonic acid and from which are deposited solderable and corrosion resistant coatings that can be used, for example, as substitutes for lead-containing solderable coatings in electronics for manufacture of circuit boards, etc.
  • the invention is based on the task of providing a method for deposition of bronzes that, in contrast to the methods known from the prior art, enables uniform deposition of at least tin and copper side by side from an acid electrolyte at considerably higher deposition rates. Moreover, with this method firmly bonding and pore-free bronze coatings with high copper contents as well as various decorative and mechanical properties are said to be deposited.
  • an acid electrolyte that can have a high content of divalent copper ions, is stable with respect to oxidation-caused sludge formation, and is both economical and environmentally friendly when used over a long period of time, is to be made available.
  • the task is solved in accordance with the invention by a method of the kind mentioned at the start, which is characterized by the fact that an aromatic, nonionic wetting agent is added to the electrolyte.
  • the disadvantages known in the prior art are remedied with the offering of a new electrolyte composition and in this way considerably better deposition results are achieved.
  • the conduct of the method is made to be simpler and more economical.
  • This, too, is mainly based on the advantageous composition of the electrolyte.
  • the method is carried out at room temperature, or between 17 and 25°C, and the substrate to be coated is plated in a highly acid environment at a pH ⁇ 1.
  • the electrolyte is particularly stable in this temperature range.
  • there are no longer any costs for heating the electrolyte and the plated substrates also do not have to be cooled very much, with large expenditures of time and money.
  • deposition rates of 0.25 microns/min at a current density of 1 A/dm 2 are achieved due to, among other things, the pH value and the advantageous addition of at least one aromatic non-ionic wetting agent.
  • this rate can be raised up to 7 A/dm 2 in rack operation and even up to 120 A/dm 2 for continuous plants.
  • usable current densities in a range from 0.1-120 A/dm 2 are reached in each case according to plant type.
  • the wetting of the surfaces to be plated is considerably improved in particular through the addition of at least one nonionic wetting agent to the electrolyte.
  • nonionic wetting agent that is used is that because of the advantageous wetting properties the electrolyte and/or the substrate in the electrolyte need to be agitated only a little or even not at all, in order to achieve the desired deposition results, so that additional devices for agitation of the electrolyte can be omitted.
  • aromatic nonionic wetting agent because of the advantageous use of the aromatic nonionic wetting agent, electrolyte residues drain from the plated substrate better when it is removed from the electrolyte, which leads to reduced entrainment losses and thus to lower process costs.
  • the proposed method is therefore advantageously economical and environmentally friendly compared to the cyanide processes.
  • anionic and/or aliphatic nonionic wetting agent that is known from the prior art is also optionally possible, provided these wetting agents support or even enhance the advantageous effects of the aromatic nonionic wetting agent.
  • polyethylene glycols and/or anionic surfactants are preferably added to the electrolyte as anionic and/or aliphatic nonionic wetting agents.
  • Additional exemplary aliphatic nonionic wetting agents include aliphatic fatty alcohol ethoxylates, with compounds having from 13 to 15 carbon atoms (C-13 to C-15) being especially preferred.
  • the fatty alcohol ethoxylate is incorporated in a concentration of, for example, about 0.1 to 10 g/L; preferably about 0.5 to about 5 g/L.
  • concentration of, for example, about 0.1 to 10 g/L; preferably about 0.5 to about 5 g/L.
  • substituted dithioglycols act advantageously as wetting agents and brighteners. These compounds provide a source of sulphur which has a positive effect on copper plating. Therefore, the invention include substituted dithioglycols, such as, for example, those selected from the group consisting of:
  • the substituted dithioglycol in incorporated in a concentration of about 5 to about 100 mg/L; preferably about 10 to about 50 mg/L.
  • the method in accordance with the invention is characterized in particular by the special composition of the electrolyte. It contains essentially tin and copper ions, an alkylsulfonic acid and an aromatic nonionic wetting agent substituted dithioglycol brightener, and oxidation inhibitor.
  • stabilizers and/or complexing agents, anionic and/or nonionic, brighteners, and other metal salts can optionally be contained in the electrolyte.
  • the metals that are primarily added to the electrolyte for deposition of bronzes in accordance with the invention - tin and copper - can first and foremost be in the form of salts of alkylsulfonic acids, preferably as methanesulfonates, or as salts of mineral acids, preferably as sulfates.
  • Tin methanesulfonate is especially preferably used as tin salt in the electrolyte preferably in an amount of 5-195 g/L of electrolyte, preferably 11-175 g/L of electrolyte. This corresponds to a use of 2-75 g/L, preferably 4-57 g/L divalent tin ions.
  • Copper methanesulfonate is especially preferably used in the electrolyte as the copper salt, which is advantageously added to the electrolyte in an amount of 8-280 g/L of electrolyte, preferably 16-260 g/L of electrolyte. This corresponds to the use of 2-70 g/L, preferably 4-65 g/L divalent copper ions.
  • an acid preferably a mineral and/or an alkylsulfonic acid
  • an acid is added to the electrolyte in amounts of 140-382 g/L of electrolyte, preferably 175-245 g/L of electrolyte.
  • methanesulfonic acid turned out to be especially advantageous, since for one thing this produces advantageous solubility of metal salts and for another, because of its acid strength, it produces or facilitates the adjustment of the pH needed for the process.
  • methanesulfonic acid has the advantageous property of contributing considerably to the stability of the bath.
  • At least one additional metal and/or chloride is added to the electrolyte.
  • the metals are in the form of their soluble salts.
  • the addition of zinc and/or bismuth has a considerable effect on the properties of the deposited coatings.
  • the metals zinc and/or bismuth added to the electrolyte can namely be in the form of salts of alkylsulfonic acids, preferably as methanesulfonates or as salts of mineral acids, preferably as sulfates.
  • Zinc sulfate is especially preferably uses in the electrolytes as zinc salt, and is advantageously added in an amount of 0-25 g/L of electrolyte, preferably 15-20 g/L of electrolyte.
  • Bismuth methane sulfate is especially preferably used in the electrolyte as bismuth salt and is advantageously added to the electrolyte in an amount of 0-5 g/L of electrolyte, preferably 0.05-0.2 g/L of electrolyte.
  • additives for example stabilizers and/or complexing agents, that are usually used in acid electrolytes for deposition of tin alloys can be added to the electrolyte.
  • Gluconates are advantageously added to the electrolyte and stabilizers and/or complexing agents.
  • the concentration of the stabilizers and/or complexing agents is 0-50 g/L of electrolyte, preferably 20-30 g/L of electrolyte.
  • Compounds from the class of the dihydroxybenzenes, for example mono- or polyhydroxyphenyl compounds like pyrocatechol or phenolsulfonic acid are preferably used as oxidation inhibitors.
  • the concentration of oxidation inhibitors is 0-5 g/L of electrolyte.
  • Sodium hypophosphite is optionally used as an additional oxidation inhibitor.
  • the electrolyte contains hydroquinone as oxidation inhibitor.
  • the conduct of the method in accordance with the invention enables the deposition of bronzes onto various substrates.
  • all of the usual methods for making electronic components can be used.
  • especially hard and wear-resistant bronze coatings can be deposited on materials like bearings, etc., to the method in accordance with the invention.
  • the method in accordance with the invention is advantageously also used in the fields of decorative coating of, for example, fixtures and jewelry, etc., where the deposition of multi-component alloys that contain tin, copper, zinc and bismuth is particularly advantageous in these areas.
  • a really special advantage is that the so-called "true" bronzes that have a copper content >60% can be deposited with the method in accordance with the invention, where the copper content can be up to 95 wt% in each according to the desired properties.
  • the ratio of the amount of copper to the amount of tin in the electrolyte has a considerable effect of properties like hardness and color of the bronze coatings. For instance, at a tin/copper ratio of 40/60 silver-colored coatings, the so-called white bronzes, which are relatively soft, are deposited.
  • the invention is effective for forming white bronze deposits having a tin/copper weight ratio of about 40/60 or less, yellow bronze deposits having a tin/copper weight ratio of about 20/80 or less, and even red bronze deposits having a tin/copper weight ratio of about 10/90 or less.
  • the electrolyte contains brighteners from the class of the aromatic carbonyl compounds and/or ⁇ , ⁇ -unsaturated carbonyl compounds.
  • the concentration of brighteners is 0-5 g/L of electrolyte.
  • Electrolyte composition :
  • the base electrolyte of the highly acid electrolyte in accordance with the invention contains essentially (per liter of electrolyte)
  • electrolyte per liter of electrolyte
  • the electrolyte is prepared by varying the individual components, as given below as a matter of example. Additional information about the corresponding process conditions as well as other properties of the individual coatings can be seen in Table 1. Examples 1 to 8 are comparative examples only and are not a subject of the claimed invention.
  • Example No. Coating/Amounts in wt% Properties of coating Sn Cu Zn Bi Hardness Ductility Gloss Color 1 10 90 - - 180 HV 50 ++ Yes Red 2a 20 80 - - 283 Hvso ⁇ Yes Yellow 2b 20 80 - - 317 HV 50 ⁇ Yes Yellow 3 40 60 - - 360 HV 50 ⁇ Yes White 4 90 10 - - - - No White 5 20 80 ⁇ 1 - - +++ Yes Yellow 6 20 80 - ⁇ 1 345 HV 50 - Yes Yellow 7 20 80 ⁇ 1 - - ++ Yes Yellow
  • Electrolytic coating was performed on a copper plated brass substrate at 25 C and a current density of 1.2 A/dm 2 with soluble bronze (60Cu/40Sn) anodes for 8 minutes to a thickness of 3 microns. Ductility was acceptable; uniformity was good; hardness was 350 HV25; gloss was very good. The specimens passed a thio acetimide tarnish resistance test (storage 4 hours at 180 C).

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

    FIELD OF THE INVENTION
  • This invention concerns a method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.
  • BACKGROUND OF THE INVENTION
  • Methods for deposition of tin and tin alloys on the basis of various types of electrolytes are known from the prior art and are already widely used in practice. Methods for deposition of tin and/or tin alloys from cyanide electrolytes are very common. Such electrolytes, however, are highly toxic, which makes their use problematic from the environmental standpoint, so that for some years there has been a push to develop cyanide-free electrolytes, for example electrolytes based on pyrophosphates or oxalates, which operate in a pH region of 5-9. However, such methods have both economic and technical disadvantages, of which the relatively slow deposition rates may be mentioned here.
  • For these reasons development is currently going mostly in the direction of making available methods for deposition of tin and/or tin alloys from acid electrolytes, since, for one thing, divalent tin can be very easily reduced to metallic tin in acid electrolytes, which leads to better deposition rates while having qualitatively equivalent coatings, and for another the disadvantageous effect of alkaline electrolytes on substrates, for example ceramic structural elements, is prevented by this.
  • Thus, acid electrolytes and methods for deposition of qualitatively high grade tin or tin alloys with a higher deposition rate are known from EP 1 111 097 A2 and US 6,176,996 B1 . These are electrolytes that contain at least two divalent metal salts of an organic sulfonic acid and from which are deposited solderable and corrosion resistant coatings that can be used, for example, as substitutes for lead-containing solderable coatings in electronics for manufacture of circuit boards, etc.
  • However, such methods have their limits in the deposition of tin-copper alloys with high copper contents, such as the so-called "true" bronzes, which have a copper content of at least 10%. For example, due to the high difference of potential between tin and copper higher rates of oxidation of the divalent tin can occur, due to which it very easily becomes oxidized to tetravalent tin in acid electrolytes. However, in this form tin can no longer be electrolytically deposited in an acid and thus is withdrawn from the process, which leads to uneven deposition of the two metals and to a decrease of the deposition rate. In addition, oxidation to tetravalent tin leads to increased sludge formation, which can prevent stable operation and long lifetime of the acid electrolyte. Moreover, because of such contaminated of a firmly bonding and pore-free coating is no longer guaranteed.
    Because of such technical process disadvantages, there is currently no large area of use for electrolytically deposited bronze coatings. Occasionally bronze coatings are used in the jewelry industry as a substitute for expensive silver or allergy-triggering nickel. In the same way methods for electrodeposition of bronzes are also gaining importance in some technical fields, for example in electronics for coating electronic components or in mechanical engineering and/or in process technology for coating bearing overlays and friction layers. However, in this case mainly white bronzes or the so-called "false bronzes," whose copper content can be kept quite low due to process conditions, are deposited as nickel substitutes.
  • SUMMARY OF THE INVENTION
  • Therefore, the invention is based on the task of providing a method for deposition of bronzes that, in contrast to the methods known from the prior art, enables uniform deposition of at least tin and copper side by side from an acid electrolyte at considerably higher deposition rates. Moreover, with this method firmly bonding and pore-free bronze coatings with high copper contents as well as various decorative and mechanical properties are said to be deposited.
  • In addition, an acid electrolyte that can have a high content of divalent copper ions, is stable with respect to oxidation-caused sludge formation, and is both economical and environmentally friendly when used over a long period of time, is to be made available.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The task is solved in accordance with the invention by a method of the kind mentioned at the start, which is characterized by the fact that an aromatic, nonionic wetting agent is added to the electrolyte.
  • With this invention a method for electrodeposition of bronzes according to claim 1 is made available.
  • Through the method in accordance with the invention the disadvantages known in the prior art are remedied with the offering of a new electrolyte composition and in this way considerably better deposition results are achieved. Moreover, the conduct of the method is made to be simpler and more economical. This, too, is mainly based on the advantageous composition of the electrolyte. For example, the method is carried out at room temperature, or between 17 and 25°C, and the substrate to be coated is plated in a highly acid environment at a pH <1. The electrolyte is particularly stable in this temperature range. In addition, there are no longer any costs for heating the electrolyte and the plated substrates also do not have to be cooled very much, with large expenditures of time and money. Moreover, deposition rates of 0.25 microns/min at a current density of 1 A/dm2 are achieved due to, among other things, the pH value and the advantageous addition of at least one aromatic non-ionic wetting agent. By increasing the metal content this rate can be raised up to 7 A/dm2 in rack operation and even up to 120 A/dm2 for continuous plants. Thus, usable current densities in a range from 0.1-120 A/dm2 are reached in each case according to plant type.
  • Surprisingly, the wetting of the surfaces to be plated, above all those of more complex substrates, is considerably improved in particular through the addition of at least one nonionic wetting agent to the electrolyte. This advantageously has the result that not only are the considerably higher deposition rates achieved through the use of the method in accordance with the invention, but moreover the coatings produced by the method are uniform and qualitatively high grade, have very good adhesion and are generally pore-free.
  • Another advantage of the nonionic wetting agent that is used is that because of the advantageous wetting properties the electrolyte and/or the substrate in the electrolyte need to be agitated only a little or even not at all, in order to achieve the desired deposition results, so that additional devices for agitation of the electrolyte can be omitted. In addition, because of the advantageous use of the aromatic nonionic wetting agent, electrolyte residues drain from the plated substrate better when it is removed from the electrolyte, which leads to reduced entrainment losses and thus to lower process costs.
  • The addition of 2-40 g/L of one or more aromatic nonionic wetting agents is especially advantageous, with beta-naphthol ethoxylate and/or nonylphenol ethoxylate are especially preferred. Also preferred is sulfopropylated polyalkoxylated naphthol, potassium salt.
  • The proposed method is therefore advantageously economical and environmentally friendly compared to the cyanide processes.
  • The additional or alternative use of one or more anionic and/or aliphatic nonionic wetting agent that is known from the prior art is also optionally possible, provided these wetting agents support or even enhance the advantageous effects of the aromatic nonionic wetting agent. In this regard polyethylene glycols and/or anionic surfactants are preferably added to the electrolyte as anionic and/or aliphatic nonionic wetting agents. Additional exemplary aliphatic nonionic wetting agents include aliphatic fatty alcohol ethoxylates, with compounds having from 13 to 15 carbon atoms (C-13 to C-15) being especially preferred. In one embodiment, the fatty alcohol ethoxylate is incorporated in a concentration of, for example, about 0.1 to 10 g/L; preferably about 0.5 to about 5 g/L. These compounds work as emulsifiers for the degradation products of the nonionic wetting agent, and improve uniformity and brightness in combination with the wetting agent and brightener system.
  • It has also been discovered that substituted dithioglycols act advantageously as wetting agents and brighteners. These compounds provide a source of sulphur which has a positive effect on copper plating. Therefore, the invention include substituted dithioglycols, such as, for example, those selected from the group consisting of:
    1. (1) Thiobis(diethyleneglycol)represented by H- (OCH2CH2)2-S-(CH2CH2O)2-H,
    2. (2) Thiobis(hexaethylene glycol),
    3. (3) Thiobis(pentadecaglycelol)represented by H-(OCH2CH(OH)CH2)15-S-(CH2CH(OH)CH2O)15-H,
    4. (4) Thiobis(icosaethyleneglycol) represented by H- (OCH2CH2)20-S-(CH2CH2O)20-H,
    5. (5) Thiobis(pentacontaethyleneglycol),
    6. (6) 4,10-dioxa-7-thiatridecane-2,12-diol represented by HO-CH(CH3)CH2-OCH2CH2-SCH2CH2-OCH2CH(CH3)-OH,
    7. (7) Thiodiglycerin represented by HOCH2CH (OH) CH2-S-CH2CH (OH) CH2OH,
    8. (8) Thiobis(triglycerin) represented by H- (OCH2CH (OH)CH2)3 -S- (CH2CH (OH) CH2O)-H,
    9. (9) 2,2'-thiodibutanolbis(octaethyleneglycolpentaglycerol) ether represented by H-(OCH2CH(OH)CH2)5-(OCH2CH2)8-OC4H8-SC4H8-O-(CH2CH2O)8- (CH2CH (OH) CH2O) -H,
    10. (10) Thiobis(octaethyleneglycol)bis(2-chloroethyl)ether represented by Cl-CH2CH2CH2- (OCH2CH2)8-S-(CH2CH2O)8-CH2CH2CH2-Cl,
    11. (11) Thiobis(decaethyleneglycol)bis(carboxymethyl)ether,
    12. (12) Thiobis(dodecaethyleneglycol)bis(2-nitroethyl)ether,
    13. (13) Thiodiglycolbis(carboxymethyl)ether represented by HOOCCH2OCH2CH2-S-CH2CH2OCH2COOH,
    14. (14) Dithiodiglycolbis(carboxymethyl)ether represented by HOOCCH2OCH2CH2- S - S - CH2CH2OCH2COOH,
    15. (15) Thiobis(dodecaethyleneglycol) represented by H- (OCH2CH2)12-S-(CH2CH2O)12-H,
    16. (16) Dithiobis(hentetracontaethyleneglycol) represented by H-(OCH2CH2)41-S-S-(CH2CH2O)41-H,
    17. (17) Dithiobis(icosaethyleneglycolpentapropyleneglycol) represented by H-(OC3H6)5-(OC2H4)20-S-S-(OC2H4)20-(OC3H6)5-H,
    18. (18) Dithiobis(triglycerol) represented by H-(OCH2CH(OH)CH2)3-S-S-(CH2CH(OH)CH2O)3-H,
    19. (19) Dithiobis(decaglycelol),
    20. (20) 3,6-Dithiaoctane-1,8-diol represented by HOCH2CH2S-CH2CH2-SCH2CH2OH (also 2,2'-(Ethylenedithio)diethanol),
    21. (21) 1,3-Propanedithiolbis(decaethyleneglycol)thioether represented by H- (OC2H4) 10-S-C3H6-S-(OC2H4)10-H,
    22. (22) 1,4-Buthanedithiolbis(pentadecaglycerol)thioether represented by H-(OCH2CH(OH)CH2)15-S-C4H8-S-(CH2CH(OH)CH2O)15-H,
    23. (23) 1,3-Dithioglycerolbis(pentaethyleneglycol)thioether represented by H-(OCH2CH2)5-SCH2CH(OH)CH2S-(CH2CH2O)5-H,
    24. (24) 1,2-Ethanedithiolbis(penta(1-ethyl)ethyleneglycol)thioether represented by H-(OCH(C2H5)CH2)5-SC2H4S-(CH2CH(C2H5)O)5-H,
    25. (25) 1,3-Dithioglycerolbis(di(1-ethyl)ethyleneglycol)thioether represented by H- (OCH (CH3) CH2)2-SCH2CH(OH)CH2S-(CH2CH (CH3) O)2-H,
    26. (26) 2-Mercaptoethylsulfide bis(hexatriacontaethylene-glycol) represented by H-(OC2H4)18-SC2H4-SC2H4-S-(C2H4O)18-H,
    27. (27) 2-Mercaptoethylsulfidebis(icosaethyleneglycol)dimethylether represented by CH3- (OC2H4)10-SC2H4-SC2H4-S-(C2H4O)10-CH3,
    28. (28) 2-Mercaptoethyletherbis(diethyleneglycol) represented by H-(OC2H4)2-S-CH2CH2OCH2CH2-S-(C2H4O)2-H,
    29. (29) Thiodiglyceroltetra(decaethyleneglycol)ether represented by the above formula (6),
    30. (30) Diethyleneglycolmonomethylthioether represented by CH3-S-(CH2CH2O)2-H,
    31. (31) Decaglycerolmono(6-methylthiohexyl)thioether represented by CH3-S-C6H12-S-(CH2CH(OH)CH2O)10-H,
    32. (32) 2-Mercaptoethylsulfide-ω-{(2-bromoethyl)icosaethyleneglycol}thioethe r-ω'-{(2-bromoethyl)hectaethyleneglycol}thioether represented by BrCH2CH2-(OCH2CH2)20-(S-CH2CH2)3-(OCH2CH2)100-OCH2CH2Br,
    33. (33) 1,4-Butanediol-ω-{(2-benzyloxy-1-methyl)ethyl}thioether-ω'-(de capropyleneglycoloctacontaethyleneglycol)thioether represented by PhCH2OCH2CH(CH3)-S-C4H8-S-(CH2CH2O)80- (CH2CH(CH3)O)10-H,
    34. (34) Dithiobis(icosaethyleneglycol)bis(2-methyl-thioethyl)ether represented by CH3-S-CH2CH2-(OCH2CH2)20-S-S-(CH2CH2O)20-CH2CH2-S-CH3,
    35. (35) 1,2-Ethanediol-ω-(4-methoxybenzyl)thioether-ω'-(pentacontaethy leneglycol)thioether represented by CH3O-Ph-CH2S-CH2CH2-(CH2CH2O)50-H,
    36. (36) Triacontaethyleneglycolmono(4-cyanobenzyl)thioether represented by NC-Ph-CH2-S-(CH2CH20)30-H,
    37. (37) Thiobis(pentadecaethyleneglycol)bisallylether represented by CH2=CHCH2-(OCH2CH2)15-S-(CH2CH2O)15-CH2CH=CH2,
    38. (38) Tricosaethyleneglycolmono(4-formylphenetyl)thioether represented by OHC-Ph-CH2CH2-S-(CH2CH2O)23-H,
    39. (39) Pentadecaethyleneglycolmono{(acetylmethyl)thioethyl}thioether represented by CH3COCH2-S-CH2CH2-S-(CH2CH2)15-H,
    40. (40) 1,2-Ethanediol-ω-(glycidyl)thioether-ω'-icosaethyleneglycolthioether represented by
      Figure imgb0001
    41. (41) Octadecaethyleneglycolbis(2-methylthioethyl)ether represented by CH3-S-CH2CH2CO-(CH2CH2O)18-CH2CH2S-CH3,
    42. (42) Hexadecaethyleneglycolmono(2-methylthioethyl)thioether represented by CH3-S-CH2CH2-S-(CH2CH2O)16-H,
    43. (43) Icosaethyleneglycolmonomethylthioether represented by CH3-S-(CH2CH2O)20-H,
    44. (44) Undecaethyleneglycoldi(n-propyl)thioether represented by C3H7-S-(CH2CH2O)10-CH2CH2S-C3H7,
    45. (45) Dodecaethyleneglycolbis(2-hydroxyethyl)thioether represented by HOCH2CH2-S-(CH2CH2O)11-CH2CH2-S-CH2CH2OH,
    46. (46) Undecaethyleneglycoldimethylthioether,
    47. (47) Pentatriacontaethyleneglycolmono(2-n-butyldithioethyl)dithioether represented by C4H9-S-S-CH2CH2-S-S-(CH2CH2O)35-H,
    48. (48) 4,8,12-trithiapentadecane-1,2,6,10,14,15-hexaol represented by HOCH2CH(OH)CH2-S-CH2CH(OH)CH2-S-CH2CH(OH)CH2-S-CH2CH(OH) CH2OH,
    49. (49) Icosaglycerolmono(2-ethylthioethyl)thioether represented by C2H5-S-CH2CH2-S-(CH2CH (OH) CH2O)20-H,
    50. (50) Triacontaethyleneglycolmono(2-methylthioethyl)thioether represented by CH3-S-CH2CH2-S-(C2H4O)30-H,
    51. (51) Dithiobis(icosaethyleneglycol)dibenzylether represented by Ph-CH2-(OC2H4)20-S-S-(C2H4O)20-CH2-Ph,
    52. (52) Tridecaethyleneglycolmonomethylthioether represented by CH3-S-(CH2CH2O)10-H,
    53. (53) Hexadecaethyleneglycol dimethylthioether represented by CH3-S-(CH2CH2O)15-CH2CH2-S-CH3,
    54. (54) 1,2-Ethanedithiolbis(icosaethyleneglycol)thioether represented by H- (OCH2CH2)20-S-CH2CH2-S-(CH2CH2O)20-H,
    55. (55) Dithiobis(pentadecaethyleneglycol) represented by H-(OCH2CH2)15-S-S-(CH2CH2O)15-H, and
    56. (56) 3,3'-thiodipropanol represented by HO-CH2CH2CH2-S-CH2CH2CH2-OH. In the above-listed structural formulae, Ph represents a phenyl group.
  • In one embodiment, the substituted dithioglycol in incorporated in a concentration of about 5 to about 100 mg/L; preferably about 10 to about 50 mg/L.
  • As already mentioned above, the method in accordance with the invention is characterized in particular by the special composition of the electrolyte. It contains essentially tin and copper ions, an alkylsulfonic acid and an aromatic nonionic wetting agent substituted dithioglycol brightener, and oxidation inhibitor. In addition, stabilizers and/or complexing agents, anionic and/or nonionic, brighteners, and other metal salts can optionally be contained in the electrolyte.
  • The metals that are primarily added to the electrolyte for deposition of bronzes in accordance with the invention - tin and copper - can first and foremost be in the form of salts of alkylsulfonic acids, preferably as methanesulfonates, or as salts of mineral acids, preferably as sulfates. Tin methanesulfonate is especially preferably used as tin salt in the electrolyte preferably in an amount of 5-195 g/L of electrolyte, preferably 11-175 g/L of electrolyte. This corresponds to a use of 2-75 g/L, preferably 4-57 g/L divalent tin ions. Copper methanesulfonate is especially preferably used in the electrolyte as the copper salt, which is advantageously added to the electrolyte in an amount of 8-280 g/L of electrolyte, preferably 16-260 g/L of electrolyte. This corresponds to the use of 2-70 g/L, preferably 4-65 g/L divalent copper ions.
  • Since the deposition is clearly higher in an acid environment, an acid, preferably a mineral and/or an alkylsulfonic acid, is added to the electrolyte in amounts of 140-382 g/L of electrolyte, preferably 175-245 g/L of electrolyte. The use of methanesulfonic acid turned out to be especially advantageous, since for one thing this produces advantageous solubility of metal salts and for another, because of its acid strength, it produces or facilitates the adjustment of the pH needed for the process. In addition, methanesulfonic acid has the advantageous property of contributing considerably to the stability of the bath.
  • In accordance with an additional characteristic of the invention at least one additional metal and/or chloride is added to the electrolyte. Advantageously, the metals are in the form of their soluble salts. In particular, the addition of zinc and/or bismuth has a considerable effect on the properties of the deposited coatings. The metals zinc and/or bismuth added to the electrolyte can namely be in the form of salts of alkylsulfonic acids, preferably as methanesulfonates or as salts of mineral acids, preferably as sulfates. Zinc sulfate is especially preferably uses in the electrolytes as zinc salt, and is advantageously added in an amount of 0-25 g/L of electrolyte, preferably 15-20 g/L of electrolyte. Bismuth methane sulfate is especially preferably used in the electrolyte as bismuth salt and is advantageously added to the electrolyte in an amount of 0-5 g/L of electrolyte, preferably 0.05-0.2 g/L of electrolyte.
  • In addition, various additives; for example stabilizers and/or complexing agents, that are usually used in acid electrolytes for deposition of tin alloys can be added to the electrolyte.
  • In particular, the use of suitable compounds for stabilizing the electrolyte is an important condition for rapid as well as qualitative high grade deposition of bronzes. Gluconates are advantageously added to the electrolyte and stabilizers and/or complexing agents. Here in the method in accordance with the invention the preferred use of sodium gluconate turned out to be especially advantageous. The concentration of the stabilizers and/or complexing agents is 0-50 g/L of electrolyte, preferably 20-30 g/L of electrolyte. Compounds from the class of the dihydroxybenzenes, for example mono- or polyhydroxyphenyl compounds like pyrocatechol or phenolsulfonic acid are preferably used as oxidation inhibitors. The concentration of oxidation inhibitors is 0-5 g/L of electrolyte. Sodium hypophosphite is optionally used as an additional oxidation inhibitor. In one embodiment, the electrolyte contains hydroquinone as oxidation inhibitor.
  • The conduct of the method in accordance with the invention enables the deposition of bronzes onto various substrates. For example, all of the usual methods for making electronic components can be used. In the same way especially hard and wear-resistant bronze coatings can be deposited on materials like bearings, etc., to the method in accordance with the invention. The method in accordance with the invention is advantageously also used in the fields of decorative coating of, for example, fixtures and jewelry, etc., where the deposition of multi-component alloys that contain tin, copper, zinc and bismuth is particularly advantageous in these areas.
  • A really special advantage is that the so-called "true" bronzes that have a copper content >60% can be deposited with the method in accordance with the invention, where the copper content can be up to 95 wt% in each according to the desired properties. In addition, the ratio of the amount of copper to the amount of tin in the electrolyte has a considerable effect of properties like hardness and color of the bronze coatings. For instance, at a tin/copper ratio of 40/60 silver-colored coatings, the so-called white bronzes, which are relatively soft, are deposited. At a tin/copper ratio of 20/80 yellow gold colored coatings result, the so-called yellow bronzes, and at a tin/copper ratio of 10/90 red gold colored coatings are formed, the so-called red bronzes. As illustrated in the examples below, the invention is effective for forming white bronze deposits having a tin/copper weight ratio of about 40/60 or less, yellow bronze deposits having a tin/copper weight ratio of about 20/80 or less, and even red bronze deposits having a tin/copper weight ratio of about 10/90 or less.
  • Moreover, the deposition of high-tin white bronzes with a copper content = 10% is also possible.
  • In each case according to the desired appearance of the bronze coatings additives such as brighteners are added to the electrolyte, in addition to it having a varying copper content. Advantageously, the electrolyte contains brighteners from the class of the aromatic carbonyl compounds and/or α, β-unsaturated carbonyl compounds. The concentration of brighteners is 0-5 g/L of electrolyte.
  • Some preferred embodiments are presented below for illustration of the invention in more detail, but the invention is not limited to these embodiments.
  • Electrolyte composition:
  • The base electrolyte of the highly acid electrolyte in accordance with the invention contains essentially (per liter of electrolyte)
    • 2-75 g divalent tin,
    • 2-70 g divalent copper,
    • - 2-40 g of an aromatic nonionic wetting agent, and
    • 140-382 g of a mineral and/or alkylsulfonic acid.
  • Optionally, other components can be added to the electrolyte (per liter of electrolyte):
    • 0-10 g of an anionic and/or aliphatic nonionic wetting agent,
    • 0-50 g of a stabilizer and/or complexing agent,
    • 0-5 g of an oxidation inhibitor,
    • 0-5 g of a brightener
    • 0-5 trivalent bismuth
    • 0-25 g divalent zinc.
  • In order to achieve a specific color of the deposited bronze coatings the electrolyte is prepared by varying the individual components, as given below as a matter of example. Additional information about the corresponding process conditions as well as other properties of the individual coatings can be seen in Table 1. Examples 1 to 8 are comparative examples only and are not a subject of the claimed invention.
  • Example 1 (red bronze; comparative only)
    • 4 g/L Sn2+
    • 18 g/L Cu2+
    • 286 g/L methanesulfonic acid
    • 3 g/L aromatic nonionic wetting agent
    • 0.4 g/l aliphatic nonionic wetting agent
    • 2 g/L oxidation inhibitor
    • 20 mg/L complexing agent
    Example 2a (yellow bronze; comparative only)
    • 4 g/L Sn2+
    • 18 g/L Cu2+
    • 240 g/L methanesulfonic acid
    • 32.2 g/L aromatic nonionic wetting agent
    • 2 g/L oxidation inhibitor
    • 25 mg/L stabilizer/complexing agent
    Example 2b (yellow bronze; comparative only)
    • 4 g/L Sn2+
    • 18 g/L Cu2+
    • 286 g/L methanesulfonic acid
    • 32.2 g/L aromatic nonionic wetting agent
    • 6 mg/Lbrightener
    • 2 g/L oxidation inhibitor
    • 50 mg/L stabilizer/complexing agent
    Example 3 (white bronze; comparative only)
    • 5 g/L Sn2+
    • 10 g/L Cu2+
    • 240 g/L methanesulfonic acid
    • 32.2 g/L aromatic nonionic wetting agent
    • 6 mg/Lbrighteher
    • 2 g/L oxidation inhibitor
    • 25 mg/L stabilizer/complexing agent
    Example 4 (matte white bronze; comparative only)
    • 18 g/L Sn2+
    • 2 g/L Cu2+
    • 258 g/L methanesulfonic acid
    • 9 g/L aromatic nonionic wetting agent
  • To improve the hardness and/or ductility of the deposited bronze coatings the contents of zinc and/or bismuth indicated below as examples are added to the electrolyte. Additional data on the corresponding process conditions and other properties of the individual coatings can be seen in Table 1.
  • Example 5 (high ductility; comparative only)
    • 4 g/L Sn2+
    • 18 g/L Cu2+
    • 238 g/L methanesulfonic acid
    • 32.2 g/L aromatic nonionic wetting agent
    • 3 mg/Lbrightener
    • 2 g/L oxidation inhibitor
    • 25 mg/L stabilizer/complexing agent
    • 20 g/L ZnSO4
    Example 6 (hardness; comparative only)
    • 4 g/L Sn2+
    • 18 g/L Cu2+
    • 238 g/L methanesulfonic acid
    • 32.2 g/L aromatic nonionic wetting agent
    • 2 g/L oxidation inhibitor
    • 25 mg/L stabilizer/complexing agent
    • 0.1 g/L Bi3+
    Example 7 (yellow bronze; comparative only)
    • 14.5 g/L Sn2+
    • 65.5 g/L Cu2+
    • 382 g/L methanesulfonic acid
    • 32.2 g/L aromatic nonionic wetting agent
    • 4 g/L oxidation inhibitor
    • 25 mg/L stabilizer/complexing agent
    • 20 g/L ZnSO4
    Example 8 (yellow bronze; comparative only)
    • 2 g/L Sn2+
    • 8 g/L Cu2+
    • 400 g/L methanesulfonic acid
    • 2.5 g/L aromatic nonionic wetting agent
    • 1 g/L aliphatic fatty alcohol ethoxylate
    • 4 g/L oxidation inhibitor
    Example 9 (white bronze)
    • 4 g/L Sn2+
    • 8 g/L Cu2+
    • 400 g/L methanesulfonic acid
    • 1 g/L aromatic nonionic wetting agent
    • 40 mg/L substituted dithioglycol
    • 4 g/L oxidation inhibitor
  • With these exemplary electrolyte compositions coatings with specific properties were deposited under the process conditions listed in the following table.
    Example No. Coating/Amounts in wt% Properties of coating
    Sn Cu Zn Bi Hardness Ductility Gloss Color
    1 10 90 - - 180 HV50 ++ Yes Red
    2a 20 80 - - 283 Hvso ± Yes Yellow
    2b 20 80 - - 317 HV50 ± Yes Yellow
    3 40 60 - - 360 HV50 ± Yes White
    4 90 10 - - - - No White
    5 20 80 <1 - - +++ Yes Yellow
    6 20 80 - <1 345 HV50 - Yes Yellow
    7 20 80 <1 - - ++ Yes Yellow
  • Example 10 (white bronze)
    • 3 g/L Sn2+
    • 6 g/L Cu2+
    • 300 - 400 g/L methanesulfonic acid
    • 2 g/L aromatic nonionic wetting agent
    • 15-30 mg/L substituted dithioglycol
    • 4 g/L oxidation inhibitor
  • Electrolytic coating was performed on a copper plated brass substrate at 25 C and a current density of 1.2 A/dm2 with soluble bronze (60Cu/40Sn) anodes for 8 minutes to a thickness of 3 microns. Ductility was acceptable; uniformity was good; hardness was 350 HV25; gloss was very good. The specimens passed a thio acetimide tarnish resistance test (storage 4 hours at 180 C).
  • When introducing elements of the present invention or the preferred embodiment(s) thereof, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements. The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements.

Claims (19)

  1. A method for electrolytic deposition of bronze onto a substrate, the method comprising:
    immersing a substrate in an aqueous acidic electrolyte having a pH of less than 1 and containing:
    a) tin ions;
    b) copper ions;
    c) methanesulfonic acid;
    d) an aromatic non-ionic wetting agent;
    e) a substituted dithioglycol brightener; and
    f) an oxidation inhibitor;
    wherein a ratio of tin ion concentration to copper ion concentration is sufficient to electrolytically deposit a bronze comprising at least 60% by weight Cu; and
    electrodepositing onto said substrate bronze comprising at least 60% by weight Cu, wherein said electrodepositing occurs by passing current through a copper-tin anode and the substrate
  2. The method of claim 1 wherein the copper ions are present in a concentration of 4-65 g/L, and wherein the substituted dithioglycol brightener is present in the composition in a concentration of 10-50 mg/L.
  3. The method of claim 1 wherein the electrolyte further contains a dihydroxybenzene compound as an oxidation inhibitor.
  4. The method of claim 1 wherein the non-ionic wetting agent is present in the electrolyte at a concentration of from 2 to 40 g/L.
  5. The method of any one of claims 1 through 4 wherein tin methanesulfonate is present in the electrolyte in an amount of from 5 to 195 g/L of electrolyte, thereby providing the tin ions at a concentration of from 2 to 75 g/L of electrolyte.
  6. The method of any one of claims 1 through 5 wherein copper methanesulfonate is present in the electrolyte in an amount of from 16 to 260 g/L of electrolyte, thereby providing the copper ions at a concentration of from 4 to 65 g/L of electrolyte.
  7. The method of any one of claims 1 through 6 wherein the substituted dithioglycol is selected from the group consisting of Thiobis(diethyleneglycol), Thiobis(hexaethylene glycol), Thiobis(pentadecaglycelol), Thiobis(icosaethyleneglycol), Thiobis(pentacontaethyleneglycol), 4,10-dioxa-7-thiatridecane-2,12-diol, Thiodiglycerin, Thiobis(triglycerin), 2,2'-thiodibutanolbis(octaethyleneglycolpentaglycerol) ether, Thiobis(octaethyleneglycol)bis(2-chloroethyl)ether, Thiobis(decaethyleneglycol)bis(carboxymethyl)ether, Thiobis(dodecaethyleneglycol)bis(2-nitroethyl)ether, Thiodiglycolbis(carboxymethyl)ether, Dithiodiglycolbis(carboxymethyl)ether, Thiobis(dodecaethyleneglycol), Dithiobis(hentetracontaethyleneglycol), Dithiobis(icosaethyleneglycolpentapropyleneglycol), Dithiobis(triglycerol), Dithiobis(decaglycelol), 3,6-Dithiaoctane-1,8-diol, 1,3-Propanedithiolbis(decaethyleneglycol)thioether, 1,4-Butanedithiolbis(pentadecaglycerol)thioether, 1,3-Dithioglycerolbis(pentaethyleneglycol)thioether, 1,2-Ethanedithiolbis(penta(1-ethyl)ethyleneglycol)thioether, 1,3-Dithioglycerolbis(di(1-ethyl)ethyleneglycol)thioether, 2-Mercaptoethylsulfide bis(hexatriacontaethylene-glycol), 2-Mercaptoethylsulfidebis(icosaethyleneglycol)di-methylether,2-Mercaptoethyletherbis(diethyleneglycol), Thiodiglyceroltetra(decaethyleneglycol)ether, Diethyleneglycolmonomethylthioether, Decaglycerolmono(6-methylthiohexyl)thioether, 2-Mercaptoethylsulfide-ω-{(2-bromoethyl) icosaethyleneglycol}thioether-ω'-{(2-bromoethyl) hectaethyleneglycol}thioether, 1,4-Butanediol-ω-{(2-benzyloxy-1-methyl)ethyl}thioether-ω'-(de capropyleneglycoloctacontaethyleneglycol)thioether, Dithiobis(icosaethyleneglycol)bis(2-methyl-thioethyl)ether, 1,2-Ethandiol-ω-(4-methoxybenzyl)thioether-ω'-(pentacontaethy leneglycol)thioether, Triacontaethyleneglycolmono(4-cyanobenzyl)thioether, Thiobis(pentadecaethyleneglycol)bisallyether, Tricosaethyleneglycolmono(4-formylphenetyl)thioether, Pentadecaethyleneglycolmono{(acetylmethyl)thioethyl}thioether, 1,2-Ethanediol-ω-(glycidyl)thioether-ω'-icosaethyleneglycolthioether, Octadecaethyleneglycolbis(2-methylthioethyl)ether, Hexadecaethyleneglycolmono(2-methylthioethyl)thioether, Icosaethyleneglycolmonomethylthioether, Undecaethyleneglycoldi(n-propyl)thioether, Dodecaethyleneglycolbis(2-hydroxyethyl)thioether, Undecaethyleneglycoldimethylthioether, Pentatriacontaethyleneglycolmono(2-nbutyldithioethyl) dithioether, 4,8,12-trithiapentadecane-1,2,6,10,14,15-hexaol, Icosaglycerolmono(2-ethylthioethyl)thioether, Triacontaethyleneglycolmono(2-methylthioethyl)thioether, Dithiobis(icosaethyleneglycol)dibenzylether, Tridecaethyleneglycolmonomethylthioether, Hexadecaethyleneglycol dimethylthioether, 1,2-Ethanedithiolbis(icosaethyleneglycol)thioether, Dithiobis(pentadecaethyleneglycol), 3,3'-thiodipropanol, and combinations thereof.
  8. The method of any one of claims 1 through 7 wherein said aqueous acidic electrolyte further contains a gluconate.
  9. The electrolyte method of any one of claims 1 through 8 wherein said aqueous acidic electrolyte further contains hydroquinone.
  10. A method according to claim 1 for electrolytic deposition of bronze onto a substrate, the method comprising:
    immersing a substrate in an aqueous acidic electrolyte having a pH of less than 1 and containing:
    a) tin ions;
    b) copper ions in a concentration of 4 - 65 g/L;
    c) methanesulfonic acid in a concentration between 140 g/L and 382 g/L;
    d) a nonionic wetting agent in a concentration from 2 g/L to 40 g/L which is an aromatic, non-ionic wetting agent;
    e) a substituted dithioglycol brightener; and
    f) an oxidation inhibitox;
    wherein a ratio of tin ion concentration to copper ion concentration is sufficient to electrolytically deposit a bronze comprising at least 60% by weight Cu; and
    electrodepositing onto said substrate bronze comprising at least 60% by weight Cu.
  11. The method of any one of claims 1 through 10 wherein the ratio of tin ion concentration to copper ion concentration is sufficient to electrolytically deposit a bronze comprising at least 80% by weight Cu.
  12. The method of any one of claims 1 through 10 wherein the ratio of tin ion concentration to copper ion concentration is sufficient to electrolytically deposit a bronze comprising at least 90% by weight Cu.
  13. The method of any one of claims 1 through 10 wherein the substrate is a decorative article.
  14. The method of any one of claims 1 through 10 wherein the ratio of tin ion concentration to copper ion concentration is 40/60.
  15. The method of any one of claims 1 through 10 wherein the ratio of tin ion concentration to copper ion concentration is 20/80.
  16. The method of any one of claims 1 through 10 wherein the ratio of tin ion concentration to copper ion concentration is 10/90.
  17. The method of any one of claims 1 through 10 the aromatic, non-ionic wetting agent is a β-naphthol ethoxylate.
  18. The method of anyone of claims 1 through 10 wherein the substituted dithioglycol brightener is present in the composition at a concentration of 40 mg/L.
  19. The method of claim 11 wherein said aqueous acidic electrolyte consisting essentially only of the stated components.
EP06750231.0A 2005-04-14 2006-04-14 Method for electrodeposition of bronzes Expired - Lifetime EP1874982B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/105,947 US20060260948A2 (en) 2005-04-14 2005-04-14 Method for electrodeposition of bronzes
PCT/US2006/014141 WO2006113473A1 (en) 2005-04-14 2006-04-14 Method for electrodeposition of bronzes

Publications (3)

Publication Number Publication Date
EP1874982A1 EP1874982A1 (en) 2008-01-09
EP1874982A4 EP1874982A4 (en) 2011-07-27
EP1874982B1 true EP1874982B1 (en) 2014-05-07

Family

ID=37115474

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06750231.0A Expired - Lifetime EP1874982B1 (en) 2005-04-14 2006-04-14 Method for electrodeposition of bronzes

Country Status (7)

Country Link
US (1) US20060260948A2 (en)
EP (1) EP1874982B1 (en)
JP (1) JP2008537017A (en)
KR (1) KR101361431B1 (en)
CN (1) CN101194049B (en)
TW (1) TWI391534B (en)
WO (1) WO2006113473A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2531163T3 (en) * 2002-10-11 2015-03-11 Enthone Procedure and electrolyte for galvanic deposition of bronzes
DE102004041701A1 (en) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Process for the electrolytic deposition of metals
US7296370B2 (en) * 2004-09-24 2007-11-20 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
US9263609B2 (en) * 2006-05-24 2016-02-16 Atotech Deutschland Gmbh Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell
DE102011008836B4 (en) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Electrolyte and method for depositing copper-tin alloy layers
US8426241B2 (en) 2010-09-09 2013-04-23 International Business Machines Corporation Structure and method of fabricating a CZTS photovoltaic device by electrodeposition
CN102605394B (en) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 Cyanogen-free acidic cupronickel-tin plating solution
JP6101510B2 (en) * 2013-02-18 2017-03-22 株式会社シミズ Non-cyanide copper-tin alloy plating bath
US8945978B2 (en) * 2013-06-28 2015-02-03 Sunpower Corporation Formation of metal structures in solar cells
KR20160094385A (en) 2013-12-05 2016-08-09 허니웰 인터내셔날 인코포레이티드 STANNOUS METHANSULFONATE SOLUTION WITH ADJUSTED pH
US10155894B2 (en) 2014-07-07 2018-12-18 Honeywell International Inc. Thermal interface material with ion scavenger
CA2957587C (en) * 2014-08-08 2019-03-05 Okuno Chemical Industries Co., Ltd. Copper-tin alloy plating bath
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
CN107250317A (en) 2014-12-05 2017-10-13 霍尼韦尔国际公司 High performance thermal interface material with low thermal resistance
CN107771227B (en) * 2015-04-20 2019-04-02 埃托特克德国有限公司 Electrolytic copper plating bath composition and usage thereof
CA2989621A1 (en) * 2015-06-16 2016-12-22 3M Innovative Properties Company Plating bronze on polymer sheets
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
MX393621B (en) 2016-03-08 2025-03-24 Honeywell Int Inc PHASE CHANGE MATERIAL.
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
CN108103540B (en) * 2018-01-24 2020-01-07 永星化工(上海)有限公司 Tin alloy electroplating solution
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
CN112236548B (en) * 2018-07-27 2022-03-04 三菱综合材料株式会社 Tin alloy plating solution
JP6645609B2 (en) 2018-07-27 2020-02-14 三菱マテリアル株式会社 Tin alloy plating solution
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2854388A (en) * 1955-03-14 1958-09-30 City Auto Stamping Co Electrodeposition of copper-tin alloys
US2916423A (en) * 1957-06-19 1959-12-08 Metal & Thermit Corp Electrodeposition of copper and copper alloys
DE3339541C2 (en) * 1983-11-02 1986-08-07 Degussa Ag, 6000 Frankfurt Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings
DE3934866A1 (en) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech METHOD FOR DEPOSITING LEAD AND LEAD-CONTAINING LAYERS, ELECTROLYTE FOR CARRYING OUT THE METHOD AND USE OF SURFACTANTS IN ACID LEAD ELECTROLYTE
JP2901292B2 (en) * 1989-12-05 1999-06-07 住友ゴム工業 株式会社 Bead wire for rubber coated tire and tire using the same
DE4336664A1 (en) * 1993-10-27 1995-05-04 Demetron Gmbh Workpieces made of non-corrosion-resistant metals with coatings applied using the PVD process
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP4359907B2 (en) * 1999-08-11 2009-11-11 石原薬品株式会社 Tin-copper alloy plating bath
JP3433291B2 (en) * 1999-09-27 2003-08-04 石原薬品株式会社 Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film
JP2001107287A (en) * 1999-10-07 2001-04-17 Ebara Udylite Kk Sn-Cu alloy plating bath
JP2001181889A (en) * 1999-12-22 2001-07-03 Nippon Macdermid Kk Bright tin-copper alloy electroplating bath
JP2001234387A (en) * 2000-02-17 2001-08-31 Yuken Industry Co Ltd Whisker generation inhibitor and method for preventing tin-based electroplating
EP1325175B1 (en) * 2000-09-20 2005-05-04 Dr.Ing. Max Schlötter GmbH &amp; Co. KG Electrolyte and method for depositing tin-copper alloy layers
KR20020073434A (en) * 2001-03-16 2002-09-26 쉬플리 캄파니, 엘.엘.씨. Tin plating
JP3876383B2 (en) * 2002-06-03 2007-01-31 京都市 Copper-tin alloy plating bath and copper-tin alloy plating method using the plating bath
ES2531163T3 (en) * 2002-10-11 2015-03-11 Enthone Procedure and electrolyte for galvanic deposition of bronzes
KR20040073974A (en) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. Electroplating composition

Also Published As

Publication number Publication date
TWI391534B (en) 2013-04-01
KR20070120600A (en) 2007-12-24
CN101194049A (en) 2008-06-04
CN101194049B (en) 2011-12-07
KR101361431B1 (en) 2014-02-10
US20060260948A2 (en) 2006-11-23
EP1874982A1 (en) 2008-01-09
JP2008537017A (en) 2008-09-11
EP1874982A4 (en) 2011-07-27
WO2006113473A1 (en) 2006-10-26
TW200702498A (en) 2007-01-16
US20050263403A1 (en) 2005-12-01

Similar Documents

Publication Publication Date Title
US20060260948A2 (en) Method for electrodeposition of bronzes
US20060137991A1 (en) Method for bronze galvanic coating
CN102016130B (en) Modified copper-tin electrolyte and method of depositing bronze layers
US9145617B2 (en) Adhesion promotion of cyanide-free white bronze
US6165342A (en) Cyanide-free electroplating bath for the deposition of gold and gold alloys
CN102089466B (en) Improved copper-tin electrolyte and method for depositing bronze layers
KR20090063146A (en) Bronze electroplating
JPS6362595B2 (en)
JPS6254397B2 (en)
ES2221374T3 (en) DUCTILITY AGENTS FOR TUNGSTEN NICKEL ALLOYS.
CN103069054B (en) For depositing electrolyte and the method for copper-tin alloy layers
US4605474A (en) Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings
US20040195107A1 (en) Electrolytic solution for electrochemical deposition gold and its alloys
US11643742B2 (en) Silver/tin electroplating bath and method of using the same
EP3178969B1 (en) Copper-tin alloy plating bath
JPS6141999B2 (en)
US3440151A (en) Electrodeposition of copper-tin alloys
GB2167447A (en) Cyanide free copper plating process
US4565611A (en) Aqueous electrolytes and method for electrodepositing nickel-cobalt alloys
US20120003498A1 (en) Copper-zinc alloy electroplating bath and method of plating using same

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20071025

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20110624

17Q First examination report despatched

Effective date: 20120224

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20140107

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 666787

Country of ref document: AT

Kind code of ref document: T

Effective date: 20140515

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602006041478

Country of ref document: DE

Effective date: 20140626

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 666787

Country of ref document: AT

Kind code of ref document: T

Effective date: 20140507

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20140507

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140907

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140808

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140908

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602006041478

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20150210

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602006041478

Country of ref document: DE

Effective date: 20150210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150414

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20150414

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150414

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150430

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150430

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150414

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 12

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20060414

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140507

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 13

P01 Opt-out of the competence of the unified patent court (upc) registered

Free format text: CASE NUMBER: UPC_APP_327740/2023

Effective date: 20230524

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20250319

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20250319

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20250319

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 602006041478

Country of ref document: DE