EP1832340B1 - Process and device for partial surface treatment of a component by low pressure plasma generated in a vacuum chamber - Google Patents
Process and device for partial surface treatment of a component by low pressure plasma generated in a vacuum chamber Download PDFInfo
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- EP1832340B1 EP1832340B1 EP06090034A EP06090034A EP1832340B1 EP 1832340 B1 EP1832340 B1 EP 1832340B1 EP 06090034 A EP06090034 A EP 06090034A EP 06090034 A EP06090034 A EP 06090034A EP 1832340 B1 EP1832340 B1 EP 1832340B1
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- Prior art keywords
- reaction chamber
- opening
- miniaturized
- plasma
- plasma reactor
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
Definitions
- the invention relates to a method for partially treating the surface of at least one component with low-pressure plasma, which is to be generated in at least one reactor chamber provided with an opening, wherein the opening of the reactor chamber is closed and the reactor chamber is then evacuated and filled with a process gas, the through Energy input into the reactor chamber in this is ionized to form the low-pressure plasma and brought to act on the part of the component surface to be treated.
- the invention furthermore relates to a device for partially treating the surface of a component with low-pressure plasma, which has at least one closable reaction chamber provided with an opening, which is connected to a vacuum pump and a process gas container via lines each having a valve device, from or to the reaction chamber to be evacuated or to be filled with the process gas, and on the outside of a plasma generator is provided by means of which is filled in the evacuated reaction chamber process gas to form the low pressure plasma in the reaction chamber to ionize, so that the ionized process gas to a part to be treated Component surface can act
- a vacuum seal provided on the wall of the reactor chamber surrounds the opening.
- an RF electrode provided on the inner surface of the chamber wall is used, the plasma within
- a vacuum pump, an RF generator and a plasma source are arranged in a control console, which are connected via respective supply lines to the reactor chamber, which manually or by means of a Robot can be placed at various points of the component surface for the treatment of the opening of the chamber each occluding part of the component surface
- the opening of the process bell is sealingly closed by the part of the surface of the component to be treated, whereupon the process bell is evacuated and the ionized particles of the process gas are evacuated from the vacuum chamber
- This communicating flexible supply line led into the process bell and brought in this on the treating part of the component surface to act after completion of the treatment of the corresponding part of Bauateiloberf
- the task is to cancel the evacuation of the process bell before the process bell can be moved to another position of the component surface for its further local treatment, which is relatively time-consuming.
- the aim of the invention is therefore a location-flexible time and cost-effective treatment of local areas of component surfaces with low-pressure plasma, in particular for the continuous targeted activation, cleaning and / or coating automotive attachments, wherein a Inhne integration of the local treatment of component surfaces by constantly maintaining the low-pressure plasma of Interest is.
- the invention is therefore based on the object to provide a method and apparatus for the partial treatment of the surface of at least one component with low pressure plasma according to the type mentioned above such that the disadvantages of the prior art are overcome and an uninterrupted targeted treatment of at least one Component or simultaneously several local areas of the component is also guaranteed with different desired results while allowing an inlinetransporten local surface treatment
- the dimensions of the reaction chamber of the miniaturized LP plasma reactor are preferred in terms of their length, width and height in the range of 10 mm to 100 mm or 10 mm to 100 mm or 10 mm to 100 mm and the feed pressure in the reaction chamber of the miniaturized LP plasma reactor in the range of 1 Pa to 1000 Pa selected
- the miniaturized LP plasma reactor can be moved robotically, whereby the closure device of the opening of the reaction chamber of the miniaturized LP plasma reactor can also be moved to the closed and the release position in a robot-controlled manner. It is also possible that the miniaturized ND plasma reactor is moved over the surface of the component by means of air cushions before or after closing the opening of the reaction chamber. Furthermore, a plurality of miniaturized ND plasma reactors can be used be moved simultaneously on the surface of the component to their partial treatment.
- a portable autarkic miniaturized LP plasma reactor can also be used simultaneously on the opposite surfaces of a relatively thin polyethylene opaque plate for the treatment thereof, wherein air as the carrier medium in the reaction chamber communicating with the vacuum pump and the process gas container of the respective self-sufficient miniaturized portable autonomous
- the detection is carried out on the one hand by the optical detectability of the plasma boundary through the thin opaque polyethylene plate and on the other hand by the representation of the changed wettability of the treated surface by a test ink. Etching and cleaning processes possible
- the invention enables in an effective and cost-saving manner, the continuous simultaneous treatment of various local areas, in particular automotive attachments for activation, cleaning and / or coating by means of low-pressure plasma.
- the possibility of maintaining the ND plasma permanently ensures inline-capable local treatment of various component surfaces.
- the size and configuration of the reaction chamber of the portable, self-sufficient, miniaturized ND plasma reactor is dependent on the size of the part of the component surface to be treated and of the latter Radius of curvature or to select the size of the component.
- the seals of the reaction chamber of the miniaturized LP plasma reactor are to be adapted to the roughness of the component surface to be treated. Accordingly, the roughness of the component surface must be taken into account when designing the reaction chamber such as the vacuum pump.
- the pumping times are extremely low in comparison to conventional low-pressure plasma.
- Fig. 1 is a schematic representation of a first embodiment of the inventive device for partially treating the surface 2 of a component 3 with low-pressure plasma in the form of a portable self-sufficient miniaturized LP plasma reactor 1, which has a provided with an opening 15 reaction chamber 16 at which a closure device 21 is provided in the form of a slide or shutter for the opening 15 of the reaction chamber 16.
- the closure device 21 is, for example, to move manually or robotically into its opening 15 closing or releasing position.
- the reaction chamber 16 is to be evacuated by a vacuum pump 9, which is connected to the reaction chamber 16 via a line 7 having a valve 5.
- the evacuated reaction chamber 16 is then filled with process gas from a process gas tank 10 via a valve 6 filling line 8, which is connected to the reaction chamber 16.
- process gas from a process gas tank 10 via a valve 6 filling line 8, which is connected to the reaction chamber 16.
- a valve 6 filling line 8 which is connected to the reaction chamber 16.
- the closure means 21 for the opening 15 of the reaction chamber 16 is then moved into its release position, the opening 15 continuing through the part 19 of the component surface 2 to be treated sealed, which then immediately exposed to the action of the low-pressure plasma in the reaction chamber 16 of the miniaturized ND plasma reactor 1 for the treatment is.
- the opening 15 of the reaction chamber 16 is again closed by the closure device 20 by their movement into their closed position, so that the miniaturized LP plasma reactor 1 without shutdown of the low-pressure plasma in the reaction chamber 16 to continuously
- Continued partial treatment of a different part of the component surface 2 is a corresponding treatment of component geometries other than those of Fig. 1 shown plate-shaped component 1 is of course possible
- FIG. 1 corresponding second embodiment of the inventive device in the form of the portable autarkic miniaturized ND plasma reactor 1, in which on the outer wall 23 of the reaction chamber 16 in the vicinity of their alseuticden on the component surface 2 end edges 22 compressed air nozzles 24 are provided by means of an air cushion
- this air cushion can for gentle treatment of the component surface 2 for a relative movement between the latter and the LP plasma reactor 1 after treatment of the part 19 of the component surface 2 and closing the opening 15 of the reaction chamber 16 from position A in Fig. 3 be ensured so that a displacement of the miniaturized LP plasma reactor, for example, in the position B according to Fig. 3 without switching off the low-pressure plasma is possible to continue a corresponding partial treatment of the component surface 2
- Fig. 4 schematically shows one of Fig. 1 corresponding third embodiment of the portable autarkic miniaturized LP plasma reactor 1, wherein via a vacuum chamber 4 two Reaction chambers 16 are each connected via a flexible supply line 14 to the process gas container 10 and the vacuum pump 9. Of the two reaction chambers 16, the opposing surfaces of the plate-shaped member in accordance with in connection with Fig. 1 be treated simultaneously and continuously partially with low pressure plasma. Accordingly, the portable autarkic miniaturized LP plasma reactor 1 can be equipped with more than two reaction chambers 16, so that the surfaces 2 of different components 3 are to be treated simultaneously and continuously locally
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- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
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Abstract
Description
Die Erfindung betrifft ein Verfahren zum partiellen Behandeln der Oberfläche mindestens eines Bauteils mit Niederdruckplasma, das in mindestens einer mit einer Öffnung versehenen Reaktorkammer zu erzeugen ist, wobei die Öffnung der Reaktorkammer verschlossen wird und die Reaktorkammer dann evakuiert und mit einem Prozeßgas gefüllt wird, das durch Energieeintrag in die Reaktorkammer in dieser unter Bildung des Niederdruckplasmas ionisiert und auf dem zu behandelnden Teil der Bauteiloberfläche zur Einwirkung gebracht wird.The invention relates to a method for partially treating the surface of at least one component with low-pressure plasma, which is to be generated in at least one reactor chamber provided with an opening, wherein the opening of the reactor chamber is closed and the reactor chamber is then evacuated and filled with a process gas, the through Energy input into the reactor chamber in this is ionized to form the low-pressure plasma and brought to act on the part of the component surface to be treated.
Die Erfindung betrifft weiterhin eine Vorrichtung zum partiellen Behandeln der Oberfläche eines Bauteils mit Niederdruckplasma, die mindestens eine mit einer Öffnung versehene, verschließbare Reaktionskammer aufweist, die über jeweils eine Ventileinrichtung aufweisende Leitungen mit einer Vakuumpumpe und einem Prozessgasbehälter verbunden ist, von der bzw dem die Reaktionskammer zu evakuieren bzw mit dem Prozessgas zu füllen ist, und an der außerhalb ein Plasmagenerator vorgesehen ist, mittels dem das in die evakuierte Reaktionskammer gefüllte Prozessgas unter Bildung des Niederdruckplasmas in der Reaktionskammer zu ionisieren ist, so dass das ionisierte Prozessgas auf ein zu behandelndes Teil der Bauteiloberfläche einwirken kannThe invention furthermore relates to a device for partially treating the surface of a component with low-pressure plasma, which has at least one closable reaction chamber provided with an opening, which is connected to a vacuum pump and a process gas container via lines each having a valve device, from or to the reaction chamber to be evacuated or to be filled with the process gas, and on the outside of a plasma generator is provided by means of which is filled in the evacuated reaction chamber process gas to form the low pressure plasma in the reaction chamber to ionize, so that the ionized process gas to a part to be treated Component surface can act
Aus der
Bekannt ist weiterhin der Einsatz einer Plasmareaktorkammer (
Im Bereich der Niedertemperatur-Plasmatechnologie findet heutzutage weitgehend die unter Vakuumbedingungen stattfindende Niederdruckplasmatechnologie Verwendung, wobei es sich somit immer um ein Batch-Verfahren handelt Wenn eine Inline-Integration in eine Fertigungslinie gewünscht wird, so ist diese nur mit anspruchsvollen Schleusensystemen möglichIn the field of low-temperature plasma technology nowadays, the low-pressure plasma technology taking place under vacuum is used extensively thus always a batch process If an inline integration into a production line is desired, this is only possible with sophisticated lock systems
Bekannt ist ist weiterhin ein Verfahren und eine Vorrichtung zum partiellen Behandeln der Oberfläche eines Bauteils mit einem Niederdruckplasma (
Ziel der Erfindung ist daher, eine ortsflexible zeit- und kostengünstige Behandlung lokaler Bereiche von Bauteiloberflächen mit Niederdruckplasma, insbesondere zur fortlaufenden gezielten Aktivierung, Reinigung und/oder Beschichtung automobiler Anbauteile, wobei eine Inhne-Integration der lokalen Behandlung von Bauteiloberflächen durch ständiges Aufrechterhalten des Niederdruckplasmas von Interesse ist.The aim of the invention is therefore a location-flexible time and cost-effective treatment of local areas of component surfaces with low-pressure plasma, in particular for the continuous targeted activation, cleaning and / or coating automotive attachments, wherein a Inhne integration of the local treatment of component surfaces by constantly maintaining the low-pressure plasma of Interest is.
Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren und eine Vorrichtung zur partiellen Behandlung der Oberfläche mindestens eines Bauteils mit Niederdruckplasma gemäß der eingangs erwähnten Art zur Verfugung zu stellen derart, daß die Nachteile des Standes der Technik überwunden werden und eine ununterbrochene gezielte Behandlung mindestens eines Bauteils oder gleichzeitig mehrerer lokaler Bereiche des Bauteils auch mit unterschiedlich angestrebten Resultaten bei gleichzeitiger Ermöglichung einer inlinefähigen lokalen Oberflächenbehandlung gewährleistet istThe invention is therefore based on the object to provide a method and apparatus for the partial treatment of the surface of at least one component with low pressure plasma according to the type mentioned above such that the disadvantages of the prior art are overcome and an uninterrupted targeted treatment of at least one Component or simultaneously several local areas of the component is also guaranteed with different desired results while allowing an inlinefähigen local surface treatment
Diese Aufgabe wird verfahrensmäßig erfindungsgemäß dadurch gelöst, dass
- mindestens ein portabler autarker miniaturisierter offener ND-Plasma-Reaktor verwendet wird,
- wobei die Öffnung der Reaktionskammer vor Aufnahme der Oberflächenbehandlung durch eine in eine Schliessstellung zu bewegende Verschlusseinrichtung dicht verschlossen gehalten wird, worauf
- das Prozessgas in die von der Verschlusseinrichtung verschlossene Reaktionskammern gefüllt und in dieser mittels Mikrowellenanregung ionisiert wird,
- die Verschlusseinrichtung dann in eine die Öffnung der Reaktionskammer freigebende Stellung bewegt wird, in der die Öffnung der Reaktionskammer nunmehr fortgesetzt von dem zu behandelnden Teil der Oberfläche des Bauteils dicht verschlossen gehalten wird und das ionisierte Prozessgas auf dem zu behandelnden Teil der Bauteiloberfläche zur Einwirkung kommt,
- die Verschlusseinrichtung nach erfolgter Behandlung des die Öffnung der Reaktionskammer verschliessenden Teils der Bauteiloberfläche in ihre Schliessstellung zurückbewegt wird und
- dann der miniaturisierte ND-Plasma-Reaktor ohne Abschattung des in der Reaktionskammer erzeugten Niederdruckplasmas zur unmittelbar fortgesetzten partiellen Behandlung der Bauteiloberfläche an anderer Stelle in Position gebracht wird
- at least one portable autarkic miniaturized open ND plasma reactor is used,
- wherein the opening of the reaction chamber is held tightly closed before receiving the surface treatment by a closure device to be moved to a closed position, whereupon
- the process gas is filled into the reaction chambers closed by the closure device and ionized therein by means of microwave excitation,
- the closure device is then moved into a position releasing the opening of the reaction chamber, in which the opening of the reaction chamber is now kept tightly closed by the part of the surface of the component to be treated and the ionized process gas is applied to the part of the component surface to be treated,
- the closure device is moved back into its closed position after treatment of the opening of the reaction chamber closing part of the component surface and
- then the miniaturized LP plasma reactor without shading of the low pressure plasma generated in the reaction chamber for immediate continued partial treatment of the component surface is placed elsewhere in position
Bevorzugt werden die Abmessungen der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors hinsichtlich ihrer Länge, Breite und Höhe im Bereich von 10 mm bis 100 mm bzw 10 mm bis 100 mm bzw 10 mm bis 100 mm und der Einsatzdruck in der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors im Bereich von 1 Pa bis 1000 Pa gewähltThe dimensions of the reaction chamber of the miniaturized LP plasma reactor are preferred in terms of their length, width and height in the range of 10 mm to 100 mm or 10 mm to 100 mm or 10 mm to 100 mm and the feed pressure in the reaction chamber of the miniaturized LP plasma reactor in the range of 1 Pa to 1000 Pa selected
Der miniaturisierte ND-Plasma-Reaktor kann robotergesteuert bewegt werden, wobei die Verschlußeinrichtung der Öffnung der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors ebenfalls robotergesteuert in die Schliess- und die Freigabestellung bewegt werden kann. Als Verschlusseinrichtung kann eine Schiebetür oder ein Shutter verwendet werden, Auch ist es möglich, daß der miniaturisierte ND-Plasma-Reaktor vor oder nach Schliessen der Öffnung der Reaktionskammer mittels Luftkissen über die Oberfläche des Bauteils bewegt wird Ferner können mehrere miniaturisierte ND-Plasma-Reaktoren gleichzeitig auf der Oberfläche des Bauteils zu deren partiellen Behandlung bewegt werden.The miniaturized LP plasma reactor can be moved robotically, whereby the closure device of the opening of the reaction chamber of the miniaturized LP plasma reactor can also be moved to the closed and the release position in a robot-controlled manner. It is also possible that the miniaturized ND plasma reactor is moved over the surface of the component by means of air cushions before or after closing the opening of the reaction chamber. Furthermore, a plurality of miniaturized ND plasma reactors can be used be moved simultaneously on the surface of the component to their partial treatment.
Es kann auch jeweils ein portabler autarker miniaturisierter ND-Plasma-Reaktor auf den gegenüberliegenden Flächen einer verhältnismäßig dünnen opaken Platte aus Polyethylen zu deren Behandlung gleichzeitig eingesetzt werden, wobei Luft als Trägermedium in der mit der Vakuumpumpe und dem Prozessgasbehälter kommunizierenden Reaktionskammer des jeweiligen portablen autarken miniaturisierten ND-Plasma-Reaktors verwendet werden kann Der Nachweis erfolgt einerseits durch die optische Erkennbarkeit des Plasmabrandes durch die dünne opake Polyethylenplatte und andererseits durch die Darstellung der veränderten Benetzbarkeit der behandelten Oberfläche durch eine Testtinte In entsprechender Weise sind auch Beschichtungs. Ätz- und Reinigungsprozesse möglichA portable autarkic miniaturized LP plasma reactor can also be used simultaneously on the opposite surfaces of a relatively thin polyethylene opaque plate for the treatment thereof, wherein air as the carrier medium in the reaction chamber communicating with the vacuum pump and the process gas container of the respective self-sufficient miniaturized portable autonomous The detection is carried out on the one hand by the optical detectability of the plasma boundary through the thin opaque polyethylene plate and on the other hand by the representation of the changed wettability of the treated surface by a test ink. Etching and cleaning processes possible
Die Aufgabe der Erfindung wird weiterhin erfindungsgemäß gelöst durch die eingangs genannte Vorrichtung zum partiellen Behandeln der Oberfläche mindestens eines Bauteils mit Niederdruckplasma, die dadurch gekennzeichnet ist, das
- mindestens ein autarker portabler miniaturisierter ND-Plasma-Reaktor verfügbar ist, bei dem
- an der Reaktionskammer eine Verschlusseinrichtung vorgesehen ist, die in eine die Reaktionskammer dicht verschliessende Verschlussstellung zu bewegen ist, in der die Reaktionskammer zu evakuieren und mit Prozessgas zu füllen ist,
- der Plasmagenerator ein Mikrowellen- oder Radiofrequenzgenerator ist, von dem das Prozessgas in der von der Verschlusseinrichtung dicht verschlossenen Reaktionskammer zu ionisieren ist, und
- die Verschlusseinrichtung in eine die Öffnung der Reaktionskammer freigebende Stellung zu bewegen ist, in der die Öffnung der Reaktionskammer fortgesetzt durch das zu behandelnde Teil der Bauteiloberfläche dicht verschlossen gehalten und das zu behandelnde Teil zugleich der Wirkung der ionisierten Prozessgasteilchen ausgesetzt ist und
- aus der die Verschlusseinrichtung nach erfolgter Behandlung des die Öffnung dicht verschliessenden Teils der Bauteiloberfläche in die ihrerseits die Reaktionskammer wieder abdichtend verschliessende Stellung zurückzubewegen ist, in der der miniaturisierte ND-Plasma-Reaktor ohne Abschaltung des in der Reaktionskammer erzeugten Niedruckplasmas zur unmittelbar fortgesetzten partiellen Behandlung der Bauteiloberfläche an anderer Stelle in Position zu bringen ist.
- at least one self-contained portable miniaturized LP plasma reactor is available, in which
- a closure device is provided on the reaction chamber, which device is to be moved into a closure position sealing the reaction chamber in which the reaction chamber is to be evacuated and filled with process gas,
- the plasma generator is a microwave or radio-frequency generator from which the process gas is to be ionized in the reaction chamber sealed by the closure device, and
- the closure device is to be moved into a position releasing the opening of the reaction chamber in which the opening of the reaction chamber continues to be kept tightly closed by the part of the component surface to be treated and the part to be treated is simultaneously exposed to the action of the ionized process gas particles and
- from which the closure device after treatment of the opening tightly closing part of the component surface in the turn the reaction chamber again sealingly closing position is to be moved back, in which the miniaturized LP plasma reactor without switching off the low pressure plasma generated in the reaction chamber for immediate continued partial treatment Component surface is to be positioned elsewhere.
Vorteilhafte Weiterbildungen der erfindungsgemäßen Vorrichtung ergeben sich aus den Patentansprüchen 11 bis 19Advantageous developments of the device according to the invention will become apparent from the
Die Erfindung ermöglicht in effektiver und kostensparender Weise die ununterbrochene gleichzeitige Behandlung verschiedener lokaler Bereiche insbesondere automobiler Anbauteile zur Aktivierung, Reinigung und/oder Beschichtung mittels Niederdruckplasma. Durch die Möglichkeit des ständigen Aufrechterhaltens des ND-Plasmas ist eine inlinefähige lokale Behandlung verschiedener Bauteiloberflächen gewährleistet. Die Größe und Konfiguration der Reaktionskammer des portablen, autarken, miniaturisierten ND-Plasma-Reaktors ist Abhängigkeit von der Größe des zu behandelnden Teils der Bauteiloberfläche und von deren Krümmungsradius oder von der Größe des Bauteils zu wählen. Die Dichtungen der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors sind an die Rauhigkeit der zu behandelnden Bauteiloberfläche anzupassen Entsprechend ist die Rauhigkeit der Bauteiloberfläche bei der Auslegung der Reaktionskammer wie der Vakuumpumpe zu berücksichtigen. Vorteilhaft erweist sich, daß aufgrund des geringen Volumens der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors die Abpumpzeiten im Vergleich zu herkömmlichen Niederdruckplasmaverfahren äußerst gering sind.The invention enables in an effective and cost-saving manner, the continuous simultaneous treatment of various local areas, in particular automotive attachments for activation, cleaning and / or coating by means of low-pressure plasma. The possibility of maintaining the ND plasma permanently ensures inline-capable local treatment of various component surfaces. The size and configuration of the reaction chamber of the portable, self-sufficient, miniaturized ND plasma reactor is dependent on the size of the part of the component surface to be treated and of the latter Radius of curvature or to select the size of the component. The seals of the reaction chamber of the miniaturized LP plasma reactor are to be adapted to the roughness of the component surface to be treated. Accordingly, the roughness of the component surface must be taken into account when designing the reaction chamber such as the vacuum pump. Advantageously, it turns out that due to the small volume of the reaction chamber of the miniaturized LP plasma reactor, the pumping times are extremely low in comparison to conventional low-pressure plasma.
Die Erfindung wird nun anhand der Zeichnungen erläutert In diesen sind
-
Fig. 1 eine schematische Darstellung eine ersten Ausführungsform der erfindungsgemäßen Vorrichtung in Form eines portablen autarken miniaturisierten ND-Plasma-Reaktors bei Positionierung der Verschlußeinrichtung für die Öffnung der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors in der Freigabestellung, -
Fig. 2 eine der inFig. 1 dargestellten Ausführungsform entsprechende zweite Ausführungsform der Vorrichtung bei Positionierung der Verschlußeinrichtung für die Öffnung der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors in der Freigabestellung, wobei Druckluftdüsen an der Außenwand der Reaktionskammer zur Erzeugung eines Luftkissens vorgesehen sind, -
Fig. 3 eine Darstellung der Ausführungsform gemäßFig. 2 bei Positionierung der Verschlußeinrichtung für die Öffnung der Reaktionskammer des miniaturisierten ND-Plasma-Reaktors in der Verschlußstellung, wobei der miniaturisierte ND-Plasma-Reaktor in einem Behandlungsort A und in einem Behandlungsort B gezeigt ist, in den der ND-Plasma-Reaktor durch Relativbewegung zur Bauteiloberfläche mittels des Luftkissens versetzt worden ist, und -
Fig. 4 eine der Darstellung nachFig 1 entsprechende dritte Ausführungsform in Form des portablen autarken miniaturisierten ND-Plasma-Reaktors, jedoch mit zwei Reaktionskammern, die jeweils über eine Vakuumkammer mit der Vakuumpumpe und dem Prozessgasbehälter verbunden sind und mit denen jeweils die einander gegenüberliegenden Oberflächen des inFig 1 gezeigten plattenförmigen Bauteils zu behandeln sind.
-
Fig. 1 a schematic representation of a first embodiment of the device according to the invention in the form of a portable autarkic miniaturized LP plasma reactor in positioning the closure device for the opening of the reaction chamber of the miniaturized LP plasma reactor in the release position, -
Fig. 2 one of the inFig. 1 in a second embodiment of the device according to the second embodiment of the invention when positioning the closure device for the opening of the reaction chamber of the miniaturized LP plasma reactor in the release position, compressed-air nozzles being provided on the outer wall of the reaction chamber for producing an air cushion; -
Fig. 3 a representation of the embodiment according toFig. 2 positioning the closure means for opening the reaction chamber of the miniaturized LP plasma reactor in the closed position, wherein the miniaturized LP plasma reactor is shown in a treatment location A and in a treatment location B, in which the LP plasma reactor by relative movement has been added to the component surface by means of the air cushion, and -
Fig. 4 one of the representation afterFig. 1 corresponding third embodiment in the form of the portable self-sufficient miniaturized LP plasma reactor, but with two reaction chambers, which are each connected via a vacuum chamber with the vacuum pump and the process gas container and with which in each case the opposing surfaces of the inFig. 1 to be treated plate-shaped component shown.
Aus
Aus den
Bei den Ausfuhrungsformen der erfindungsgemässen Vorrichtung nach den
- 11
- ND-Plasma-ReaktorLP plasma reactor
- 22
- Oberfläche des BauteilsSurface of the component
- 33
- Bauteilcomponent
- 44
- Vakuumkammervacuum chamber
- 55
- VentilValve
- 66
- VentilValve
- 77
- Leitungmanagement
- 88th
- Leitungmanagement
- 99
- Vakuumpumpevacuum pump
- 1010
- ProzeßgasbehälterProcess gas containers
- 1111
- MikrowellengeneratorElektrode für RadiofrequenzanregungMicrowave Generator Electrode for Radio Frequency Excitation
- 1313
- VentilValve
- 1414
- Zuteilungallocation
- 1 51 5
- Öffnungopening
- 1616
- Reaktionskammerreaction chamber
- 1717
- VentilValve
- 1818
- Leitungmanagement
- 1919
- Teil der OberflächePart of the surface
- 2020
- Dichtungpoetry
- 2121
- Verschlußeinrichtungclosure device
- 2222
- Stirnkanten der ReaktionskammerEnd edges of the reaction chamber
- 2323
- Außenwand der ReaktionskammerOuter wall of the reaction chamber
- 2424
- DruckluftdüsenCompressed air nozzles
- A, BA, B
- Position des ND-Plasma-ReaktorsPosition of the LP plasma reactor
Claims (19)
- A method for the partial treatment of the surface at least of one component with low pressure plasma, which is to be produced in at least one reaction chamber provided with an opening, wherein the opening of the reaction chamber is closed and the reaction chamber is then evacuated and filled with a process gas which through application of energy into the reaction chamber is ionized therein with the formation of the low pressure plasma and is brought into effect on the part of the surface of the component which is to be treated,
characterized in that- at least one portable self-sufficient miniaturized open LP-plasma reactor is used,- wherein the opening of the reaction chamber of the LP-plasma reactor is held tightly closed by a closure arrangement, to be moved into a closed position, before the start of the surface treatment, whereupon- the process gas is filled into the reaction chamber, which is closed by the closure arrangement, and is ionized therein by means of microwave stimulation,- the closure arrangement is then moved into a position exposing the opening of the reaction chamber, in which the opening of the reaction chamber is now continued to be tightly closed by the part of the component surface which is to be treated, and the ionized process gas comes to act on the part of the component surface which is to be treated,- the closure arrangement, after completed treatment of the part of the component surface closing the opening of the reaction chamber, is moved back into its closed position and- then the miniaturized LP-plasma reactor, without disconnection of the low pressure plasma produced in the reaction chamber, is brought into the corresponding position for the immediately continued partial treatment of another part of the component surface. - The method according to Claim 1, characterized in that the dimensions of the reaction chamber of the portable self-sufficient miniaturized LP-plasma reactor are selected with regard to its length, width and height in the range of 10 mm to 100 mm or respectively 10 mm to 100 mm or respectively 10 mm to 100 mm.
- The method according to Claim 1 and 2, characterized in that the operation pressure in the reaction chamber of the portable self-sufficient miniaturized LP-plasma reactor is selected in the range of 1 Pa to 1000 Pa.
- The method according to Claim 1 to 3, characterized in that the portable self-sufficient miniaturized LP-plasma reactor is moved in a robot-controlled manner.
- The method according to Claim 4, characterized in that the closure arrangement for the opening of the reaction chamber of the portable self-sufficient miniaturized LP-plasma reactor is moved in a robot-controlled manner into the closed and the exposure position.
- The method according to one of the preceding claims, characterized in that a sliding door or a shutter is used as closure arrangement.
- The method according to one of Claims 1 to 6, characterized in that the portable self-sufficient LP-plasma reactor is moved by means of air cushions relative to the surface of the component before or after closure of the opening of the reaction chamber.
- The method according to one of Claims 1 to 7, characterized in that the reaction chambers of several portable self-sufficient miniaturized LP-plasma reactors are moved simultaneously on the surface of the component or of various components for their partial treatment.
- The method according to one of the preceding claims, characterized in that respectively a portable self-sufficient miniaturized LP-plasma reactor is used simultaneously on the opposite surfaces of a relatively thin opaque sheet of polyethylene for its treatment, wherein air is used as carrier medium in the reaction chamber, communicating with the vacuum pump and the process gas container, of the respective portable self-sufficient miniaturized LP-plasma reactor.
- A device for the partial treatment of the surface (2) of a component (3) with low pressure plasma, which has at least one closable reaction chamber (16), provided with an opening (15), which chamber is connected via ducts (7, 8), respectively having a valve arrangement (5, 6), with a vacuum pump (9) and with a process gas container (10), from which the reaction chamber (16) is to be evacuated or respectively is to be filled with process gas, and on which a plasma generator (11) is provided externally, by means of which the process gas, filled into the evacuated reaction chamber (16), is to be ionized with the formation of the low pressure plasma in the reaction chamber (16), so that the ionized process gas can act on a part (19) of the component surface (2) which is to be treated,
characterized in that- at least one portable self-sufficient miniaturized LP-plasma reactor (1) is available, in which- a closure arrangement (21) is provided on the reaction chamber (16) which is to be moved into a closure position tightly closing the opening (15) of the reaction chamber (16), in which the reaction chamber (16) is to be evacuated and is to be filled with process gas,- the plasma generator (11) is a microwave-, radio frequency wave- or other HF generator, by which the process gas is to be ionized in the reaction chamber (16) which is tightly closed by the closure arrangement (21), and- the closure arrangement (21) is to be moved into a position exposing the opening (15) of the reaction chamber (16), in which the opening (15) of the reaction chamber (16) is held tightly closed continuously by the part (19) of the component surface (2) to be treated, and the part (19) to be treated is exposed at the same time to the action of the ionized process gas particles and- from which the closure arrangement (21) after completed treatment of the part (19) of the component surface (2) tightly closing the opening (15) is to be moved back into the position in turn again closing the reaction chamber (16) in a sealing manner, in which the portable self-sufficient miniaturized LP-plasma reactor (1), without disconnection of the low pressure plasma produced in the reaction chamber (16) is to be brought into position for the directly continued partial treatment of another part (19) of the component surface (2). - The device according to Claim 10, characterized in that the portable self-sufficient miniaturized LP-plasma reactor (1) has several reaction chambers (16) connected via a flexible duct with the process gas container (10) and the vacuum pump (9), which chambers are to be used simultaneously for the partial treatment of the surface (2) of one and/or more components (3).
- The device according to Claim 10 or 12, characterized in that the closure arrangement (21) for the opening (15) of the reaction chamber (16) is to be moved in a robot-controlled manner into the closed position and into the exposure position.
- The device according to one of Claims 10 to 12, characterized in that the closure arrangement (21) is a sliding door or a shutter.
- The device according to one of Claims 10 to 13, characterized in that the portable self-sufficient miniaturized LP-plasma reactor (1) in the closed position and in the exposure position of the closure arrangement (21) for the opening (15) of the reaction chamber (16) is to be moved by means of an air cushion relative to the component surface (2), wherein the air cushion at the same time forms a seal of the reaction chamber (16) with respect to the component surface (2).
- The device according to one of Claims 10 to 14, characterized in that the portable self-sufficient miniaturized LP-plasma reactor (1) is to be moved by means of a robot.
- The device according to Claim 15, characterized in that the reaction gas container (10), the vacuum pump (9) and the at least one reaction chamber (16) of the portable self-sufficient miniaturized LP-plasma reactor (1) are secured by means of the robot and are to be moved relative to each other.
- The device according to one of Claims 10 to 16, characterized in that in the treatment position of the reaction chamber (16), the closure arrangement for the opening (15) of the reaction chamber (16) is arranged in closed position immediately above the part (19) of the component surface (2) which is to be treated, wherein on movement of the closure arrangement (21) into its exposure position, leakage flows of the ionized process gas are negligible.
- The device according to one of Claims 10 to 17, characterized in that the dimensions of the reaction chamber (16) with regard to its length, width and height lie in the range of 10 mm to 100 mm or respectively 10 mm to 100 mm or respectively 10 mm to 100 mm.
- The device according to one of Claims 10 to 18, characterized in that the operation pressure in the reaction chamber (16) lies in the range of 1 Pa to 1000 Pa.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE502006005836T DE502006005836D1 (en) | 2006-03-08 | 2006-03-08 | Method and device for partially treating the surface of at least one component with low pressure plasma to be generated in at least one vacuum chamber |
AT06090034T ATE454211T1 (en) | 2006-03-08 | 2006-03-08 | METHOD AND DEVICE FOR PARTIALLY TREATING THE SURFACE OF AT LEAST ONE COMPONENT WITH LOW-PRESSURE PLASMA TO BE GENERATED IN AT LEAST ONE VACUUM CHAMBER |
EP06090034A EP1832340B1 (en) | 2006-03-08 | 2006-03-08 | Process and device for partial surface treatment of a component by low pressure plasma generated in a vacuum chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06090034A EP1832340B1 (en) | 2006-03-08 | 2006-03-08 | Process and device for partial surface treatment of a component by low pressure plasma generated in a vacuum chamber |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1832340A1 EP1832340A1 (en) | 2007-09-12 |
EP1832340B1 true EP1832340B1 (en) | 2010-01-06 |
Family
ID=38180380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06090034A Not-in-force EP1832340B1 (en) | 2006-03-08 | 2006-03-08 | Process and device for partial surface treatment of a component by low pressure plasma generated in a vacuum chamber |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1832340B1 (en) |
AT (1) | ATE454211T1 (en) |
DE (1) | DE502006005836D1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130115867A1 (en) * | 2011-11-08 | 2013-05-09 | General Electric Company | Enclosure system and method for applying coating |
CN109950409B (en) * | 2019-02-28 | 2023-01-06 | 深圳市先进清洁电力技术研究有限公司 | Perovskite atmosphere processing apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02267290A (en) | 1989-04-10 | 1990-11-01 | Toshiba Corp | Microwave plasma treating device |
US5190703A (en) * | 1990-12-24 | 1993-03-02 | Himont, Incorporated | Plasma reactor chamber |
DE4218196A1 (en) * | 1992-06-03 | 1993-12-09 | Fraunhofer Ges Forschung | Installation for surface treatment of components by low-pressure plasma - with the low-pressure container sealed by the component undergoing treatment |
DE4401718C1 (en) * | 1994-01-21 | 1995-08-17 | Anke Gmbh & Co Kg | Method and appts. for treatment of workpieces in a vacuum atmosphere |
DE10332921A1 (en) | 2003-07-19 | 2005-03-03 | Eisenlohr, Jörg | Treating surface of components with low pressure plasma comprises using vacuum chamber having opening which is closed before evacuation, introduction and ionization of process gas |
-
2006
- 2006-03-08 DE DE502006005836T patent/DE502006005836D1/en active Active
- 2006-03-08 AT AT06090034T patent/ATE454211T1/en active
- 2006-03-08 EP EP06090034A patent/EP1832340B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
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EP1832340A1 (en) | 2007-09-12 |
DE502006005836D1 (en) | 2010-02-25 |
ATE454211T1 (en) | 2010-01-15 |
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