DE10332921A1 - Treating surface of components with low pressure plasma comprises using vacuum chamber having opening which is closed before evacuation, introduction and ionization of process gas - Google Patents
Treating surface of components with low pressure plasma comprises using vacuum chamber having opening which is closed before evacuation, introduction and ionization of process gas Download PDFInfo
- Publication number
- DE10332921A1 DE10332921A1 DE2003132921 DE10332921A DE10332921A1 DE 10332921 A1 DE10332921 A1 DE 10332921A1 DE 2003132921 DE2003132921 DE 2003132921 DE 10332921 A DE10332921 A DE 10332921A DE 10332921 A1 DE10332921 A1 DE 10332921A1
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- Germany
- Prior art keywords
- vacuum chamber
- component
- opening
- process gas
- introduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/03—Pressure vessels, or vacuum vessels, having closure members or seals specially adapted therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0824—Details relating to the shape of the electrodes
- B01J2219/0835—Details relating to the shape of the electrodes substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0873—Materials to be treated
- B01J2219/0879—Solid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0894—Processes carried out in the presence of a plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/162—Open vessel, i.e. one end sealed by object or workpiece
Abstract
Description
Die Erfindung betrifft ein Verfahren zum Behandeln der Oberfläche von Bauteilen mit Niederdruckplasma in einer mit Prozessgas füllbaren Vakuumkammer, wobei das Prozessgas mittels elektrischer Energie ionisierbar ist und nach der Ionisation auf die Oberfläche des Bauteils einwirkt und eine Vorrichtung zur Durchführung des Verfahrens.The The invention relates to a method for treating the surface of Components with low pressure plasma in a fillable with process gas Vacuum chamber, wherein the process gas by means of electrical energy is ionizable and after ionization on the surface of the Acts component and a device for carrying out the Process.
Bei dem mit Niederdruckplasma arbeitenden Verfahren wird das Bauteil in einen verschließbaren Behälter gebracht, der dann verschlossen und mittels einer Vakuumpumpe bis auf einen Arbeitsdruck von 0,01 bis 10 mbar gebracht. Bei diesem Druck wird das Prozessgas in die Vakuumkammer zugeführt und ionisiert.at the low pressure plasma method becomes the component placed in a closable container, The then closed and by means of a vacuum pump to one Working pressure brought from 0.01 to 10 mbar. At this pressure, the Process gas fed into the vacuum chamber and ionized.
Die dazu erforderliche elektrische Energie kann auf unterschiedliche Weise in die Vakuumkammer eingekoppelt werden. Dabei ist vielfach eine Elektrode in der Vakuumkammer untergebracht, die von Gleichspannung, Nieder-, Mittel-, oder Hochfrequenz reich gespeist wird. Der Prozess kann kontinuierlich erfolgen, wobei der Gasdurchsatz mit Pumpen geregelt werden kann. Die Behandlungszeiten im Niederdruckplasma-Verfahren liegen zwischen 1 und 30 min. Die Größe der Vakuumkammer richtet sich dabei nach der Große des zu behandelnden Bauteils und können ein Aufnahmevolumen von 5000 l und mehr haben.The For this required electrical energy can be different Way be coupled into the vacuum chamber. It is many times an electrode housed in the vacuum chamber, which is powered by DC, Low, medium, or high frequency is richly fed. The process can be done continuously, with the gas flow regulated by pumps can be. The treatment times in the low-pressure plasma method lie between 1 and 30 min. The size of the vacuum chamber is aimed look for the big one of the component to be treated and can a receiving volume of 5000 l and more.
Plasmen im Niederdruckbereich erwärmen das Bauteil nur leicht. Das ist bei vielen Materialien ein Vorteil. Das Verfahren eignet sich bis jetzt nur für kleine Bauteile, die in einer nicht all zu großen Vakuumkammer unterzubringen sind. Die Niederdruckplasmaanlage kann dann mit vertretbarem Kostenaufwand realisiert und für die verschiedensten Anwendungen, wie Reinigung, Aktivierung, Ätzung, Beschichtung und dgl. eingesetzt werden.plasmas in the low pressure range, this will heat up Component only slightly. This is an advantage for many materials. The process is suitable only for small components, which in one not too big Vacuum chamber are to accommodate. The low-pressure plasma system can then realized at a reasonable cost and for the most diverse Applications such as cleaning, activation, etching, coating and the like. be used.
Es ist Aufgabe der Erfindung, ein Verfahren der eingangs erwähnten Art so zu vereinfachen, dass es auch für großflächige Bauteile mit vertretbarem Anlagenaufwand einsetzbar ist.It Object of the invention, a method of the type mentioned so simplify that it also for large-scale components with reasonable investment can be used.
Diese Aufgabe wird nach der Erfindung dadurch gelöst, dass eine Vakuumkammer mit einer Öffnung verwendet wird und dass die Öffnung der Vakuumkammer vor dem Evakuieren, dem Einbringen und der Ionisation des Prozessgases mittels eines Teils der Oberfläche des zu behandelnden Bauteils dicht verschlossen wird.These The object is achieved according to the invention in that a vacuum chamber with an opening is used and that the opening the vacuum chamber before evacuation, introduction and ionization the process gas by means of a part of the surface of the component to be treated tight is closed.
Bei diesem Verfahren bildet die zu behandelnde Oberfläche des Bauteils selbst einen Teil der Vakuumkammer und kann daher im Aufwand auch für die Vakuumtechnologie klein und sogar mobil ausgelegt werden. Der Energieverbrauch ist klein und zur Gesamtbehandlung der großflächigen Bauteile wie Platten, Folien und dgl. gibt es verschiedene Möglichkeiten.at This process forms the surface to be treated of the Component itself a part of the vacuum chamber and therefore can effortlessly also for The vacuum technology can be designed small and even mobile. Of the Energy consumption is small and the overall treatment of large-scale components such as Plates, foils and the like. There are several possibilities.
So kann nach einer Ausgestaltung des Verfahrens vorgesehen sein, dass bei großflächigen Bauteilen eine das Bauteil oder die Vakuumkammer bewegende Vorrichtung verwendet wird, mit der eine Relativbewegung zwischen Bauteil-Oberfläche und Vakuumkammer-Öffnung angeführt wird, bis die gesamte zu behandelnde Oberfläche des Bauteils einer Behandlung unterzogen würde.So can be provided according to an embodiment of the method, that for large components a device moving the component or the vacuum chamber used with which a relative movement between the component surface and the vacuum chamber opening is mentioned, until the entire surface to be treated of the component of a treatment would undergo.
Denselben Effekt kann man auch dadurch erreichen, dass bei großflächigen Bauteilen mit den Öffnungen mehrerer Vakuumkammern der gesamte zu behandelnde Oberflächenbereich des Bauteils abgedeckt wird und dass die Vakuumkammern vorzugsweise gleichzeitig mit Gas gefüllt und das Prozessgas ionisiert wird.the same Effect can also be achieved by the fact that with large-area components with the openings several vacuum chambers, the entire surface area to be treated the component is covered and that the vacuum chambers preferably filled with gas at the same time and the process gas is ionized.
Der dichte Verschluss und die Aufrechterhaltung desselben lässt sich dadurch sicherstellen, dass um die Öffnungen) des oder der Vakuumkammer(n) ein Dichtungselement angeordnet wird, an dem zum dichten Verschluss der Öffnung ein Teil des Oberflächenbereiches des Bauteils angelegt und durch den Unterdruck in der Vakuumkammer gehalten wird.Of the tight closure and maintenance of the same can be by ensuring that around the openings (s) of the vacuum chamber (s) Is arranged sealing element, on which for sealing closure the opening a part of the surface area of the component applied and by the negative pressure in the vacuum chamber is held.
Zur einfachen Ableitung der Relativbewegung zwischen Bauteil und Vakuumkammer ist vorzugsweise vorgesehen, dass mit der Bewegungs-Vorrichtung das großflächige Bauteil an den Öffnungen aller Vakuumkammern vorbei bewegt wird.to easy derivation of the relative movement between component and vacuum chamber is preferably provided that with the movement device the large-area component at the openings all vacuum chambers is moved past.
Der kontinuierliche Prozess kann dadurch ablaufen, dass das Prozessgas während des Bewegungsvorganges der Vorrichtung kontinuierlich zugeführt und ionisiert wird und dass während des Prozesses verunreinigtes Gas aus der oder den Vakuumkammer(n) abgesaugt wird.Of the continuous process can be done by the process gas while the movement process of the device continuously supplied and is ionized and that during the process contaminated gas from the vacuum chamber (s) is sucked off.
Eine Vorrichtung zur Durchführung des Verfahrens ist im einfachsten Fall so ausgebildet, dass eine einseitig mit einer Öffnung versehene Vakuumkammer mit einer Einführung für eine an einem Plasmagenerator angeschlossene Elektrode versehen ist, dass in die Öffnung ein Dichtungselement abstehend in die Vakuumkammer eingelassen ist und dass die Vakuukammer mit einem Anschluss für eine Vakuumpumpe und einem Anschluss für die Einleitung des Prozessgases versehen ist. Derartige Vakuumkammern können auch gleichzeitig betrieben und bewegt werden.A Apparatus for carrying out of the method is formed in the simplest case, that a one-sided with an opening provided with a vacuum chamber with an introduction to a plasma generator connected electrode is provided that in the opening Upstream sealing element is embedded in the vacuum chamber and that the vacuum chamber with a connection for a vacuum pump and a Connection for the introduction of the process gas is provided. Such vacuum chambers can be operated and moved simultaneously.
Die Erfindung wird anhand eines in der Zeichnung schematisch dargestellten Ausführungsbeispiel näher beschrieben.The The invention is based on a schematically illustrated in the drawing embodiment described in more detail.
Bei
dem neuen Niederdruckplasma-Verfahren wird im Gegensatz zum Stand
der Technik das zu behandelnde Bauteil
Bei
dem gezeigten Ausführungsbeispiel
ist das Bauteil
In
gleicher Weise können
auch mehrere kleine Vakuumkammern
Die
kleinen Vakuumkammern
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003132921 DE10332921A1 (en) | 2003-07-19 | 2003-07-19 | Treating surface of components with low pressure plasma comprises using vacuum chamber having opening which is closed before evacuation, introduction and ionization of process gas |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE2003132921 DE10332921A1 (en) | 2003-07-19 | 2003-07-19 | Treating surface of components with low pressure plasma comprises using vacuum chamber having opening which is closed before evacuation, introduction and ionization of process gas |
Publications (1)
Publication Number | Publication Date |
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DE10332921A1 true DE10332921A1 (en) | 2005-03-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE2003132921 Ceased DE10332921A1 (en) | 2003-07-19 | 2003-07-19 | Treating surface of components with low pressure plasma comprises using vacuum chamber having opening which is closed before evacuation, introduction and ionization of process gas |
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DE (1) | DE10332921A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1832340A1 (en) | 2006-03-08 | 2007-09-12 | INPRO Innovationsgesellschaft für fortgeschrittene Produktionssysteme in der Fahrzeugindustrie mbH | Process and device for partial surface treatment of a component by low pressure plasma generated in a vacuum chamber |
DE202012102438U1 (en) | 2012-05-21 | 2013-08-22 | Rehau Ag + Co | coating agents |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1063612A (en) * | 1963-06-10 | 1967-03-30 | Glaverbel | Improvements in or relating to appliances for coating windscreens |
US4514275A (en) * | 1981-02-12 | 1985-04-30 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Apparatus for physical vapor deposition |
US5364481A (en) * | 1992-07-24 | 1994-11-15 | Fuji Electric Co., Ltd. | Apparatus for manufacturing a thin-film photovoltaic conversion device |
DE4401718C1 (en) * | 1994-01-21 | 1995-08-17 | Anke Gmbh & Co Kg | Method and appts. for treatment of workpieces in a vacuum atmosphere |
DE69113231T2 (en) * | 1990-12-24 | 1996-02-22 | Boc Group Inc | Plasma reaction chamber. |
-
2003
- 2003-07-19 DE DE2003132921 patent/DE10332921A1/en not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1063612A (en) * | 1963-06-10 | 1967-03-30 | Glaverbel | Improvements in or relating to appliances for coating windscreens |
US4514275A (en) * | 1981-02-12 | 1985-04-30 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Apparatus for physical vapor deposition |
DE69113231T2 (en) * | 1990-12-24 | 1996-02-22 | Boc Group Inc | Plasma reaction chamber. |
US5364481A (en) * | 1992-07-24 | 1994-11-15 | Fuji Electric Co., Ltd. | Apparatus for manufacturing a thin-film photovoltaic conversion device |
DE4401718C1 (en) * | 1994-01-21 | 1995-08-17 | Anke Gmbh & Co Kg | Method and appts. for treatment of workpieces in a vacuum atmosphere |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1832340A1 (en) | 2006-03-08 | 2007-09-12 | INPRO Innovationsgesellschaft für fortgeschrittene Produktionssysteme in der Fahrzeugindustrie mbH | Process and device for partial surface treatment of a component by low pressure plasma generated in a vacuum chamber |
DE202012102438U1 (en) | 2012-05-21 | 2013-08-22 | Rehau Ag + Co | coating agents |
DE102012104357A1 (en) | 2012-05-21 | 2013-11-21 | Rehau Ag + Co. | Process for coating a molded part |
WO2013174491A1 (en) | 2012-05-21 | 2013-11-28 | Rehau Ag + Co | Coating agent |
WO2013174492A1 (en) | 2012-05-21 | 2013-11-28 | Rehau Ag + Co | Method for coating a moulded part |
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