EP1800524A2 - Procede et dispositif pour revetir des cartes de circuits imprimes - Google Patents
Procede et dispositif pour revetir des cartes de circuits imprimesInfo
- Publication number
- EP1800524A2 EP1800524A2 EP05777598A EP05777598A EP1800524A2 EP 1800524 A2 EP1800524 A2 EP 1800524A2 EP 05777598 A EP05777598 A EP 05777598A EP 05777598 A EP05777598 A EP 05777598A EP 1800524 A2 EP1800524 A2 EP 1800524A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit boards
- printed circuit
- coating
- coating material
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Definitions
- the invention relates to a method and a device for coating printed circuit boards as they are used for electrical circuits, integrated circuits and the like.
- Circuit boards are coated with a liquid coating material such as lacquer, whereupon the coating is dried before the circuit boards are further processed.
- the coating can be applied by passing the printed circuit boards on a transport path under a casting device, through which a casting curtain falling onto the printed circuit boards is produced.
- side covers are used which limit the width of the curtain. It is difficult to avoid thickening of the coating at the edges.
- the coating can also be applied by spraying the printed circuit boards, which mainly results in problems that also adjacent machine and transport elements are sprayed with the coating material and must be cleaned consuming. This also results in a correspondingly high consumption of coating material (overspray). With conventional spray coatings, production must be interrupted several times a day for cleaning work. This results in high production costs.
- the object of the invention is to provide a method and a Vorrichtimg of the type described in such a way that with a uniform coating order, the loss of coating material is kept low and expensive cleaning operations omitted.
- edges of the circuit boards covering means is provided and the deposited thereon coating material from the circuit boards away a recovery device is supplied.
- This is achieved in particular by a circulating belt or a rotating drum, which covers the edge region of the printed circuit boards and leads away the coating material applied to the covering device from the edge region, whereupon it can be transferred by a stripping device into a reservoir for the coating material.
- Fig. 4 shows a modified ⁇ us enclosuresform the cover to the
- FIG. 5 is a perspective view of a cover
- Fig. 6 is a schematic view of another embodiment
- Fig. 7 is a Fig. 3 corresponding coating apparatus in which the circuit boards are transported edgewise through the spray system.
- Fig. 1 shows schematically a circuit board to be coated 1, which is moved on a transport device, not shown, for example, a conveyor belt perpendicular to the plane of the drawing. On the conveyor belt, the printed circuit boards are arranged in succession. About the circuit boards 1, a spray gun 2 in the direction of the double arrow X back and forth across the width of the circuit boards, wherein the spray gun 2, a coating material 3 is sprayed.
- the coating material may be solder mask, primary resist and the like.
- the spray application for applying the coating material is shown in FIG. 1 merely simplified as a spray gun 2. It can consist of several spray heads. By means of the spray system, the printed circuit boards can be completely or partially provided with coating material.
- the liquid coating material 3 is supplied to the spray system or the spray gun 2 via a line 2 a from a pump 2 b, which sucks the coating material from a reservoir 4.
- a reservoir 4 with pump 2b may also be a Pressure vessel be provided, from which the coating material of the spray gun 2 is supplied.
- the edge regions of the circuit boards 1 remain free of coating material, in a preferred embodiment on both sides circulating belts 5 and 5 'are arranged, which are guided around guide rollers 5 a, 5 b, wherein the arranged adjacent to the circuit board 1 guide roller 5 a arranged is that it covers with the circulating belt 5, the lateral edge portion Ia of the circuit board.
- the coating material 3 is sprayed onto the band 5 in the edge region 1a of the printed circuit board 1, so that the edge region remains free of coating material.
- the coating material applied to the strip is removed from the edge region and fed to a stripping device 6, which strips the coating material from the strip 5.
- the stripping device is simplified by a Abstreifmesser reproduced 6, below which a funnel 7 is arranged for collecting the stripped coating material, from which the coating material via a line 7a and a pump 7 b is supplied to the reservoir 4.
- the band 5 preferably runs around the deflecting rollers 5a and 5b in such a way that the band in the covering area moves away from the surface of the printed circuit board 1 to be coated, as indicated by arrows in FIG.
- the covering devices formed by circumferential bands 5 on the two sides of the printed circuit board 1 may have a variable distance from each other, so that printed circuit boards of different width, length and thickness can be coated.
- the rotational speed of the bands 5 and 5 ' can be adjusted depending on the transport speed of the printed circuit boards 1. If the printed circuit boards are to be sprayed over the entire surface, the covering devices on the two sides can be adjusted so far outwards that the printed circuit boards are provided with a coating over their entire surface, while the cover elements cover the transport elements laterally from the printed circuit boards.
- the edge area 1a on which no coating material is applied may, for example, have a width of 4 mm, wherein this edge area 1a may be set manually or automatically depending on the application method, the thickness of the printed circuit boards and the like
- the edge region Ia can also be set mechanically independently left and right in the direction of travel.
- the coating device is surrounded by a spray booth, not shown in FIG.
- the described covering device in the form of circumferential bands 5 which guide the coating material arising in the edge region away from the printed circuit board and 2x1 of a stripping device 6, an adjustable, coating-free surface results in the edge region 1a, while at the same time covering the transport device arranged below the printed circuit board 1 in that it is not contaminated by spray mist in the spray booth.
- the transport device can be operated almost maintenance-free, and it must not be interrupted operation for cleaning.
- the loss of coating material can be kept as low as possible. This is particularly advantageous for high paint consumption, for example, if the transport speed of the printed circuit boards 1 is very high. It can be up to 4m / min.
- the uncoated edge region 1a simplifies the handling of the printed circuit boards in the subsequent handling and drying systems, since the printed circuit boards usually rest in this edge region and / or are detected by grippers.
- Fig. 2 shows a coating device according to FIG. I 5 wherein the circuit board 1 is sprayed from below with coating material.
- a spray system go through the Circuit boards 1, a first spray station, in which they are coated from above, as shown in FIG. 1, whereupon they are coated in a second spray station from below, as shown in FIG. 2.
- the same transport device can be used.
- the circuit board 1 is turned and then coated from above on the second side.
- Fig. 3 shows an embodiment in which the printed circuit boards 1 are moved approximately vertically by means of a transport device, not shown, through the spray system, wherein the spray gun 2 is moved vertically over the coating area.
- the covering device is formed by a drum 50, which covers the edge region 1a of the printed circuit board 1 with a part of its cross section. Also in this embodiment, the drum 50 rotates so that its peripheral surface in the edge region Ia moves away from the circuit board 1.
- FIG. 5 shows a perspective view of a cover unit, wherein the band 5 is covered by a cover plate 8 on the portion remote from the coating area.
- Two arms 8 a of the cover plate extending along the edges of the band 5 to the storage of the guide roller 5a in a frame 9.
- the guide roller 5 a can be used for example by means of .A quick release in the frame 9 to facilitate the replacement and cleaning of the tape ,
- the area of the band 5 exposed between the lateral arms 8a of the cover plate 8 is used to direct the spray jet onto this area of the band away from the coating area until the beam is fully developed and free from impurities, at the beginning of the spraying of the printed circuit boards Spray gun is directed away from the belt 5 on the circuit board.
- the cutout in the cover plate 8 serves to adjust the spray cone before the coating process, wherein the coated on the tape coating material is stripped and returned to the reservoir 4 and a corresponding pressure vessel.
- the spraying process begins and ends in each case in the region 5c of the band 5 between the lateral arms 8a of the cover plate 8, wherein the spray head 2 in the region 5c can pass through a path which is sufficiently long for the perfect formation of the spray jet, ie until droplet formation no longer takes place and therefore a perfect coating is guaranteed on the circuit board.
- a relatively large paint consumption is acceptable because of the intended recycling readily.
- the interruption of the spraying operation in the region 5c allows the spray head 2 to always travel to the lateral stop and to leave the coating parameters (plate feed and spray head moving speed) constant irrespective of the plate width.
- the walls of the spray booth may be arranged adjacent to the edges of the cover plate 8 and its arms 8a.
- Denoted at 10 is a drive unit through which at least one of the deflection rollers 5a and 5b is driven, and at which the rotational speed of the belt 5 can be adjusted depending on the speed of the spray head 2 and the passage speed of the circuit boards 1 through the spray booth. At the same time, the adjustment of the covering area of the band 5 in height and depth relative to the printed circuit board 1 can be integrated into this drive unit.
- the cover device described in the form of a belt 5 or a drum 5O 5 whose axis extends in the transport direction of the circuit boards, can also be used in a coating system in which the circuit boards are coated by a curtain.
- the width of the belt 5 and the length of the drum 50 can be made shorter than in a spray coating, wherein the spray cone of the spray gun acts on a relatively wide strip on the surface of the circuit boards, while in a curtain curtain only one very narrow strip is applied to the coating material.
- a pivotable cover plate may be provided which is pivoted away from the covering position to the coating material applied thereto to remove, after which the cover plate can be pivoted back into the covering position.
- the coated printed circuit board dummies are washed off with solvent and dried. This results in a significant loss of expensive paint and cleaning agents.
- PCB dummies of different sizes must be kept in the appropriate number of pieces, because when changing the PCB width dummies must be used according to the adjusted width.
- a transversely to the transport direction or in the transport direction of the circuit boards belt is arranged according to the invention under the transport path for the circuit boards in the spray area, which strikes the paint when between the circuit boards a distance during coating is present. Due to the circulating belt, the impacting paint is continuously removed and fed via a squeegee to a reprocessing device.
- FIGS. 6 and 7 show an embodiment with a circulating band under the spray area, wherein the same reference numerals are used for the same or corresponding components as in the preceding figures.
- Fig. 6 shows a Fig. 1 corresponding coating apparatus in which the circuit boards 1 are transported horizontally through the spray area. Under the circuit boards 1, a transversely to the transport direction of the circuit board circulating belt 15 is arranged in the spray area, the do rollers 15 a and 5 b is performed, which have a distance from each other, which is preferably greater than the reproduced in Fig. 6 width of a circuit board 1.
- the guide rollers 15a and 15b are approximately below the pulleys 5a of the edges of the circuit board 1 covering bands 5 and 5 '.
- the width of the band 15 perpendicular to the plane of the drawing is designed so that it extends at least over the spray area of the spray gun 2, so that on both sides of a single circuit board 1 emitted by the spray gun coating material impinges on the belt 15 and the spray system under the circuit boards 1 are not polluted can.
- the coating material impinging on the upper side on the belt 15 is stripped on the underside by a stripping device 6 ', or a doctor blade, and collected by a funnel 7', from which the coating material is supplied to the reservoir 4 or to a reprocessing plant.
- the width of the strip 15 is designed to be independent of the size of the printed circuit boards to be coated, so that the coating material always strikes the strip 15 when individual printed circuit boards 1 or printed circuit boards are transported at a distance from one another through the spray area.
- it is also possible to make the spray system ready for production without a printed circuit board on the Transport system is because the discharged from the spray gun 2 coating material 3 impinges on the belt 15 and is recycled.
- the circulating in the vertical direction band 15 is disposed behind the circuit boards to be coated 1 in the spray area, the stripping 6 'expediently arranged in the region of the lower guide roller or roller 15a is to strip the coating material from the belt 15.
- the circulating belt 15 arranged behind or under the printed circuit boards to be coated in the spray area for collecting coating material can also be used advantageously in a spray system in which bands 5 or rollers 50 (FIG. 4) covering the edge region of the printed circuit boards are not present.
- the length of the strip 15 or the distance between the guide rollers 15a and 15b extends over a larger area than the reproduced in the drawing width measurement of a circuit board 1, so that by the tape 15 and coating material is collected, which is the In the figures reproduced edge regions of the circuit board 1 is sprayed past.
- the band 15 forming a covering device in the transport direction of the printed circuit boards 1 perpendicular to the plane of the drawing, the band 15 having at least one length and width covering the spraying area.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
L'invention concerne un dispositif pour revêtir des cartes de circuits imprimés au moyen d'un matériau de revêtement liquide qui est appliqué sur la surface des cartes. Le dispositif selon l'invention comprend : une installation de transport conçue pour les cartes de circuits imprimés (1) ; une installation d'application de revêtement (2) qui est disposée sur ou sous l'installation de transport ; une installation de recouvrement (5 ; 50) dont au moins un côté est disposé au-dessus d'une zone périphérique (1a) des cartes de circuits imprimés (1), la zone de cette installation de recouvrement qui recouvre la zone périphérique de la carte de circuits imprimés pouvant être éloignée de la carte de circuits imprimés, et ; une installation d'enlèvement (6) qui enlève le matériau de revêtement éloigné de la carte de circuits imprimés, de l'installation de recouvrement, et l'introduit dans un réservoir (4).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004040945A DE102004040945B4 (de) | 2004-08-24 | 2004-08-24 | Verfahren und Vorrichtung zum selektiven Beschichten von Leiterplatten |
PCT/EP2005/009099 WO2006021423A2 (fr) | 2004-08-24 | 2005-08-23 | Procede et dispositif pour revetir des cartes de circuits imprimes |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1800524A2 true EP1800524A2 (fr) | 2007-06-27 |
Family
ID=35482349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05777598A Withdrawn EP1800524A2 (fr) | 2004-08-24 | 2005-08-23 | Procede et dispositif pour revetir des cartes de circuits imprimes |
Country Status (4)
Country | Link |
---|---|
US (1) | US7814861B2 (fr) |
EP (1) | EP1800524A2 (fr) |
DE (1) | DE102004040945B4 (fr) |
WO (1) | WO2006021423A2 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004040945B4 (de) | 2004-08-24 | 2008-05-21 | All4-Holding Ag | Verfahren und Vorrichtung zum selektiven Beschichten von Leiterplatten |
US20100062169A1 (en) * | 2008-09-08 | 2010-03-11 | JN Machinery | Coating high temperature parts with polymer |
DE102009007148A1 (de) | 2009-02-02 | 2011-01-27 | Steinemann Technology Ag | Beschichtungssystem für eine Laminier- oder Kaschiermaschine |
EP2397321B1 (fr) | 2010-06-17 | 2013-04-24 | Steinemann Technology AG | Procédé de revêtement pour une machine de laminage ou une contre-colleuse |
US20150128856A1 (en) * | 2013-11-14 | 2015-05-14 | Illinois Tool Works Inc. | Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus |
US10239088B2 (en) * | 2017-03-22 | 2019-03-26 | Ford Motor Company | Fluid application system adapted to collect and reuse reclaimed fluid |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6014624B2 (ja) * | 1977-11-09 | 1985-04-15 | 富士写真フイルム株式会社 | 塗布方法 |
GB2053121A (en) * | 1979-07-06 | 1981-02-04 | Coal Industry Patents Ltd | Conveyor belt cleaning equipment |
US4559896A (en) * | 1983-09-15 | 1985-12-24 | Ciba Geigy Corporation | Coating apparatus |
DE3642737A1 (de) * | 1986-12-13 | 1988-06-16 | Thomas Dipl Ing Cramer | Vorrichtung zum auftragen von adhaesiven materialien auf einen gegenstand, insbesondere eine glasscheibe |
US4888200A (en) * | 1988-04-21 | 1989-12-19 | W. R. Grace & Co.,-Conn. | Process and machine for electrostatic coating |
US5175018A (en) * | 1989-03-29 | 1992-12-29 | Robotic Vision Systems, Inc. | Automated masking device for robotic painting/coating |
US4974532A (en) * | 1989-05-02 | 1990-12-04 | Ford Motor Company | Spray coating apparatus |
SE467564B (sv) * | 1990-12-05 | 1992-08-10 | Ekstroem Bo | Saett och anordning foer elektrostatisk applicering av faergpulver i sprutbox |
US5733376A (en) * | 1994-04-01 | 1998-03-31 | Argus International | Apparatus for spray coating opposing major surfaces of a workpiece |
JP3526139B2 (ja) * | 1996-07-03 | 2004-05-10 | 株式会社エクセディ | ダンパーディスク組立体 |
DE19735588A1 (de) * | 1997-04-21 | 1999-02-18 | Jagenberg Papiertech Gmbh | Verfahren und Vorrichtung zum Auftragen einer Pigmentstreichfarbe auf eine Papier- oder Kartonbahn |
ITMI991311A1 (it) * | 1999-06-11 | 2000-12-11 | Elmag Spa | Dispositivo per pulire un nastro trasportatore da sostanze liquide spruzzate sullo stesso |
DE102004040945B4 (de) | 2004-08-24 | 2008-05-21 | All4-Holding Ag | Verfahren und Vorrichtung zum selektiven Beschichten von Leiterplatten |
-
2004
- 2004-08-24 DE DE102004040945A patent/DE102004040945B4/de not_active Expired - Fee Related
-
2005
- 2005-08-23 EP EP05777598A patent/EP1800524A2/fr not_active Withdrawn
- 2005-08-23 WO PCT/EP2005/009099 patent/WO2006021423A2/fr active Application Filing
-
2007
- 2007-02-23 US US11/710,211 patent/US7814861B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO2006021423A2 * |
Also Published As
Publication number | Publication date |
---|---|
US7814861B2 (en) | 2010-10-19 |
US20080069946A1 (en) | 2008-03-20 |
WO2006021423A2 (fr) | 2006-03-02 |
DE102004040945A1 (de) | 2006-03-16 |
DE102004040945B4 (de) | 2008-05-21 |
WO2006021423A3 (fr) | 2006-06-29 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 20070322 |
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Kind code of ref document: A2 Designated state(s): AT CH DE IT LI |
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DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20080414 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20140815 |