EP1787330A4 - Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition - Google Patents

Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition

Info

Publication number
EP1787330A4
EP1787330A4 EP05746303A EP05746303A EP1787330A4 EP 1787330 A4 EP1787330 A4 EP 1787330A4 EP 05746303 A EP05746303 A EP 05746303A EP 05746303 A EP05746303 A EP 05746303A EP 1787330 A4 EP1787330 A4 EP 1787330A4
Authority
EP
European Patent Office
Prior art keywords
heterostructures
fabrication
devices
vapor deposition
chemical vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05746303A
Other languages
German (de)
French (fr)
Other versions
EP1787330A2 (en
Inventor
Arpan Chakraborty
Benjamin A Haskell
Stacia Keller
James S Speck
Steven P Denbaars
Shuji Nakamura
Umesh K Mishra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California
Original Assignee
University of California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California filed Critical University of California
Publication of EP1787330A2 publication Critical patent/EP1787330A2/en
Publication of EP1787330A4 publication Critical patent/EP1787330A4/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/34Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34333Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02387Group 13/15 materials
    • H01L21/02389Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02428Structure
    • H01L21/0243Surface structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02502Layer structure consisting of two layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00Special growth methods for semiconductor lasers
    • H01S2304/04MOCVD or MOVPE
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00Special growth methods for semiconductor lasers
    • H01S2304/12Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0206Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0213Sapphire, quartz or diamond based substrates

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Biophysics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
EP05746303A 2004-05-10 2005-05-06 Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition Withdrawn EP1787330A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56974904P 2004-05-10 2004-05-10
PCT/US2005/015774 WO2005112123A2 (en) 2004-05-10 2005-05-06 Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition

Publications (2)

Publication Number Publication Date
EP1787330A2 EP1787330A2 (en) 2007-05-23
EP1787330A4 true EP1787330A4 (en) 2011-04-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP05746303A Withdrawn EP1787330A4 (en) 2004-05-10 2005-05-06 Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition

Country Status (4)

Country Link
EP (1) EP1787330A4 (en)
JP (2) JP5379973B2 (en)
KR (2) KR20070013320A (en)
WO (1) WO2005112123A2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7504274B2 (en) 2004-05-10 2009-03-17 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
JP5379973B2 (en) * 2004-05-10 2013-12-25 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic vapor phase epitaxy
JPWO2006088261A1 (en) * 2005-02-21 2008-07-17 財団法人神奈川科学技術アカデミー InGaN layer generation method and semiconductor device
JP4807081B2 (en) * 2006-01-16 2011-11-02 ソニー株式会社 Method for forming underlayer made of GaN-based compound semiconductor, and method for manufacturing GaN-based semiconductor light-emitting device
KR101416838B1 (en) 2006-02-10 2014-07-08 더 리전츠 오브 더 유니버시티 오브 캘리포니아 Method for conductivity control of (Al,In,Ga,B)N
JP2008053640A (en) * 2006-08-28 2008-03-06 Kanagawa Acad Of Sci & Technol Group iii-v nitride layer and manufacturing method thereof
JP5077985B2 (en) * 2006-08-28 2012-11-21 シャープ株式会社 Method for forming nitride semiconductor layer
JP2008108924A (en) * 2006-10-26 2008-05-08 Matsushita Electric Works Ltd Compound semiconductor light-emitting element, illumination apparatus employing the same and manufacturing method of compound semiconductor light-emitting element
JP2008153285A (en) * 2006-12-14 2008-07-03 Rohm Co Ltd Nitride semiconductor apparatus and nitride semiconductor manufacturing method
JP2008159606A (en) * 2006-12-20 2008-07-10 Rohm Co Ltd Nitride semiconductor light-emitting element and its manufacturing method
KR100843474B1 (en) 2006-12-21 2008-07-03 삼성전기주식회사 Growth method of iii group nitride single crystal and iii group nitride crystal produced by using the same
WO2008099643A1 (en) * 2007-01-30 2008-08-21 Rohm Co., Ltd. Semiconductor laser diode
JP2008226865A (en) * 2007-01-30 2008-09-25 Rohm Co Ltd Semiconductor laser diode
JP5363996B2 (en) 2007-02-12 2013-12-11 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Al (x) Ga (1-x) N cladding-free nonpolar III-nitride based laser diode and light emitting diode
KR100889956B1 (en) * 2007-09-27 2009-03-20 서울옵토디바이스주식회사 Ac light emitting diode
TWI452726B (en) 2007-11-30 2014-09-11 Univ California High light extraction efficiency nitride based light emitting diode by surface roughening
JP5003527B2 (en) 2008-02-22 2012-08-15 住友電気工業株式会社 Group III nitride light emitting device and method for fabricating group III nitride semiconductor light emitting device
US20090310640A1 (en) * 2008-04-04 2009-12-17 The Regents Of The University Of California MOCVD GROWTH TECHNIQUE FOR PLANAR SEMIPOLAR (Al, In, Ga, B)N BASED LIGHT EMITTING DIODES
CN102576652A (en) * 2009-08-21 2012-07-11 天空公司 Rapid growth method and structures for gallium and nitrogen containing ultra-thin epitaxial structures for devices
JP2011049488A (en) * 2009-08-28 2011-03-10 Sumitomo Electric Ind Ltd Group iii nitride semiconductor laminate wafer and group iii nitride semiconductor device
WO2011058697A1 (en) * 2009-11-12 2011-05-19 パナソニック株式会社 Method for manufacturing nitride semiconductor element
JP2011146651A (en) * 2010-01-18 2011-07-28 Sumitomo Electric Ind Ltd Group iii nitride light emitting diode
EP2667421A1 (en) * 2011-01-21 2013-11-27 Panasonic Corporation Gallium nitride compound semiconductor light emitting element and light source provided with said light emitting element
US9236530B2 (en) 2011-04-01 2016-01-12 Soraa, Inc. Miscut bulk substrates
US9646827B1 (en) 2011-08-23 2017-05-09 Soraa, Inc. Method for smoothing surface of a substrate containing gallium and nitrogen
KR20130066870A (en) 2011-12-13 2013-06-21 삼성전자주식회사 Semiconductor light emitting device
WO2013123241A1 (en) 2012-02-17 2013-08-22 The Regents Of The University Of California Method for the reuse of gallium nitride epitaxial substrates
WO2014015337A2 (en) 2012-07-20 2014-01-23 The Regents Of The University Of California Structure and method for the fabrication of a gallium nitride vertical cavity surface emitting laser
KR101954145B1 (en) * 2012-08-29 2019-03-05 엘지전자 주식회사 Non-polar substrate having hetero-structure and method for manufacturing the same, nitride-based light emitting device using the same
JP5682716B2 (en) * 2014-01-09 2015-03-11 三菱化学株式会社 Nitride semiconductor
JP6426359B2 (en) * 2014-03-24 2018-11-21 株式会社東芝 Semiconductor light emitting device and method of manufacturing the same
DE102014113068A1 (en) * 2014-09-10 2016-03-10 Seaborough Ip I B.V. Light-emitting device
FR3076080B1 (en) * 2017-12-27 2019-11-29 Aledia PSEUDO-SUBSTRATE FOR OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030198837A1 (en) * 2002-04-15 2003-10-23 Craven Michael D. Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3448450B2 (en) * 1996-04-26 2003-09-22 三洋電機株式会社 Light emitting device and method for manufacturing the same
JP3778609B2 (en) * 1996-04-26 2006-05-24 三洋電機株式会社 Manufacturing method of semiconductor device
JP2000340892A (en) 1999-05-26 2000-12-08 Nec Corp Compound semiconductor device and manufacture thereof
JP3438674B2 (en) * 1999-10-21 2003-08-18 松下電器産業株式会社 Method for manufacturing nitride semiconductor device
JP2001160656A (en) * 1999-12-01 2001-06-12 Sharp Corp Nitride compound semiconductor device
US6903376B2 (en) 1999-12-22 2005-06-07 Lumileds Lighting U.S., Llc Selective placement of quantum wells in flipchip light emitting diodes for improved light extraction
US6958497B2 (en) * 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
JP2004059325A (en) 2001-07-04 2004-02-26 Fuji Photo Film Co Ltd Method for manufacturing substrate for semiconductor device, substrate for semiconductor device, and semiconductor device
KR100904501B1 (en) * 2001-10-26 2009-06-25 암모노 에스피. 제트오. 오. Substrate for epitaxy
WO2003036771A1 (en) * 2001-10-26 2003-05-01 Ammono Sp.Zo.O. Nitride semiconductor laser element, and production method therefor
JP2003229645A (en) 2002-01-31 2003-08-15 Nec Corp Quantum well structure, semiconductor element employing it and its fabricating method
US20060138431A1 (en) * 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
US6835957B2 (en) * 2002-07-30 2004-12-28 Lumileds Lighting U.S., Llc III-nitride light emitting device with p-type active layer
US7186302B2 (en) * 2002-12-16 2007-03-06 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
JP5379973B2 (en) * 2004-05-10 2013-12-25 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic vapor phase epitaxy

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030198837A1 (en) * 2002-04-15 2003-10-23 Craven Michael D. Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
WO2003089694A1 (en) * 2002-04-15 2003-10-30 The Regents Of The University Of California NON-POLAR (A1,B,In,Ga) QUANTUM WELL AND HETEROSTRUCTURE MATERIALS AND DEVICES

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
BHATTACHARYYA A ET AL: "Comparative study of GaN/AlGaN MQWs grown homoepitaxially on (1100) and (0001) GaN", JOURNAL OF CRYSTAL GROWTH, ELSEVIER, AMSTERDAM, NL, vol. 251, no. 1-4, 1 April 2003 (2003-04-01), pages 487 - 493, XP004416295, ISSN: 0022-0248, DOI: 10.1016/S0022-0248(02)02433-8 *
CHITNIS ASHAY ET AL: "Visible light-emitting diodes using a-plane GaN-InGaN multiple quantum wells over r-plane sapphire", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 84, no. 18, 3 May 2004 (2004-05-03), pages 3663 - 3665, XP012061343, ISSN: 0003-6951, DOI: 10.1063/1.1738938 *
See also references of WO2005112123A2 *
YUE JUN SUN ET AL: "Nonpolar InxGa1-xN/GaN(11 00) multiple quantum wells grown on [gamma]-LiAlO2(100) by plasma-assisted molecular-beam epitaxy", PHYSICAL REVIEW B (CONDENSED MATTER AND MATERIALS PHYSICS) APS THROUGH AIP USA,, vol. 67, no. 4, 15 January 2003 (2003-01-15), pages 41306 - 1, XP002610861 *

Also Published As

Publication number Publication date
KR101365604B1 (en) 2014-02-20
JP2007537600A (en) 2007-12-20
KR20120008539A (en) 2012-01-30
EP1787330A2 (en) 2007-05-23
JP2012209582A (en) 2012-10-25
KR20070013320A (en) 2007-01-30
JP5379973B2 (en) 2013-12-25
WO2005112123A2 (en) 2005-11-24
WO2005112123A3 (en) 2006-12-28

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