EP1779971A1 - Appareil de dressage pour tampon de polissage mécano-chimique et son procédé de fabrication - Google Patents

Appareil de dressage pour tampon de polissage mécano-chimique et son procédé de fabrication Download PDF

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Publication number
EP1779971A1
EP1779971A1 EP05023680A EP05023680A EP1779971A1 EP 1779971 A1 EP1779971 A1 EP 1779971A1 EP 05023680 A EP05023680 A EP 05023680A EP 05023680 A EP05023680 A EP 05023680A EP 1779971 A1 EP1779971 A1 EP 1779971A1
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EP
European Patent Office
Prior art keywords
pad
cavities
pad conditioner
conditioning
abrasive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05023680A
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German (de)
English (en)
Inventor
Ying-Che Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Princo Corp
Original Assignee
Princo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Princo Corp filed Critical Princo Corp
Priority to EP05023680A priority Critical patent/EP1779971A1/fr
Publication of EP1779971A1 publication Critical patent/EP1779971A1/fr
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

Definitions

  • the present invention relates to a pad conditioner for dressing or conditioning a CMP pad and a method of making such a pad conditioner, and more particularly to a pad conditioner for conditioning a CMP pad and a method of making such a pad conditioner wherein abrasive particles are evenly distributed on the pad conditioner and securely fixed on a substrate.
  • CMP Chemical Mechanical Polishing
  • a silicon wafer is held by a rotating or moving polishing head and pressed on a rotating polishing pad, and slurry is injected onto the polishing pad.
  • the slurry also contains acid solution or alkaline solution that is chosen based on the material to be polished. For example, since most dielectric materials are oxides, the selected slurry is usually alkaline solution, and if the metal materials such as tungsten or copper are to be polished, the selected slurry is often acid solution.
  • the polishing pads are commonly made from polyurethane resin and the polishing pad has a rough surface with via holes.
  • the top of polishing pad holds the abrasive particles, usually by a means such as fibers. It is very important to keep the top as flexible as possible to provide necessary friction for holding particles. Therefore, although the majority of debris coming from the polishing of silicon wafers, slurry particles and conditioning disk is washed away by water during the CMP process, a small amount of debris still accumulates in the via holes of the polishing pad, causing the polishing pad surface to glaze or harden, which makes the pad less able to hold the slurry particles. Thus the removal rate of polishing is decreased, which causes instability in the CMP process and fast wear-out of the polishing pad.
  • a pad conditioner that is capable of removing the debris on the polishing pad surface and reviving the polishing pad is needed so that the process remains stable.
  • the pad conditioner must also be capable of distributing the slurry uniformly on the polishing pad so that the process is more stable.
  • electroplated pad conditioner There are two most common types of conventional pad conditioners: electroplated pad conditioner and alloy-brazed pad conditioner.
  • the abrasive particles of the electroplated pad conditioner are fixed on its substrate by way of electroplating nickel, but the bonding force of such mechanical locking method is poor and the abrasive particles tend to be dislodged easily and may scratch the wafer being polished.
  • the electroplated layer must cover more than half of each abrasive particle in order to engage the abrasive particles to the substrate, therefore the protrusion level of the abrasive particles is limited, and thus the polishing pad cannot be effectively conditioned and the via holes are stuffed with the debris. Therefore, the current CMP process uses less of the electroplated pad conditioner.
  • abrasive particles of alloy-brazed pad conditioner are fixed on its substrate by way of alloy brazing, and the bonding force of such chemical locking method is better, and the abrasive particles are harder to dislodge than when the electroplated pad conditioner is used.
  • U.S. Patent No. 6,368,198 discloses a pad dresser and a method of making such a pad dresser.
  • abrasive particles 3 are affixed to a substrate 1 via a brazing alloy sheet 2, and the reason that the abrasive particles 3 can be evenly distributed is due to a template with apertures (not shown) that was used to place the abrasive particles on the brazing alloy sheet 2 before brazing.
  • an anti-corrosive layer of diamond-like carbon (DLC) 5 can be added thereon by physical vapor deposition.
  • the brazing alloy is molten and flows freely in the high temperature vacuum furnace.
  • the pre-placed abrasive particles could be displaced by the brazing liquid such that neighboring particles touch each other.
  • the bonding force is decreased due to such clustering of abrasive particles.
  • the dislodging of abrasive particles would still occur at times.
  • An object of the invention is to provide a pad conditioner for evenly conditioning a CMP pad, and a method of making such a pad conditioner.
  • Another object of the invention is to provide a pad conditioner for conditioning a CMP pad, wherein abrasive particles are securely fixed on the substrate, and a method for making such a pad conditioner.
  • abrasive particles refer to all super-hard crystals, including: natural diamond, synthetic single crystal diamond, synthetic polycrystalline diamond (PCD), cubic boron nitride (cBN), polycrystalline cubic boron nitride (PcBN), etc.
  • a substrate refers to a base member made of material such as metal, alloy, or ceramic.
  • cavities are for containing and holding the abrasive particles, and the cavities can be of any shape, such as hemispherical shape, bowl shape, cylindrical shape, or conical shape.
  • a bonding agent is any material that is capable of affixing the abrasive particles to the substrate, including: metal, alloy, etc.
  • the invention provides a pad conditioner for conditioning a CMP pad, including: a substrate having a plurality of cavities thereon; a bonding agent filling the plurality of cavities; and a plurality of abrasive particles fixed in the plurality of cavities by the bonding agent.
  • the cavities are arranged in a regular manner and the size of each cavity is such that only one abrasive particle can be accommodated.
  • the cavities are preferred to be bowl-shaped.
  • the bonding agent affixes the plurality of abrasive particles to the plurality of cavities by way of brazing.
  • the aforementioned pad conditioner for conditioning a CMP pad further includes a lubricating layer; the lubricating layer is made of parylene, tungsten carbide/carbon film (WC/C), diamond film, or diamond-like carbon film (DLC).
  • the lubricating layer can enhance the speed of debris removal, reduce the accumulation of debris, and shorten the conditioning time.
  • the invention provides a method of making a pad conditioning for conditioning a CMP pad, including: providing a substrate; forming a plurality of cavities on the substrate; filling a bonding agent in the plurality of cavities; placing a plurality of abrasive particles in the bonding agent; and securely fixing the plurality of abrasive particles on the substrate by using the bonding agent.
  • the cavities are regularly arranged and each cavity is sized such that preferably it can only accommodate one abrasive particle.
  • the cavities are preferably bowl-shaped.
  • the bonding agent bonds the plurality of abrasive particles to the plurality of cavities by way of brazing.
  • the aforementioned method of making such a pad conditioner further includes: forming a lubricating layer on the substrate, the bonding agent and the plurality of abrasive particles.
  • the lubricating layer is made of parylene, WC/C, diamond film, or DLC.
  • the efficiency and uniformity of the pad conditioner are improved, and the life of the polishing pad is extended.
  • the invention can enhance the stability of CMP process, reduce the conditioning time, minimize the number and time of equipment maintenances, and reduce the generation of scratched wafers, thus enhancing the quality and yield of wafers.
  • FIG. 1 illustrates a sectional view of a conventional pad conditioner.
  • FIG. 2 illustrates a sectional view of a pad conditioner according to a first embodiment of the invention.
  • FIG. 3 illustrates a sectional view of a pad conditioner according to a second embodiment of the invention.
  • FIG. 4 illustrates a sectional view of a pad conditioner according to a third embodiment of the invention.
  • FIG. 5 illustrates a sectional view of a pad conditioner according to a fourth embodiment of the invention.
  • FIGs. 6A - 6E illustrate a method of making a pad conditioner according to a first embodiment of the invention.
  • a pad conditioner for conditioning a CMP pad and a method of making such a pad conditioner according to a preferred embodiment of the invention will be described below with reference to the drawings, wherein the like reference numerals denote the like components. Please note that the embodiments of the invention described below are for explanatory purposes and are not limited to the description thereof unless such limitation is specified in the embodiments.
  • a sectional view of a pad conditioner according to a first embodiment of the invention wherein a plurality of abrasive particles 13 are respectively fixed in a plurality of flat-bottom, bowl-shaped cavities 14 on a substrate 11 by a bonding agent 12.
  • the substrate 11 is made of stainless steel SUS 316, and the sizes of the abrasive particles are from about 100 ⁇ m to about 250 ⁇ m, preferably about 130 ⁇ m to about 200 ⁇ m.
  • the depth of the cavities 14 is about 50 ⁇ m, which can be adjusted according to the sizes of the abrasive particles and the protrusion that the abrasive particles are to be exposed.
  • the diameters of the cavities 14 are designed to only accommodate one abrasive particle so that the abrasive particles can be evenly distributed as per the positioning of the cavities 14.
  • the cavities 14 are of a bowl shape with flat bottom, which can structurally hold the abrasive particle 13 securely and separate each abrasive particle completely, so that the abrasive particles will not be dislodged easily.
  • FIG. 3 shows a sectional view of a pad conditioner according to a second embodiment of the invention.
  • the pad conditioner of this embodiment further has a lubricating layer 15 deposited on the pad conditioner described in the first embodiment.
  • the lubricating layer 15 can be made of diamond, DLC, parylene, or WC/C, and is preferably made of Parylene or WC/C.
  • the lubricating layer resistant to acids and bases such that it adapts to different process conditions, it is also capable of filling and fixing the defects on the surface of the pad conditioner to reduce the friction coefficient, so that the surface of the pad conditioner is smooth and the rate of debris removal is enhanced.
  • the dislodging of abrasive particles or chipping of partial sharp angles caused by uneven forces due to surface defects is decreased, and therefore the occurrence of scratching of wafers is minimized.
  • FIG. 4 shows a sectional view of a pad conditioner according to a third embodiment of the invention.
  • the pad conditioner of this embodiment is as the pad conditioner described in the first embodiment with the plurality of cavities 14 being of a cylindrical shape instead of bowl-shaped.
  • FIG. 5 shows a sectional view of a pad conditioner according to a fourth embodiment of the invention.
  • the pad conditioner of this embodiment is as the pad conditioner described in the first embodiment with the plurality of cavities 14 being cone-shaped instead of bowl-shaped.
  • the shape of the cavities of the invention is not limited to the shapes described in the aforementioned embodiments; cavities of other shapes also can achieve the intended effect of the invention.
  • FIGs. 6A - 6E illustrate a method of making the pad conditioner as described in the first embodiment.
  • a substrate 11 is provided, and then a photo-resist layer 16 is formed on the substrate 11.
  • a pre-defined pattern (not illustrated) is used to expose and develop the photo-resist layer 16 to get a patterned photo-resist layer 16a, as shown in FIG. 6B.
  • a plurality of bowl-shaped cavities 14 are formed on the substrate 11 by wet-etching and the photo-resist layer 16a is removed.
  • the cavities 14 are then filled with a bonding agent 12 as shown in FIG. 6D by printing method, and then as shown in FIG. 6E, a plurality of abrasive particles 13 are respectively placed in the bonding agent 12.
  • the abrasive particles 13 are securely and separately fixed on the substrate 11 by the bonding agent 12.
  • the way to form cavities is not limited to wet-etching; other methods such as mechanical drilling, laser drilling, galvanic process, dry-etching, and more, can be used.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
EP05023680A 2005-10-28 2005-10-28 Appareil de dressage pour tampon de polissage mécano-chimique et son procédé de fabrication Withdrawn EP1779971A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05023680A EP1779971A1 (fr) 2005-10-28 2005-10-28 Appareil de dressage pour tampon de polissage mécano-chimique et son procédé de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05023680A EP1779971A1 (fr) 2005-10-28 2005-10-28 Appareil de dressage pour tampon de polissage mécano-chimique et son procédé de fabrication

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EP1779971A1 true EP1779971A1 (fr) 2007-05-02

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009013716A2 (fr) * 2007-07-23 2009-01-29 Element Six Limited Mise en place d'un matériau extra dur
KR101105799B1 (ko) * 2009-04-23 2012-01-17 주식회사 디어포스 연마제품
WO2015048011A1 (fr) * 2013-09-25 2015-04-02 3M Innovative Properties Company Tampons à polir multicouches

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2438600A1 (de) * 1974-08-10 1976-02-26 Winter & Sohn Ernst Abrichtwerkzeug, insbesondere fuer schleifscheiben
US4155721A (en) * 1974-11-06 1979-05-22 Fletcher J Lawrence Bonding process for grinding tools
DE9107089U1 (fr) * 1990-12-21 1991-08-22 Zahnradpraezision Horst Reineke & Co. Gmbh, 5980 Werdohl, De
US5669943A (en) * 1995-06-07 1997-09-23 Norton Company Cutting tools having textured cutting surface
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US6419574B1 (en) * 1999-09-01 2002-07-16 Mitsubishi Materials Corporation Abrasive tool with metal binder phase
US20020197947A1 (en) * 2001-03-02 2002-12-26 Asahi Diamond Industrial Co., Ltd. Super abrasive tool and process for producing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2438600A1 (de) * 1974-08-10 1976-02-26 Winter & Sohn Ernst Abrichtwerkzeug, insbesondere fuer schleifscheiben
US4155721A (en) * 1974-11-06 1979-05-22 Fletcher J Lawrence Bonding process for grinding tools
DE9107089U1 (fr) * 1990-12-21 1991-08-22 Zahnradpraezision Horst Reineke & Co. Gmbh, 5980 Werdohl, De
US5669943A (en) * 1995-06-07 1997-09-23 Norton Company Cutting tools having textured cutting surface
US6419574B1 (en) * 1999-09-01 2002-07-16 Mitsubishi Materials Corporation Abrasive tool with metal binder phase
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US20020197947A1 (en) * 2001-03-02 2002-12-26 Asahi Diamond Industrial Co., Ltd. Super abrasive tool and process for producing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009013716A2 (fr) * 2007-07-23 2009-01-29 Element Six Limited Mise en place d'un matériau extra dur
WO2009013716A3 (fr) * 2007-07-23 2009-03-19 Element Six Ltd Mise en place d'un matériau extra dur
KR101105799B1 (ko) * 2009-04-23 2012-01-17 주식회사 디어포스 연마제품
WO2015048011A1 (fr) * 2013-09-25 2015-04-02 3M Innovative Properties Company Tampons à polir multicouches
US10071459B2 (en) 2013-09-25 2018-09-11 3M Innovative Properties Company Multi-layered polishing pads

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