EP1754012A1 - Formkörper aus lignocellulosehaltigen materialien - Google Patents
Formkörper aus lignocellulosehaltigen materialienInfo
- Publication number
- EP1754012A1 EP1754012A1 EP05744784A EP05744784A EP1754012A1 EP 1754012 A1 EP1754012 A1 EP 1754012A1 EP 05744784 A EP05744784 A EP 05744784A EP 05744784 A EP05744784 A EP 05744784A EP 1754012 A1 EP1754012 A1 EP 1754012A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- weight
- microcapsules
- shaped body
- heat storage
- latent heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 title claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 239000003094 microcapsule Substances 0.000 claims abstract description 43
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims description 50
- 239000000178 monomer Substances 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 239000002775 capsule Substances 0.000 claims description 33
- 239000011230 binding agent Substances 0.000 claims description 31
- 239000000835 fiber Substances 0.000 claims description 25
- 238000005338 heat storage Methods 0.000 claims description 25
- 229920000642 polymer Polymers 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 18
- 239000011232 storage material Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000002023 wood Substances 0.000 claims description 15
- 239000012071 phase Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 10
- 229920000877 Melamine resin Polymers 0.000 claims description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 8
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 6
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 5
- 229920003180 amino resin Polymers 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- 239000007764 o/w emulsion Substances 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000007791 liquid phase Substances 0.000 claims description 4
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 4
- 239000007790 solid phase Substances 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 125000005907 alkyl ester group Chemical group 0.000 claims 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 30
- 239000002245 particle Substances 0.000 description 18
- 238000006116 polymerization reaction Methods 0.000 description 17
- 239000000084 colloidal system Substances 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 15
- 239000011093 chipboard Substances 0.000 description 13
- 239000006185 dispersion Substances 0.000 description 13
- 229920002522 Wood fibre Polymers 0.000 description 11
- 239000001993 wax Substances 0.000 description 11
- 239000002025 wood fiber Substances 0.000 description 11
- -1 polyethylene Polymers 0.000 description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 235000013877 carbamide Nutrition 0.000 description 6
- 239000000839 emulsion Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 230000008961 swelling Effects 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000000129 anionic group Chemical group 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000004566 building material Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 239000004848 polyfunctional curative Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 244000060011 Cocos nucifera Species 0.000 description 3
- 235000013162 Cocos nucifera Nutrition 0.000 description 3
- 235000004431 Linum usitatissimum Nutrition 0.000 description 3
- 240000006240 Linum usitatissimum Species 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 238000001246 colloidal dispersion Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- HOWGUJZVBDQJKV-UHFFFAOYSA-N docosane Chemical compound CCCCCCCCCCCCCCCCCCCCCC HOWGUJZVBDQJKV-UHFFFAOYSA-N 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 150000002191 fatty alcohols Chemical class 0.000 description 3
- YCOZIPAWZNQLMR-UHFFFAOYSA-N heptane - octane Natural products CCCCCCCCCCCCCCC YCOZIPAWZNQLMR-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- GDBCGGFNFKMPAE-UHFFFAOYSA-N 1-decylnaphthalene Chemical compound C1=CC=C2C(CCCCCCCCCC)=CC=CC2=C1 GDBCGGFNFKMPAE-UHFFFAOYSA-N 0.000 description 2
- AOHAPDDBNAPPIN-UHFFFAOYSA-N 3-Methoxy-4,5-methylenedioxybenzoic acid Chemical compound COC1=CC(C(O)=O)=CC2=C1OCO2 AOHAPDDBNAPPIN-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 244000198134 Agave sisalana Species 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 2
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 2
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 2
- 240000000491 Corchorus aestuans Species 0.000 description 2
- 235000011777 Corchorus aestuans Nutrition 0.000 description 2
- 235000010862 Corchorus capsularis Nutrition 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- FLIACVVOZYBSBS-UHFFFAOYSA-N Methyl palmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC FLIACVVOZYBSBS-UHFFFAOYSA-N 0.000 description 2
- HPEUJPJOZXNMSJ-UHFFFAOYSA-N Methyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC HPEUJPJOZXNMSJ-UHFFFAOYSA-N 0.000 description 2
- 240000008790 Musa x paradisiaca Species 0.000 description 2
- 235000018290 Musa x paradisiaca Nutrition 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920002396 Polyurea Polymers 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 150000008064 anhydrides Chemical group 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 235000009120 camo Nutrition 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 235000005607 chanvre indien Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 239000000374 eutectic mixture Substances 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 239000008273 gelatin Substances 0.000 description 2
- 229920000159 gelatin Polymers 0.000 description 2
- 235000019322 gelatine Nutrition 0.000 description 2
- 235000011852 gelatine desserts Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011487 hemp Substances 0.000 description 2
- FNAZRRHPUDJQCJ-UHFFFAOYSA-N henicosane Chemical compound CCCCCCCCCCCCCCCCCCCCC FNAZRRHPUDJQCJ-UHFFFAOYSA-N 0.000 description 2
- BJQWYEJQWHSSCJ-UHFFFAOYSA-N heptacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCC BJQWYEJQWHSSCJ-UHFFFAOYSA-N 0.000 description 2
- NDJKXXJCMXVBJW-UHFFFAOYSA-N heptadecane Chemical compound CCCCCCCCCCCCCCCCC NDJKXXJCMXVBJW-UHFFFAOYSA-N 0.000 description 2
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- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- CBFCDTFDPHXCNY-UHFFFAOYSA-N icosane Chemical compound CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 2
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
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- 229920000609 methyl cellulose Polymers 0.000 description 2
- 150000005217 methyl ethers Chemical class 0.000 description 2
- 239000001923 methylcellulose Substances 0.000 description 2
- 235000010981 methylcellulose Nutrition 0.000 description 2
- LQERIDTXQFOHKA-UHFFFAOYSA-N nonadecane Chemical compound CCCCCCCCCCCCCCCCCCC LQERIDTXQFOHKA-UHFFFAOYSA-N 0.000 description 2
- ZYURHZPYMFLWSH-UHFFFAOYSA-N octacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC ZYURHZPYMFLWSH-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- YKNWIILGEFFOPE-UHFFFAOYSA-N pentacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCC YKNWIILGEFFOPE-UHFFFAOYSA-N 0.000 description 2
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- 239000004814 polyurethane Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BEKZXQKGTDVSKX-UHFFFAOYSA-N propyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCCC BEKZXQKGTDVSKX-UHFFFAOYSA-N 0.000 description 2
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- 239000002994 raw material Substances 0.000 description 2
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- 238000000926 separation method Methods 0.000 description 2
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- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 2
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- POOSGDOYLQNASK-UHFFFAOYSA-N tetracosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC POOSGDOYLQNASK-UHFFFAOYSA-N 0.000 description 2
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- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 description 1
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- GWESGLGUMMNXDU-UHFFFAOYSA-N 1-bromononadecane Chemical compound CCCCCCCCCCCCCCCCCCCBr GWESGLGUMMNXDU-UHFFFAOYSA-N 0.000 description 1
- WSULSMOGMLRGKU-UHFFFAOYSA-N 1-bromooctadecane Chemical compound CCCCCCCCCCCCCCCCCCBr WSULSMOGMLRGKU-UHFFFAOYSA-N 0.000 description 1
- JKOTZBXSNOGCIF-UHFFFAOYSA-N 1-bromopentadecane Chemical compound CCCCCCCCCCCCCCCBr JKOTZBXSNOGCIF-UHFFFAOYSA-N 0.000 description 1
- XRJWGFXUIIXRNM-UHFFFAOYSA-N 1-hexylnaphthalene Chemical compound C1=CC=C2C(CCCCCC)=CC=CC2=C1 XRJWGFXUIIXRNM-UHFFFAOYSA-N 0.000 description 1
- JIABEENURMZTTI-UHFFFAOYSA-N 1-isocyanato-2-[(2-isocyanatophenyl)methyl]benzene Chemical class O=C=NC1=CC=CC=C1CC1=CC=CC=C1N=C=O JIABEENURMZTTI-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
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- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000002888 oleic acid derivatives Chemical class 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012673 precipitation polymerization Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 235000010288 sodium nitrite Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000001256 steam distillation Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- JZALLXAUNPOCEU-UHFFFAOYSA-N tetradecylbenzene Chemical compound CCCCCCCCCCCCCCC1=CC=CC=C1 JZALLXAUNPOCEU-UHFFFAOYSA-N 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- 229940078499 tricalcium phosphate Drugs 0.000 description 1
- 229910000391 tricalcium phosphate Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/10—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products
- E04C2/16—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products of fibres, chips, vegetable stems, or the like
Definitions
- Shaped body made of lignocellulose-containing materials
- the present application relates to moldings made of lignocellulose-containing materials and a size resin, a process for their preparation and a binder composition containing size resin and microcapsules.
- the mass of building materials in a building stores the inflowing heat during the day in summer and ideally keeps the inside temperature constant. In the cooler night, the stored heat is released back into the outside air. In order to achieve a pleasant indoor climate even in summer without active air conditioning, the thermal mass of the building is essential. However, modern buildings lack such a large thermal mass due to their construction.
- chipboard is not able to store heat at all, but rather has an insulating effect.
- latent heat storage has been investigated as a new material combination in building materials. Their mode of operation is based on the enthalpy of conversion occurring during the solid / liquid phase transition, which means energy absorption or energy release to the environment. They can therefore be used to keep the temperature constant within a defined temperature range. Since the latent heat storage materials are also available in liquid form depending on the temperature, they cannot be processed directly with building materials, as there is a risk of emissions to the room air and separation from the building material.
- EP-A-1 029 018 teaches the use of microcapsules with a capsule wall made of a highly crosslinked methacrylic acid ester polymer and a latent heat storage core in binding materials such as concrete or gypsum.
- the capsule walls since the capsule walls only have a thickness in the range from 5 to 500 nm, they are very sensitive to pressure, an effect which is used when they are used in carbonless papers. However, this limits their use.
- DE-A-101 39 171 describes the use of microencapsulated latent heat storage materials in plasterboard.
- the object of the present invention was to find further possibilities for effective heat storage and thus air conditioning of buildings.
- molded articles made of lignocellulose-containing materials containing 5-20% by weight glue resin, calculated as a solid, based on the weight of the molded article, and 1-30% by weight microcapsules with a polymer as the capsule wall and a capsule core consisting predominantly of latent heat storage materials ,
- the microcapsules contained in the moldings according to the invention are particles with a capsule core consisting predominantly, to more than 95% by weight, of latent heat storage materials and a polymer as the capsule wall.
- the capsule core is solid or liquid, depending on the temperature.
- the average particle size of the capsules (Z-means by means of light scattering) is 0.5 to 100 ⁇ m, preferably 1 to 80 ⁇ m, in particular 1 to 50 ⁇ m.
- the weight ratio of capsule core to capsule wall is generally from 50:50 to 95: 5.
- a core / wall ratio of 70:30 to 90:10 is preferred.
- latent heat storage materials are substances which have a phase transition in the temperature range in which heat transfer is to be carried out.
- the latent heat storage materials preferably have a solid / liquid phase transition in the temperature range from -20 to 120 ° C.
- the latent heat stores are organic, preferably lipophilic substances.
- Suitable substances are: aliphatic hydrocarbon compounds such as saturated or unsaturated C 1 -C 8 -hydrocarbons which are branched or preferably linear, for example such as n-tetradecane, n-pentadecane, n-hexadecane, n-heptadecane, n-octadecane, n-nonadecane, n-eicosane, n-heneicosane, n-docosane, n-tricosane, n-tetracosane, n-pentacosane, n-hexacosane, n-heptacosane, n-octacosane and cyclic hydrocarbons, for example cyclohexane, cyclooctane, cyclodecane;
- aromatic hydrocarbon compounds such as benzene, naphthalene, biphenyl, o- or n-terphenyl, C 1 -C 0 alkyl-substituted aromatic hydrocarbons such as dodecylbenzene, tetradecylbenzene, hexadecylbenzene, hexylnaphthalene or decylnaphthalene; saturated or unsaturated C 6 -C 30 fatty acids such as lauric, stearic, oleic or behenic acid, preferably eutectic mixtures of decanoic acid with, for example, myristic, palmitic or lauric acid;
- Fatty alcohols such as lauryl, stearyl, oleyl, myristyl, cetyl alcohol, mixtures such as coconut fatty alcohol and the so-called oxo alcohols which are obtained by hydroformylating ⁇ -olefins and other reactions;
- C 6 -C 3 o-fatty amines such as decylamine, dodecylamine, tetradecylamine or hexadecylamine;
- esters such as C 1 -C 4 -alkyl esters of fatty acids such as propyl palmitate, methyl stearate or methyl palmitate and preferably their eutectic mixtures or methyl cinnamate;
- Natural and synthetic waxes such as montanic acid waxes, montan ester waxes, carnauba wax, polyethylene wax, oxidized waxes, polyvinyl ether wax, ethylene vinyl acetate wax or hard waxes according to the Fischer-Tropsch process;
- Halogenated hydrocarbons such as chlorinated paraffin, bromooctadecane, bromopentadecane, bromononadecane, bromeicosane, bromdocosane.
- Mixtures of these substances are also suitable as long as there is no lowering of the melting point outside the desired range or the heat of fusion of the mixture becomes too low for a sensible application.
- n-alkanes n-alkanes with a purity of greater than 80% or of alkane mixtures which are obtained as technical distillate and are commercially available as such.
- the capsule core-forming substances may be advantageous to add compounds soluble in the capsule core-forming substances in order to prevent the lowering of the freezing point which sometimes occurs with the non-polar substances.
- compounds with a melting point 20 to 120 K higher than the actual core substance are advantageously used.
- Suitable compounds are the fatty acids, fatty alcohols, fatty amides and aliphatic hydrocarbon compounds mentioned above as lipophilic substances. They are added in amounts of 0.1 to 10% by weight based on the capsule core.
- the latent heat storage materials are selected.
- latent heat storage materials whose solid / liquid phase transition is in the temperature range from 0 to 60 ° C. are preferably used for heat stores in building materials in a temperate climate.
- single substances or mixtures with transition temperatures of 15 to 30 ° C are selected for indoor applications.
- Preferred latent heat storage materials are aliphatic hydrocarbons, particularly preferably those listed above by way of example.
- aliphatic hydrocarbons with 16, 17 or 18 carbon atoms and mixtures thereof are preferred.
- the materials known for the microcapsules for carbonless papers can be used as the polymer for the capsule wall.
- thermosetting polymers are thermosetting polymers.
- Thermosetting is understood to mean wall materials that do not soften due to the high degree of crosslinking, but decompose at high temperatures.
- Suitable thermosetting wall materials are, for example, highly crosslinked formaldehyde resins, highly crosslinked polyureas and highly crosslinked polyurethanes and highly crosslinked methacrylic acid ester polymers.
- Formaldehyde resins are reaction products made from formaldehyde
- Triazines such as melamine, carbamides such as urea, phenols such as phenol, m-cresol and resorcinol, amino and amido compounds such as aniline, p-toluenesulfonamide, ethylene urea and guanidine,
- Formaldehyde resins preferred as capsule wall material are urea-formaldehyde resins, urea-resorcinol-formaldehyde resins, urea-melamine resins and melamine-formaldehyde resins.
- the C 1 -C 4 -alkyl- in particular methyl ethers of these formaldehyde resins and the mixtures with these formaldehyde resins are preferred.
- melamine-formaldehyde resins and / or their methyl ethers are preferred. In the processes known from carbonless papers, the resins are used as prepolymers.
- the prepolymer is still soluble in the aqueous phase and migrates to the interface in the course of the polycondensation and encloses the oil droplets.
- Methods for microencapsulation with formaldehyde resins are generally known and are described, for example, in EP-A-562 344 and EP-A-974 394.
- Capsule walls made of polyureas and polyurethanes are also known from carbonless papers.
- the capsule walls are formed by reacting NH 2 groups or reactants carrying OH groups with di- and / or polyisocyanates.
- Suitable isocyanates are, for example, ethylene diisocyanate, 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate and 2,4- and 2,6-tolylene diisocyanate.
- polyisocyanates such as derivatives with a biuret structure, polyurethane-imines and isocyanurates may be mentioned.
- Possible reactants are: hydrazine, guanidine and its salts, hydroxylamine, di- and polyamines and amino alcohols.
- Such interfacial polyaddition processes are known for example from US 4,021,595, EP-A 0392 876 and EP-A 0 535384.
- Microcapsules are preferred, the capsule wall of which is a highly crosslinked methacrylic acid ester polymer.
- the degree of crosslinking is achieved with a crosslinker fraction> 10% by weight, based on the total polymer.
- the wall-forming polymers are from 30 to 30 to
- the polymers can contain up to 80% by weight, preferably 5 to 60% by weight, in particular 10 to 50% by weight, of a bi- or polyfunctional monomer as monomer II which is insoluble or sparingly soluble in water, polymerized included.
- the polymers can contain up to 40% by weight, preferably up to 30% by weight, of other monomers III in copolymerized form.
- C 1 -C 24 -Alkyl esters of acrylic and / or methacrylic acid are suitable as monomers I.
- Particularly preferred monomers I are methyl, ethyl, n-propyl and n-butyl acrylate and / or the corresponding methacrylates.
- Isopropyl, isobutyl, sec-butyl and tert-butyl acrylate and the corresponding methacrylates are preferred.
- Methacrylonitrile should also be mentioned.
- the methacrylates are generally preferred.
- Suitable monomers II are bifunctional or polyfunctional monomers which are insoluble or sparingly soluble in water, but have a good to limited solubility in the lipophilic substance.
- Low solubility means a solubility of less than 60 g / l at 20 ° C.
- Bifunctional or polyfunctional monomers are understood to mean compounds which have at least 2 non-conjugated ethylenic double bonds. In front- Divinyl and polyvinyl monomers which crosslink the capsule wall during the polymerization are usually suitable.
- Preferred bifunctional monomers are the diesters of diols with acrylic acid or methacrylic acid, furthermore the diallyl and divinyl ethers of these diols.
- Preferred divinyl monomers are ethanediol diacrylate, divinylbenzene, ethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, methallyl methacrylamide and allyl methacrylate.
- Propanediol, butanediol, pentanediol and hexanediol diacrylate or the corresponding methacrylates are particularly preferred.
- Preferred polyvinyl monomers are trimethylolpropane triacrylate and methacrylate, pentaerythritol triallyl ether and pentaerythritol tetraacrylate.
- monomers III are suitable as monomers III, preference is given to monomers purple, such as styrene, ⁇ -methylstyrene, ⁇ -methylstyrene, butadiene, isoprene, vinyl acetate, vinyl propionate and vinyl pyridine.
- the water-soluble monomers IIIb e.g. Acrylonitrile, methacrylamide, acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride,
- N-vinyl pyrrolidone 2-hydroxyethyl acrylate and methacrylate and acrylamido-2-methylpropanesulfonic acid.
- N-methylolacrylamide N-
- methylol methacrylamide dimethylaminoethyl methacrylate and diethylaminoethyl methacrylate.
- microcapsules suitable for use according to the invention can be produced by a so-called in-situ polymerization.
- microcapsules and their preparation are known from EP-A-457 154, DE-A-10 139 171, DE-A-102 30 581, EP-A-1 321 182, to which express reference is made.
- the microcapsules are produced in such a way that a stable oil-in-water emulsion is produced from the monomers, a radical initiator, a protective colloid and the lipophilic substance to be encapsulated, in which they are present as a disperse phase.
- the polymerization of the monomers is then triggered by heating and controlled by a further increase in temperature, the resulting polymers forming the capsule wall which encloses the lipophilic substance.
- the polymerization is carried out at 20 to 100 ° C., preferably at 40 to 80 ° C.
- the dispersion and polymerization temperature should be above the melting temperature of the lipophilic substances.
- the polymerization is expediently continued for a period of up to 2 hours in order to lower the residual monomer content.
- microcapsules with an average particle size in the range from 0.5 to 100 ⁇ m can be produced, the particle size being adjustable in a manner known per se via the shear force, the stirring speed, the protective colloid and its concentration.
- Preferred protective colloids are water-soluble polymers, since these reduce the surface tension of the water from 73 mN / m to a maximum of 45 to 70 mN / m and thus ensure the formation of closed capsule walls and microcapsules with preferred particle sizes between 1 and 30 ⁇ m, preferably 3 and 12 ⁇ m, form.
- the microcapsules are produced in the presence of at least one organic protective colloid, which can be both anionic and neutral.
- organic protective colloid which can be both anionic and neutral.
- Anionic and nonionic protective colloids can also be used together.
- Inorganic protective colloids are preferably used, optionally in a mixture with organic protective colloids.
- Organic neutral protective colloids are cellulose derivatives such as hydroxyethyl cellulose, carboxymethyl cellulose and methyl cellulose, polyvinyl pyrrolidone, copolymers of vinyl pyrrolidone, gelatin, gum arabic, xanthan, sodium alginate, casein, polyethylene glycols, preferably polyvinyl alcohols and partially hydrolysed polyols.
- Suitable anionic protective colloids are polymethacrylic acid, the copolymers of sulfoethyl acrylate and methacrylate, sulfopropyl acrylate and methacrylate, N- (sulfoethyl) maleimide, 2-acrylamido-2-alkyl sulfonic acids, styrene sulfonic acid and vinyl sulfonic acid.
- Preferred anionic protective colloids are naphthalenesulfonic acid and naphthalenesulfonic acid-formaldehyde condensates, and especially polyacrylic acids and phenolsulfonic acid-formaldehyde condensates.
- the anionic protective colloids are generally used in amounts of 0.1 to 10% by weight, based on the water phase of the emulsion.
- inorganic protective colloids so-called Pickering systems, which enable stabilization by very fine solid particles and which are insoluble but dispersible in water or insoluble and non-dispersible in water but wettable by the lipophilic substance.
- a Pickering system can consist of the solid particles alone or in addition of auxiliaries which improve the dispersibility of the particles in water or the wettability of the particles by the lipophilic phase.
- the inorganic solid particles can be metal salts such as salts, oxides and hydroxides of calcium, magnesium, iron, zinc, nickel, titanium, aluminum, silicon, barium and manganese.
- metal salts such as salts, oxides and hydroxides of calcium, magnesium, iron, zinc, nickel, titanium, aluminum, silicon, barium and manganese.
- These include magnesium hydroxide, magnesium carbonate, magnesium oxide, calcium oxalate, calcium carbonate, barium carbonate, barium sulfate, titanium dioxide, aluminum oxide, aluminum hydroxide and zinc sulfide.
- Silicates, bentonite, hydroxyapatite and hydrotalcites are also mentioned. Highly disperse silicas, magnesium pyrophosphate and tricalcium phosphate are particularly preferred.
- the Pickering systems can either be added to the water phase first, or added to the stirred oil-in-water emulsion. Some fine, solid particles are produced by precipitation, as described in EP-A-1 029 018 and EP-A-1 321 182.
- the highly disperse silicas can be dispersed as fine, solid particles in water.
- colloidal dispersions of silica in water.
- the colloidal dispersions are alkaline, aqueous mixtures of silica. The particles are swollen in the alkaline pH range and stable in water.
- the pH is adjusted to pH 2 to 7 with an acid during the oil-in-water emulsion.
- the inorganic protective colloids are generally used in amounts of 0.5 to 15% by weight, based on the water phase.
- the organic neutral protective colloids are used in amounts of 0.1 to 15% by weight, preferably 0.5 to 10% by weight, based on the water phase.
- the dispersion conditions for producing the stable oil-in-water emulsion are preferably chosen in a manner known per se such that the oil droplets have the size of the desired microcapsules.
- microcapsules can be incorporated into glue resins commonly used for lignocellulose-containing materials.
- lignocellulose-containing materials are, for example, wood chips from machined logs and billets, sawmill and veneer waste, planing and peeling chips and other lignocellulose-containing raw materials, e.g. Bagasse, flax slices, cotton stems, jute, sisal, straw, flax, coconut fibers, banana fibers, hemp and cork. Wood fibers or wood chips are particularly preferred.
- the raw materials can be in the form of granules, flour, or preferably chips, fibers and / or chips.
- Amine resins, phenolic resins, isocyanate resins and polycarbonate resins are preferred as glue resins.
- Suitable aminoplast resins are binders based on formaldehyde condensates of urea or melamine. They are commercially available as aqueous solutions or powders under the names Kaurit ® and Kauramin ® (manufacturer BASF) and contain urea and / or melamine-formaldehyde precondensates. Mixed condensates and condensates, which may contain other components such as phenol or other aldehydes, are common.
- Suitable aminoplast resins and phenolic resins are urea-melamine-formaldehyde condensates, melamine-urea-formaldehyde phenol condensates, phenol-formaldehyde condensates, phenol-resorcinol
- Formaldehyde condensates, urea-formaldehyde condensates and melamine formaldehyde condensates and their mixtures Their manufacture and use is generally known. As a rule, the precondensation of the starting materials is carried out up to a viscosity of 200 to 500 mPas (based on a 66% by weight resin solution).
- Urea-formaldehyde resins are preferred, in particular those with a molar ratio of 1 mol of urea to 1.1 to 1.4 mol of formaldehyde.
- the soluble and meltable aminoplast precondensates are converted into infusible and insoluble products.
- curing it is known that cross-linking of the pre-condensates, which is usually accelerated by hardeners.
- the hardeners known to those skilled in the art for urea, phenol and / or melamine-formaldehyde resins such as acid-reacting and / or acid-releasing compounds, e.g. Ammonium or amine salts.
- the hardener content in a glue resin liquor is 1 to 5% by weight based on the liquid resin content.
- MDI methylene diphenylene isocyanates
- Suitable isocyanate resins are for example as Lupranat® ® grades (from E lastogran) are commercially available.
- glue resins are polycarboxylic acid resins which are Suitable as glue resins.
- Polymers which contain maleic acid and / or maleic anhydride as monomers a) are particularly preferred.
- Preferred monomers b) are acrylic acid, methacrylic acid, ethene, propene, butene, isobutene, cyclopentene, methyl vinyl ether, ethyl vinyl ether, acrylamide, 2-acrylamido-2-methylpropanesulfonic acid, vinyl acetate, styrene, butadiene, acrylonitrile or mixtures thereof.
- Acrylic acid, methacrylic acid, ethene, acrylamide, styrene and acrylonitrile or mixtures thereof are particularly preferred.
- the monomer b) comprises at least one C 3 -C 6 monocarboxylic acid, preferably acrylic acid, as comonomer b).
- the polymers can be prepared by conventional polymerization processes, e.g. by substance, emulsion, suspension, dispersion, precipitation and solution polymerization.
- the usual equipment is used for all polymerization methods, e.g. Stirred tanks, stirred tank cascades, autoclaves, tubular reactors and kneaders. As is known to the person skilled in the art, the process is carried out in the absence of oxygen.
- the method of solution and emulsion polymerization is preferably used.
- the polymerization is carried out in water, optionally with proportions of up to 60% by weight of alcohols or glycols, as solvents or diluents.
- the ethylenically unsaturated carboxylic acids can be completely or partially neutralized by bases before or during the polymerization.
- bases are, for example, alkali or alkaline earth metal compounds, ammonia, primary, secondary and tertiary amines such as diethanolamin and triethanolamine, and polybasic amines.
- the ethylenically unsaturated carboxylic acids are particularly preferably not neutralized either before or during the polymerization.
- a large number of variants can be used to carry out the polymerization continuously or batchwise.
- some of the monomers are initially introduced, if appropriate, in a suitable diluent or solvent and, if appropriate, in the presence of an emulsifier, a protective colloid or other auxiliaries, and the temperature is increased until the desired polymerization temperature is reached.
- the radical initiator, further monomers and other auxiliaries, such as regulators or crosslinking agents, are each metered in, if appropriate, in a diluent within a defined period.
- the polymers A) are preferably in the form of an aqueous dispersion or solution with solids contents of preferably 10 to 80% by weight, in particular 40 to 65% by weight.
- Alkanolamines with at least two OH groups such as diethanolamine, triethanolamine, diisopropanolamine, triisopropanolamine, methyldiethanolamine, butyldiethanolamine and methyldiisopropanolamine, are mentioned as component B). Triethanolamine is preferred.
- the polymer A) and the alkanol laminate B) are preferably used in such a ratio to one another that the molar ratio of carboxyl groups of component A) and the hydroxyl groups of component B) is 20: 1 to 1: 1, preferably 8 : 1 to 1.5: 1 and particularly preferably 5: 1 to 1.7: 1 (the anhydride groups are calculated here as 2 carboxyl groups).
- polycarboxylic acid resins takes place e.g. simply by adding the alkanolamine to the aqueous dispersion or solution of the polymers A).
- microcapsules can be added to the mixture of wood fibers or chips and binder used as the basis for the shaped bodies in various ways and at different points in the manufacturing process.
- microcapsules can be incorporated into the binder composition as a powder or, preferably, as a dispersion. 2 to 30% by weight, preferably 5 to 15% by weight, of microcapsules, based on the shaped body, are incorporated. However, it is also possible to dry the microcapsules together with the lignocellulose-containing materials in a first process step and then to thermally harden them with the glue resin.
- the present invention further relates to binder compositions containing 40-95% by weight, preferably 40-65% by weight, in particular 50-60% by weight of glue resin, calculated as a solid, 5-40% by weight, preferably 10-35% by weight .-%, in particular 20-30% by weight of microcapsules and optionally water based on 100% by weight of binder composition.
- auxiliaries and additives such as the hardeners, buffers, insecticides, fungicides, fillers, water repellents such as silicone oils, paraffins, waxes, fatty soaps, water retention agents, wetting agents and Flame retardants such as borates and aluminum hydroxide. Accordingly, these auxiliaries and additives can also be contained in the binder compositions according to the invention.
- the moldings according to the invention are in particular plates. Depending on the size of the lignocellulose-containing particles used, a distinction is made between OSB (oriented structural board) boards, chipboard and medium-density (MDF) and high-density (HDF) fiber boards.
- OSB oriented structural board
- MDF medium-density
- HDF high-density
- the binder composition according to the invention is preferably used for chipboard materials, in particular panels.
- the lignocellulose-containing materials can be coated directly with the microcapsules or the binder composition according to the invention.
- the lignocellulose-containing materials are mixed with the binder composition and this mixture is cured thermally, the binder composition comprising 40-95% by weight of glue resin and 5-40% by weight of microcapsules with a polymer as the capsule wall and a capsule core consisting predominantly of latent heat storage materials and 0 - Contains 20 wt .-% water.
- 9 to 30% by weight, preferably 12 to 20% by weight, of the aqueous binder composition are added to the lignocellulose-containing materials, based on the total amount of lignocellulose-containing material and binder composition.
- the viscosity of the aqueous binder composition is preferably (in particular in the production of moldings from wood fibers or wood chips) to 10 to 10,000, particularly preferably to 50 to 1,500 and very particularly preferably to 100 to 1,000 mPa-s (DIN 53019, rotational viscometer at 41 sec -1 ).
- the mixture of lignocellulose-containing materials and the binder composition can be predried, for example, at temperatures from 10 to 150 ° C and then to the shaped articles, e.g. at temperatures of 50 to 300 ° C, preferably 100 to 250 ° C and particularly preferably 140 to 225 ° C and pressures of generally 2 to 200 bar, preferably 5 to 100 bar, particularly preferably 20 to 50 bar to the moldings be pressed.
- temperatures from 10 to 150 ° C and then to the shaped articles e.g. at temperatures of 50 to 300 ° C, preferably 100 to 250 ° C and particularly preferably 140 to 225 ° C and pressures of generally 2 to 200 bar, preferably 5 to 100 bar, particularly preferably 20 to 50 bar to the moldings be pressed.
- the microcapsules are not destroyed, although the mold temperatures are usually above the softening temperatures of the capsule wall materials.
- binder compositions according to the invention are particularly suitable for the production of wood-based materials such as chipboard and wood fiber boards (cf. Wood chips and wood fibers can be produced.
- chipboard is generally known and is described for example in H. Deppe, K. Ernst Taschenbuch der Spanplattenentechnik, 2nd edition, Verlag Leinfelden 1982, described.
- the glue is dried on the previously dried chips in continuous mixers. Different chip fractions are usually glued differently in separate mixers and then separated (multi-layer boards) or poured together.
- the microcapsules can be added to the chips in aqueous solution before the dryer in a continuous mixer or during gluing. men or separately from the glue. A combination of the two methods is also possible.
- Chips are preferably used whose average chip thickness is 0.1 to 2 mm, in particular 0.2 to 0.5 mm, and which contain less than 6% by weight of water.
- the binder composition is applied to the wood chips as evenly as possible, for example by spraying the binder composition onto the chips in finely divided form.
- the glued wood chips are then spread to form a layer with a surface that is as uniform as possible, the thickness of the layer depending on the desired thickness of the finished chipboard.
- the scattering layer is cold pre-compressed if necessary and at a temperature of e.g. 100 to 250 ° C, preferably from 140 to 225 ° C by using pressures of usually 10 to 750 bar pressed to a dimensionally stable plate.
- the pressing times required can vary within a wide range and are generally between 15 seconds and 30 minutes.
- the wood fibers of suitable quality required to produce medium-density wood fiber boards (MDF) from the binders can be made from bark-free wood chips by grinding in special mills or so-called refiners at temperatures of approx. 180 ° C.
- the fibers are glued in the blowline after the refiner.
- the wood fibers are generally whirled up with an air stream and the binder composition is injected into the fiber stream thus produced ("blow-line" process).
- the glued fibers then pass through a dryer in which they are dried to a residual moisture of 7 to 13% by weight. Occasionally the fibers are first dried and subsequently glued in special continuous mixers.
- a combination of blowline and mixer gluing is also possible.
- the microcapsules can be added to the fibers in an aqueous solution in the blowline or separately from the glue.
- the ratio of wood fibers to binder composition based on the dry content or solids content is usually 40: 1 to 3: 1, preferably 20: 1 to 4: 1.
- the glued fibers are in the fiber stream at temperatures of e.g. Dried 130 to 180 ° C, spread into a nonwoven fabric, if necessary cold pre-compressed, and compressed to plates or moldings at pressures of 20 to 40 bar.
- the wood chips are dried to a residual moisture content of 1 - 4%, separated into the middle and top layer material and glued separately in a continuous mixer.
- the addition of the microcapsules to the wood chips can be done in aqueous solution before the dryer in a continuous mixer, or at the Gluing takes place together or separately from the glue. A combination of the two methods is also possible.
- the glued wood chips are then poured into mats, if necessary cold pre-compressed and pressed into boards in heated presses at temperatures of 170 to 240 ° C.
- the glued wood fibers can also, e.g. described in DE-OS 2417 243, processed into a transportable fiber mat.
- This semi-finished product can then be made into plates or molded parts, e.g. Interior door panels of motor vehicles are processed.
- binder compositions according to the invention are furthermore suitable for the production of plywood and blockboard by the generally known production processes.
- natural fiber materials such as sisal, jute, hemp, straw, flax, coconut fiber, banana fiber and other natural fibers can also be processed with the binders into sheets and moldings.
- the natural fiber materials can also be mixed with plastic fibers, e.g. Polypropylene, polyethylene, polyester, polyamide or polyacrylonitrile can be used. These plastic fibers can also act as cobinders in addition to the binder composition according to the invention.
- the proportion of plastic fibers is preferably less than 50% by weight, in particular less than 30% by weight and very particularly preferably less than 10% by weight, based on all chips, chips or fibers.
- the fibers can be processed using the method practiced with wood fiber boards.
- preformed natural fiber mats can also be impregnated with the binders according to the invention, optionally with the addition of a wetting aid.
- the impregnated mats are then e.g. at temperatures between 100 and 250 ° C and pressures between 10 and 100 bar pressed into sheets or molded parts.
- the moldings according to the invention are outstandingly suitable for interior applications such as wall and ceiling cladding. Furthermore, they can be surface-coated by coating, for example for the manufacture of furniture and laminate flooring. They have good heat storage properties.
- the plates according to the invention unexpectedly show good results in water absorption and in thickness swelling after water storage.
- Feed 1 1.09 g of t-butyl hydroperoxide, 70% by weight in water
- Feed 2 0.34 g of ascorbic acid, 0.024 g of NaOH, 56 g of H 2 O.
- the above water phase was introduced at room temperature and adjusted to pH 4 with 3 g of 10% nitric acid. After the oil phase had been added, the mixture was dispersed at 4800 rpm using a high-speed dissolver stirrer. After 40 minutes of dispersion, a stable emulsion with a particle size of 1 to 9 ⁇ m in diameter was obtained.
- the emulsion was heated with stirring with an anchor stirrer to 56 ° C. in 40 minutes, to 58 ° C. within a further 20 minutes, to 71 ° C. within a further 60 minutes and to 85 ° C. within a further 60 minutes. The resulting microcapsule dispersion was cooled to 70 ° C. with stirring and feed 1 was added.
- Feed 2 was metered in with stirring at 70 ° C. over 80 minutes. It was then cooled.
- the microcapsule dispersion formed had a solids content of 47.2% by weight and an average particle size of 5.8 ⁇ m (volume average, measured by means of Fraunhofer diffraction).
- the dispersion could easily be dried in a laboratory spray dryer with a two-fluid nozzle and cyclone separation with 130 ° C inlet temperature of the heating gas and 70 ° C outlet temperature of the powder from the spray tower.
- Microcapsule dispersion and powder showed a melting point between 24.5 and 27.5 ° C. with a conversion enthalpy of 110 J / g alkane mixture when heated in differential calorimetry at a heating rate of 1 K / minute.
- Example 1 Chipboard with latent heat storage
- Thickness swelling The percentage increase in plate thickness due to water storage was determined using a caliper.
- Example 2 MDF board with latent heat storage
- the MDF board contained 14% solid resin / dry fibers, 0.5% solid wax / dry fibers and 5% microcapsules / dry fibers.
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Panels For Use In Building Construction (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57342004P | 2004-05-24 | 2004-05-24 | |
| PCT/EP2005/005522 WO2005116559A1 (de) | 2004-05-24 | 2005-05-21 | Formkörper aus lignocellulosehaltigen materialien |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1754012A1 true EP1754012A1 (de) | 2007-02-21 |
Family
ID=34968335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05744784A Withdrawn EP1754012A1 (de) | 2004-05-24 | 2005-05-21 | Formkörper aus lignocellulosehaltigen materialien |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20080033075A1 (de) |
| EP (1) | EP1754012A1 (de) |
| JP (1) | JP2008501809A (de) |
| WO (1) | WO2005116559A1 (de) |
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| JP5537776B2 (ja) | 2005-03-04 | 2014-07-02 | ビーエーエスエフ ソシエタス・ヨーロピア | マイクロカプセル粉末 |
| ATE451964T1 (de) * | 2006-07-13 | 2010-01-15 | Basf Se | Polyelektrolyt-modifizierte mikrokapseln |
| WO2008046839A1 (de) * | 2006-10-17 | 2008-04-24 | Basf Se | Mikrokapseln |
| WO2008071649A2 (de) | 2006-12-13 | 2008-06-19 | Basf Se | Mikrokapseln |
| DE102007026170A1 (de) * | 2007-06-04 | 2008-12-11 | Akzenta Paneele + Profile Gmbh | Laminierte Dekorplatte und Verfahren zu deren Herstellung |
| PT2234712T (pt) | 2007-12-19 | 2016-10-14 | Basf Se | Processo para a produção de microcápsulas |
| PL2223786T3 (pl) * | 2009-02-26 | 2015-02-27 | SWISS KRONO Tec AG | Płyta z tworzywa drzewnego oraz sposób wytwarzania płyty z tworzywa drzewnego |
| EP2442901A2 (de) * | 2009-06-15 | 2012-04-25 | Basf Se | Mikrokapseln mit hochverzweigten polymeren als vernetzer |
| AU2010270141B2 (en) | 2009-07-10 | 2015-05-07 | Basf Se | Microcapsules having polyvinyl monomers as cross-linking agents |
| CN102639620B (zh) | 2009-11-20 | 2014-01-22 | 巴斯夫欧洲公司 | 含有微珠的树脂泡沫 |
| WO2011095409A1 (de) | 2010-02-03 | 2011-08-11 | Basf Se | Melamin-/formaldehyd-schaumstoff mit in die struktur eingebauten mikrokapseln |
| JP2013538251A (ja) | 2010-07-20 | 2013-10-10 | ビーエーエスエフ ソシエタス・ヨーロピア | マイクロカプセル化した潜熱アキュムレータ材料を含有するポリアミド成形品 |
| US8957133B2 (en) | 2010-07-20 | 2015-02-17 | Basf Se | Polyamide moldings comprising microencapsulated latent-heat-accumulator material |
| US8937106B2 (en) | 2010-12-07 | 2015-01-20 | Basf Se | Melamine resin foams with nanoporous fillers |
| US9181466B2 (en) | 2011-02-16 | 2015-11-10 | Basf Se | Microcapsules with a paraffin composition as capsule core |
| KR101900522B1 (ko) | 2011-02-16 | 2018-09-19 | 바스프 에스이 | 캡슐 코어로서 파라핀 조성물을 가지는 마이크로캡슐 |
| US9353232B2 (en) | 2011-05-16 | 2016-05-31 | Basf Se | Melamine-formaldehyde foams comprising hollow microspheres |
| ES2690524T3 (es) | 2011-05-16 | 2018-11-21 | Basf Se | Espuma de melamina/formaldehído que contiene microesferas huecas |
| US8629196B2 (en) | 2011-05-16 | 2014-01-14 | The Procter & Gamble Company | Cleaning implement based on melamine-formaldehyde foam comprising hollow microspheres |
| EP2620211A3 (de) | 2012-01-24 | 2015-08-19 | Takasago International Corporation | Neue Mikrokapseln |
| ES3015693T3 (en) * | 2016-02-22 | 2025-05-07 | Wood Innovations Ltd | Lightweight board containing undulated elements |
| CN116890378B (zh) * | 2023-06-06 | 2024-06-11 | 索菲亚家居股份有限公司 | 一种片材及其制备方法和应用 |
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- 2005-05-21 EP EP05744784A patent/EP1754012A1/de not_active Withdrawn
- 2005-05-21 US US11/596,978 patent/US20080033075A1/en not_active Abandoned
- 2005-05-21 JP JP2007513770A patent/JP2008501809A/ja active Pending
- 2005-05-21 WO PCT/EP2005/005522 patent/WO2005116559A1/de not_active Ceased
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2008501809A (ja) | 2008-01-24 |
| US20080033075A1 (en) | 2008-02-07 |
| WO2005116559A1 (de) | 2005-12-08 |
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