EP1738623A1 - Procede de brasage par fusion - Google Patents

Procede de brasage par fusion

Info

Publication number
EP1738623A1
EP1738623A1 EP05752759A EP05752759A EP1738623A1 EP 1738623 A1 EP1738623 A1 EP 1738623A1 EP 05752759 A EP05752759 A EP 05752759A EP 05752759 A EP05752759 A EP 05752759A EP 1738623 A1 EP1738623 A1 EP 1738623A1
Authority
EP
European Patent Office
Prior art keywords
solder
mixed
soldering
absorption material
electromagnetic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05752759A
Other languages
German (de)
English (en)
Inventor
Horst Lettner
Rolf Diehm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seho Systemtechnik GmbH
Original Assignee
Seho Systemtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seho Systemtechnik GmbH filed Critical Seho Systemtechnik GmbH
Publication of EP1738623A1 publication Critical patent/EP1738623A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering

Definitions

  • the invention relates to a method for reflow soldering of conductor tracks with components and assemblies, which are applied to a printed circuit board by means of a solder paste, in which a radiation-absorbing absorption material is heated by radiation of an electromagnetic wave and this heating to the Solder paste for melting a solder contained in the solder paste is transferred.
  • the object of the invention is to keep the amount of heat generated and emitted via the absorption material as low as possible. According to the invention, this takes place in that the solder paste with the absorption material mixed material and the mixed material is applied to the solder joints of the conductor tracks.
  • the heat required for melting the solder is briefly, in particular abruptly, supplied to the solder and the soldering points by means of the concentration concentrated on the absorption material by the electromagnetic wave, since the absorption material is mixed with the solder paste, so that the resulting mixing material , which also contains the solder, can directly and directly transfer its heat generated by absorption to the solder, which is thus subjected to particularly intense direct heating, which leads to rapid soldering at solder joints. This only leads to a negligible further increase in the temperature of the components and assemblies, so that they cannot be damaged.
  • the mixed material is applied to the solder joint on the relevant point on the conductor track.
  • the soldering points are expediently preheated to a temperature of the solder below the melting point by means of heating acting on the soldering points from the outside, and then the soldering points are abruptly impacted by the electromagnetic wave Melt temperature of the solder brought.
  • the former heating can be, for example, infrared radiation or convection heating.
  • Additional heating of the solder joints in order to reduce the energy requirement at the solder joints can be expediently brought about by applying a lacquer layer to the part in question to which the absorption material is mixed.
  • the part in question is specifically heated, this warming is also attributed to the solder joints via the conductor.
  • the solder paste used in the method according to the invention is a commercially available material such as is available for reflow soldering.
  • This solder paste is mixed with the absorption material, which consists, for example, of a metal powder with a binder.
  • the powder can also be metal oxides, as are known with regard to their property of absorbing electromagnetic waves.
  • Figure 1 shows the prepared soldering point of a conductor track with an assembly
  • Figure 2 shows a fully soldered solder joint
  • FIG. 3 shows a similar solder joint, in which the assembly additionally has a lacquer layer in the area of its solder joint, to which the absorption material is admixed;
  • FIG. 4 shows a similar solder joint, in which the conductor track additionally has a lacquer layer in the area of its solder joint, to which the absorption material is admixed;
  • Figure 5 shows an apparatus for performing the method according to the invention.
  • the conductor track 2 is applied, which is, for example, a copper layer.
  • the conductor track 2 carries a pad 3 made of the mixed material, which consists of a solder paste and an admixed absorption material.
  • the assembly 4 On the Pad 3 is the assembly 4, which is provided with the contact point 5, which is held in contact with the conductor track 2 via the pad 3.
  • Such a connection for a later R flow soldering is known.
  • FIG. 2 shows the circuit board 1 with the assembly 4 according to FIG. 1 in the soldered state.
  • the pad 3 according to FIG. 1 has become the solder joint 7, which connects the contact point 5 of the assembly 4 to the conductor track 2 by means of continuous soldering.
  • FIG. 3 shows a modification of the arrangement according to FIG. 1, which is an additional lacquer layer 6 with which the contact point 5 is coated.
  • the lacquer layer 6 is admixed with the absorption material which, when irradiated with an electromagnetic wave, heats up and additionally emits its heat to the pad 3, so that the heat requirement of the pad 3 is reduced accordingly.
  • FIG. 4 shows an arrangement similar to the arrangement according to FIG. 3, in which the additional lacquer layer 17 is applied to the conductor track 2, specifically in the area where the pad 3 is located.
  • the lacquer layer 17 is provided with the absorption material in the arrangement according to FIG ,
  • lacquer layers 6 and 17 according to FIGS. 3 and 4 can also be applied together on the conductor track 2 and the contact point 5, which results in particularly intensive supplementary heating.
  • FIG. 5 shows a device for carrying out the method described above.
  • the device contains three stages, namely the initial stage 8 for preheating the printed circuit boards 9 by means of the fan heater 16, which by a conveyor 10 can be transported through the device.
  • the conveyor 10 is a commonly known assembly, such as those used in soldering systems.
  • the initial stage 8 is followed by the middle stage 11, which is provided with the radiator 12, the radiation of which is indicated by the wavy lines 13 emerging from it.
  • This radiation is electromagnetic waves, in particular microwaves, which are, for example, in a frequency range from 300 MHz to 100 GHz.
  • the radiation is then absorbed by the pads of mixed material applied to the soldering points of the printed circuit boards 9, and because of the preheating applied by the initial stage 8 in the middle stage 11, only a short burst of radiation is required in order to melt the solder contained in the mixed material bring and thus solder the relevant contact points together.
  • the middle stage 12 is then followed by the final stage 14, which serves to cool the soldered printed circuit boards passing through it.
  • the output stage 14 is provided with an outlet 15, from which a cooled gas, in particular nitrogen, emerges. The gas can also be cooled. Then the printed circuit boards 9 emerge from the output stage 14 as completely soldered printed circuit boards.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé et un dispositif permettant de braser par fusion des tracés conducteurs comportant des composants et des blocs de composants (4), montés sur une carte de circuit (1) au moyen d'une pâte à souder. Selon ce procédé, sous l'effet du rayonnement d'une onde électromagnétique, un matériau d'absorption absorbant ledit rayonnement est échauffé et cet échauffement est transmis à la pâte à souder afin de faire fondre un apport de brasage contenu dans ladite pâte à souder. La pâte à souder est mélangée au matériau d'absorption pour former un matériau mixte (3) et ledit matériau mixte est appliqué sur les points de brasage des cartes de circuit (2).
EP05752759A 2004-04-13 2005-04-06 Procede de brasage par fusion Withdrawn EP1738623A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004017772A DE102004017772A1 (de) 2004-04-13 2004-04-13 Verfahren zum Reflow-Löten
PCT/EP2005/003611 WO2005101932A1 (fr) 2004-04-13 2005-04-06 Procede de brasage par fusion

Publications (1)

Publication Number Publication Date
EP1738623A1 true EP1738623A1 (fr) 2007-01-03

Family

ID=34970774

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05752759A Withdrawn EP1738623A1 (fr) 2004-04-13 2005-04-06 Procede de brasage par fusion

Country Status (6)

Country Link
US (1) US20070246514A1 (fr)
EP (1) EP1738623A1 (fr)
DE (1) DE102004017772A1 (fr)
MX (1) MXPA06011768A (fr)
TW (1) TW200533448A (fr)
WO (1) WO2005101932A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10361230A1 (de) * 2003-12-24 2005-07-28 Ticona Gmbh Verbundkörper, Verfahren zu dessen Herstellung und dessen Verwendung
US7985657B1 (en) * 2005-10-24 2011-07-26 Microwave Bonding Instruments, Inc. Systems and methods for bonding materials using microwave energy
DE102007005345B4 (de) 2007-02-02 2014-06-18 Seho Systemtechnik Gmbh Verfahren zum Reflow-Löten sowie Vorrichtung zur Durchführung des Verfahrens
DE102014106631B4 (de) 2013-05-10 2021-12-02 Seho Systemtechnik Gmbh Vorrichtung und Verfahren zum Herstellen von Lötverbindungen
JP6497524B2 (ja) * 2016-05-31 2019-04-10 パナソニックＩｐマネジメント株式会社 はんだ材料
KR102409913B1 (ko) * 2017-12-06 2022-06-16 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
EP4061102A4 (fr) * 2019-11-15 2023-12-13 National Institute Of Advanced Industrial Science and Technology Carte de câblage de montage, carte montée sur un composant électronique, procédé de montage d'un composant électronique, procédé de chauffage par micro-ondes et dispositif de chauffage par micro-ondes
DE112020005768T5 (de) * 2019-11-26 2022-09-08 National Institute Of Advanced Industrial Science And Technology Durch ein magnetisches feld schmelzendes lötmittel, und verbindungsverfahren,in dem dieses verwendet wird

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59110462A (ja) * 1982-12-14 1984-06-26 Matsushita Electric Ind Co Ltd はんだ付け方法
DE3720912A1 (de) * 1986-07-03 1988-01-07 Licentia Gmbh Verfahren und anordnung zum reflow-loeten und reflow-entloeten von leiterplatten
DE3810370A1 (de) * 1988-03-26 1989-10-05 Bosch Gmbh Robert Verfahren zum herstellen von elektrischen verbindungen
AT398877B (de) * 1991-10-31 1995-02-27 Philips Nv Zwei- oder mehrlagige leiterplatte, verfahren zum herstellen einer solchen leiterplatte und laminat für die herstellung einer solchen leiterplatte nach einem solchen verfahren
DE4327683A1 (de) * 1993-08-13 1994-03-17 Manfred Goellner Bearbeitungseinrichtung unter Verwendung elektromagnetischer Strahlung
US5607609A (en) * 1993-10-25 1997-03-04 Fujitsu Ltd. Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
JP3385872B2 (ja) * 1995-12-25 2003-03-10 三菱電機株式会社 はんだ供給法およびはんだ供給装置
GB2376201A (en) * 2001-09-26 2002-12-11 Bookham Technology Plc Joining method
DE10316513B4 (de) * 2003-04-09 2015-07-09 Endress + Hauser Gmbh + Co. Kg Durchlauf-Lötofen und Verfahren zum Erwärmen von Leiterplatten in einem Durchlauf-Lötofen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005101932A1 *

Also Published As

Publication number Publication date
WO2005101932B1 (fr) 2006-01-19
WO2005101932A1 (fr) 2005-10-27
TW200533448A (en) 2005-10-16
US20070246514A1 (en) 2007-10-25
MXPA06011768A (es) 2007-03-21
DE102004017772A1 (de) 2005-11-03

Similar Documents

Publication Publication Date Title
WO2005101932A1 (fr) Procede de brasage par fusion
DE3423172C2 (de) Verfahren zum Herstellen einer Solarbatterie
EP0528350B1 (fr) Méthode de soudage et montage de composant sur plaquettes de circuits imprimés
DE60205159T2 (de) Lötverfahren zur Verbindung von Kunststoff-Flexleiterplatten mit einem Diodelaser
DE10136524A1 (de) Verbindungsverfahren und Verbindungsstruktur von gedruckten Leiterplatten
DE10111718A1 (de) Elektronisches Schaltungsbauteil
EP2361001A1 (fr) Masque de soudage pour procédé de brasage à la vague et procédé de soudage sélectif de composants individuels d'une plaquette dans un automate de brasage à la vague
CH647908A5 (de) Verfahren und anordnung zum kontaktieren der leiterbahnen von leiterplatten mit kontaktstiften.
DE4446289C2 (de) Verfahren zur Mikroverbindung von Kontaktelementen
EP1917844B1 (fr) Procede pour souder des composants smd sur une carte de circuits imprimes et four de soudure par refusion a cet effet
DE10259195B4 (de) System und Verfahren zum Löten von Oberflächenmontagekomponenten an ein Substrat unter Verwendung eines Lasers
DE1690298A1 (de) Auf glasartige Koerper aufgebrachte Bestandteile elektrischer Anordnungen
DE102006035528A1 (de) Verfahren und Wellenlötanlage zum Löten von Bauteilen auf Ober- und Unterseite einer Leiterplatte
EP1275462A1 (fr) Procédé et dispositif pour souder des elements électriques sur une feuille plastique
EP0307766A1 (fr) Circuit imprimé permettant le montage de composants SMD
DE102006026948B3 (de) Beheizungseinrichtung
DE102005043279A1 (de) Leiterplatte und Verfahren zur Lötung von SMD-Bauteilen in einem Reflow-Lötofen und anschließender selektiver Lötung von wenigstens einem bedrahteten Bauteil
DE4103098C1 (fr)
DE3390451C2 (de) Verfahren zum Laser-L¦ten
EP3762171B1 (fr) Procédé de fabrication d'un ensemble sandwich
DE102006044327B4 (de) Gekennzeichnete Holzfaserdämmstoffe
DE19509786A1 (de) Verfahren zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte
EP2747531B1 (fr) Procédé de fabrication de cartes de circuit imprimé à composants mixtes
DE10316513B4 (de) Durchlauf-Lötofen und Verfahren zum Erwärmen von Leiterplatten in einem Durchlauf-Lötofen
DE10123852C1 (de) Verfahren zur Laserbearbeitung, insbesondere zum Laserlöten und/oder Laserschweissen, von Teilen mit hoher Reflektivität

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20061113

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20071213

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20100923