EP1737035A4 - Heat sink manufacturing method - Google Patents

Heat sink manufacturing method

Info

Publication number
EP1737035A4
EP1737035A4 EP05727986A EP05727986A EP1737035A4 EP 1737035 A4 EP1737035 A4 EP 1737035A4 EP 05727986 A EP05727986 A EP 05727986A EP 05727986 A EP05727986 A EP 05727986A EP 1737035 A4 EP1737035 A4 EP 1737035A4
Authority
EP
European Patent Office
Prior art keywords
heat sink
sink manufacturing
manufacturing
heat
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05727986A
Other languages
German (de)
French (fr)
Other versions
EP1737035A1 (en
Inventor
Mitsuo Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JISOUKEN CO Ltd
Original Assignee
JISOUKEN CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JISOUKEN CO Ltd filed Critical JISOUKEN CO Ltd
Publication of EP1737035A1 publication Critical patent/EP1737035A1/en
Publication of EP1737035A4 publication Critical patent/EP1737035A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP05727986A 2004-03-31 2005-03-31 Heat sink manufacturing method Withdrawn EP1737035A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004104919 2004-03-31
PCT/JP2005/006309 WO2005096376A1 (en) 2004-03-31 2005-03-31 Heat sink manufacturing method

Publications (2)

Publication Number Publication Date
EP1737035A1 EP1737035A1 (en) 2006-12-27
EP1737035A4 true EP1737035A4 (en) 2010-01-20

Family

ID=35064076

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05727986A Withdrawn EP1737035A4 (en) 2004-03-31 2005-03-31 Heat sink manufacturing method

Country Status (6)

Country Link
US (1) US20070223195A1 (en)
EP (1) EP1737035A4 (en)
JP (1) JP4601610B2 (en)
KR (1) KR100978917B1 (en)
CN (1) CN1938847B (en)
WO (1) WO2005096376A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381494B (en) * 2004-01-07 2013-01-01 Jisouken Co Ltd Cooling device
JP4969973B2 (en) * 2005-11-16 2012-07-04 臼井国際産業株式会社 heatsink
JP2008098591A (en) * 2006-10-16 2008-04-24 Jigyo Sozo Kenkyusho:Kk Heat sink and method of manufacturing the same
WO2009005285A2 (en) * 2007-07-05 2009-01-08 Fawoo Technology Co., Ltd. Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device
KR100906087B1 (en) * 2007-10-26 2009-07-06 화우테크놀러지 주식회사 A led lighting fitting
JP2009188032A (en) * 2008-02-04 2009-08-20 Fuji Electric Systems Co Ltd Power converting device
EP2293328B1 (en) * 2008-06-12 2019-11-20 Mitsubishi Electric Corporation Method for manufacturing a power semiconductor circuit device
KR100904391B1 (en) * 2008-06-30 2009-06-26 박교양 Heatproof lamp
US20100123848A1 (en) * 2008-11-18 2010-05-20 Samsung Electronics Co., Ltd. Led module and liquid crystal display having the same
EP3113590B1 (en) * 2015-06-30 2020-11-18 ABB Schweiz AG Cooling apparatus
KR102433388B1 (en) * 2015-10-22 2022-08-17 삼성전자주식회사 Outdoor unit of air conditioner, cooling unit applying the same and method of manufacturing cooling unit
EP3293453A1 (en) * 2016-09-09 2018-03-14 Valeo Iluminacion Lighting device with a heat dissipation element
CN106455443A (en) * 2016-11-03 2017-02-22 常州热盛换热器有限公司 Radiator and forming process based on same
CN107717357A (en) * 2017-11-14 2018-02-23 北京动力机械研究所 A kind of manufacture method of special-shaped curved sandwich metal shell
US10651109B2 (en) * 2018-07-16 2020-05-12 Infineon Technologies Ag Selective plating of semiconductor package leads

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE561245A (en) *
US2595457A (en) * 1947-06-03 1952-05-06 Air Preheater Pin fin heat exchanger
GB768464A (en) * 1954-10-25 1957-02-20 Gallay Ltd Improvements in or relating to heat exchanger elements
DE1165621B (en) * 1957-10-23 1964-03-19 Helmut Alfred Freyholdt Heat exchanger element with wire-shaped elements in the channels and dividing walls made of stacked strips
US3543844A (en) * 1968-05-17 1970-12-01 Air Reduction Multiple-pass heat exchanger for cryogenic systems
GB2146423A (en) * 1984-09-07 1985-04-17 Redpoint Limited Heat transfer devices
US20020079097A1 (en) * 2000-12-21 2002-06-27 Seri Lee Heat sink

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1516430A (en) * 1921-08-25 1924-11-18 Christopher A Hess Water heater
US1960305A (en) * 1933-08-10 1934-05-29 Gen Motors Corp Radiator spiral coil tube
US2277462A (en) * 1939-12-22 1942-03-24 Gen Electric Heat transfer surface
US2784947A (en) * 1954-09-13 1957-03-12 Air Preheater Heat exchange assembly
GB1056104A (en) * 1962-07-20 1967-01-25 Oestbo John D B Improvements in or relating to heat-exchangers, pre-heaters and economizers
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
JPH0381640U (en) * 1989-12-07 1991-08-21
JPH0471257A (en) * 1990-07-11 1992-03-05 Hitachi Ltd Electronic device
JPH04243153A (en) * 1991-01-16 1992-08-31 Akutoronikusu Kk Heat sink and its manufacture
JP2873765B2 (en) * 1992-04-13 1999-03-24 アクトロニクス 株式会社 A sword-shaped heat sink having a group of pins
JPH06275746A (en) * 1993-03-18 1994-09-30 Hitachi Ltd Semiconductor device
JPH07297327A (en) * 1994-04-27 1995-11-10 Toshiba Corp Semiconductor device and manufacture thereof
JPH1154676A (en) * 1997-08-07 1999-02-26 Ebara Densen Kk Heat radiating parts
JP2002190557A (en) * 2000-12-21 2002-07-05 Fujikura Ltd Wire heat sink

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE561245A (en) *
US2595457A (en) * 1947-06-03 1952-05-06 Air Preheater Pin fin heat exchanger
GB768464A (en) * 1954-10-25 1957-02-20 Gallay Ltd Improvements in or relating to heat exchanger elements
DE1165621B (en) * 1957-10-23 1964-03-19 Helmut Alfred Freyholdt Heat exchanger element with wire-shaped elements in the channels and dividing walls made of stacked strips
US3543844A (en) * 1968-05-17 1970-12-01 Air Reduction Multiple-pass heat exchanger for cryogenic systems
GB2146423A (en) * 1984-09-07 1985-04-17 Redpoint Limited Heat transfer devices
US20020079097A1 (en) * 2000-12-21 2002-06-27 Seri Lee Heat sink

Also Published As

Publication number Publication date
JPWO2005096376A1 (en) 2008-02-21
WO2005096376A1 (en) 2005-10-13
EP1737035A1 (en) 2006-12-27
US20070223195A1 (en) 2007-09-27
JP4601610B2 (en) 2010-12-22
KR20070007312A (en) 2007-01-15
KR100978917B1 (en) 2010-08-31
CN1938847B (en) 2010-10-27
CN1938847A (en) 2007-03-28

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20060928

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20091217

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20100316