JP4969973B2 - heatsink - Google Patents

Description

  The present invention is arranged in contact with a heating element such as an electronic element, and the heat of the heating element is released by a radiation fin to cool it, or connected to a condensing part of a heat pipe, and the heat transferred by the heat pipe is externally provided. It relates to a heat sink that emits.

  In an electronic device such as a computer, the amount of heat generated by an electronic element such as a semiconductor is enormous. Therefore, in order to effectively cool this heat, as shown in Patent Documents 1 and 2 below, Exchangers are widely used. This heat sink is used by, for example, arranging a substrate as a heat receiving portion directly on the surface of a heating element such as an electronic element and fixing it to the heating element with fixing means such as screws.

  Among such conventional heat sinks, as shown in Patent Document 3, a metal wire is continuously formed in a rectangular uneven shape for the purpose of expanding the surface area and improving heat dissipation than those shown in Patent Documents 1 and 2. A fin member is formed by bending and a plurality of fin members are disposed on the surface of the substrate.

JP 2002-1511 A JP 2002-190558 A JP 2002-190557 A

  However, the fin member as shown in Patent Document 3 is a planar member in which rectangular irregularities are formed on the same plane with a wire rod. Therefore, it is easy to fall down and it is difficult to stably arrange on the surface of the substrate, and it takes time to arrange such a fin member densely on the substrate, so the fin member is arranged densely on the substrate. However, it has been difficult to increase the surface area and form many long edges.

  Accordingly, the present invention is intended to solve the above-described problems, and is capable of stably arranging the fin member on the substrate, has a large surface area, and has a high heat dissipation property in which a large number of long edges are formed. Is intended to be easily manufacturable.

To solve such problems described above, the present invention comprises a substrate, is fixed arranged a guide member which is manually formed to the wire material, the fin member formed by winding a wire helically, in contact with the guide member And arranged on the substrate. Thus, by disposing the fin member on the surface of the substrate via the guide member, the fin member is supported by the guide member and can be stably disposed on the substrate, and the fin member is disposed on the substrate. Since the fin member can be easily positioned on the substrate when the fin member is disposed, the positional accuracy of the fin member disposed on the substrate can be improved.

  Further, the fin member may be linearly arranged on the surface of the substrate, and the guide member may be linearly arranged on the surface of the substrate.

  Further, the fin member may be arranged in a spiral shape on the surface of the substrate. Thus, by arranging the fin members in a spiral shape on the substrate, the fin members can be densely and efficiently arranged on the substrate, and the heat dissipation surface area of the heat sink can be increased. In addition, a heat sink that is particularly preferable for an application in which cooling air flows radially from the vicinity of the center can be obtained.

  Further, the guide member may be arranged in a spiral shape on the surface of the substrate. Thus, by arranging the guide member in a spiral shape, the fin member can be easily arranged in a spiral shape along the guide member.

  Further, the fin member may be annularly arranged on the surface of the substrate. In this way, by disposing the fin members annularly on the substrate, it is possible to obtain a heat sink that is particularly preferable for applications in which cooling air flows radially from the vicinity of the center.

  Further, the guide member may be arranged in an annular shape on the surface of the substrate. Thus, by arranging the guide member in an annular shape, the fin member can be easily arranged in an annular shape along the guide member.

  Further, the fin members may be arranged radially on the surface of the substrate. Thus, by disposing the fin members radially on the substrate, it is possible to obtain a heat sink that is particularly preferable for applications in which cooling air flows radially from the vicinity of the center.

  The guide members may be arranged radially on the surface of the substrate. By arranging the guide members radially as described above, the fin members can be easily arranged radially along the guide members.

  Further, the fin member may be fixed to the surface of the substrate by brazing, bonding or welding. By fixing the fin member to the substrate in this way, the fin member can be stably disposed on the substrate. In addition, since the contact area between the fin member and the surface of the substrate increases, the heat transfer area increases and the heat dissipation effect can be enhanced.

  The fin member may be fixed to the guide member by brazing, bonding, or welding. By fixing the fin member to the guide member in this manner, the fin member can be placed in contact with the guide member in a stable state.

  The guide member may be fixed to the surface of the substrate by brazing, bonding, or welding. By fixing the guide member to the substrate in this manner, the guide member can be stably disposed on the substrate. Further, since the contact area between the guide member and the surface of the substrate is increased, the heat transfer area is increased and the heat dissipation effect can be enhanced.

  The fin member may be one in which one side is embedded in the substrate and fixed to the substrate. By embedding and arranging the fin member in the substrate in this way, the fin member can be fixedly arranged on the substrate in a stable state, and work such as brazing and bonding is not required, so that manufacturing is easy. It can be.

  The guide member may be one in which one side is embedded in the substrate and fixed to the substrate. By embedding and arranging the guide member in the substrate in this way, the guide member can be fixedly disposed on the substrate in a stable state, and work such as brazing and bonding is not required, so that manufacturing is easy. It can be.

  The present application is configured as described above, and the fin member is three-dimensionally formed by winding the wire in a spiral shape. Therefore, the fin member can be stably disposed on the substrate. It will be possible. Therefore, since such fin members can be easily arranged densely on the surface of the substrate, it is possible to easily manufacture a product with high heat dissipation having a large surface area and forming a large number of long edges. Become.

  Further, the present invention is such that a guide member is disposed on the surface of the substrate, and the fin member is disposed in contact with the guide member. The fin member is disposed on the substrate by disposing the guide member on the substrate in advance. Since the positioning accuracy of the fin member to be arranged on the substrate can be improved, the workability when arranging the fin member on the substrate can be improved. Moreover, since the guide member supports the fin member by arranging the fin member in contact with the guide member, the fin member can be stably arranged on the substrate.

  Embodiment 1 showing the present invention will be described with reference to FIGS. 1 to 3. (1) is a fin member formed by spirally winding a single wire (3), as shown in FIG. Are disposed on the surface of the substrate (2). The first embodiment will be described in more detail. The fin member (1) of the first embodiment has a flat oval shape as shown in FIG. 2 and is made of stainless steel, aluminum, an aluminum-based alloy, copper, and the like. , Copper-based alloy, nickel, iron, or other wire (3). Since the fin member (1) is formed in a three-dimensional manner by spirally forming the fin member (1) in this manner, the fin member (1) is stably disposed on the surface of the substrate (2). Is possible. The substrate (2) has a substantially square plate shape as shown in FIG. 1 and is made of aluminum. In other different embodiments, the substrate (2) can be formed of copper, an aluminum alloy, a copper alloy, or a casting of these metals.

  Further, a guide member (7) formed of a wire material is fixedly arranged on the surface of the substrate (2), and the fin member (1) is brought into contact with the guide member (7). Is disposed on the surface of the substrate (2).

  The first embodiment will be described in detail below. First, a plurality of guide members (7) formed of a wire material are arranged on the surface of the substrate (2). As shown in FIG. 1, these guide members (7) are arranged linearly from one end to the other end in parallel with a desired interval. Each guide member (7) is fixed to the substrate (2) by brazing. In the first embodiment, the guide member (7) is fixed to the substrate (2) by brazing as described above. However, in other different embodiments, the guide member (7) is bonded to the substrate (by bonding or welding). It is also possible to fix and arrange in 2).

Next, the fin member (1) formed by spirally winding a single wire (3) is placed on the substrate (2) to which the plurality of guide members (7) are fixed as described above. In this fin member (1) is in its winding shape as shown in FIG. 10 (a), oval forming the both side portions in a straight line as well as both ends and arcuate. As shown in FIG. 2, one side (6) of the fin member (1) is brought into contact with the surface of the substrate (2), and the outer periphery of the arcuate portion (10) of the linear piece (4) is The position of the fin member (1) is adjusted so that it contacts the guide member (7) of the book. In this way, the surface of the fin member (1) and the substrate (2) and the fin member (1) and the guide member (7) are continuously brought into contact from one end to the other end of the fin member (1). Alternatively, the fin member (1) is linearly fixed on the surface of the substrate (2) as shown in FIG. The fin member (1) is connected and fixed to the surface of the substrate (2) by brazing.

  By arranging the guide member (7) and the fin member (1) on the surface of the substrate (2) as described above, the fin member (1) is supported by the guide member (7) in the arcuate portion (10). It becomes. Therefore, the fin member (1) fixedly arranged on the substrate (2) becomes difficult to fall down due to the presence of the guide member (7). Accordingly, the fin member (1) is placed in a stable state as compared with the case where only one side (6) of the fin member (1) is fixedly arranged on the substrate (2) without arranging the guide member (7). It becomes possible to arrange in (2). Further, as described above, the fin member (1) is arranged along the guide member (7) fixed on the substrate (2), so that the fin member (1) can be easily positioned on the substrate (2). It is possible to improve the positional accuracy of the fin member (1) disposed on the substrate (2). Accordingly, it is possible to improve workability when the fin member (1) is disposed on the substrate (2).

  Further, by disposing not only the fin member (1) but also the guide member (7) on the surface of the substrate (2), the heat radiation surface area of the heat sink can be further increased, and the number of edges can be further increased. The turbulence effect can be further enhanced.

  In the first embodiment, as shown in FIG. 2, the fin member (1) is mounted on the substrate (1) in a state where one guide member (7) is in contact with the arcuate portion (10) of the fin member (1). 2), in the second embodiment, as shown in FIG. 4, the pair of guide members (7) are brought into contact with the arcuate portion (10) of the fin member (1), respectively. 1) is arranged on the substrate (2).

  The second embodiment will be described in detail. First, a plurality of pairs of linear guide members (7) parallel to each other and maintained at a constant interval are arranged on the surface of the substrate (2) with a desired interval therebetween. . The gap between the pair of guide members (7) is such that when the fin member (1) is disposed within the gap, one side (6) of the fin member (1) is placed on the substrate (2) as shown in FIG. ) And the outer periphery of the arcuate portion (10) of the fin member (1) is adjusted so that it can contact the pair of guide members (7) on both sides of the contact portion. . Accordingly, the fin member (1) is placed on the substrate (2) while the arcuate portion (10) of the fin member (1) and the pair of guide members (7) are in contact with both sides of the linear piece (4). It can be fixedly arranged on the surface.

  By arranging the fin member (1) on the surface of the substrate (2) as described above, as shown in FIG. 4, the arc-shaped portion (10) of the fin member (1) is located at two locations on one side (6). Since it is supported by the guide member (7), the fin member (1) is unlikely to fall down in either direction. Accordingly, the fin member (1) can be arranged on the surface of the substrate (2) in a more stable state.

  In the second embodiment and the first embodiment, the cross-sectional shape of the wire-shaped guide member (7) is circular as shown in FIG. 5 (a), but in other different embodiments, as shown in FIG. , (B) an ellipse, (c) a rectangle, or (d) a triangle.

Further, in the above first and second embodiments have the winding configuration is using oval fin member (1), in the third embodiment, as shown in FIG. 10 (c), the winding shape Is using a rectangular fin member (1). Thus, when the fin member (1) is arranged on the substrate (2) by using the rectangular fin member (1), one side (6) of the fin member (1) is placed on the substrate (2). It will be in line contact with the surface. Therefore, the contact area between the fin member (1) and the substrate (2) is widened, and the fin member (1) can be arranged in a stable state by the substrate (2), and the fins from the substrate (2) can be arranged. The amount of heat transfer to the member (1) increases, and the heat dissipation can be further improved.

Also, in the implementation example 4, the guide member (7), as shown in FIG. 6, are arranged on the surface of the base plate (2) continuously spiral. Then, along the guide member (7) disposed on the substrate (2) as described above, are disposed fin member (1).

In the embodiment 5, as shown in FIG. 7, and a plurality formed alignment guide member (7) and the fin member (1) radially.

Also, in the implementation example 6, as shown in FIG. 8, different radii annular guide member, respectively (7) a plurality form, the annular guide member (7), on the surface of the substrate (2), They are arranged on concentric circles centering on the central portion (5) of the substrate (2). A plurality of fin members (1) are annularly arranged on the surface of the substrate (2) along the guide members (7) which are annularly arranged on the surface of the substrate (2).

Further, in the above Symbol Example 1-6, although the cross-sectional shape of a circular wire (3) as shown in FIG. 9 (a), in other different embodiments, as shown in FIG. 9, (b) An arbitrary shape such as an ellipse, (c) rectangle, (d) triangle, (e) rhombus, and (f) star shape may be used. Further, in the third embodiment, the winding shape of the fin member (1) is rectangular as shown in FIG. 10 ( c), and in the first, second, fourth , and sixth embodiments, as shown in FIG. 10 ( a) . In other different embodiments, as shown in FIG. 10, an arbitrary winding shape such as (b) triangle, (d) square shape, (e) gourd shape, etc. may be used. Good . In addition , although the said Examples 1-5 and the present Example 6 demonstrated the case of heat dissipation, in the case of heat absorption, a heat flow becomes reverse.

  In another different embodiment, when the fin member (1) and / or the guide member (7) is bonded to the surface of the substrate (2) with an adhesive, the adhesive contains carbon nanofibers. Thus, heat transfer is improved, and a heat sink excellent in heat dissipation can be obtained, which is preferable. Further, when carbon nanofibers are contained in the substrate (2), the wire (4), and further the guide member (7), it is preferable because heat transfer is improved and a heat sink excellent in heat dissipation can be obtained.

In Example 1 , the top view which shows the state which has arrange | positioned the guide member on the board | substrate. 2 is a partial cross-sectional view of a heat sink showing Example 1. FIG. 1 is a plan view of a heat sink showing Example 1. FIG. FIG. 6 is a partial cross-sectional view of a heat sink showing Example 2. Sectional drawing which shows the guide member of Example 1, 2 and another different Example. FIG. 9 is a plan view of a heat sink showing Example 4; FIG. 9 is a plan view of a heat sink showing Example 5. 9 is a plan view of a heat sink showing Example 6. FIG. Sectional drawing of the wire which shows Examples 1-6 and another different Example. The conceptual diagram which shows the winding shape of the fin member which shows Examples 1-6 and another different Example.

1 Fin member 2 Substrate 3 Wire 6 One side 7 Guide member

Claims (14)

Heat sink on the surface of the substrate, is fixed arranged a guide member which is manually formed to the wire material, the fin member formed by winding a wire helically, characterized in that in contact with the guide member disposed on the substrate .   2. The heat sink according to claim 1, wherein the fin members are linearly arranged on the surface of the substrate.   The heat sink according to claim 1, wherein the guide member is linearly arranged on the surface of the substrate.   2. The heat sink according to claim 1, wherein the fin members are spirally arranged on the surface of the substrate.   The heat sink according to claim 1, wherein the guide member is disposed in a spiral shape on the surface of the substrate.   2. The heat sink according to claim 1, wherein the fin member is annularly arranged on the surface of the substrate.   2. The heat sink according to claim 1, wherein the guide member is annularly arranged on the surface of the substrate.   2. The heat sink according to claim 1, wherein the fin members are arranged radially on the surface of the substrate.   2. The heat sink according to claim 1, wherein the guide members are arranged radially on the surface of the substrate.   The heat sink according to claim 1, wherein the fin member is fixed to the surface of the substrate by brazing, bonding, or welding.   The heat sink according to claim 1, wherein the fin member is fixed to the guide member by brazing, bonding, or welding.   The heat sink according to claim 1, wherein the guide member is fixed to the surface of the substrate by brazing, bonding, or welding.   The heat sink according to claim 1, wherein the fin member is fixed to the substrate by embedding one side in the substrate.   The heat sink according to claim 1, wherein the guide member is fixed to the substrate by being embedded in one side of the guide member.