JPH07297327A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To expect a sufficient heat dissipation effect and to cope flexibly with the change in the mounting space in a ceramic package provided with a heat sink. CONSTITUTION:For example, a plurality of thin pure copper wires 12a of a heat sink 12 for heat dissipation of a PGA are fixed with a solder 12b each at one end. The other end of each wire is spread in the radiation pattern, so that the heat sink 12 is formed. The heat sink 12 is fixed to the surface of a ceramic case 11 of the PGA with the solder 12b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device provided with a radiator, for example, and a method for manufacturing the same, and is particularly used for a ceramic package device or the like.

[0002]

2. Description of the Related Art Conventionally, in the case of a ceramic package device in which heat generation is a problem, a heat sink 2 is provided on a package 1 as shown in FIG. 3 to solve the heat generation problem.

As a heat sink used in a ceramic package device, a disk-shaped heat sink is generally used in addition to a geta-shaped heat sink formed by mechanical processing as shown in the figure. Also, a heat sink formed by arranging a large number of cylindrical bodies has been devised.

However, since the surface area of the heat sink affects the heat radiation effect, there is a problem that the size of the heat sink must be increased in order to obtain a heat radiation effect to some extent.

Further, in order to obtain a sufficient heat radiation effect, the surface area of the heat sink needs to be increased, while the surface area of the heat sink cannot be increased more than necessary depending on the mounting space of the ceramic package, and therefore it is sufficient. There was a problem that it was difficult to obtain the heat dissipation effect.

[0006]

As described above, in the prior art, in order to obtain a certain amount of heat dissipation effect, the heat sink must be increased in size, but the surface area of the heat sink may be sufficient depending on the mounting space. There were problems such as being unable to earn money.

Therefore, an object of the present invention is to provide a semiconductor device which can expect a sufficient heat dissipation effect and can flexibly cope with a change in mounting space, and a manufacturing method thereof.

[0008]

In order to achieve the above object, in the semiconductor device of the present invention, an assembly of fine metal wires having excellent heat dissipation is provided on the surface of the envelope for housing the semiconductor chip. It is configured to have a heat radiator made of a body.

Further, according to the semiconductor device of the present invention,
On the surface of the envelope that houses the semiconductor chip, a plurality of thin metal wires having excellent heat dissipation properties are bundled and fixed at one end, and the other end is arranged radially to provide a radiator. .

Further, in the semiconductor device of the present invention, a heat dissipating member is provided on the surface of an envelope for accommodating a semiconductor chip, the heat dissipating member being formed by forming fine metal wires having excellent heat dissipating properties in the shape of a metal scissor. It is said that.

Similarly, in the method of manufacturing a semiconductor device according to the present invention, a heat dissipating member composed of an assembly of fine metal wires having excellent heat dissipating property is fixed to the surface of the envelope housing the semiconductor chip with a fixing agent. It is supposed to do.

Further, according to the method of manufacturing a semiconductor device of the present invention, on the surface of the envelope for housing the semiconductor chip,
One end of a plurality of thin metal wires with excellent heat dissipation is bundled and fixed by a fixing agent, and the other ends of the thin metal wires are cut to a predetermined length and then arranged radially to form a heat radiator. It has become.

Further, according to the method of manufacturing a semiconductor device of the present invention, a heat dissipating member is formed by forming thin metal wires having excellent heat dissipating properties in the form of a metal scissor on the surface of an envelope for housing a semiconductor chip. It is fixed by a fixing agent.

[0014]

According to the present invention, the surface area per unit volume can be increased by the above-mentioned means, so that the heat radiation effect or compactness can be improved accordingly. In addition, since the above-mentioned means enables flexible formation, it can be easily deformed.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration of a ceramic package device according to the first embodiment. In addition,
FIG. 1A is an external perspective view showing a schematic configuration of the ceramic package device, and FIG. 1B is a sectional view of the same.

That is, this ceramic package device is, for example, a PGA (Pin Grid Array).
Case 1 forming a package (enclosure)
A heat sink 12 as a radiator is provided on the surface of 1.

The PGA has a structure in which the semiconductor chip 13 is housed in the ceramic case 11, for example, and a large number of lead terminals 14 are juxtaposed from the back surface of the semiconductor chip 13.

Each lead terminal 14 of the PGA is electrically connected to each electrode pad (not shown) on the semiconductor chip 13 via a bonding wire 15.

The heat sink 12 is constructed, for example, such that one end of a plurality of thin pure copper wires (thin metal wires) 12a is put together by a solder 12b as a fixing agent, and the other ends thereof are radially spread.

The heat sink 12 is fixed to the surface of the PGA ceramic case 11 by the solder 12b, for example. Here, a method of forming the heat sink 12 will be described.

For example, one end of a plurality of pure copper wires 12a is fixed to the solder 12b in a bundled manner. Then, after each pure copper wire 12a is aligned and cut to a predetermined length, the other end of each pure copper wire 12a is radially expanded.

The heat sink 1 thus formed
For No. 2, it is possible to increase the surface area of the pure copper wire 12a by increasing the number of pure copper wires 12a fixed by the solder 12b and by fixing the pure copper wire 12a as closely as possible.

That is, in the case of this heat sink 12,
By increasing the number of pure copper wires 12a, the surface area per same volume can be easily increased. This makes it possible to increase the surface area easily and significantly compared with a conventional heat sink having a geta structure. Therefore, the thermal resistance can be reduced and a higher heat dissipation effect can be obtained.

Moreover, the pure copper wire 1 fixed to the solder 12b
The surface area of the heat sink 12 can be freely changed according to the number and length of the 2a, and the heat dissipation effect can be easily adjusted.

Since the pure copper wire 12a has flexibility, it can be easily deformed according to the mounting space of the ceramic package device. For example, when the mounting space has a margin in the height direction, the radiation angle is narrowed, and when the mounting space has a margin in the lateral direction, the radiation angle is conversely widened to improve the mountability.

It is also possible to form a plurality of pure copper wires 12a, which are cut into a predetermined length in advance, by fixing one end with solder 12b and then expanding the other end radially.

FIG. 2 shows a schematic structure of a ceramic package device according to the second embodiment. It should be noted that FIG. 1A is an external perspective view showing a schematic configuration of the ceramic package device, and FIG. 1B is a sectional view of the same.

That is, in this ceramic package device, for example, a heat sink 22 as a radiator is provided on the surface of a ceramic case 11 forming a PGA package.
Is provided.

The PGA has a structure in which the semiconductor chip 13 is housed in the ceramic case 11, for example, and a large number of lead terminals 14 are juxtaposed from the back surface of the semiconductor chip 13.

Each lead terminal 14 of the PGA is electrically connected to each electrode pad (not shown) on the semiconductor chip 13 via a bonding wire 15.

The heat sink 22 is, for example, a thin pure copper wire (thin metal wire) 22a rolled into a mess and formed into a so-called metal scissor shape.
It is fixed to the surface of the.

Here, a method for forming the heat sink 22 will be described. For example, thin and long pure copper wires 22a are irregularly gathered and formed into a metal scourer. In this case, the long pure copper wire 22a can be formed by pushing the long pure copper wire 22a into a case (not shown) having a predetermined shape through a narrow hole to crush it into a long shape, or shaving a pure copper columnar body into an elongated shape.

In this way, the lump of the pure copper wire 22a formed by the pure copper wire 22a having the predetermined length is fixed by the solder 22b. In the heat sink 22 thus formed, the surface area of the pure copper wire 22a can be increased by extending the length of the pure copper wire 22a and assembling it as close as possible.

That is, in the case of this heat sink 22,
By using a very long pure copper wire 22a and forming it small, the surface area per same volume can be easily increased. This makes it possible to increase the surface area easily and significantly compared with a conventional heat sink having a geta structure. Therefore, the thermal resistance can be reduced and a higher heat dissipation effect can be obtained.

Moreover, the surface area of the heat sink 22 can be freely changed according to the length of the pure copper wire 22a, and the heat dissipation effect can be easily adjusted. Also,
Since the pure copper wire 22a has flexibility, it can be easily deformed according to the mounting space of the ceramic package device. For example, the mountability can be improved by, for example, squeezing and reducing the size when there is no mounting space, and conversely expanding it when there is space.

The same operation can be performed by curling a plurality of pure copper wires 22a, one end of which is fixed to the solder 22b in advance, and winding them into a coil, and then collecting them.

As described above, the surface area per unit volume can be increased. That is, the heat sink is formed by densely providing thin pure copper wires. As a result, the surface area of the heat sink can be easily increased, and the heat dissipation effect or compactness can be improved accordingly. Therefore, a sufficient heat dissipation effect can be expected without causing an increase in size.

Further, since it can be formed with flexibility, it can be easily deformed, and it is possible to flexibly cope with changes in the mounting space. In the above embodiment, the PGA is taken as an example,
The present invention is not limited to this, and can be similarly applied to, for example, other ceramic package devices and various package devices in which heat generation is a problem.

The fine metal wire is not limited to pure copper wire,
It is also possible to use a fine wire having excellent heat dissipation such as gold. Further, other than solder, various adhesives having excellent heat conductivity can be used. Of course, various modifications can be made without departing from the scope of the invention.

[0040]

As described above in detail, according to the present invention, it is possible to provide a semiconductor device which can expect a sufficient heat dissipation effect and can flexibly cope with a change in mounting space, and a manufacturing method thereof.

[Brief description of drawings]

FIG. 1 is a configuration diagram schematically showing a ceramic package device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram schematically showing a ceramic package device according to a second embodiment of the present invention.

FIG. 3 is a schematic configuration diagram of a ceramic package device shown for explaining the related art and its problems.

[Explanation of symbols]

11 ... Ceramic case, 12, 22 ... Heat sink,
12a, 22a ... Pure copper wire, 12b, 22b ... Solder, 13
... semiconductor chip, 14 ... lead terminal, 15 ... bonding wire.

Claims (6)

[Claims] 1. A semiconductor device comprising a heat radiator made of an assembly of fine metal wires having excellent heat radiation property provided on a surface of an envelope for housing a semiconductor chip. 2. A heat radiating body, in which one end of a plurality of thin metal wires having excellent heat dissipation is bundled and fixed and the other end is radially arranged on the surface of an envelope for housing a semiconductor chip. A semiconductor device characterized by the above. 3. A semiconductor device comprising a heat radiator formed by forming thin metal wires having excellent heat radiation in a metal scissor shape on the surface of an envelope for housing a semiconductor chip. 4. A semiconductor device manufacturing method characterized in that a heat-dissipating member made of an assembly of fine metal wires having excellent heat-dissipating property is fixed on a surface of an envelope for accommodating a semiconductor chip by a fixing agent. Method. 5. A plurality of thin metal wires having excellent heat dissipation properties are bundled and fixed by a fixing agent on the surface of an envelope containing a semiconductor chip, and the other ends of the thin metal wires have a predetermined length. A method for manufacturing a semiconductor device, comprising: arranging and cutting the same, and arranging them radially to form a radiator. 6. A heat dissipating member comprising a metal scissor-like metal thin wire excellent in heat dissipating property fixed to the surface of an envelope accommodating a semiconductor chip by a fixing agent. Manufacturing method of semiconductor device.