EP1706770A1

EP1706770A1 - Printed circuit board element comprising at least one optical waveguide, and method for the production of such a printed circuit board element

Info

Publication number: EP1706770A1
Application number: EP04802021A
Authority: EP
Inventors: Günther LEISING; Arno Klamminger; Gregor Langer; Volker Schmidt; Riika Reitzer
Original assignee: AT&S Austria Technologie und Systemtechnik AG
Current assignee: AT&S Austria Technologie und Systemtechnik AG
Priority date: 2003-12-29
Filing date: 2004-12-28
Publication date: 2006-10-04
Also published as: ATA20962003A; KR20060131816A; CA2551654A1; EP2309294A3; AT413891B; JP2007517248A; EP2309294A2; WO2005064381A1; KR101122442B1; US20080044127A1

Abstract

Disclosed is a printed circuit board element comprising an optical waveguide and an embedded optoelectronic element.

Description

Printed circuit board element with at least one optical waveguide and method for producing such a printed circuit board element

The invention relates to a circuit board element with at least one optical waveguide provided in an optical layer and with at least one optoelectronic component which is in optical connection with the optical waveguide.

The invention further relates to a method for producing such a circuit board element.

In electronics, the speed and complexity of electronic components, such as processors, are increasing rapidly, and this increase in performance also leads to an enormous increase in the data rates with which these electronic components are fed and communicate with other components. The transmission of the high amounts of data required presents a special challenge to the signal connections between the components. To meet these requirements, optical signal connections have already been proposed in printed circuit boards.

For example, WO 01/16630 AI discloses a circuit board element which is designed as a conventional multilayer circuit board, but including an optical waveguide layer. In detail, this known circuit board element is conventionally fitted with electronic components on the outside, and embedded in the circuit board structure are optoelectronic components in the form of a laser element and a photodiode, which are electrically connected to the external electronic components. These optoelectronic components are accommodated in a buffer layer adjacent to an optical waveguide layer, and mirrors or grating structures are provided in this optical waveguide layer for optical signal transmission in alignment with the optoelectronic components, so that the laser beam or light beam is appropriately introduced into the optical waveguide. To divert the layer into or out of it. The disadvantage here is that the production Alignment of the optoelectronic components and these deflection elements is critical, and that, moreover, losses due to the passive optical deflection elements have to be accepted. The optical waveguide layer consists in particular of a polyimide material, which is applied by means of a spin coating and cured at elevated temperature, producing flat light waveguide structures within which the respective laser beam is aligned with the aid of the passive deflection elements, etc. It is therefore also essential for this that a well-focused laser beam is generated by the laser component.

On the other hand, it is already known, for example from WO 01/96915 A2, WO 01/96917 A2 and US 4,666,236 A, to use optical or waveguide structures in an organic or inorganic, optical material, for example in block form, with the aid of photon absorption processes generate, wherein the optical material is locally converted when irradiated with photons such that it has a larger refractive index compared to the rest of the optical material. The known optical waveguide structures are used as optocoupler components for coupling optical fiber cables to one another or with optoelectronic components. These known optocoupler components can therefore only be used in very special cases.

A comparable optical component with a light guide, but without an optically structured light guide layer, is disclosed in US Pat. No. 4,762,381 A. Here, too, it is essentially only a matter of coupling light into the light guide, a light source being embedded directly in the light guide material.

It is then known from EP 1 219 994 A2 to install a flat waveguide layer in a semiconductor device with a platelet-shaped substrate, the electro-optical components being arranged on the surface of the waveguide layer; only limited applications of the semiconductor devices are possible here. A similar integrated circuit is described in US 2002/0081056 AI, a multilayer optical layer with a core layer between cladding layers, on a semiconductor substrate, is provided. In this case, an optoelectronic component is arranged in one of the cladding layers, that is to say not in the core layer forming the actual light guide.

It is an object of the invention to provide a circuit board element as stated at the outset and to provide a method for producing such a circuit board element, the construction of the circuit board element being simple and the production simple and in particular uncritical with regard to the positioning of individual elements and, moreover, optical losses during operation of the circuit board element be reduced to a minimum.

To achieve this object, the circuit board element according to the invention of the type mentioned at the outset is characterized in that the optoelectronic component is embedded in the optical layer and the light waveguide structured by radiation within the optical layer on the optoelectronic component. then .. ...

In a corresponding manner, the method for producing such a printed circuit board element according to the invention is characterized in that at least one optoelectronic component is attached to a substrate, and then an optical layer is formed on the substrate, which consists of an optical material that changes its refractive index under photon irradiation, is applied, the optoelectronic component being embedded in the optical layer, and then a waveguide structure adjoining the optoelectronic component being produced in the optical layer by photon irradiation.

Advantageous embodiments and further developments are defined in the subclaims.

In the technology according to the invention, optoelectronic components are directly embedded in the optical layer, ie surface mounting of such components is avoided. It follows that the position tioning of the optoelectronic components is not critical, and that the alignment of the optical waveguide structure is comparatively uncritical. Since the optoelectronic components are embedded directly in the optical layer and the waveguide structure is thus de facto directly provided next to these optoelectronic components, there is not only a simplified structure in this respect as mirrors, gratings and the like. can be dispensed with, but it also enables a lower overall height of the circuit board element, apart from the fact that losses caused by passive optical elements such as mirrors and gratings are avoided. This enables, for example, multilayer printed circuit boards with integrated optical signal connections, which enable the transfer of large amounts of data between components and modules, such as between processors and memories. For example, data transfer rates of well over 10 Gbit / s can be achieved. It is also an advantage that, on the one hand, conventional circuit board technologies with copper conductor connections and, on the other hand, optical signal connections where large amounts of data are available. are transferred, can be combined, and there may also be printed circuit board structures as a whole which, like conventional printed circuit boards, for example a so-called motherboard, can be installed in computer systems etc.

The structuring of the light waveguides within the optical layer can advantageously be carried out in such a way that the optoelectronic component already embedded in the optical layer is sighted with the aid of a camera or the like. Optical vision unit and its position is detected; An irradiation unit with a lens system is then controlled via this vision unit in order to move the focus area of the emitted photon beam, in particular laser beam, in the plane of the circuit board element, ie in the x / y plane, and also in depth within the optical one Layer, i.e. in the z direction. Thus, with the respective optoelectronic component as a reference element, the light waveguide can be structured in the desired manner within the optical layer, for example as a simple straight-line light wave conductor connection or as a waveguide structure with branches or the like. Structures, in particular also as a three-dimensional structure. The cross-sectional dimensions of the light waveguide structured in this way can be, for example, on the order of a few micrometers, the cross-section of such a structured light waveguide can be, for example, elliptical to rectangular; the exact shape can be determined by the photon beam and its focus control.

In the technique for waveguide structuring according to the invention, preference is given to using a two-photon process (TPA) in which a chemical reaction (e.g. polymerization) is activated by the simultaneous absorption of two photons. The optical material to be structured is transparent to the excitation wavelength used (e.g. wavelength = 800nm) of the light source (of the laser). Thus there is no absorption and no one-photon process in the material. In the focus area of the laser beam, however, the intensity is so high that the material absorbs two photons (.two-photon process) (here wavelength = 400nm), which activates a chemical reaction. The advantage here is that the transparency of the optical material for the excitation wavelength means that all points in the volume are reached, and thus three-dimensional structures can be written into the volume without any problems. Furthermore, non-linear coherent and incoherent physical effects result in self-focusing of the laser beam, as a result of which very small focus areas and thus very small structural dimensions can be achieved. Furthermore, the two-photon process is a one-step structuring process, which means that multiple exposures, e.g. according to US 4,666,236 A, and wet chemical development steps are not required.

Current optoelectronic components have a height of 100 μm, for example, and this height also gives the (minimum) thickness for the optical layer. Particularly low overall heights can, however, be achieved if instead of prefabricated optoelectronic components which are embedded in the optical layer, in situ optoelectronic components are produced using thin-film technology. On the other hand, it is also conceivable not only to embed mere transducer components as optoelectronic components in the optical layer, for example a laser component and a photodiode, but also to integrate associated electronic components, such as a processor or a memory component, so that they are combined Structural units, such as in particular “optoelectronic chips”, can also be embedded in the optical layer, as a result of which an external assembly of the printed circuit board element can be simplified or omitted at all. The printed circuit board element can have a substrate carrying the optical layer, a conventional one for this Printed circuit board layer, that is to say a synthetic resin layer with an inner copper layer and / or outer copper layer, can also be provided on the side opposite to such a substrate or such a printed circuit board layer be provided with a printed circuit board layer, it being possible for there to be an inner copper layer and / or an outer copper layer with corresponding structuring. In this way, multilayer printed circuit board structures are provided in a manner known per se in order to achieve the respective desired circuit functions.

Internal, i.e. conductive layers adjacent to the optical layer can also serve as heat dissipation layers in order to dissipate thermal energy from the respective optoelectronic component to the outside.

The optoelectronic components embedded in the optical layer can advantageously be contacted via so-called via laser bores, these via bores being provided in a manner known per se with metallic wall coverings, in particular made of copper, or at all with (electrically) conductive material, especially copper, can be filled. Heat can also be removed from the inside, embedded optoelectronic components via these via holes, in particular via holes completely filled with conductive material.

For contacting the embedded optoelectronic components however, the inner layers of circuit board structures or layers, as mentioned above, can also be used. In this case, it is expedient if one side of the optoelectronic components borders directly on the inner layer of a circuit board layer. Otherwise, it is of course also possible to completely embed the optoelectronic components in an optical layer, which facilitates the structuring of the light waveguides, ie the control of the focal point of the photon beams in the z direction, since then the positioning in the z- Direction is not so critical.

In the printed circuit board elements according to the invention, the structured light waveguides practically connect directly to the respective optoelectronic component, whereby “direct connection” means that there are no intermediate passive elements such as mirrors, gratings or the like. However, it may well be that in individual cases, the respective light waveguide is left with a small distance, for example in the order of magnitude of 0.5 μm or 1 μm, from the optoelectronic component, nevertheless “capturing” the light emitted by the optoelectronic component or coupling it in of the transmitted light into the neighboring optoelectronic component is possible without significant optical losses. It is also conceivable to provide a photonic light diffraction crystal structure at the end of the light waveguide as a transition to the optoelectronic component in order to achieve the best possible light concentration with this photonic crystal structure. Other options for connecting the light waveguide to the optoelectronic component are still that the light waveguide end is widened in a funnel shape or that it at least partially, but possibly also completely, surrounds the optoelectronic component.

It is also possible within the scope of the invention to present the present circuit board element as a flexible circuit board element, that is to say without a rigid substrate or the like, but essentially only as, for example, a two-layer optical layer with at least one optoelectronic component completely embedded and borrow connections for this purpose, wherein such a flexible circuit board element can subsequently be attached, for example glued, to a carrier, such as a housing wall of an electrical device.

The invention will now be explained in more detail below on the basis of preferred exemplary embodiments, to which it should not be restricted, however, and with reference to the drawing. They show in detail:

Figure 1 is a schematic cross section through an embodiment of a circuit board element according to the invention.

Figures 2 to 7 different stages of manufacture in the manufacture of a circuit board element as shown in Fig. 1.

8 and 9 show two further embodiments of circuit board elements according to the invention in schematic cross-sectional representations similar to that of FIG. 1;

10 shows yet another embodiment of a printed circuit board element according to the invention in a cross-sectional illustration, wherein different training options are combined;

11 shows a cross-sectional illustration comparable to that according to FIG. 5, a printed circuit board element with an intermediate layer between the substrate and the optical layer;

FIG. 12 shows a representation similar to FIG. 3 an intermediate stage in the manufacture of a printed circuit board element, in which instead of embedding prefabricated optoelectronic components, in situ manufacture of optoelectronic components using thin-film technology is provided;

13A and 13B in a similar cross-sectional representation a flexible printed circuit board element (FIG. 13B), FIG. 13A also showing a substrate used in the course of the production, which is then removed;

14 is a simplified circuit board element in cross section, with a single optoelectronic component, the transition between the optoelectronic component and the structured light waveguide being drawn out for better illustration;

15 shows schematically in cross section a circuit board element with a VCSEL laser and a correspondingly structured optical waveguide;

16A to 16F schematically show different possibilities for connecting a structured light waveguide to an optoelectronic component; and

17, 18 and 19 are schematic top views of various possibilities for forming structures with optoelectronic components and structured light waveguides.

In Fig. 1, a structure of a circuit board element ... 1 is shown very schematically in a cross-section which is not to scale, an assembly with external components having already been illustrated; however, it should be pointed out that such a placement with components generally only takes place immediately before installation in a device, at a device manufacturer, and that bare circuit board elements, as can be seen in FIG. 7, are sold. “Printed circuit board elements” are therefore also to be understood as meaning those without external assembly, as well as those in which no such external assembly takes place at all, cf., for example, also FIG. 9 on the right.

The circuit board element 1 schematically illustrated in FIG. 1 has a substrate 2, such as a conventional FR4 substrate containing an epoxy resin layer. Above this substrate 2 there is an optical layer 3, which is at least substantially transparent to the manufacturing process described in more detail below or to the wavelengths used in operation and, for example, consists of an inorganic or organic material. A well-known optical material that is suitable for the. PCB 1 is well suited is an inorganic-organic hybrid material, for example a organically modified ceramic material, which is produced by means of a sol-gel process. Another known material is an inorganic-organic hybrid glass, which is also produced in a sol-gel process and doped with a photoinitiator (benzyldimethyl ketal). This hybrid glass consists of methyl acrylate with a silica / zirconia network. Other known materials are photosensitive imides or polyimides and organosilsesquioxanes.

1, two optoelectronic components 4, 5 are embedded in this optical layer 3, wherein these two components 4, 5 rest on the substrate 2 and are otherwise enclosed by the material of the optical layer 3. Between the two optoelectronic components 4, 5 there extends a light waveguide 6 structured by local structuring, namely by local polymerization with the addition of light energy. In detail, the component 4 can be, for example, a laser diode, whereas the component 5 Photodetector, ie can be a photodiode.

Provided above the optical layer 3 is a circuit board layer 7, namely an epoxy resin layer 8 or the like. Insulating layer, for example with an electrically conductive outer layer 9, which is already structured according to FIG. 1, usually made of copper. Through this circuit board layer 7 and also the optical material of the optical layer 3 located above the components 4, 5, the optoelectronic components 4, 5 are contacted via micro-via (μVia) laser bores 10, the inner walls of these micro-via bores 10 can either be provided with a copper covering 11 or with a copper filling 12. The electrical connection between the optoelectronic components 4, 5 on the one hand and the structured outer layer 9 or external electronic components 13, 14 applied to the printed circuit board element 1 on the other hand is established via this copper material in the μVia bores 10, these components 13, 14 being soldered on, for example or with the aid of a conductive adhesive, as known per se, attached to the circuit board element 1. The outer components 13, 14 can, for example, be a pro act processor module 13 or a memory module 14, the processor module 13 writes data into the memory module 14 via the optical signal connection formed by the elements 4, 6 and 5; A similar optical signal connection (in the opposite direction; not shown) can be present for reading out data.

In the case of filling the micro via bores 10 with copper, as shown in FIG. 1 at 12, the advantage is achieved that good heat dissipation from the embedded optoelectronic components, as in FIG. 1 in the case of the component 5 shown on the right , to the top layer. As will be explained in more detail below, for example with reference to FIG. 8, however, other measures can also be taken, if desired, for heat dissipation in addition or instead.

Individual steps for producing a printed circuit board element 1, as shown in FIG. 1, are shown in FIGS. 2 to 7, and a method for producing such a printed circuit board element will now be explained by way of example with reference to these FIGS. 2 to 7.

2, a substrate 2, such as the already mentioned FR4 substrate with epoxy resin, is assumed, and the optoelectronic components 4, 5, such as a laser diode and a photodiode, are applied to this substrate, e.g. glued.

Thereafter, as shown in FIG. 3, material for the optical layer 3 is applied to the substrate 2, such as by casting or spin coating (spin coating), as is known per se. This optical layer 3 consists of a photoreactive polymer etc., as already explained above, the material being locally converted by photon irradiation in such a way that it obtains a comparatively higher refractive index.

This local conversion of the photoreactive material of the optical layer 3 with the aid of photon beams is illustrated schematically in FIG. 4 as the next step. A light source 15, such as a laser source, can be seen, which is coupled to a vision unit 16 and which is preceded by a lens system 17 for focusing the emitted laser beam 18 in a focus area 19 within the material of the optical layer 3.

In particular, in this structuring of the optical layer 3 by the vision or sighting unit 16, starting from, for example, the one optoelectronic component 4, the coordinates of which are detected, the distances on the sample 1 'given by the circuit board element (if already present) are measured, and the relative movement between this sample 1 'and the exposure system 20 given by the laser source 15 and the lens system 17 is controlled, not only in the plane of the sample 1', that is to say in the x or y direction, but also in the thickness direction of the sample 1 ′, that is to say in the z direction, in order to maintain the focus area of the laser beam 18 at the desired location within the optical layer 3. The sample 1 'is preferably moved in the three directions x, y and z in order to move the focus region 19 in the desired manner relative to the sample 1' within it and so .du, rch. the photon radiation locally convert the optical material; In this way, the structured light waveguide 6 is formed. In the focus area 19, the intensity of the laser light is namely so high that a two-photon absorption process, as is known per se, occurs. Through this process, the optical material of the optical layer 3 reacts (polymerizes), so that the optical waveguide 6 is formed, which has a larger refractive index compared to the material of the optical layer 3 surrounding it. This makes it an optical waveguide 6 similar to an optical fiber cable, where in the case of light transmission by corresponding reflections of the light at the interface: light-waveguide 6 surrounding material a bundled light transmission is achieved without significant optical losses.

In the next step, the upper circuit board layer 7 is applied to the optical layer 3 with an epoxy resin layer 8 and a copper outer layer 9, in particular by pressing, and the result of this method step is illustrated in FIG. 5. 6, the copper outer layer 9 is structured in the desired manner by a conventional photolithographic process in order to achieve the conductor tracks and connection areas required depending on the intended use of the circuit board element 1. (As is known, in a photolithographic structuring process of this type, a photoresist is first applied, which is exposed via a photomask and then developed, after which, for example, the copper regions not protected by the converted photoresist are etched away; the remaining resist lacquer is then removed.)

7, the micro-via holes 10 are finally made with the aid of laser beams and copper-plated on the inner walls, i.e. provided with the copper coating 11. If necessary, the via holes 10 can also be filled with copper material, as explained with reference to FIG. 1, in order to obtain improved heat dissipation through such a copper filling 12 in addition to the electrically conductive connection.

A printed circuit board element 1 is thus obtained without assembly. As mentioned, a corresponding, already populated circuit board element 1 is shown in FIG. 1. According to this exemplary embodiment, the external electronic components 13, 14 are fitted on the upper side of the printed circuit board element 1, as shown in the drawing, but this is only to be understood as an example. Theoretically, it is also conceivable to provide an assembly on the underside of the circuit board element 1 instead or in addition, in which case a conventional circuit board layer structure, such as an FR4 substrate with an outer layer of copper, is also used as the substrate 2, see. Fig. 8. In addition, such a circuit board layer, like the circuit board layer 7 'in Fig. 8, can also be provided on its top with a distributor layer 21' or inner layer, apart from the epoxy resin layer 8 'and the outer layer 9'. This distribution layer 21 ', which can be obtained in its final form by comparable photolithographic structuring, is preferred not only for the production of the electrical connections of the optoelectronic components 4 and 4 shown in FIG. 8 5 is used (whereby the advantage is achieved that the exact positioning of the connecting bores, as in the case of the micro via bores 10, can be avoided, since it is not the integrated components 4, 5 themselves, but only the distributor layer 21 that has to be contacted) , but it also creates an advantageous way to dissipate heat. The inner distribution layer 21 'is connected to the outer layer 9' by means of bores 22 filled with copper, which can be provided at more or less arbitrary locations, namely where there is space. Finally, the external electronic components, for example again a processor module 13 'and a memory module 14', are attached to this outer layer 9 '.

It is also conceivable to combine electronic components, i.e. components that receive, process and forward electronic data in the broadest sense, with the optoelectronic component, which essentially accomplishes an optical / electrical data conversion (in whatever direction) to form a structural unit; 9 shows the embedding of such a unit 514, which includes, for example, a combination of the optoelectronic component 5 and the outer electronic component 14. In this way, an optoelectronic chip is embedded directly in the optical layer 3, it being possible for optical and electronic data to be processed in this chip, and there is thus no need for subsequent external assembly or space for others on the outside of the circuit board element 1 Components won. The assembly 514 can in turn be connected to an outer copper layer 9 by means of micro-via bores 10 with a metal coating 11 in order to produce the electrical connections. Otherwise, the embodiment according to FIG. 9 is the same as that according to FIG. 1, so that a further explanation thereof is not necessary.

FIG. 10 then shows a combination of the design and assembly options explained above with reference to FIGS. 1 and 8; in this embodiment it is therefore an upper circuit board structure 7 with an outer layer 9 and an inner layer 21 and a lower circuit board structure 7 'with an outer layer 9' and an inner layer would lie 21 'and in between the optical layer 3, and the circuit board element 1 thus modified is equipped with electronic components 13, 14 and 13', 14 'both on the upper outside and on the lower outside. For the rest, optoelectronic components 4, 5 are in turn embedded in the optical layer 3 and connected to one another directly by a locally structured light waveguide 6, as described above, without the interposition of any passive optical elements.

In the embodiment according to FIG. 11, in a representation similar to that of FIG. 5, an intermediate layer 3 'is shown on the substrate 2, in deviation from FIG. 5, and the optical layer 3 is only applied to this intermediate layer 3'. The optoelectronic components 4, 5 lie on the intermediate layer 3 'and are in turn embedded in the optical layer 3. On this optical layer 3 there is again a printed circuit board structure 7 with an epoxy resin layer 8 and an outer copper layer 9. The intermediate layer 3 'can be a conductive or insulating, in particular also photoreactive optical material, in the latter case the two layers 3, 3 'together result in an optical layer 3-3', in the material of which the optoelectronic components 4, 5 are embedded on all sides. According to FIG. 11, the locally structured light waveguide 6 in turn extends between the optoelectronic components 4, 5.

As a modification of this, it is of course also conceivable to mount the optoelectronic components 4, 5 on the substrate 2 and then to apply the - optical - intermediate layer 3 'and the layer 3.

FIG. 12 shows, in a representation similar to FIG. 4, a modified circuit board element 1 with a lower substrate 2, but without an upper circuit board structure, the optoelectric components 4 ', 5' embedded in an optical layer 3 now differing from the first embodiment. are formed by thin-film technology components. These thin-film components 4 ', 5' are built up on site by known processes on the substrate 2 before the attached optical layer 3 and then provided in this optical layer 3 in the manner described above, the light waveguide 6 structured by photon irradiation. The further embodiment can then be carried out in a manner similar to that described above with reference to FIGS. 5 to 7, FIG. 8, etc., but it is also quite conceivable to use a printed circuit board element 1 without external printed circuit board structures, with a copper outer layer and / or inner layer, to provide, and in particular without equipping with electronic components on the upper and / or lower outside.

A simple, flexible printed circuit board element 31 is shown in FIG. 13B, this printed circuit board element 31 being built beforehand on a carrier substrate 2 ′ shown in FIG. 13A. The circuit board element 31 can be designed with an intermediate layer 3 'and the optical layer 3, wherein the intermediate layer 3' can also be an optical layer, made of comparable transparent, optical, photoreactive material, but can also be formed by another plastic layer. The substrate 2, which in .Fig. 13A can be seen, is removed after the production of the circuit board element 31, so that a flexible layer is obtained, which is given by the layers 3, 3 'and which can be very thin, in the manner of a film. This flexible printed circuit board element 31 can be applied to a base, such as the inside of a housing of an electrical device, in order to use the space for electrical circuits there.

In the example of FIGS. 13A and 13B, only a single optoelectronic component 4 is shown, which is applied to the intermediate layer 3 '; Before attaching the optical layer 3 in the manner explained above with reference to FIG. 3, connections 32 to the optoelectronic component 4 are produced, for example by bonding with copper wire.

It is further shown in FIGS. 13A and 13B that the light waveguide 6, which in turn is produced as explained with reference to FIG. 4, connects to the optoelectronic component 4 via a transition region 33, an “interface”, this transition region 33 simultaneously with the light waveguide 6 is produced by the described photon radiation.

A comparable transition region 33 is also illustrated in the embodiment according to FIG. 14, a two-layer structure with substrate 2 and optical layer 3 being shown there, and also only a single optoelectronic component 4 to which the light waveguide 6 is illustrated connects over this transition region 33. The substrate 2 here can have an outer and / or inner layer of conductive material, not shown in any more detail.

Before various possibilities for forming such a transition region 33 are explained with reference to FIGS. 16A-16F, reference is also made to FIG. 15, in which a formation with a VCSEL laser element 34 (VCSEL - Vertical-cavity surface emitting laser) as Optoelectronic component and a photodiode 35 equipped on the top side with the light receiving side is shown, here the light waveguide 6 via arcuate transition regions 33 'to these two optoelectronic components 34, 35 - which in turn are in the manner described in an optical layer attached to a substrate 2 3 are embedded - connects.

In Fig. 16 are now in the sub-figures 16A to 16F different training options for the optoelectronic component, e.g. 4, the subsequent end (transition region 33) of the optical waveguide 6 is schematically illustrated. 16A, the optical waveguide 6 is "inscribed" reaching directly to the component 4, so as to bring about a sharp edge at the end of the optical waveguide 6. According to FIG. 16B, the optical waveguide 6 is at its end or in Transition region 33 expanded to form a funnel 36, and according to FIG. 16C, the optical waveguide 6 is “inscribed” in the transition region directly around the optoelectronic component 4, partial enclosing being obtained in the connection region 37.

16D, a photonic crystal structure 38 (with columns etc., with a periodicity in two dimensions or in three dimensions) is inscribed at the end of the light waveguide 6 in the course of the photon irradiation described, where this crystal structure - which is known per se from its effect - limits the light to a central passage and thus enables an optical connection from the component 4 to the light waveguide 6 or vice versa with extremely low losses.

16E, the optoelectronic component 4 is not only partially enclosed, as shown in FIG. 16C, but entirely by the optical waveguide end, as shown at 39. The exemplary embodiments according to FIGS. 16B and 16C could therefore also be regarded as special cases of 16E.

Finally, FIG. 16F shows that it is also permissible to leave a - small - gap or gap 40 between the component 4 and the optical waveguide 6, for example when the “optical waveguide 6 is“ inscribed ”, as shown in FIG 4 explains above that the laser beam must not be focused directly on the component 4. Such a gap 40 can be in the order of magnitude of, for example, 1 μm without impairing the function.

Finally, individual examples of optical signal connections including optoelectronic components that can be implemented in the circuit board element according to the invention are explained with reference to FIGS. 17, 18 and 19. However, it should be pointed out that there are of course numerous other possibilities for such optical signal connections with optoelectronic components and structured light waveguides.

17 shows, for example, a Y configuration for an optical signal connection, a multiplexer / demultiplexer component 41, for example, following an optical waveguide 6 and, on the other hand, optical waveguides 42, 43 being shown at the node, and so on to connect optoelectronic components 44 on the one hand and 45, 46 on the other hand.

18 also shows a Y configuration with two combined optoelectronic processor or memory modules 45 ', 46 'on the one hand and a structural unit 44' on the other hand, the optical waveguide 6 leading away from the structural unit 44 'being branched into two branches 42', 43 '.

Finally, FIG. 19 shows an optical bus system with optoelectronic transmitting / receiving unit 51, 52, 53 and 54, the optical bus system 50 comprising a main light waveguide 6 'and light waveguides 61, 62, 63 branching off from it and contains 64.

Claims

Claims:

1. Printed circuit board element (1) with at least one optical waveguide (6) provided in an optical layer (3) and with at least one optoelectronic component (4, 5; 4 ', 5') which is connected to the optical waveguide (6) is in optical connection, characterized in that the optoelectronic component (4, 5; 4 ', 5') is embedded in the optical layer (3), that the light waveguide (6) is connected to the optoelectronic component (4, 5; 4 ', 5') and that the light waveguide is structured by irradiation within the optical layer (3).

2. Printed circuit board element according to claim 1, characterized in that the optoelectronic component (4, 5; 4 ', 5') with one side to a substrate (2) carrying the optical layer (3) or a coating layer (3 ') attached thereon ; 21) adjoins.

3. Printed circuit board element according to claim 1 or 2, characterized in that there. _, s optoelectronic component (4, 5; 4 ', 5') is embedded on all sides in the optical layer (3, 3 '), for example in two layers.

4. Printed circuit board element according to claim 3, characterized in that the optical layer (3, 3 ') is designed as a flexible layer.

5. Printed circuit board element according to one of claims 1 to 4, characterized in that at least two optoelectronic components connected to one another via the optical waveguide (6)

(4, 5; 4 ', 5') are embedded in the optical layer (3).

6. Printed circuit board element according to one of claims 1 to 5, characterized in that the or at least one optoelectronic (s) component with one side borders on a heat dissipation layer (21 ').

7. Printed circuit board element according to claim 6, characterized in that the heat dissipation layer (21 ') is formed by a structured inner layer.

8. Printed circuit board element according to one of claims 1 to 7, characterized in that the optoelectronic component (5) with an associated electronic component (14) is combined to form an embedded structural unit (514).

9. Printed circuit board element according to claim 8, characterized in that the embedded structural unit (514) is an optoelectronic chip.

10. Printed circuit board element according to one of claims 1 to 9, characterized in that the optoelectronic component (4, 5) borders on an electrically conductive distributor layer (21 ').

11. Printed circuit board element according to claim 10, characterized in that the distribution layer (21 ') is connected to at least one external electrical contact.

12. Printed circuit board element according to claim 11, characterized in that the distribution layer (21 ') is connected to the at least one external electrical contact via a via hole (22) in the substrate (7').

13. Circuit board element according to one of claims 1 to 12, characterized in that on at least one side of the electrically insulating optical layer (3) a circuit board layer (7, 7 ') with a structured conductive inner layer (21, 21') and or or External layer (9, 9 ') is applied.

14. Printed circuit board element according to one of claims 1 to 13, characterized in that the optoelectronic component (4, 5) or optionally the structural unit (514) via via bores (10) in the optical layer (3) and optionally one on this applied circuit board layer (7) is contacted.

15. Printed circuit board element according to claim 14, characterized in that an electronic component (13, 14) connected to the optoelectronic component (4, 5) is attached to the printed circuit board layer (7).

16. Printed circuit board element according to one of claims 1 to 15, characterized in that the optoelectronic component (4 ', 5') is a component produced in situ by thin-film technology.

17. Printed circuit board element according to one of claims 1 to 15, characterized in that the optoelectronic component is a VCSEL laser component (34) to which the light waveguide connects, for example with an arcuate transition (33 ').

18. Printed circuit board element according to one of claims 1 to 17, characterized in that the light waveguide (6) is widened in a funnel shape at the end (34) adjoining the optoelectronic component (4).

19. Printed circuit board element according to one of claims 1 to 17, characterized in that the light waveguide (6) at least partially surrounds the optoelectronic component (4) with its end (37; 39) adjoining the optoelectronic component (4).

20. Printed circuit board element according to one of claims 1 to 17, characterized in that the light waveguide (6) is provided at its end adjoining the optoelectronic component (4) with a photonic light diffraction crystal structure (38).

21. The method for producing a printed circuit board element (1) according to one of claims 1 to 20, characterized in that on a substrate (2) at least one optoelectronic component (4, 5; 4 ', 5') is attached, that after that An optical layer (3), which consists of an optical material that changes its refractive index under photon irradiation, is applied to the substrate, the optoelectronic component (4, 5; 4 ', 5') being embedded in the optical layer (3), and that an optical waveguide structure (6) adjoining the optoelectronic component (4, 5; 4 ', 5') is then produced in the optical layer (3) by photon irradiation.

22. The method according to claim 21, characterized in that at least two optoelectronic components (4, 5; 4 ', 5') attached to the substrate (2) and embedded in the optical layer (3) and then by the directly adjoining them optical waveguide structure (6) are interconnected.

23. The method according to claim 21 or 22, characterized in that after the generation of the optical waveguide structure (6) in the optical layer (3) on at least one side of this optical layer (3) a circuit board layer (7, 7 ') with a conductive Inner (21, 21 ') and / or outer layer (9, 9') is applied.

24. The method according to claim 23, characterized in that the inner layer (21, 21 ') is structured before the application of the circuit board layer on the optical layer.

25. The method according to claim 23 or 24, characterized in that the outer layer (9, 9 ') is structured after the application of the circuit board layer on the optical layer.

26. The method according to any one of claims 23 to 25, characterized in that in the optical layer (3), optionally also in the circuit board layer (7, 7 '), in association with the optoelectronic component (4, 5; 4', 5 ' ) Via holes (22) are attached and made via these electrically conductive connections to the optoelectronic component.

27. The method according to claim 26, characterized in that on the circuit board layer (7) and or or on the substrate at least one electronic component (13, 14) is attached, which is conductively connected to the optoelectronic component (4, 5).

28. The method according to any one of claims 21 to 27, characterized in that an optoelectronic component (5) combined with an associated electronic component (14) to form a structural unit is applied to the substrate and embedded in the optical layer.

29. The method according to any one of claims 21 to 28, characterized in that the substrate (3) is provided with at least one coating layer (3 '; 21) before the optoelectronic component (4, 5) is applied thereon.

30. The method according to claim 29, characterized in that a coating layer (3 ') made of optical material is applied to the substrate (3).

31. The method according to claim 29 or 30, characterized in that an electrically conductive coating layer on the substrate

(21 ') is applied as a distributor layer, this distributor layer being subsequently structured if necessary.

32. The method according to claim 31, characterized in that electrical connections for the optoelectronic component (4, 5) are made via the distributor layer.

33. The method according to claim 31 or 32, characterized in that the distributor layer is formed as a heat dissipation layer.

34. The method according to any one of claims 21 to 33, characterized in that the optoelectronic component (4, 5) is produced in thin film technology in situ on the substrate (3).

35. The method according to any one of claims 21 to 34, characterized in that the optical waveguide structure (6) is produced with a funnel-shaped extension (37) at the end adjoining the optoelectronic component (4).

36. Method according to one of claims 21 to 34, characterized in that the optical waveguide structure (6) is produced with an end region (37; 39) which at least partially surrounds the optoelectronic component (4).

37. The method according to any one of claims 21 to 34, characterized in that the optical waveguide structure (6) at the end adjoining the optoelectronic component (4) is produced with a photonic light diffraction crystal structure (38).