EP1699892A1 - Film adhesif destine a l'implantation de modules electriques dans un corps carte - Google Patents

Film adhesif destine a l'implantation de modules electriques dans un corps carte

Info

Publication number
EP1699892A1
EP1699892A1 EP04804967A EP04804967A EP1699892A1 EP 1699892 A1 EP1699892 A1 EP 1699892A1 EP 04804967 A EP04804967 A EP 04804967A EP 04804967 A EP04804967 A EP 04804967A EP 1699892 A1 EP1699892 A1 EP 1699892A1
Authority
EP
European Patent Office
Prior art keywords
rubbers
adhesive film
film according
rubber
nitrile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04804967A
Other languages
German (de)
English (en)
Inventor
Marc Husemann
Renke Bargmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Publication of EP1699892A1 publication Critical patent/EP1699892A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a blend of at least one thermoplastic and a synthetic rubber, which is activated with an implant stamp at 150 ° C. and used for bonding electrical modules to card bodies.
  • the adhesive must have good adhesion to polycarbonate, ABS, PVC and PET, but also good adhesion to the electrical module.
  • the adhesive is usually glued to epoxy materials, polyesters or polyimide.
  • cyan acrylates were used as liquid adhesives, which have the advantage that optimal wetting of the card body and the electrical chip was achieved.
  • this technology is dying out because the processes are very slow. The solvent evaporated only slowly from the cavity of the card body, the syringes for dosing clogged when they stopped due to drying out and were also difficult to dose, and the liquid adhesive also needed a certain amount of time to harden. As a result, the quality of the bond was quite poor.
  • the hotmelt pressure sensitive adhesives are clearly superior to the liquid adhesives. Nevertheless, the selection of suitable connections is very limited here as well, because of the high number Requirements are placed on this joining technology.
  • One limitation is the very different materials that have to be glued. Due to the very different polarities of PC, PVC, PET, ABS, epoxy and polyimide, it is impossible to find a single polymer that adheres equally well to all materials.
  • One way to increase the adhesion on different substrates is to mix different adhesives. But here too there is the problem of achieving a stable mixture which, for example, is stable as a microphase-separated system over a very long period of time and the adhesion does not deteriorate. This applies in particular to longer storage at elevated temperatures.
  • the requirements of end customers continue to increase.
  • the flatness of the electrical module with the card body is an important criterion, since otherwise the cards could no longer be read out.
  • This means that the implant temperatures are capped, e.g. PVC in particular tends to deform at implant temperatures above 170 ° C.
  • Another criterion is the requirement from the banking sector that the electrical modules cannot be removed without being destroyed. Accordingly, the internal cohesion of the adhesive must be very high, so that it does not split in the middle and the adhesion on both sides (card body + electrical module) is extremely high. At the same time, the adhesive must also have a very high level of flexibility, since the cards undergo torsion and bending tests after the implantation. The card material should preferably break before the adhesion to the card body and to the electrical module ceases. As a rule, not even marginal withdrawals are tolerated. Another criterion is temperature fluctuations and the influence of moisture, as these cards withstand both high and low temperatures in later use and sometimes have to survive one wash cycle.
  • the adhesive should not become brittle at low temperatures, should not liquefy at high temperatures and have a low tendency to absorb water.
  • Another requirement criterion is the processing speed due to the growing number of card requirements.
  • the glue should soften or very quickly Melt so that the implantation process can be completed within a second.
  • the invention is based on the object of specifying an adhesive film for implanting electrical modules in a card body, which fulfills the criteria mentioned above and in particular at implant temperatures of 150 ° C. in the stamp for the different card bodies and electrical modules trains very high liability.
  • an adhesive film consisting of a blend of a synthetic rubber S1 and a thermoplastic T2, the blend a) being separated by microphases b) having at least two softening temperatures, at least one softening temperature greater than 65 ° C. and less than 125 ° C, c) has a storage module G 'measured at 23 ° C of greater than 10 7 Pas by test method A d) has a loss module G "measured at 23 ° C of greater than 10 6 Pas e) and one by test method A measured crossover (same value of memory module and loss module) of less than 125 ° C.
  • Microphase separation in the sense of the invention means that thermodynamically incompatible components segregate into spatially separate areas, but without a macroscopic phase separation occurring. Depending on the composition, phases of different structures result. Typical methods for determining an existing micro-phase separation include, for example
  • DSC differential thermocalorimetry
  • DTA differential thermal analysis
  • micro-phase separation it is not necessary for the invention that the micro-phase separation to be observed or measured accordingly produces “ideal” structures.
  • the micro-phase separation to be observed on PSAs according to the invention only provides such ideal structures in the limiting case, but this does not in any way conflict with the inventive teaching.
  • the crossover temperature must be below 125 ° C, otherwise the adhesive would not flow and would not optimally wet the card surface and the electrical module.
  • the curves of the storage module G 'and loss module G "intersect; physically, this should be interpreted as a transition from elastic to viscous behavior.
  • the elastic component that is, the storage module G' must be greater than 10 7 Pas and the viscous component , ie the loss modulus G "is greater than 10 6 Pas, since otherwise optimal flexibility of the adhesive is not guaranteed.
  • the adhesive must guarantee the stresses that occur between the card body and the electrical module even under severe bending. Therefore theologically optimized viscoelastic behavior is required.
  • the mixture of the blend according to the invention improves the adhesion to the card body, which can be optimally achieved with a blend.
  • an adhesive film is used for the implantation of electrical modules with card bodies, the adhesive film consisting of a blend of an Nrtril rubber and a thermoplastic T2, and a) the blend is micro-phase separated b) the blend has at least two softening temperatures, at least one softening temperature being greater than 65 ° C. and less than 125 ° C. c) a memory module G 'measured at 23 ° C. of greater than 10 7 Pas at 23 ° C. has one) according to the test method A measured loss modulus G "at 23 ° C of greater than 10 6 Pas has e) and a crossover measured by test method A of less than 125 ° C.
  • microphase-separated blends of nitrile rubber and thermoplastic are used, with a ) the nitrile rubber has a softening temperature of -80 ° C to 0 ° C b) the thermoplastic has a softening temperature of 65 ° C to 125 ° C c) the nitrile rubber is insoluble in the thermoplastic.
  • Softening temperature is to be understood here as a glass transition temperature for amorphous systems and a melting temperature for semicrystalline polymers.
  • the temperatures given here correspond to those obtained from quasi-steady-state experiments, e.g. DSC (Differential Scanning Calometry) can be obtained.
  • the weight fraction of the nitrile rubber in the thermoplastic is preferably between 2 and 60% by weight, particularly preferably between 5 and 50%.
  • the bonding of the electrical module 2 to a card body 3 for producing a so-called chip card is shown schematically in FIG. 1.
  • the inventive temperature-activatable adhesive 1 has a layer thickness between 10 and 100 ⁇ m in a preferred embodiment, and a layer thickness of 30 to 80 ⁇ m in a particularly preferred embodiment.
  • the mixture with the synthetic rubber S1 reduces the viscosity under implantation conditions. The mass therefore does not flow out of the cavity of the card - even if the implant temperature rises - and thus contributes completely to the bonding.
  • Synthetic rubbers S1 The inventive heat-activatable adhesive consists of a blend of at least one synthetic rubber S1 and at least one thermoplastic polymer T2.
  • synthetic rubber S1 is polyvinyl butyral, polyvinyl formal, Nrtril rubbers, nitrile butadiene rubbers, hydrogenated nitrile butadiene rubbers, polyacrylate rubbers, chloroprene rubbers, ethylene propylene diene rubbers, methyl vinyl fluoro rubber, toluene fluoro toluene rubber, toluene fluoro toluene rubber, toluene fluoro toluene rubber, toluene fluoro toluene rubber, toluene fluoro toluene rubber, toluene fluoro toluene rubber, toluene fluoro toluene rubber, toluene fluoro silicone rubber Propylene copolymer rubbers, butyl rubbers, styrene-butadiene rubbers are used.
  • Nitrile butadiene rubbers are available under Europrene TM from Eni Chem, or under Krynac TM from Bayer, or under Breon TM and Nipol N TM from Zeon.
  • Polyvinyl butyrals are available under Butvar TM from Solucia, under Pioloform TM from Wacker and under Mowital TM from Kuraray.
  • Hydrogenated nitrile butadiene rubbers are available under Therban TM from Bayer and under Zetpol TM from Zeon.
  • Polyacrylate rubbers are available under Nipol AR TM from Zeon.
  • Chloroprene rubbers are available under Baypren TM from Bayer.
  • Ethylene propylene diene rubbers are available under Keltan TM from DSM, under Vistalon TM from Exxon Mobile and under Buna EP TM from Bayer.
  • Methyl vinyl silicone rubbers are available under Silastic TM from Dow Corning and under Silopren TM from GE Silicones. Fluorosilicone rubbers are available under Silastic TM from GE Silicones.
  • Butyl rubbers are available under Esso Butyl TM from Exxon Mobile.
  • Styrene-butadiene rubbers are available under Buna S TM from Bayer, Europrene TM from Eni Chem and under Polysar S TM from Bayer.
  • Polyvinyl formals are available under Formvar TM from Ladd Research.
  • the synthetic rubbers S1 have a softening temperature between -80 ° C. and 0 ° C.
  • Thermoplastics T2 are Thermoplastics T2:
  • thermoplastic materials are preferably selected from the group of the following polymers: polyurethanes, polystyrene, acrylonitrile-butadiene-styrene terpolymers, polyester, hard polyvinylchloride, soft polyvinylchloride, polyoxymethylene, polybutylene terephthalate, polycarbonate, fluorinated polymer, such as, for.
  • thermoplastics have a softening temperature between 60 ° C and 125 ° C.
  • optional adhesive-strengthening resins or reactive resins can be added.
  • the proportion of the resins is preferably between 2 and 50% by weight, based on the blend.
  • tackifier resins known and described in the literature can be used as tackifying resins to be added.
  • Representative are the pinene, indene and rosin resins, whose disproportionated, hydrogenated, polymerized, esterified
  • Hydrocarbon resins Any combination of these and other resins can be used to adjust the properties of the resulting adhesive as desired.
  • all (soluble) resins compatible with the corresponding thermoplastics T2 and rubbers S1 can be used, in particular reference is made to all aliphatic, aromatic, alkylaromatic
  • Hydrocarbon resins hydrocarbon resins based on pure monomers, hydrogenated hydrocarbon resins, functional hydrocarbon resins and natural resins.
  • reactive resins are added to the blend.
  • a very preferred group includes epoxy resins.
  • the molecular weight M w (weight average) of the epoxy resins varies from 100 g / mol up to a maximum of 10000 g / mol for polymeric epoxy resins.
  • the epoxy resins include, for example, the reaction product of bisphenol A and epichlorohydrin, the reaction product of phenol and formaldehyde (novolak resins) and epichlorohydrin, glycidyl ester, the reaction product of epichlorohydrin and p-amino phenol.
  • Preferred commercial examples include Araldite TM 6010, CY-281 TM, ECN TM 1273, ECN TM 1280, MY 720, RD-2 from Ciba Geigy, DER TM 331, DER TM 732, DER TM 736, DEN TM 432, DEN TM 438, DEN TM 485 from Dow Chemical, Epon TM 812, 825, 826, 828, 830, 834, 836, 871, 872, 001, 1004, 1031 etc. from Shell Chemical and HPT TM 1071, HPT TM 1079 also from Shell Chemical.
  • Examples of commercial aliphatic epoxy resins include vinyl cyclohexane dioxides such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
  • novolak resins e.g. Epi-Rez TM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DEN TM 431, DEN TM 438, Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku, Epiclon TM N673 from DaiNipon Ink Chemistry or Epicote TM 152 from Shell Chemical.
  • Melamine resins such as e.g. Cymel TM 327 and 323 from Cytec.
  • Terpenophenol resins such as e.g. Use Arizona Chemical's NIREZ TM 2019.
  • phenolic resins such as e.g. YP 50 by Toto Kasei, PKHC by Union Carbide Corp. and BKR 2620 from Showa Union Gosei Corp. deploy.
  • polyisocyanates such as e.g. Use Coronate TM L from Nippon Polyurethane Ind., Desmodur TM N3300 or Mondur TM 489 from Bayer.
  • crosslinkers and accelerators can optionally be added to the mixture.
  • Suitable accelerators are e.g. Imidazoles, commercially available from 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505, L07N from Shikoku Chem. Corp. or Curezol 2MZ from Air Products.
  • plasticizers can also be used.
  • plasticizers based on polyglycol ethers, polyethylene oxides, phosphate esters, aliphatic carboxylic acid esters and benzoic acid esters can be used here.
  • Aromatic carboxylic acid esters, higher molecular weight diols, sulfonamides and adipic acid esters can also be used.
  • fillers e.g. fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres made of other materials, silica, silicates
  • nucleating agents e.g. fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres made of other materials, silica, silicates
  • blowing agents e.g. in the form of primary and secondary antioxidants or in the form of light stabilizers.
  • polyolefins in particular poly- ⁇ -olefins, are added to the blend. From Degussa are under the
  • the blends have static softening temperatures T EA or melting points T S , A of 65 ° C. to 125 ° C.
  • T EA or melting points T S , A of 65 ° C. to 125 ° C.
  • the adhesive strength of these polymers can be increased by targeted additives.
  • polyimine or polyvinyl acetate copolymers can be used as additives that promote adhesion.
  • the heat-activatable adhesive is used in particular as an adhesive film for bonding electrical chip modules in card bodies, the respective adhesive layer forming very good adhesion to the card body and to the electrical chip module after the temperature activation.
  • inventive blends can be made from solution or in the melt.
  • Solvents in which at least one of the components has good solubility are preferably used for the preparation of the blend in solution.
  • the known stirring units are used to produce the mixture. For this, the Entry of heat may be required.
  • the blends are then coated from solution or more preferably from the melt.
  • the solvent is removed from the blend beforehand.
  • the solvent is drawn off in a concentration extruder under reduced pressure, for which purpose, for example, single or twin screw extruders can be used, which preferably distill off the solvent in different or the same vacuum stages and have feed preheating. Coating is then carried out via a melt nozzle or an extrusion nozzle, the adhesive film possibly being stretched in order to achieve the optimum coating thickness.
  • the blend is produced in the melt.
  • a kneader or a twin-screw extruder or a planetary roller extruder can be used to mix the resins.
  • the coating is then again carried out from the melt. It is coated via a melting nozzle or an extrusion nozzle, the adhesive film being stretched, if necessary, in order to achieve the optimum coating thickness.
  • the carrier materials used for the blend are the materials which are familiar and customary to the person skilled in the art, such as films (polyester, PET, PE, PP, BOPP, PVC, polyimide), nonwovens, foams, fabrics and fabric films and release paper (glassine, HDPE, LDPE).
  • the carrier materials should be equipped with a separating layer.
  • the separating layer consists of a silicone separating lacquer or a fluorinated separating lacquer.
  • the measurement was carried out using a rheometer from Rheometrics Dynamic Systems (RDA II).
  • the "Rheomatics Dynamical Analyzer” (RDA II) measures the torque that occurs
  • the iso-bending test is carried out analogously to the ISO / IEC standard 10373: 1993 (E) - section 6.1. The test is passed if a total of more than 4000 bends are reached.
  • the chip card In the hand test, the chip card is bent by hand over one of the two corners, which are closer to the electrical module, until the card breaks or the module breaks. Then the test is passed. If the electrical module comes loose or pops out, the test is considered failed.
  • the softening temperatures are preferably determined using differential scanning calorimetry (DSC).
  • a 10 3 ⁇ column of 50 mm length is followed by a 10 6 ⁇ , a 10 4 ⁇ and a 10 3 ⁇ column, each with a length of 300 mm.
  • Tetrahydrofuran is used as the eluent and is pumped at a flow rate of 1.0 ml / min.
  • the columns are calibrated with Polystyrene standards, the detection is carried out by measuring the change in the refractive index using a Shodex differential refractometer Rl 71).
  • Example 1 30% by weight of Breon N41 H80 (nitrile rubber) from Zeon and 70% by weight of Platamid 2395 (copolyamide) from Atofina were mixed in a measuring kneader from Haake at approx. 130 ° C. and 15 minutes at 25 rpm. mixed. The heat-activatable adhesive was then pressed to 60 ⁇ m at 140 ° C. between two layers of siliconized glassine release paper.
  • examples 1 to 3 are laminated at 2 bar onto the module belt from Nedcard using a two-roll laminating system from Storck GmbH. Then the electrical modules are implanted in the appropriate cavity of the card body.
  • the following parameters were used for all examples:
  • Table 1 shows that all the inventive examples have passed the most important criteria for a chip card and are therefore very well suited for bonding electrical modules to card bodies.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention concerne un film adhésif composé d'un mélange constitué d'un caoutchouc synthétique S1 et d'un thermoplastique (2) et destiné à coller des modules électriques dans des cartes à puces. Selon l'invention, a) le mélange est séparé en microphases; b) le mélange a au moins 2 températures de ramollissement, au moins une température de ramollissement étant supérieure à 65 DEG C et inférieure à 125 DEG C; c) il a un G' mesuré d'après la méthode de test A à 23 DEG C de 10<7> Pas minimum ; d) un G'' mesuré d'après la méthode de test A à 23 DEG C de 10<6 >Pas minimum ; e) et a un croisement mesuré d'après la méthode de test A de 125 DEG C maximum.
EP04804967A 2003-12-23 2004-12-21 Film adhesif destine a l'implantation de modules electriques dans un corps carte Withdrawn EP1699892A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10361541A DE10361541A1 (de) 2003-12-23 2003-12-23 Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper
PCT/EP2004/053632 WO2005063909A1 (fr) 2003-12-23 2004-12-21 Film adhesif destine a l'implantation de modules electriques dans un corps carte

Publications (1)

Publication Number Publication Date
EP1699892A1 true EP1699892A1 (fr) 2006-09-13

Family

ID=34706664

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04804967A Withdrawn EP1699892A1 (fr) 2003-12-23 2004-12-21 Film adhesif destine a l'implantation de modules electriques dans un corps carte

Country Status (4)

Country Link
EP (1) EP1699892A1 (fr)
DE (2) DE10361541A1 (fr)
MX (1) MXPA06007085A (fr)
WO (1) WO2005063909A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005025056A1 (de) * 2005-05-30 2006-12-07 Tesa Ag Nitrilkautschuk-Blends zur Fixierung von Metallteilen auf Kunststoffen
DE102005026191A1 (de) * 2005-06-06 2006-12-07 Tesa Ag Hitze-aktivierbare Folien zur Fixierung von Metallteilen auf Kunststoffen
DE102005035905A1 (de) 2005-07-28 2007-02-01 Tesa Ag Nitrilkautschuk Blends zur Fixierung von Metallteilen auf Kunststoffen
DE102006035787A1 (de) 2006-07-28 2008-03-13 Tesa Ag Verfahren zum Stanzen von bei Raumtemperatur nicht tackigen hitzeaktivierbaren Klebmassen
DE102006047735A1 (de) * 2006-10-06 2008-04-10 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102006047739A1 (de) * 2006-10-06 2008-04-17 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102006058935A1 (de) * 2006-12-12 2008-02-28 Tesa Ag Verbundmittelkopf-Sicherungselement
EP2079107B1 (fr) 2008-01-10 2017-10-18 Gemalto AG Procédé destiné à la fabrication d'un support de données en forme de carte et support de données fabriqué selon ce procédé
DE102017221039B4 (de) * 2017-11-24 2020-09-03 Tesa Se Verfahren zur Herstellung einer Haftklebemasse auf Basis von Acrylnitril-Butadien-Kautschuk

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630238B2 (en) * 1995-02-16 2003-10-07 3M Innovative Properties Company Blended pressure-sensitive adhesives
DE19948560A1 (de) * 1999-10-08 2001-08-23 Atp Alltape Klebetechnik Gmbh Klebstoffolie zum Implantieren von elektrischen Modulen in einen Kartenkörper und Verfahren zu deren Herstellung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005063909A1 *

Also Published As

Publication number Publication date
DE10361541A1 (de) 2005-07-28
WO2005063909A1 (fr) 2005-07-14
DE112004002184D2 (de) 2006-09-14
MXPA06007085A (es) 2006-09-04

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