EP1686619A3 - Solid-state imaging device and method of manufacturing the same - Google Patents
Solid-state imaging device and method of manufacturing the same Download PDFInfo
- Publication number
- EP1686619A3 EP1686619A3 EP06008632A EP06008632A EP1686619A3 EP 1686619 A3 EP1686619 A3 EP 1686619A3 EP 06008632 A EP06008632 A EP 06008632A EP 06008632 A EP06008632 A EP 06008632A EP 1686619 A3 EP1686619 A3 EP 1686619A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- solid
- imaging device
- state imaging
- semiconductor substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000003384 imaging method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
- H01L27/14843—Interline transfer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66946—Charge transfer devices
- H01L29/66954—Charge transfer devices with an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002219791A JP4271909B2 (en) | 2002-07-29 | 2002-07-29 | Solid-state imaging device and manufacturing method thereof |
JP2002219645A JP2004063751A (en) | 2002-07-29 | 2002-07-29 | Solid-state image sensing device and its manufacturing method |
EP03254432A EP1387397A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03254432A Division EP1387397A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1686619A2 EP1686619A2 (en) | 2006-08-02 |
EP1686619A3 true EP1686619A3 (en) | 2007-01-03 |
Family
ID=30117492
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08007679A Withdrawn EP1942522A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP06008632A Withdrawn EP1686619A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP08015176A Withdrawn EP1990829A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP06008631A Withdrawn EP1686618A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP10001345A Withdrawn EP2178112A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP06008630A Withdrawn EP1686617A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP03254432A Ceased EP1387397A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08007679A Withdrawn EP1942522A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08015176A Withdrawn EP1990829A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP06008631A Withdrawn EP1686618A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP10001345A Withdrawn EP2178112A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP06008630A Withdrawn EP1686617A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
EP03254432A Ceased EP1387397A3 (en) | 2002-07-29 | 2003-07-14 | Solid-state imaging device and method of manufacturing the same |
Country Status (2)
Country | Link |
---|---|
EP (7) | EP1942522A3 (en) |
CN (1) | CN100576556C (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004312666A (en) * | 2003-03-25 | 2004-11-04 | Fuji Photo Film Co Ltd | Solid-state imaging device and method for manufacturing the same |
JP2005056998A (en) * | 2003-08-01 | 2005-03-03 | Fuji Photo Film Co Ltd | Solid-state image pickup device and its manufacturing method |
JP4551638B2 (en) | 2003-08-01 | 2010-09-29 | 富士フイルム株式会社 | Method for manufacturing solid-state imaging device |
JP3801601B2 (en) * | 2004-06-15 | 2006-07-26 | シャープ株式会社 | Manufacturing method of semiconductor wafer provided with lid and manufacturing method of semiconductor device |
CN100405563C (en) * | 2004-08-19 | 2008-07-23 | 财团法人工业技术研究院 | Wafer level package structure of image sensing element and its package method |
CN101218539B (en) | 2005-07-05 | 2011-07-13 | 日立化成工业株式会社 | Photosensitive adhesive composition, and obtained adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part using the same |
FR2888989B1 (en) * | 2005-07-21 | 2008-06-06 | St Microelectronics Sa | IMAGE SENSOR |
US20070236591A1 (en) * | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
DE102006032047A1 (en) * | 2006-07-10 | 2008-01-24 | Schott Ag | Optoelectronic component e.g. image signal-detecting component, manufacturing method for e.g. digital fixed image camera, involves positioning components either one by one or in groups relative to position of associated components of wafer |
EP2070120A4 (en) * | 2006-09-28 | 2011-11-30 | Fujifilm Corp | Solid-state image sensor |
US8456560B2 (en) | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
JP2010525412A (en) | 2007-04-24 | 2010-07-22 | フレックストロニクス エーピー エルエルシー | Small form factor module using flip-chip assembly with wafer level optics with cavity at bottom |
CN101546712B (en) * | 2008-03-28 | 2010-09-08 | 菱生精密工业股份有限公司 | Method for packaging semiconductor with cavity |
US20100068847A1 (en) | 2008-09-12 | 2010-03-18 | Waldman Jaime I | Method for manufacturing an image sensor |
GB0821158D0 (en) | 2008-11-20 | 2008-12-24 | Durham Scient Crystals Ltd | Semiconductor device connection |
EP2246890B1 (en) * | 2009-04-28 | 2013-03-13 | STMicroelectronics (Crolles 2) SAS | Method of fabrication of an imager module |
CN101894797B (en) * | 2009-05-20 | 2013-08-28 | 鸿富锦精密工业(深圳)有限公司 | Manufacture method of backside illumination image sensor |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
EP2506302B1 (en) * | 2009-11-26 | 2021-08-11 | Kyocera Corporation | Wiring substrate, imaging device and imaging device module |
US9450004B2 (en) * | 2014-11-14 | 2016-09-20 | Omnivision Technologies, Inc. | Wafer-level encapsulated semiconductor device, and method for fabricating same |
US11538785B2 (en) * | 2017-12-19 | 2022-12-27 | Ultra Display Technology Corp. | Method of using optoelectronic semiconductor stamp to manufacture optoelectronic semiconductor device |
JP6609674B1 (en) * | 2018-07-11 | 2019-11-20 | 浜松ホトニクス株式会社 | Photodetection device and method for manufacturing photodetection device |
CN110212402B (en) * | 2019-05-07 | 2020-11-27 | 上海灿瑞科技股份有限公司 | Laser diode device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6342406B1 (en) * | 2000-11-15 | 2002-01-29 | Amkor Technology, Inc. | Flip chip on glass image sensor package fabrication method |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0825790B2 (en) * | 1984-06-27 | 1996-03-13 | 京セラ株式会社 | Mullite sintered body for semiconductor device package and manufacturing method thereof |
JPS6329974A (en) * | 1986-07-23 | 1988-02-08 | Nec Corp | Semiconductor device for ccd image sensor |
JP2987455B2 (en) * | 1991-10-17 | 1999-12-06 | オリンパス光学工業株式会社 | Solid-state imaging device |
US5436492A (en) * | 1992-06-23 | 1995-07-25 | Sony Corporation | Charge-coupled device image sensor |
JPH07202152A (en) | 1993-12-28 | 1995-08-04 | Olympus Optical Co Ltd | Solid-state image pickup device |
DE19508222C1 (en) * | 1995-03-08 | 1996-06-05 | Siemens Ag | Opto-electronic converter |
JPH1084509A (en) * | 1996-09-06 | 1998-03-31 | Matsushita Electron Corp | Image pickup device and its manufacture |
US6235141B1 (en) * | 1996-09-27 | 2001-05-22 | Digital Optics Corporation | Method of mass producing and packaging integrated optical subsystems |
JP4075144B2 (en) * | 1998-07-24 | 2008-04-16 | ソニー株式会社 | Manufacturing method of imaging apparatus |
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
JP3713418B2 (en) * | 2000-05-30 | 2005-11-09 | 光正 小柳 | Manufacturing method of three-dimensional image processing apparatus |
US6407381B1 (en) * | 2000-07-05 | 2002-06-18 | Amkor Technology, Inc. | Wafer scale image sensor package |
JP2002094082A (en) * | 2000-07-11 | 2002-03-29 | Seiko Epson Corp | Optical element and its manufacturing method and electronic equipment |
AU2002356147A1 (en) * | 2001-08-24 | 2003-03-10 | Schott Glas | Method for producing contacts and printed circuit packages |
DE50210653D1 (en) * | 2001-08-24 | 2007-09-20 | Schott Ag | METHOD FOR PRODUCING ELECTRONIC COMPONENTS |
JP3532178B2 (en) * | 2001-10-22 | 2004-05-31 | Hoya株式会社 | Window material glass for semiconductor package and method of manufacturing the same |
JP4174247B2 (en) * | 2002-06-24 | 2008-10-29 | 富士フイルム株式会社 | Manufacturing method of solid-state imaging device |
JP4443865B2 (en) * | 2002-06-24 | 2010-03-31 | 富士フイルム株式会社 | Solid-state imaging device and manufacturing method thereof |
-
2003
- 2003-07-14 EP EP08007679A patent/EP1942522A3/en not_active Withdrawn
- 2003-07-14 EP EP06008632A patent/EP1686619A3/en not_active Withdrawn
- 2003-07-14 EP EP08015176A patent/EP1990829A3/en not_active Withdrawn
- 2003-07-14 EP EP06008631A patent/EP1686618A3/en not_active Withdrawn
- 2003-07-14 EP EP10001345A patent/EP2178112A3/en not_active Withdrawn
- 2003-07-14 EP EP06008630A patent/EP1686617A3/en not_active Withdrawn
- 2003-07-14 EP EP03254432A patent/EP1387397A3/en not_active Ceased
- 2003-07-29 CN CN03143658A patent/CN100576556C/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6342406B1 (en) * | 2000-11-15 | 2002-01-29 | Amkor Technology, Inc. | Flip chip on glass image sensor package fabrication method |
Also Published As
Publication number | Publication date |
---|---|
EP1942522A3 (en) | 2009-11-11 |
EP1686618A3 (en) | 2007-01-03 |
EP2178112A3 (en) | 2011-08-24 |
EP1990829A3 (en) | 2009-11-11 |
EP1686617A3 (en) | 2007-01-03 |
EP1387397A3 (en) | 2005-09-07 |
EP1942522A2 (en) | 2008-07-09 |
EP1990829A2 (en) | 2008-11-12 |
EP1686617A2 (en) | 2006-08-02 |
EP1387397A2 (en) | 2004-02-04 |
CN1489218A (en) | 2004-04-14 |
EP2178112A2 (en) | 2010-04-21 |
EP1686618A2 (en) | 2006-08-02 |
EP1686619A2 (en) | 2006-08-02 |
CN100576556C (en) | 2009-12-30 |
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