EP1640108A1 - Procédé de fabrication d'un contact - Google Patents

Procédé de fabrication d'un contact Download PDF

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Publication number
EP1640108A1
EP1640108A1 EP04022661A EP04022661A EP1640108A1 EP 1640108 A1 EP1640108 A1 EP 1640108A1 EP 04022661 A EP04022661 A EP 04022661A EP 04022661 A EP04022661 A EP 04022661A EP 1640108 A1 EP1640108 A1 EP 1640108A1
Authority
EP
European Patent Office
Prior art keywords
laser
contact manufacturing
coating
contact
laser pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04022661A
Other languages
German (de)
English (en)
Other versions
EP1640108B1 (fr
Inventor
Klaus Frietsch
Matthias Dr. Müller
Karlheinz Storz
Richard Hettich
Tobias Wölfle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hugo Kern und Liebers & Co KG Platinen-Und Federnfabrik GmbH
Original Assignee
Hugo Kern und Liebers & Co KG Platinen-Und Federnfabrik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hugo Kern und Liebers & Co KG Platinen-Und Federnfabrik GmbH filed Critical Hugo Kern und Liebers & Co KG Platinen-Und Federnfabrik GmbH
Priority to EP04022661A priority Critical patent/EP1640108B1/fr
Priority to DE502004003890T priority patent/DE502004003890D1/de
Priority to US11/228,343 priority patent/US20060108334A1/en
Publication of EP1640108A1 publication Critical patent/EP1640108A1/fr
Application granted granted Critical
Publication of EP1640108B1 publication Critical patent/EP1640108B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H2011/0087Welding switch parts by use of a laser beam

Definitions

  • the invention relates to a method for producing contacts according to the preamble of claim 1.
  • micro-grinding contacts produced by the method are used for contacting printed conductors or surfaces, with a relative movement often taking place between the micro-grinding contacts and the printed conductor or surface.
  • the micro-grinding contacts consist of a plurality of contact springs, which are arranged as close together as possible.
  • the contact springs may be formed, for example, as spring tongues, which are punched out of Federblechbs.
  • contact springs (carrier) of the micro-grinding contact are produced from a cost-effective metal with good spring properties and good electrical conductivity.
  • the high wear resistance and corrosion resistance, which are only necessary for the contact surfaces, are achieved by coating the supports in the later contact area by build-up welding with a noble metal-containing alloy.
  • a powder of the noble metal-containing alloy is melted onto the carrier using a pulsed laser beam.
  • the energy supply is so great that a large melt volume is obtained, which consists of liquefied carrier material and liquefied coating material.
  • the known method results in that mixing processes take place in the melt, in particular due to the Marangoni flow, which leads to a strong mixing of carrier material and coating material. This, in turn, has the consequence that, given a low layer thickness desired for reasons of cost, the degree of purity of the coating material at the contact surface is not optimal, which may have negative effects on wear resistance and corrosion resistance.
  • the invention has for its object to propose a contact production method, can be produced inexpensively with the high quality contacts.
  • the temperature in the welding region is kept oscillating around the melting point of the carrier material and of the coating material.
  • the melt is given by the distances between the laser pulse peaks sufficient time to lower the temperature by conduction into the substrate and / or in the already applied coating material below the melting temperature. As a result, the melt volume remains very small.
  • the layer structure takes place cascade-like in the method according to the invention. This means that with each laser pulse, only a small upper layer of the already re-solidified material and added since the last liquefaction coating material be melted. This reduces the mixing of existing and newly reflowed material and thus the proportion of the carrier material in the coating with increasing thickness of the coating, whereby a contact surface is obtained with an extremely high proportion (purity) of coating material.
  • the mixing of the two materials is reduced by the method according to the invention over known methods.
  • the coating produced by means of the contact preparation method according to the invention is extremely corrosion-resistant and resistant to mechanical and abrasive stress due to the high degree of purity. Particularly noteworthy is the permanently uniform electrical contact resistance of the applied by the process coating.
  • the coating is further characterized by a high resistance to burning and material migration.
  • a laser pulse train contains 10 to about 20 temporally spaced laser pulses. It is advantageous if these laser pulses have an approximately equal peak energy and an approximately equal energy density and an approximately equal pulse length.
  • a plurality of laser pulse trains are usually connected in series. It has been found to be particularly advantageous if the Laserpulsrepetitionsrate in the range of about 5kHz to about 50kHz, preferably between about 10kHz to 20kHz and the Laserpulszugrepetitionsrate within the Laserpulszuges about 50Hz to 500Hz, preferably 50Hz to 150Hz. The upper limit of the laser pulse repetition rate is in the range of 50 kHz.
  • the laser pulse pauses are too small, so that the melt can not solidify and the Melt volume increases during the course of the coating, whereby the mixing processes increase.
  • the laser pulse repetition rate within a laser pulse train is decisive for the efficiency of the method. It is also possible to carry out the process with a laser pulse repetition rate of less than 10 kHz, but the coating process then proceeds correspondingly slower.
  • the carrier is moved relative to the laser beam.
  • the feed rate is advantageously about 5mm / s to 10mm / s.
  • The. Laser pulse repetition rate is related to the relative velocity. The higher the speed and / or the lower the laser pulse repetition rate is chosen, the greater will be the offset of the coated tracks on the carrier.
  • FIGS. 1 to 3 show an example of a micro-grinding contact, for the production of which the production or coating method according to the invention can be used.
  • a U-shaped stamped part 10 made of sheet metal, z. B. steel or a copper alloy is inserted into a support block 12.
  • a carrier 14 formed contact springs, which are formed in the example shown as round wires.
  • the carriers 14 are welded with their rear ends on embossing ribs 16 of the stamped part 10.
  • the free ends 18 of the carrier 14 are bent at right angles.
  • a contact-giving coating 20 is provided which has been applied by means of the method according to the invention.
  • the end face of the coating 20 is seated on printed conductors, not shown. In this way, the micro-grinding contact via the coating 20, the carrier 14 and the U-shaped stamped part 10 connect two interconnects.
  • a large number of contact points can be arranged side by side on a relatively small width of, for example, 2 mm.
  • contact springs By punching the carrier 14, a gap remains between each of them, so that the number of juxtaposed to a predetermined width carrier 14 is lower in such an embodiment.
  • the degree of purity of the coating is crucial. The less carrier material near the surface of the coating 20, the more accurately the desired alloy composition is achieved and the lower are the corrosion phenomena on the coating surface and the more constant the contact resistance over time.
  • coating material preferably metal powder, of an alloy containing a noble metal is applied continuously to the surfaces of the carriers 14.
  • the build-up welding which preferably takes place under protective gas, takes place by means of a pulsed laser beam. It is crucially important that the operating parameters are dimensioned such that the temperature in the welding region 22 oscillates around the melting temperature in such a way that the melt is alternately liquefied and solidifies again.
  • the pulse energy of a laser pulse is between approximately 0.5 mJ and 5 mJ, in particular between 1 mJ and 2 mJ.
  • the effective laser beam cross-sectional area amounts to about 0.05 mm 2 for a preferred laser beam diameter of 250 ⁇ m.
  • the pulse energy density is about 40 mJ / mm 2 per laser pulse.
  • the pulse length is about 0.01 ms to 0.1 ms, preferably 0.025 ms to 0.075 ms.
  • the laser pulse repetition rate within a laser pulse train with about 10 to 20 laser pulses is about 10,000 Hz.
  • the average power of a laser pulse is approximately between 1000mW and 10000mW, preferably between 1500mW and 2500mW, with peak pulse power of about 50W to 200W, preferably 100W to 150W.
  • the power density of a pulse is in the range of about 1 ⁇ 10 4 W / cm 2 to 1 ⁇ 10 5 W / cm 2 .
  • the thickness of the applied with a laser crossing coating is depending on the requirement about 10 .mu.m to 50 .mu.m, with advantage about 30 .mu.m.
  • the coating takes place in several laser pulse trains, wherein for coating the surface of a round wire of a micro-contact about a laser pulse train is necessary and for coating a spring tongue about three laser pulses are necessary.
  • the coating length of a laser pulse train is about 0.1 mm.
  • the laser pulse repetition rate is between 50 Hz and 500 Hz, preferably between 50 Hz and 150 Hz.
  • the laser beam diameter of about 250 ⁇ m is large compared to the diameter of a single carrier (round wire) of 0.1 mm.
  • the relative speed between the laser beam and the carrier is 5 mm / s.
  • this is positioned after a pulse train adjacent to an already coated track. In this way, a flat coating can be constructed strip-shaped. It is also possible to use several laser beams serially and / or in parallel in order to increase the process speed.
  • FIG. 6 shows the relative laser pulse energy and the temperature in the melting zone during a laser pulse train, here by way of example only six periodic single laser pulses, as a function of time.
  • the absolute dimensions are given in the value ranges given in the description and the claims.
  • the temperature in the welding region oscillates around the melting temperature of the carrier material and of the coating material.
  • the diagram shows by way of example that the energy of the laser beam drops to zero between two adjacent energy peaks. This is not absolutely necessary - it is sufficient if one phase lags between two peaks Laser energy is provided.
  • the parameters must be chosen so that the melt has sufficient time to at least partially release the heat to the substrate and thereby solidify.
  • laser pulse trains are also conceivable in which longer pauses without laser application are maintained between the individual laser pulses, which serve as cooling phases.
  • the illustrated waveform of the energy curve of the laser pulses is chosen only as an example. Other waveforms are also conceivable, for example, a more rectangular, trapezoidal, sinusoidal or triangular energy profile.
  • the melt cools again in the time interval 3 and the coating solidifies completely.
  • FIG. 7 shows an alternative course of the relative laser pulse energy as a function of time.
  • the absolute dimensions are given in the value ranges given in the description and the claims. It can be seen in the diagram that the energy peaks of the successive laser pulses of a laser pulse train decrease logarithmically. As a result, the heating of the carrier material occurring during a laser pulse train is compensated or taken into account.
  • the temperature in the welding region also oscillates according to the invention around the melting temperature of the carrier material and of the coating material.
  • the cascade structure of the coating 20 is shown schematically.
  • the arrow 24 symbolizes the relative speed between the laser beam 26 and the carrier 14, wherein the laser beam moves relative to the carrier to the right in the direction of the arrow. In this embodiment, this relative speed is 5mm / s with the laser fixed and the carrier 14 moving to the left below the laser becomes.
  • Coating material 28 is continuously supplied to the welding area 22.
  • the coating material 28 is inflated as a metal powder by means of a powder conveyor, not shown. It is also conceivable to ablate the coating material from a supply body, for example a wire made of coating material, by laser bombardment and thereby supply it to the welding area (so-called laser droplet welding).
  • the laser beam 26 and the powder feed in the drawing plane are moved to the right or the carrier 14 to the left.
  • the carrier material 14 and the coating material 28 located in this region are melted, as a result of which the two materials mix and then solidify again.
  • the laser beam 26 moves slightly further to the right in the drawing plane.
  • the subsequent laser pulse only the upper layer of the region of the melting region 22 just described and the coating material newly added in the meantime are liquefied again.
  • the percentage of coating material 28 in this region of the melt increases and the mixing with molten carrier material decreases very rapidly.
  • the purity achieved by the method according to the invention can only be achieved by the fact that the melt is alternately liquefied and solidifies again. As a result, only the respective upper layer of the applied coating is melted, with the result that the percentage of the newly added, continuously supplied coating material increases with increasing coating thickness. Even at low thicknesses of the coating results in a high purity of the coating material in the surface area. Due to the very high surface / volume ratio, the metal powder has a high specific absorption of the laser energy and is therefore preferably heated and melted.
  • the "mirroring" base material of the carrier absorbs the laser energy only at a depth of about the size of the wavelength of the laser and is thereby heated only at the surface.
  • the heat is dissipated in the carrier. This results in an advantageous ratio of coating material to carrier material in the coating.
  • the coating thickness profile and the coating contour profile can be varied. If the coating is to be made thicker at some points of the carrier than at other locations, this special area can either be run over several times by the laser or the relative speed can be reduced in the area. Likewise, it is conceivable to influence the coating process, for example, via the laser pulse energy density or the laser pulse length as well as the repetition rate.
  • FIG. 8 shows an alternative embodiment of a micro-grinding contact.
  • the contact-providing coating 20 is not provided at the free ends 18 of the carriers 14.
  • the contact-giving coating 20 is provided on the outer radius of the bent support 14.
  • the carrier 14 is seated with the provided on the outer radius coating 20 on printed conductors, not shown. This way you can the micro-grinding contact via the coating 20, the carrier 14 and the U-shaped stamped part 10 connect two interconnects together.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Of Switches (AREA)
EP04022661A 2004-09-23 2004-09-23 Procédé de fabrication d'un contact Expired - Fee Related EP1640108B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04022661A EP1640108B1 (fr) 2004-09-23 2004-09-23 Procédé de fabrication d'un contact
DE502004003890T DE502004003890D1 (de) 2004-09-23 2004-09-23 Kontaktherstellungsverfahren
US11/228,343 US20060108334A1 (en) 2004-09-23 2005-09-19 Process for producing an electrical contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04022661A EP1640108B1 (fr) 2004-09-23 2004-09-23 Procédé de fabrication d'un contact

Publications (2)

Publication Number Publication Date
EP1640108A1 true EP1640108A1 (fr) 2006-03-29
EP1640108B1 EP1640108B1 (fr) 2007-05-23

Family

ID=34926673

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04022661A Expired - Fee Related EP1640108B1 (fr) 2004-09-23 2004-09-23 Procédé de fabrication d'un contact

Country Status (3)

Country Link
US (1) US20060108334A1 (fr)
EP (1) EP1640108B1 (fr)
DE (1) DE502004003890D1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015136046A1 (fr) * 2014-03-12 2015-09-17 Walter Kraus Gmbh Corps de contact frottant et procédé servant à le fabriquer

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100193480A1 (en) 2009-01-30 2010-08-05 Honeywell International Inc. Deposition of materials with low ductility using solid free-form fabrication
KR101250093B1 (ko) * 2009-05-15 2013-04-02 도요타지도샤가부시키가이샤 레이저 용접 방법 및 그것을 포함하는 전지의 제조 방법
DE102009024962A1 (de) 2009-06-12 2010-12-30 Sitec Industrietechnologie Gmbh Verfahren zur partiellen stofflichen Verbindung von Bauteilen mit schmelzbaren Materialen
DE102011006899A1 (de) * 2011-04-06 2012-10-11 Tyco Electronics Amp Gmbh Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement
DE102012221617A1 (de) * 2012-11-27 2014-06-18 Robert Bosch Gmbh Verfahren zum Verbinden von artungleichen metallischen Fügepartnern mittels einer Strahlungsquelle
US10315275B2 (en) * 2013-01-24 2019-06-11 Wisconsin Alumni Research Foundation Reducing surface asperities

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2849716A1 (de) * 1978-10-31 1980-05-14 Bbc Brown Boveri & Cie Verfahren zur herstellung von elektrischen kontakten an halbleiterbauelementen
DE3005662A1 (de) * 1980-02-15 1981-08-20 G. Rau GmbH & Co, 7530 Pforzheim Kontaktelement und herstellungsverfahren hierzu
US4348263A (en) * 1980-09-12 1982-09-07 Western Electric Company, Inc. Surface melting of a substrate prior to plating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684781A (en) * 1985-01-29 1987-08-04 Physical Sciences, Inc. Method for bonding using laser induced heat and pressure
US5171709A (en) * 1988-07-25 1992-12-15 International Business Machines Corporation Laser methods for circuit repair on integrated circuits and substrates
US6173887B1 (en) * 1999-06-24 2001-01-16 International Business Machines Corporation Method of making electrically conductive contacts on substrates
DE10157320A1 (de) * 2001-11-23 2003-06-12 Kern & Liebers Verfahren zum Herstellen von Mikroschleifkontakten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2849716A1 (de) * 1978-10-31 1980-05-14 Bbc Brown Boveri & Cie Verfahren zur herstellung von elektrischen kontakten an halbleiterbauelementen
DE3005662A1 (de) * 1980-02-15 1981-08-20 G. Rau GmbH & Co, 7530 Pforzheim Kontaktelement und herstellungsverfahren hierzu
US4348263A (en) * 1980-09-12 1982-09-07 Western Electric Company, Inc. Surface melting of a substrate prior to plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015136046A1 (fr) * 2014-03-12 2015-09-17 Walter Kraus Gmbh Corps de contact frottant et procédé servant à le fabriquer

Also Published As

Publication number Publication date
EP1640108B1 (fr) 2007-05-23
DE502004003890D1 (de) 2007-07-05
US20060108334A1 (en) 2006-05-25

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