EP1608919B1 - Durchlauferhitzer - Google Patents

Durchlauferhitzer Download PDF

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Publication number
EP1608919B1
EP1608919B1 EP04719441A EP04719441A EP1608919B1 EP 1608919 B1 EP1608919 B1 EP 1608919B1 EP 04719441 A EP04719441 A EP 04719441A EP 04719441 A EP04719441 A EP 04719441A EP 1608919 B1 EP1608919 B1 EP 1608919B1
Authority
EP
European Patent Office
Prior art keywords
cooling element
heater according
power component
heating module
cold water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP04719441A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1608919A1 (de
Inventor
Markus Helminger
Christian Lindert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Bosch und Siemens Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSH Bosch und Siemens Hausgeraete GmbH filed Critical BSH Bosch und Siemens Hausgeraete GmbH
Priority to EP10162910.3A priority Critical patent/EP2226590B1/de
Publication of EP1608919A1 publication Critical patent/EP1608919A1/de
Application granted granted Critical
Publication of EP1608919B1 publication Critical patent/EP1608919B1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/20—Arrangement or mounting of control or safety devices
    • F24H9/2007—Arrangement or mounting of control or safety devices for water heaters
    • F24H9/2014—Arrangement or mounting of control or safety devices for water heaters using electrical energy supply
    • F24H9/2028—Continuous-flow heaters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H15/00—Control of fluid heaters
    • F24H15/40—Control of fluid heaters characterised by the type of controllers
    • F24H15/407—Control of fluid heaters characterised by the type of controllers using electrical switching, e.g. TRIAC
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
    • F24H1/101—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium using electric energy supply
    • F24H1/102—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium using electric energy supply with resistance

Definitions

  • the invention relates to a water heater according to the preamble of claim 1.
  • instantaneous water heaters with electronic control power components are cooled by the incoming cold water at a cooling interface, so that the power components do not exceed a temperature limit of about 70 ° C in operation.
  • the cooling interface is located on a cooling-only copper pipe loop in the cold water inlet region, wherein the power component is pressed with a resilient clamp against a flat pinched contact surface of the copper pipe. Since the copper pipe conducts electricity, the power component requires a direct ground connection. This construction principle requires many parts, a cumbersome wiring and the grounding of each power component. This results in a high manufacturing and assembly costs.
  • At least one printed circuit board is provided on which optionally further components of the control are arranged, and which are provided with their own fastening elements, e.g. Screws, is fixed to prepared mounting points of the heating module.
  • fastening elements e.g. Screws
  • heat dissipating power components are conventionally placed on the cooling interface, grounded, and connected to the controller. Therefore, the independent determination and positioning of the circuit board also increases the manufacturing and assembly costs.
  • the invention has for its object to provide a water heater of the type mentioned, which can be produced with reduced effort.
  • the object also includes avoiding the effort for earthing the cooled power component or separate fastening devices for the printed circuit board or these two aspects: The object is achieved by the features of claim 1.
  • the ceramic cooling element electrically isolates the power component, eg a triac, from the water, so that the cooling interface or the power component does not require grounding, and yet the device safety complies with the regulations.
  • the ceramic cooling element effectively transfers heat to cool the power device.
  • high thermal conductivity ceramic material is used, which also has good mechanical properties, which ensure the necessary flatness in the contact area of the component, and also withstand the fastening forces and thermal influences during operation.
  • the cooling element can be relatively small, so that the cooling interface can even be largely arranged without additional expenditure within a given cold water inlet region.
  • the ceramic cooling element is expediently used for cooling a power component, which is pressed resiliently against the cooling element with a retaining element, wherein the retaining element can also fix a printed circuit board of the electronic control unit on the heating module, possibly carrying the power component.
  • the ceramic cooling element can also be used profitably when the circuit board is fixed to the heating module in a conventional manner.
  • the ceramic cooling element between the outside of the heating module and the cold water inlet area in the heating module is used watertight.
  • the cooling interface in the heating module thereby only minor modifications in the inlet area are required.
  • the ceramic cooling element during or after the shaping of the heating module or of a heating module component.
  • One possibility would be direct overmolding during the injection molding process.
  • the cooling element could also be subsequently used by pressing, welding, gluing or latching.
  • a sealing element e.g. an O-ring, with built-in.
  • the power component is held by a resilient retaining element in cooling contact with the cooling element.
  • the holding element could be used, in order to fix even the loosely attached cooling element waterproof.
  • a platelet, disc or cap-shaped ceramic cooling element is inexpensive and can be produced with high dimensional accuracy and dimensional accuracy. These geometric shapes also provide sufficient structural strength to allow the cooling element to easily cope with mechanical, thermal and hydraulic loads.
  • the cap shape presents the contact surface for the power component easily accessible. In the cap edge area there is sufficient attack surface for fixing and / or sealing.
  • the cooling element is arranged substantially perpendicular to the inflow direction of the cold water to the cooling interface. This allows effective heat transfer from the cooling element into the water.
  • the inflow surface of the cooling element could be designed aerodynamically, eg concave, to reduce the risk of unwanted turbulence. It would also be possible to structure the inflow surface so that the in contact with the water flow coming surface is increased, for example, by ribs, which can also contribute to the flow.
  • a water dome having an opening is arranged on the heating module, which contains an inlet channel and an outlet channel.
  • the channels can merge on the cooling element.
  • the ceramic cooling element is arranged waterproof in the opening.
  • the water dome means only a minor modification of the cold water inlet area of the heating module.
  • the water dome can be easily formed from the material of the heating module and / or the cold water inlet area, and makes it possible to place the used cooling element exposed where the power component is easy to assemble.
  • the water dome is in the component group of the electronic control, or vice versa.
  • an overflow threshold is provided in the water dome lead to the flow guide, bring the incoming cold water substantially perpendicular to the inflow of the cooling element and dissipate the outflowing water as quickly as possible to force along the inflow of a favorable for the cooling effect, intensive flow dynamics.
  • plug-in slots formed for the holding leg of the support member.
  • the abutment for the holding element near the cooling interface are also useful if the holding element is not only used for pressing the power component to the cooling element, but also for at least partially setting the circuit board of the electronic control on Walkermodul.
  • positioning elements for the printed circuit board can be integrally formed on the heating module, which improve the positioning and the seat of the printed circuit board under the holding force of the holding element.
  • the holding element In this case, the power component, which is expediently mounted directly on the printed circuit board, can indirectly press against the cooling element via the printed circuit board.
  • the same retaining element can be used, e.g. a U-shaped spring clip.
  • the printed circuit board can be larger in area and heavier than the power component, it would be possible to set the printed circuit board to use a larger and / or stronger holding element with a different shape.
  • a good resilient contact pressure for the power component and / or the circuit board can be achieved if the trained as a U-spring clip retaining element in the transverse web is alternately bent in and out.
  • longitudinal stiffening beads may be formed which, preferably, e.g. exclude unintentional buckling or twisting of the retaining legs during assembly of the spring clip.
  • the power component to be cooled is a triac switching element that generates heat during operation of the instantaneous water heater and is cooled by the incoming cooling water by means of the ceramic cooling element.
  • a water heater D with electronic control or control S is in Fig. 1 shown in section a part of a heating module M, which consists of two interconnected module moldings 1, 2 (for example injection molded parts).
  • the heating module M is indicated in the operating position of the flow heater D by a dashed line Hood F covered.
  • the heating module M is connected to water supply and - not shown, and electrically connected to the mains.
  • the electronic control S for at least one heating element, not shown, in the heating module has a printed circuit board P with components mounted thereon and at least one electronic power component B, which in FIG Fig. 1 is mounted on the printed circuit board P.
  • the power component B is, for example, a triac switching element that generates heat during operation of the instantaneous water heater D and requires cooling. For this reason, the power component B is placed at a cooling interface K with the cold water inlet of the heating module M.
  • the power component B is held by means of at least one holding element H in contact with a ceramic cooling element E, which electrically isolates the power component B from the water at the cooling interface K and forms a heat transfer body to the water.
  • the holding element H acts on the printed circuit board P in order to hold the power component B indirectly via the printed circuit board P in contact with the cooling element E.
  • the holding element H serves here simultaneously to set the circuit board P on the heating module M.
  • the holding element H could apply the power component B arranged separately from the printed circuit board P directly and hold it in contact with the cooling element E.
  • the circuit board P would then be mounted differently.
  • the heating module moldings 1, 2 define an internal cold water inlet channel 3, in which the cold water flows in the direction of arrow R before heating.
  • the cold water comes from a preferably integrally molded into the molding 1 water dome 4, which has an opening 5, in which the ceramic cooling element E is used watertight, for example by means of an O-ring 13.
  • the edge of the opening 5 is, for example, plastically deformed or flanged to set the cooling element E tight.
  • the cooling element E could be held only by the holding pressure of the retaining element H in sealing engagement.
  • inlet channel 6 connected to the cold water inlet not shown inlet channel 6 is formed, which is separated by a flow channel 9 through a partition 7, which ends at an overhead overflow threshold 8 at a distance from the ceramic cooling element E.
  • partition wall 7 forms substantially perpendicular to the cooling element E oriented flow guide so that the indicated by the arc arrow Z cold water flow the cooling element E as intense as possible and vortexing acted upon (s. Fig. 2 ).
  • the positioning elements 11 may have depth stops 12 for securing the printed circuit board P.
  • the power component B In the illustrated manner of mounting the power component B is electrically isolated from the water, and the incoming cold water in the heating module M at the interface K no metallic piping, so that the power component B need not be separately grounded.
  • the printed circuit board P is usually grounded anyway.
  • Fig. 2 illustrates on an enlarged scale, as designed as a cap 14 formed ceramic cooling element E with its lower, widened cap edge on the O-ring 13, which is inserted into a socket 5 of the opening.
  • the cooling element E as mentioned, for example, be determined by crimping the opening edge or encapsulation, gluing, and similar types of connection in its illustrated sealing position. However, it is also possible to use only the holding force of the holding element H for producing the sealing flow for the cooling element E.
  • the cooling element could also be a plate or a disc of ceramic material with good thermal conductivity.
  • the exposed top of the cooling element E forms in Fig. 2 a flat contact surface 15 for the power component B, while the inner or underside of the cap 14 forms a here, for example cup-shaped inflow surface 16 for the cold water from the inlet channel 6.
  • the overflow threshold 8 is opposite the inflow surface 16 with a distance which is selected such that there are optimal flow conditions along the inflow surface 16 for efficient heat removal.
  • the retaining element H is a U-shaped spring clip with a transverse web 17 and, for example, two retaining legs 19.
  • the crosspiece 17 has several alternating bends 18 with regard to a desirable spring action.
  • sawtooth-like locking projections 20 formed in the abutments 19 are formed on the retaining legs 19 10 automatically anchor, if necessary.
  • the abutment 10 are serrated inside. Longitudinal stiffening beads 21 increase the structural strength of the retaining legs 19.
  • the retaining element H of Fig. 1 and 2 is expedient a sheet metal stamping bent part made of a suitable metal.
  • the holding element could also be a plastic molded part or a composite part.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Insulated Conductors (AREA)
EP04719441A 2003-03-21 2004-03-11 Durchlauferhitzer Expired - Fee Related EP1608919B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10162910.3A EP2226590B1 (de) 2003-03-21 2004-03-11 Durchlauferhitzer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10312728 2003-03-21
DE10312728A DE10312728A1 (de) 2003-03-21 2003-03-21 Durchlauferhitzer
PCT/EP2004/002545 WO2004083739A1 (de) 2003-03-21 2004-03-11 Durchlauferhitzer

Related Child Applications (2)

Application Number Title Priority Date Filing Date
EP10162910.3A Division EP2226590B1 (de) 2003-03-21 2004-03-11 Durchlauferhitzer
EP10162910.3 Division-Into 2010-05-17

Publications (2)

Publication Number Publication Date
EP1608919A1 EP1608919A1 (de) 2005-12-28
EP1608919B1 true EP1608919B1 (de) 2010-08-25

Family

ID=32921077

Family Applications (2)

Application Number Title Priority Date Filing Date
EP04719441A Expired - Fee Related EP1608919B1 (de) 2003-03-21 2004-03-11 Durchlauferhitzer
EP10162910.3A Expired - Fee Related EP2226590B1 (de) 2003-03-21 2004-03-11 Durchlauferhitzer

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP10162910.3A Expired - Fee Related EP2226590B1 (de) 2003-03-21 2004-03-11 Durchlauferhitzer

Country Status (5)

Country Link
EP (2) EP1608919B1 (pl)
CN (1) CN1761845B (pl)
DE (1) DE10312728A1 (pl)
PL (2) PL211167B1 (pl)
WO (1) WO2004083739A1 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008054835A1 (de) * 2008-12-17 2010-07-01 BSH Bosch und Siemens Hausgeräte GmbH Wäschetrockner
EP2489956B2 (de) 2011-02-21 2020-09-09 Gerdes Holding GmbH & Co. KG Kühleinrichtung eines elektrischen, sich erwärmenden Bauelements
DE102011013972A1 (de) * 2011-03-14 2012-09-20 Stiebel Eltron Gmbh & Co. Kg Elektrisches Haustechnik-Heizgerät
CN202126082U (zh) * 2011-05-25 2012-01-25 上海科勒电子科技有限公司 一种应用于厨卫产品的瞬时加热器
WO2015018950A1 (es) * 2013-08-09 2015-02-12 Talleres Del Agua, S.L. Sociedad Unipersonal Intercambiador de calor para calentar agua
DE102017003416A1 (de) * 2017-04-07 2018-10-11 Stiebel Eltron Gmbh & Co. Kg Elektrisches Warmwasseraufbereitungssystem

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762980A (en) * 1986-08-07 1988-08-09 Thermar Corporation Electrical resistance fluid heating apparatus
DE4106273C1 (en) * 1991-02-28 1992-05-21 Stiebel Eltron Gmbh & Co Kg, 3450 Holzminden, De Through-flow electric water heater - controls heating elements power using triacs cooled by pipe connected to cold water supply
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
DE4420493A1 (de) * 1994-06-12 1995-12-14 Ego Elektro Blanc & Fischer Elektronisches Durchflußheizelement für Medien
US6055154A (en) * 1998-07-17 2000-04-25 Lucent Technologies Inc. In-board chip cooling system

Also Published As

Publication number Publication date
EP1608919A1 (de) 2005-12-28
PL377405A1 (pl) 2006-02-06
PL211167B1 (pl) 2012-04-30
PL219136B1 (pl) 2015-03-31
CN1761845A (zh) 2006-04-19
PL396722A1 (pl) 2011-12-19
WO2004083739A1 (de) 2004-09-30
EP2226590A1 (de) 2010-09-08
CN1761845B (zh) 2010-06-16
DE10312728A1 (de) 2004-09-30
EP2226590B1 (de) 2016-10-05

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