EP1602153A1 - Contact device for improving lifetime of electrical connections - Google Patents
Contact device for improving lifetime of electrical connectionsInfo
- Publication number
- EP1602153A1 EP1602153A1 EP03786039A EP03786039A EP1602153A1 EP 1602153 A1 EP1602153 A1 EP 1602153A1 EP 03786039 A EP03786039 A EP 03786039A EP 03786039 A EP03786039 A EP 03786039A EP 1602153 A1 EP1602153 A1 EP 1602153A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- foam
- contact
- electrical
- conductors
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/304—Clamped connections, spring connections utilising a screw or nut clamping member having means for improving contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/34—Conductive members located under head of screw
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/927—Conductive gasket
Definitions
- the present invention relates to devices for improving and increasing the conductance of electrical connections and in particular relates to a contact device for improving the service life of electrical connections.
- the maintenance of the connections requires to dismantle them in order to practice a resurfacing of the areas in contact.
- the tools used for these resurfacing are generally rotary grinders. They degrade the total flatness of the surfaces in contact, which has the consequence of limiting the zones and the contact points. The contact areas being reduced, the connections are then subjected to concentrated electrical stresses on these areas and their degradation is even faster.
- the first object of the invention is to provide a contact device for electrical connections in order to improve the electrical conductance of these connections and to slow down the degradation of the surfaces in contact.
- Another object of the invention is to provide a contact device for improving the electrical connections in order to increase the electrical performance of these connections when they are in an advanced state of degradation.
- a third object of the invention is to provide a contact device for improving the electrical connections subjected to high intensity currents greater than 1000 A, in order to increase the electrical performance of these connections.
- the object of the invention is therefore a contact device for improving the conductance of an electrical connection formed by two conductors in contact with each other essentially comprising an intermediate conductive element disposed between the two contact surfaces of the two connection conductors.
- the intermediate conductive element is composed of electrically conductive foam composed of one or more materials, of high porosity and deformability in order to reduce the electrical resistance of the connection.
- FIG. 1a shows a microscopic cross section of the copper foam
- FIG. 1b represents a plate of copper foam according to an embodiment of the invention
- Figure 2a shows a section of the electrical connection according to the invention before tightening
- Figure 2b shows a section of the electrical connection according to the invention.
- the intermediate conducting element used in the device according to the invention is a metallic foam 10 preferably produced according to the method described in patent application WO 02/059396, it being understood that the device according to The invention is not limited to the metal foams obtained by the process described in this document.
- the metallic foam is preferably a copper foam. Its structure is cellular and its physical properties are mainly a high porosity and deformability and a low density of the order of 400g / m 2 . In comparison, the density of a copper sheet of the same thickness is of the order of 15 kg / m 2 .
- FIG. 1a which illustrates in a microscopic, schematic and nonlimiting manner a section through a plate of copper foam 10 according to the invention
- the honeycomb structure of the copper foam is such that it consists mainly of vacuum .
- its surface has a multitude of contact points 11 of the order of a micron, the number of which reaches 30 points per mm 2 .
- the thickness of the copper foam is of the order of 2 mm.
- this copper foam constituting the intermediate conducting element according to the invention is cut to the size of the contact surface of the electrical connection described in FIG. 2 and has an opening 18 for the passage of the tightening bolt.
- the copper foam thus cut has two peripheral seals 14 and 16.
- the peripheral seals 14 and 16 can be produced in different ways. They can be impregnated in the foam or produced by depositing an elastomer type sealant on the periphery. But it is also possible to make seals by folding the edges of the foam plate at least once on itself or by rolling the edges of the foam plate.
- Figures 2a and 2b show an electrical connection according to the invention.
- the conductors 21 and 23 are located on either side of the copper foam 10 so that their surfaces 22 and 24 come into contact with the copper foam.
- the copper foam constitutes an intermediate element between the two conductors of the electrical connection.
- the electrical connection between the conductors 21 and 23 is made by tight contact thanks to a tightening means such as a tightening bolt 25 passing through the two conductors through an orifice provided for this purpose and through the opening 18 of copper foam 10.
- the device according to the invention can be used for a contact of a new electrical connection. In this case, it improves the homogeneity of the flow of current through the contacting surface. Indeed, in an electrical connection represented for example by the two conductors 21 and 23 in contact with each other, the contact is all the more important as it is located near the tightening means or tightening bolt 25. Consequently, the resistance and therefore the electrical losses of the electrical connection consisting of the conductors 21 and 23 in contact is minimal near the clamping means 25 and increases the further one moves away from it. This inhomogeneous distribution of the current favors a zone of higher current concentration and therefore an area more stressed and therefore degraded more quickly.
- the contribution of the intermediate conductive element made of copper foam increases the points of contact between the two conductors 21 and 23 and therefore allows homogeneous distribution of the current over the entire contact surface. Thanks to this homogeneous distribution, there are no areas of current concentration therefore no areas more stressed and conducive to faster degradation.
- the device according to the invention can also be advantageously used for a contact of a degraded or deformed electrical connection.
- the conductors and the electrical connections are subjected to high intensity currents and to high temperatures.
- the wear of the connections mainly takes the form of a deformation of the contact surfaces of the electrical connections. This results in significant electrical losses of up to several KW per connection and variations in the flow of current through these contacting surfaces.
- the re-machining of the deformed contact surfaces is no longer necessary thanks to the addition of copper foam. A significant improvement is thus obtained in the electrical connections having degraded and deformed contact surfaces 22 and 24, even when deformations of the order of a millimeter are involved.
- the deformability of the copper foam allows all of the foam 10 to conform to the degraded contours of the contacting surfaces 22 and 24, as described on the enlargement of FIG. 2b and thus 'Increase the contact surface and distribute the pressure exerted by the clamping means 25.
- the tips 11 located on the surface of the copper foam multiply the contact points. This results in an improvement in the current flow conditions by reducing the electrical losses.
- the tips 11 located on the surface of the copper foam also pierce the oxide layers which appear on the surface of the metals and therefore of the conductors 21 and 23, such as copper oxide or alumina for the 'aluminum. These layers have an insulating effect and act as resistors and therefore induce electrical losses.
- the device according to the invention makes it possible to improve the electrical conductance of a used connection, even without cleaning it beforehand.
- the peripheral seal 14 and 16 makes it possible to reduce the penetration of degrading external agents into the connection by creating a tight barrier at the periphery of the connection.
- the degrading agents are generally liquids such as soda or washing water or any other polluting product transported by water.
- Copper foam can be improved by depositing a product that improves heat transfer and electrical conductivity.
- the use of silver copper foam as an intermediate conductive element improves the efficiency of the device according to the invention.
- the drop in potential of a 1 dm 2 connection formed by two copper conductors is around 50 mV for a current with an intensity of 5000 A.
- the drop in potential decreases to 26 mV and with a silvery copper foam, the potential drop is only 5 mV for identical temperature and pressure conditions in the three cases.
- the silver is deposited on the copper foam by a conventional electrochemical process or under vacuum.
- an intermediate conductive element composed of a silver foam is also possible without departing from the scope of the invention.
- the device according to the invention is all the more advantageous in that its efficiency increases with temperature. Indeed, the drop in potential of a connection of 1 dm 2 using the device according to the invention with a silver copper foam is of the order of a few mV for a current with an intensity of 5000 A and at temperature 300 ° C. This peculiarity is due to the fact that the tips 11 of the metallic foam (of copper, silver plated copper or silver) are soldered under the effect of temperature to the conductors 21 and 23 with which they are in contact.
- metal foam is preferably used for the implementation of the invention, any other conductive foam composed of one or more materials could be used.
- the device according to the invention has many other advantages. Its implementation is quick, easy and clean. It is particularly advantageous to improve the conductance of the copper / copper electrical connections but also of the connections between two different electrical conductors such as the aluminum / copper or steel / aluminum or steel / copper pairs. By reducing the electrical losses which it induces, the device according to the present invention makes it possible to slow down the degradation of the surface condition of the electrical connections subjected to high intensity currents.
- the economic interests of this device are the reduction of costs due to the reduction of electrical losses and due to the reduction of maintenance and upkeep. In addition, these interests are part of an energy saving policy dictated by environmental standards.
- copper foam according to the invention can also be envisaged to improve the thermal contact conductance and thus avoid heat losses due to the passage of heat from one material to another.
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Contacts (AREA)
- Conductive Materials (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Push-Button Switches (AREA)
- Powder Metallurgy (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0214528 | 2002-11-20 | ||
FR0214528A FR2847391A1 (en) | 2002-11-20 | 2002-11-20 | Improved life contact connector mechanism having two conductors with intermediate insertion element placed between electrically conducting surfacers having several porous/high deformability rubber materials reducing electrical resistance |
PCT/FR2003/003440 WO2004049515A1 (en) | 2002-11-20 | 2003-11-20 | Contact device for improving lifetime of electrical connections |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1602153A1 true EP1602153A1 (en) | 2005-12-07 |
EP1602153B1 EP1602153B1 (en) | 2009-06-10 |
Family
ID=32187770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03786039A Expired - Lifetime EP1602153B1 (en) | 2002-11-20 | 2003-11-20 | Metal foaming material contact for electrical connections |
Country Status (10)
Country | Link |
---|---|
US (1) | US7229296B2 (en) |
EP (1) | EP1602153B1 (en) |
JP (1) | JP2006506796A (en) |
CN (1) | CN100468875C (en) |
AT (1) | ATE433609T1 (en) |
AU (1) | AU2003295045A1 (en) |
CA (1) | CA2506788C (en) |
DE (1) | DE60327951D1 (en) |
FR (1) | FR2847391A1 (en) |
WO (1) | WO2004049515A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5463742B2 (en) * | 2009-06-10 | 2014-04-09 | 三菱電機株式会社 | Connection device and switchboard using the same |
FR2952377B1 (en) * | 2009-11-09 | 2012-05-04 | Amc Holding | CONTACT DEVICE FOR IMPROVING THERMAL DISSIPATION OF HEAT GENERATING DEVICES |
FR2962856B1 (en) * | 2010-07-16 | 2012-08-17 | Amc Holding | ELECTRICAL CONNECTION DEVICE WITH IMPROVED CONDUCTANCE |
FR2996348B1 (en) * | 2012-10-03 | 2015-05-15 | Amc Holding | POWDER AND PASTE FOR IMPROVING THE CONDUCTANCE OF ELECTRICAL CONNECTIONS |
FR2997788B1 (en) | 2012-11-05 | 2016-01-22 | Amc Etec | DEVICE FOR DISCONNECTING A HIGH INTENSITY CURRENT POWER SUPPLY LINE |
CN203232920U (en) * | 2012-12-25 | 2013-10-09 | 华广生技股份有限公司 | Battery conductive sheet and electronic device provided with movable battery conductive sheet |
US9847521B2 (en) | 2012-12-25 | 2017-12-19 | Bionime Corporation | Conductive plate and an electronic device having the same |
CN105261844A (en) * | 2015-11-11 | 2016-01-20 | 何亮 | A filling member at a connecting portion of a plane conductor |
CN105932436A (en) * | 2016-06-01 | 2016-09-07 | 国网辽宁省电力有限公司葫芦岛供电公司 | Method for filling tin dielectric film used for connecting wire clamps of power equipment |
CN105977654A (en) * | 2016-06-01 | 2016-09-28 | 国网辽宁省电力有限公司葫芦岛供电公司 | Aluminum dielectric film filling method used for electric power equipment wire clamp connection |
CN105932510A (en) * | 2016-06-01 | 2016-09-07 | 国网辽宁省电力有限公司葫芦岛供电公司 | Method for filling copper dielectric film used for connecting wire clamps of power equipment |
CN106099405A (en) * | 2016-06-01 | 2016-11-09 | 国网辽宁省电力有限公司葫芦岛供电公司 | A kind of power equipment wire clamp connects with Copper-Aluminum compound deielectric-coating fill method |
FR3073677B1 (en) * | 2017-11-13 | 2019-10-11 | A M C | CONTACT DEVICE ADAPTED TO FACILITATE THE REPAIR OF BOLT ELECTRICAL CONNECTIONS |
CN111987488A (en) * | 2019-05-23 | 2020-11-24 | 广州华嘉电力科技有限公司 | Connecting device and method for self healing of power equipment connector |
DE102020128939A1 (en) | 2020-11-03 | 2022-05-05 | TenneT TSO GmbH | High voltage contact for a geometric imperfection tolerant high voltage connection |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3535676A (en) * | 1968-02-12 | 1970-10-20 | Hughes Aircraft Co | Electrical connector |
JPS5380589A (en) * | 1976-12-24 | 1978-07-17 | Hitachi Ltd | Connecting method for electric conductor |
US4923739A (en) * | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
US5153818A (en) * | 1990-04-20 | 1992-10-06 | Rohm Co., Ltd. | Ic memory card with an anisotropic conductive rubber interconnector |
EP0568755B1 (en) * | 1992-05-08 | 1996-08-21 | Multi-Contact Ag | Contact device |
US6114645A (en) * | 1995-04-27 | 2000-09-05 | Burgess; Lester E. | Pressure activated switching device |
US5857858A (en) * | 1996-12-23 | 1999-01-12 | General Electric Company | Demountable and repairable low pitch interconnect for stacked multichip modules |
US6309742B1 (en) * | 2000-01-28 | 2001-10-30 | Gore Enterprise Holdings, Inc. | EMI/RFI shielding gasket |
LU90721B1 (en) * | 2001-01-25 | 2002-07-26 | Circuit Foil Luxembourg Trading Sarl | Method for producing metal foams and furnace for producing same |
-
2002
- 2002-11-20 FR FR0214528A patent/FR2847391A1/en not_active Withdrawn
-
2003
- 2003-11-20 CA CA2506788A patent/CA2506788C/en not_active Expired - Lifetime
- 2003-11-20 DE DE60327951T patent/DE60327951D1/en not_active Expired - Lifetime
- 2003-11-20 WO PCT/FR2003/003440 patent/WO2004049515A1/en active Application Filing
- 2003-11-20 CN CN200380103766.2A patent/CN100468875C/en not_active Expired - Fee Related
- 2003-11-20 US US10/535,244 patent/US7229296B2/en not_active Expired - Lifetime
- 2003-11-20 AU AU2003295045A patent/AU2003295045A1/en not_active Abandoned
- 2003-11-20 EP EP03786039A patent/EP1602153B1/en not_active Expired - Lifetime
- 2003-11-20 AT AT03786039T patent/ATE433609T1/en not_active IP Right Cessation
- 2003-11-20 JP JP2004554614A patent/JP2006506796A/en active Pending
Non-Patent Citations (1)
Title |
---|
See references of WO2004049515A1 * |
Also Published As
Publication number | Publication date |
---|---|
CA2506788C (en) | 2012-06-12 |
DE60327951D1 (en) | 2009-07-23 |
JP2006506796A (en) | 2006-02-23 |
CN100468875C (en) | 2009-03-11 |
ATE433609T1 (en) | 2009-06-15 |
FR2847391A1 (en) | 2004-05-21 |
WO2004049515A1 (en) | 2004-06-10 |
EP1602153B1 (en) | 2009-06-10 |
CN1714478A (en) | 2005-12-28 |
CA2506788A1 (en) | 2004-06-10 |
US20060051990A1 (en) | 2006-03-09 |
AU2003295045A1 (en) | 2004-06-18 |
US7229296B2 (en) | 2007-06-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2506788C (en) | Contact device for improving lifetime of electrical connections | |
EP2593990B1 (en) | Electrical connection device having improved conductance | |
EP3562972B1 (en) | System for high-temperature tight coupling of a stack having soec/sofc-type solid oxides | |
EP2915172B1 (en) | Device for disconnecting an electrical supply line with a high-intensity current | |
FR2727788A1 (en) | CONNECTING PLIERS ON SET OF BARS FOR CIRCUIT BREAKER OR MULTIPOLAR SYSTEM | |
EP2904615B1 (en) | Powder and paste for improving the conductivity of electrical connections | |
EP2657944A2 (en) | Electric power transmission cable | |
FR2776127A1 (en) | SPLITTER FOR INTEGRATED CIRCUITS UNDER MODULE HERMETICALLY | |
EP1116424A1 (en) | Electronic assembly comprising a sole plate forming a heat sink | |
FR2952377A1 (en) | CONTACT DEVICE FOR IMPROVING THERMAL DISSIPATION OF HEAT GENERATING DEVICES | |
FR2969811A1 (en) | PISTON AND CYLINDER DEVICE FOR MEDIUM AND HIGH VOLTAGE ELECTRICAL EQUIPMENT. | |
FR3073677B1 (en) | CONTACT DEVICE ADAPTED TO FACILITATE THE REPAIR OF BOLT ELECTRICAL CONNECTIONS | |
EP3164530B1 (en) | Anode assembly | |
FR3019439A1 (en) | ELECTRONIC DEVICE COMPRISING AN IMPROVED THERMAL INTERFACE | |
FR2823020A1 (en) | Electrical connection of electrical wires with an electrical supply bar involves introducing stripped end of the wire into recess created in the side of the bar | |
FR2879849A1 (en) | HIGH CURRENT CURRENT TRANSMISSION DEVICE | |
CN1499166A (en) | Method for filling up slots between heat conductive parts as well as structure of part | |
FR2902228A1 (en) | Ground-neutral-phase protection device, has electrode layers arranged on surfaces of bodies, respectively, and including electrodes provided with respective terminals on one body, where electrode layers are made of silver paste |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20050915 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
PUAJ | Public notification under rule 129 epc |
Free format text: ORIGINAL CODE: 0009425 |
|
DAX | Request for extension of the european patent (deleted) | ||
32PN | Public notification |
Free format text: NOTIFICATION ETABLIE CONFORMEMENT AE L'ARTICLE 96(2) CBE |
|
R17C | First examination report despatched (corrected) |
Effective date: 20061124 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: A.M.C. SARL |
|
17Q | First examination report despatched |
Effective date: 20061124 |
|
RTI1 | Title (correction) |
Free format text: METAL FOAMING MATERIAL CONTACT FOR ELECTRICAL CONNECTIONS |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: FRENCH |
|
REF | Corresponds to: |
Ref document number: 60327951 Country of ref document: DE Date of ref document: 20090723 Kind code of ref document: P |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 |
|
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090910 Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FD4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 Ref country code: IE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090921 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20091010 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090910 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 |
|
26N | No opposition filed |
Effective date: 20100311 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20091130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090911 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 20101117 Year of fee payment: 8 Ref country code: DE Payment date: 20101112 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20101020 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20091120 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20091211 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 20101221 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090610 |
|
BERE | Be: lapsed |
Owner name: A.M.C. SARL Effective date: 20111130 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20111120 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111130 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111130 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20120731 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111130 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 60327951 Country of ref document: DE Effective date: 20120601 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111120 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111130 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: RN Effective date: 20130107 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120601 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: FC Effective date: 20130702 |
|
PGRI | Patent reinstated in contracting state [announced from national office to epo] |
Ref country code: FR Effective date: 20130726 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 13 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 14 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 15 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20221122 Year of fee payment: 20 |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230513 |