CN1499166A - Method for filling up slots between heat conductive parts as well as structure of part - Google Patents
Method for filling up slots between heat conductive parts as well as structure of part Download PDFInfo
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- CN1499166A CN1499166A CNA021498385A CN02149838A CN1499166A CN 1499166 A CN1499166 A CN 1499166A CN A021498385 A CNA021498385 A CN A021498385A CN 02149838 A CN02149838 A CN 02149838A CN 1499166 A CN1499166 A CN 1499166A
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- thermal conductor
- precoated layer
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- filled
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
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Abstract
A method for filling the gap between the first and the second heat transfer parts in order to decrease thermal resistance and increase heat transfer efficiency includes cleaning their surfaces, precoating, arranging then close to each other, applying a pressure for make them in tight fit, and heating until the coated layer becomes liquid phase.
Description
Technical field
The present invention relates to a kind of method and thermal conductor structure thereof of filling up gap between thermal conductor, be particularly related to a kind of can effectively the unfairness gap between first and second thermal conductor being filled up, reduce thermal resistance to have, improve hot transfer efficiency, processing fast, and can have the method for fixing advantages such as this first thermal conductor and the structure of thermal conductor thereof simultaneously concurrently.
Background technology
Known scatterer comprises a plurality of first thermal conductor (for example heat loose fin) and one second thermal conductor (for example circular pipe type heat pipe or plate-type heat-pipe etc.), and it is the heat transfer interface of heat transfer usefulness in first and second thermal conductor part that is adjacent to each other.And it is when being fixed in each first thermal conductor on second thermal conductor, general all apply one deck heat-conducting cream at the adjoiner of this first or second thermal conductor, treat its dry after, can with this respectively this first thermal conductor be fixed on second thermal conductor, and, and has the conduction of heat of suitable effect because this heat-conducting cream is positioned at described heat transfer surface place.
Yet there is shortcoming described as follows in it:
One, when applying described heat-conducting cream, easily because this first or second thermal conductor itself is unclean, and ooze with other impurity, influence the effect of this heat-conducting cream.
Two, between the adjacent surface of this first and second thermal conductor,, and between described heat transfer interface, include gas, even still exist and cause thermal resistance excessive and influence the shortcoming of hot transfer efficiency because of the formed gap of unfairness easily because of the unfairness of this adjacent surface.
Three, processed slow and cost higher.
Four, respectively there is to each other adjacent segment in the adjacent of this first thermal conductor, causes closely being connected together each other and the bigger puzzlement of thermal resistance is arranged.
If this first and second thermal conductor when being wringing fit, still must apply lubricant, and still must be cleaned once more after the combination, and when this first and second thermal conductor welded, must be applied soldering flux again, therefore the shortcoming of not environmental protection is arranged; And add scolder and be difficult between adjacent each first thermal conductor (radiating fin) of connecting airtight, uniformity coefficient is wayward, and the course of processing is also unstable.
In addition,, then can't directly weld at all, have the problem that must plating just can be welded to one another together if this first and second thermal conductor adopts unlike material.
Summary of the invention
Main purpose of the present invention is to provide a kind of method that gap between thermal conductor can be filled up, it can be filled up the unfairness gap between first and second thermal conductor effectively, reduces thermal resistance to reach, improves hot transfer efficiency, processing is quick and can has the function of fixing this first thermal conductor simultaneously concurrently.
For reaching above-mentioned purpose, the invention provides a kind of method of filling up gap between thermal conductor, may further comprise the steps:
(a) clean in advance: in advance that first and second thermal conductor cleaning is clean;
(b) cover precoated layer in advance: make this first or second thermal conductor cover one deck precoated layer in advance;
(c) with the adjacent setting of this first and second thermal conductor, make its step (b) the precoated layer that covers in advance just between this first and second thermal conductor;
(d) apply overdraft: this first thermal conductor is applied overdraft, so that this first thermal conductor tightly fits in this second thermal conductor; And
(e) heating: this has been become first and second thermal conductor heating of wringing fit state each other, and made Heating temperature rise to the liquid phase transformation temperature of described precoated layer.
Wherein, the material of described precoated layer is fusible liquid state or the fluidic material of changing under 40～300 ℃ of low temperature, and its fusing point is lower than the fusing point of this first and second thermal conductor; Its material can be tin, lead or low melting point alloy; Also can be wax, low-melting heat-conducting cream or high molecular polymer etc.; Its thickness is between 0.002～0.5mm;
Described second thermal conductor is the circular pipe type heat pipe; Plate-type heat-pipe; Heat transfer coefficient good metal rod or heat pass coefficient good metal plate etc.;
The present invention also provides a kind of thermal conductor structure, it can be filled up the gap between thermal conductor, this structure comprises first and second thermal conductor of joint adjacent one another are, an and precoated layer, this precoated layer is before first and second thermal conductor is bonded with each other, be arranged at one of them surface of this first and second thermal conductor, or be arranged on this both surface of first and second thermal conductor, and its fusing point is lower than the fusing point of this first and second thermal conductor.
Wherein, described precoated layer can be located at described thermal conductor surface in the part; It is fusible liquid state or the fluidic material of changing under 40～300 ℃ low temperature; Its material is tin, lead or low melting point alloy, also can be wax, low-melting heat-conducting cream or high molecular polymer; Its thickness is between 0.002～0.5mm;
Described second thermal conductor is the circular pipe type heat pipe, plate-type heat-pipe, heat transfer coefficient good metal rod or heat transfer coefficient good metal plate.
Below in conjunction with the drawings and specific embodiments the present invention is launched further detailed description.
Description of drawings
Fig. 1 is a method flow diagram of the present invention;
Fig. 2 is the side-view of structure of the present invention before heating;
Fig. 2 A is the partial enlarged drawing of the present invention according to Fig. 2;
Fig. 3 is the partial enlarged drawing of structure of the present invention after heating.
Embodiment
The present invention relates to first thermal conductor 1, the second thermal conductor 2, precoated layer 3 and the heat transfer interface 4.
See also shown in Figure 1, the invention provides a kind of method and thermal conductor structure thereof of filling up gap between thermal conductor, relate to the scatterer that comprises a plurality of first thermal conductor 1 (for example radiating fin) and one second thermal conductor 2 (for example circular pipe type heat pipe, plate-type heat-pipe or heat transfer coefficient good metal rod or metal sheet), 1,2 parts that are adjacent to each other of first and second thermal conductor, promptly form the heat transfer interface 4 of heat transfer usefulness, and the method that the gap of 1,2 of first and second thermal conductor that the present invention is adjacent to each other to this is filled up may further comprise the steps:
One, cleans in advance: in advance that these first and second thermal conductor 1,2 cleanings are clean;
Two, cover precoated layer in advance: make this first or second thermal conductor 1 or 2 cover one deck precoated layer 3 in advance, and its method that covers precoated layer 3 for example can be flood, methods such as coating or plating, and make precoated layer 3 be covered with whole first or second thermal conductor 1 or 2;
Three, with the adjacent setting of this first and second thermal conductor, make its in step 2 the precoated layer that covers in advance just between this first and second thermal conductor;
Four, apply overdraft: each first thermal conductor 1 is applied overdraft, so that each first thermal conductor 1 tightly fits in this second thermal conductor 2;
Five, heating: this has been become first and second thermal conductor 1,2 heating of wringing fit state each other, and made Heating temperature rise to the liquid phase transformation temperature of described precoated layer 3.
See also Fig. 2, Fig. 2 A and shown in Figure 3, when Heating temperature rises to the liquid phase transformation temperature of described precoated layer 3, this precoated layer 3 is changed to liquid phase by solid phase, simultaneously again because 1,2 pressure that produced of this friction tight each other first and second thermal conductor, and force this precoated layer that has been fused into liquid phase 3 to produce distortion and flow, therefore can discharge the gas of 4 of this heat transfer interfaces, and then these irregular heat transfer interface 4 places are given calking, thereby reduced thermal resistance, and formed good heat transfer interface 4.
And, owing to need not use this first and second thermal conductor 1,2 required lubricant when wringing fit, also need not use this first and second thermal conductor 1,2 in required soldering flux of when welding, thereby not only environmental protection but also clean, also have processing fast and the low advantage of cost.And avoided between adjacent each first thermal conductor (radiating fin) of connecting airtight, existing the interpolation scolder to be difficult for, to weld shortcomings such as inhomogeneous and course of processing instability.
Further, the present invention can also solve in the known scatterer first and second thermal conductor must galvanized shortcoming because the unlike material problem causes directly welding.
And all parts that touch of this scatterer (such as: between first thermal conductor 1 and first thermal conductor 1, or between first and second thermal conductor 1,2), all because of the existence of precoated layer 3, make after it heat fused, can be engaged and calking each contact part, contact part between two adjacent first thermal conductor 1 shown in Fig. 2 A can form as shown in Figure 3 joint and calking state after heating.
Certainly, in actual applications, described precoated layer 3 also can cover on the surface of this first and second thermal conductor 1,2 simultaneously in advance.
The material of this precoated layer 3 be a kind of under 40～300 ℃ of low temperature fusible liquid state or the fluidic material of changing into, and its fusing point is low than the fusing point of this first and second thermal conductor 1,2, for example tin, lead or low melting point alloy, again or wax, low-melting heat-conducting cream or high molecular polymer person all can.And the thickness of this precoated layer 3 is best between 0.002～0.5mm.
By the made structure of the inventive method, see also Fig. 2, Fig. 2 A and shown in Figure 3, comprise first and second thermal conductor 1,2 of joint adjacent one another are; And wherein whole (or local) surface before being bonded with each other of at least one thermal conductor is provided with precoated layer 3 (present embodiment is for being provided with precoated layer 3 on first thermal conductor, 1 surface, shown in Fig. 2 A), and the fusing point of this precoated layer 3 is lower than the fusing point of this first and second thermal conductor 1,2.
Aforesaid invention, because it is for covering precoated layer and heating afterwards in advance, and this 1,2 of first and second thermal conductor has because the pressure that wringing fit produced each other, so can force this precoated layer that has been fused into liquid phase 3 to produce distortion with mobile and discharge the gas of 4 of this heat transfer interfaces, and then these irregular heat transfer interface 4 places are given calking, thereby has the advantage that reduces thermal resistance.Moreover, because it can make with lubricator and soldering flux, so have not only environmental protection but also clean and process fast and the also low advantage of cost, also avoided simultaneously passing and have the scolder of interpolation to be difficult for, to weld shortcomings such as inhomogeneous and course of processing instability between part (radiating fin) in adjacent each first heat of connecting airtight.In addition, solved simultaneously known scatterer because of the unlike material problem of first and second thermal conductor causes directly welding must galvanized shortcoming.Because the existence of this precoated layer 3 can be engaged after heat fused and calking reaching all parts that touch between first and second thermal conductor between first and first thermal conductor.
Above-mentioned only is of the present invention one preferable feasible embodiment, non-so limitation protection scope of the present invention, and the equivalence that all utilizations specification sheets of the present invention and accompanying drawing content are done changes, and all is contained in protection scope of the present invention.
Claims (21)
1. method that the gap between thermal conductor is filled up may further comprise the steps:
(a) clean in advance: in advance that first and second thermal conductor cleaning is clean;
(b) cover precoated layer in advance: make this first or second thermal conductor cover one deck precoated layer in advance;
(c) with the adjacent setting of this first and second thermal conductor, make its step (b) the precoated layer that covers in advance just between this first and second thermal conductor;
(d) apply overdraft: this first thermal conductor is applied overdraft, so that this first thermal conductor tightly fits in this second thermal conductor; And
(e) heating: this has been become first and second thermal conductor heating of wringing fit state each other, and made Heating temperature rise to the liquid phase transformation temperature of described precoated layer.
2. the method that the gap between thermal conductor is filled up as claimed in claim 1, it is characterized in that, the material of described precoated layer is fusible liquid state or the fluidic material of changing under 40～300 ℃ of low temperature, and its fusing point is lower than the fusing point of this first and second thermal conductor.
3. the method that the gap between thermal conductor is filled up as claimed in claim 2 is characterized in that, the material of described precoated layer is tin, lead or low melting point alloy.
4. the method that the gap between thermal conductor is filled up as claimed in claim 2 is characterized in that, shown in the material of precoated layer be wax, low-melting heat-conducting cream or high molecular polymer.
5. the method that the gap between thermal conductor is filled up as claimed in claim 1 is characterized in that, the thickness of described precoated layer is between 0.002～0.5mm.
6. the method that the gap between thermal conductor is filled up as claimed in claim 1 is characterized in that, described second thermal conductor is the circular pipe type heat pipe.
7. the method that the gap between thermal conductor is filled up as claimed in claim 1 is characterized in that, described second thermal conductor is a plate-type heat-pipe.
8. the method that the gap between thermal conductor is filled up as claimed in claim 1 is characterized in that, described second thermal conductor is a heat transfer coefficient good metal rod.
9. the method that the gap between thermal conductor is filled up as claimed in claim 1 is characterized in that, described second thermal conductor is a heat transfer coefficient good metal plate.
10. thermal conductor structure, first and second thermal conductor that comprises joint adjacent one another are, it is characterized in that, this thermal conductor also comprises a precoated layer, it is before this first and second thermal conductor mutually combines, be arranged at this first and second thermal conductor one of them or boths' surface, and the fusing point of this precoated layer is lower than the fusing point of this first and second thermal conductor.
11. thermal conductor structure as claimed in claim 10 is characterized in that, described precoated layer is arranged at this both surface of first and second thermal conductor before this first and second thermal conductor is bonded with each other.
12. thermal conductor structure as claimed in claim 10 is characterized in that, described thermal conductor surface is located in described precoated layer part.
13. thermal conductor structure as claimed in claim 11 is characterized in that, described thermal conductor surface is located in described precoated layer part.
14. thermal conductor structure as claimed in claim 10 is characterized in that, the material of described precoated layer is fusible liquid state or the fluidic material of changing under 40～300 ℃ low temperature.
15. thermal conductor structure as claimed in claim 14 is characterized in that, the material of described precoated layer is tin, lead or low melting point alloy.
16. thermal conductor structure as claimed in claim 14 is characterized in that, the material of described precoated layer is wax, low-melting heat-conducting cream or high molecular polymer.
17. thermal conductor structure as claimed in claim 10 is characterized in that, the thickness of described precoated layer is between 0.002～0.5mm.
18. thermal conductor structure as claimed in claim 10 is characterized in that, described second thermal conductor is the circular pipe type heat pipe.
19. thermal conductor structure as claimed in claim 10 is characterized in that, described second thermal conductor is a plate-type heat-pipe.
20. thermal conductor structure as claimed in claim 10 is characterized in that, described second thermal conductor is a heat transfer coefficient good metal rod.
21. thermal conductor structure as claimed in claim 10 is characterized in that, described second thermal conductor is a heat transfer coefficient good metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021498385A CN100370210C (en) | 2002-11-06 | 2002-11-06 | Method for filling up slots between heat conductive parts as well as structure of part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021498385A CN100370210C (en) | 2002-11-06 | 2002-11-06 | Method for filling up slots between heat conductive parts as well as structure of part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1499166A true CN1499166A (en) | 2004-05-26 |
| CN100370210C CN100370210C (en) | 2008-02-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021498385A Expired - Fee Related CN100370210C (en) | 2002-11-06 | 2002-11-06 | Method for filling up slots between heat conductive parts as well as structure of part |
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| CN (1) | CN100370210C (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09501016A (en) * | 1993-07-14 | 1997-01-28 | コメリクス・インコーポレーテッド | Thermally conductive interface material with good familiarity |
| DE19512102A1 (en) * | 1995-04-03 | 1996-10-10 | Kurt Prof Dr Ing Koppe | Sheet part adhesive bonding for increased adhesive joint strength |
| JP2930186B2 (en) * | 1996-03-28 | 1999-08-03 | 松下電器産業株式会社 | Semiconductor device mounting method and semiconductor device mounted body |
| CN1133065C (en) * | 1999-04-08 | 2003-12-31 | 富准精密工业(深圳)有限公司 | Heat radiator and its manufacture method |
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2002
- 2002-11-06 CN CNB021498385A patent/CN100370210C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN100370210C (en) | 2008-02-20 |
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Granted publication date: 20080220 Termination date: 20111106 |