CN2693771Y - Thermal interfacial material - Google Patents
Thermal interfacial material Download PDFInfo
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- CN2693771Y CN2693771Y CN 200320119340 CN200320119340U CN2693771Y CN 2693771 Y CN2693771 Y CN 2693771Y CN 200320119340 CN200320119340 CN 200320119340 CN 200320119340 U CN200320119340 U CN 200320119340U CN 2693771 Y CN2693771 Y CN 2693771Y
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- phase change
- heat
- electronic component
- interfacial material
- heat interfacial
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Abstract
The utility model relates to a thermal interfacial material, comprising porous matrix of the high molecular material and phase change heat conducting material which is filled in the pore space of the porous matrix of the high molecular material. The phase change heat conducting material changes from solid state into gel state when the temperature is above the temperature of the phase change, which makes the heat conducting material of the phase change and the thermal interface material have flowability. The phase changes can fill the gap between the heat radiation device and the contact surface of the electronic components, which improves heat conduction efficiency. The porous matrix of the high molecular material provided a capillary environment for the phase change heat conducting material by means of the porosity characteristic. Due to the capillarity, the phase change heat conducting material can not spill when the phase change heat conducting material is changed into gel state, which can not pollute the electronic components and effect the performance of the electronic component.
Description
[technical field]
The utility model relates to a kind of heat interfacial material, particularly a kind of heat interfacial material that can make electronic component and the contact surface between the heat abstractor fully contact, improve electronic element radiating efficient.
[background technology]
Electronic technology develops rapidly in recent years, the high frequency of electronic component, high speed and unicircuit intensive and microminiaturized, make unit volume electronic component thermal value increase severely, therefore need on electronic component, attach a heat abstractor, the heat that is produced when electronic component is worked is led away, can steady running to guarantee electronic component.
Because the contact surface that heat abstractor is contacted with electronic component is not complete burnishing surface, when therefore both fit, both contact surfaces can't contact effectively fully, the heat that causes electronic component to produce can't be fast or is fully conducted on the heat abstractor, causes the electronic component cisco unity malfunction.
Prior art is coating one deck heat interfacial material such as thermal paste (cream) on heat abstractor and contact surface that electronic component contacts, make thermal paste (cream) fill up gap between heat abstractor and the electronic component contact surface, so that allow the heat that electronic component produced conduct on the heat abstractor quick and completely.
But, thermal paste (cream) is when coating, be difficult to the air on heat abstractor and the electronic component contact surface is drained, if residual air between thermal paste (cream) and the heat abstractor contact surface, not only be unfavorable for fully contacting of heat-transfer device and electronic component, and at heat abstractor with after electronic component combines, air expanded by heating dissipation in the working process, easily cause the inner cavity that produces as air bubble-shaped of thermal paste, this cavity still causes heat abstractor to contact with electronical elements surface not exclusively, the heat that electronic component produced can not conduct on the heat abstractor quick and completely, causes electronic element radiating insufficient, makes the electronic component cisco unity malfunction.
On February 6th, 2002, disclosed Chinese patent disclosed a kind of heat interfacial material No. 99816180, this heat interfacial material is by pressure sensitive adhesive, the mixture that alpha-olefin thermoplastic component and multiple heat conductive filler are constituted, because alpha-olefin thermoplastic component melt temperature is low, this heat interfacial material can be from solid-state can flow thick melt or the semi liquid state of becoming about 40 ℃ in the electronic component operating temperature range, liquid, but the flowable state heat interfacial material can fully fill up the gap between heat abstractor and the electronic component contact surface, and the heat that produces when guaranteeing electronic component work conducts quick and completely and causes heat abstractor.
But, during the heat interfacial material fusion that discloses in this patented technology, may flow out the contact surface between heat abstractor and the electronic component, not only cause the loss of heat interfacial material, also electronic component may be polluted, influence electronic component performance, therefore need a framework (as packing ring) that the heat interfacial material frame is lived, overflow or ooze out the contact surface between electronic component and the heat abstractor when preventing the heat interfacial material fusion.But the device of this similar framework makes and combines complicatedly more between heat abstractor and the electronic component, and makes that the possibility that increases the gap is more arranged between two contact surfaces.
Therefore, provide a kind of heat interfacial material that heat abstractor is fully contacted with the electronic component contact surface and do not overflow the contact surface between heat abstractor and the electronic component very necessary.
[utility model content]
The technical problems to be solved in the utility model is can not fully fit between heat abstractor and the contact surface that electronic component contacts in the prior art, causes electronic element radiating efficient to reduce; The phase change heat interfacial material overflows the contact surface between heat abstractor and the electronic component easily, causes heat interfacial material loss and pollution electronic component, influences electronic component performance.
The purpose of this utility model is to solve the problems of the technologies described above, a kind of heat interfacial material is provided, utilize the phase change of heat interfacial material own and be out of shape, guarantee fully to fit between the contact surface of heat abstractor and electronic component, and the phenomenon that heat interfacial material overflows contact surface between heat abstractor and the electronic component does not take place.
The technical scheme of the utility model technical solution problem provides a kind of heat interfacial material, and this heat interfacial material comprises porousness macromolecular material matrix and is filled in phase change thermally conductive material in the matrix pores.This porousness macromolecular material matrix is that the phase change thermally conductive material provides a capillary environment with its porosity characteristic, phase change thermally conductive material normal temperature is down for solid-state, when temperature is higher than its phase change temperature by the solid-state gel state that becomes, be full of the capillary-size pore of matrix, heat abstractor and electronic component contact surface are fully fitted, and can not overflow this contact surface.
Heat interfacial material provided by the utility model further improves and is: can add nano level conductive metal or metal compound powder in the phase change thermally conductive material, to strengthen the capacity of heat transmission of heat interfacial material.
Compared with prior art, heat interfacial material provided by the utility model has the following advantages: heat interfacial material as matrix, owing to its porous characteristic, forms an environment with capillarity with the porousness macromolecular material; Be filled with the phase change thermally conductive material in the hole, be attached at the contact surface of heat abstractor and electronic component when this heat interfacial material, during electronic component work, when temperature is higher than heat interfacial material phase change temperature, thermally conductive materials will be by the solid-state gel state that becomes, make this heat interfacial material have certain rheological properties, can fully fill up the space between heat abstractor and the electronic component contact surface, with raising electronic element radiating efficient, and the contact surface that can not overflow between heat abstractor and the electronic component owing to wicking action phase change thermally conductive material influences electronic component performance.
[description of drawings]
Fig. 1 is the heat interfacial material structural representation that the utility model first embodiment is provided.
Fig. 2 is the heat interfacial material structural representation that the utility model second embodiment is provided.
Fig. 3 is the synoptic diagram of thermal interface material applications in an electronic component shown in Figure 2.
Fig. 4 is the enlarged view of the contact surface part between Fig. 3 heat abstractor and the electronic component.
[embodiment]
Below in conjunction with illustrating the specific embodiment that heat interfacial material provided by the utility model is described:
As shown in Figure 1, heat interfacial material 10 comprises porousness macromolecular material matrix 11, is filled in the phase change thermally conductive materials 12 in the macromolecular material hole among first embodiment provided by the utility model.
Wherein porousness macromolecular material matrix 11 comprises polysiloxane, urethane, polyacrylic acid, thermoplastic elastomer etc., and its porosity requires more than 60%.Phase change thermally conductive materials 12 comprises the alpha-olefin thermoplastic component, and its phase change temperature is 40 ℃.
As shown in Figure 2, heat interfacial material 20 comprises porousness macromolecular material matrix 21, is filled in the phase change thermally conductive material 22 in matrix 21 holes and is dispersed in nano level heat-conducting metal or metal compound powder 23 in the phase change thermally conductive material 22 among second embodiment provided by the utility model.
Wherein porousness macromolecular material matrix 21 comprises polysiloxane, urethane, polyacrylic acid, thermoplastic elastomer etc., and its porosity requires more than 60%.Phase change thermally conductive materials 22 comprises the alpha-olefin thermoplastic component.Nano level heat-conducting metal or metal compound powder 23 comprise copper, aluminium, aluminum oxide, aluminium nitride, cupric oxide etc.
As shown in Figure 3, the utility model second embodiment heat interfacial material 20 is applied in heat radiation on the electronic component 32, is that heat interfacial material 20 is coated on the contact surface of heat abstractor 31 and electronic component 32.
Find out that from Fig. 4 the contact surface 311 of heat abstractor 31 is uneven surface with the contact surface 322 of electronic component 32, two contact surfaces need heat interfacial material 20 that it is fitted closely when fitting.When the service temperature of electronic component 32 surpasses 40 ℃, phase change thermally conductive material 22 becomes gel state from solid state transformation, thereby heat interfacial material 20 begins to soften, it is gapped to fill up between contact surface 311 and 322 institute, two contact surfaces are fully fitted, thereby the heat that electronic component 32 is produced can fully conduct to heat abstractor 31.Because porousness macromolecular material matrix 21 provides a capillary porous environment, wicking action still is retained in the hole of matrix 21 after making phase change thermally conductive material 22 change into gel state, can seepage or overflow heat abstractor 31 and electronic component 32 between contact surface and pollute electronic component 32, influence the performance of electronic component 32.
Claims (7)
1. heat interfacial material, it comprises macromolecular material matrix and phase change thermally conductive material, it is characterized in that this macromolecular material matrix is the porousness macromolecular material, this phase change thermally conductive material is filled in a plurality of holes of porousness macromolecular material matrix.
2. heat interfacial material as claimed in claim 1 is characterized in that this porousness macromolecular material matrix comprises polysiloxane, urethane, polyacrylic acid or thermoplastic elastomer.
3. heat interfacial material as claimed in claim 1 is characterized in that this porousness macromolecular material porosity is greater than 60%.
4. heat interfacial material as claimed in claim 1 is characterized in that this phase change thermally conductive material comprises the alpha-olefin thermoplastic component.
5. heat interfacial material as claimed in claim 1 is characterized in that this phase change thermally conductive material phase change temperature is 40 ℃.
6. heat interfacial material as claimed in claim 1 is characterized in that being added with in this phase-transition material nano level heat-conducting metal or metal compound powder.
7. heat interfacial material as claimed in claim 6 is characterized in that this nanometer grade powder comprises copper, aluminium, aluminum oxide, aluminium nitride or cupric oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320119340 CN2693771Y (en) | 2003-12-13 | 2003-12-13 | Thermal interfacial material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320119340 CN2693771Y (en) | 2003-12-13 | 2003-12-13 | Thermal interfacial material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2693771Y true CN2693771Y (en) | 2005-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320119340 Expired - Lifetime CN2693771Y (en) | 2003-12-13 | 2003-12-13 | Thermal interfacial material |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100572490C (en) * | 2005-10-20 | 2009-12-23 | 鸿富锦精密工业（深圳）有限公司 | A kind of method of synthetic thermal grease |
| CN104650814A (en) * | 2015-01-15 | 2015-05-27 | 北京大学 | Phase-change thermal rectifier and preparation method thereof |
| CN105210465A (en) * | 2013-03-15 | 2015-12-30 | 天津莱尔德电子材料有限公司 | Thermal interface materials |
| CN107760278A (en) * | 2016-08-22 | 2018-03-06 | 杜邦公司 | Composition as thermal interfacial material |
| CN109913183A (en) * | 2019-04-12 | 2019-06-21 | 哈尔滨理工大学 | A kind of insulating heat-conductive preparation of sections method with phase-change characteristic |
| CN111574967A (en) * | 2020-05-06 | 2020-08-25 | 苏州通富超威半导体有限公司 | Heat dissipation material, chip packaging assembly applying heat dissipation material and preparation method |
-
2003
- 2003-12-13 CN CN 200320119340 patent/CN2693771Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100572490C (en) * | 2005-10-20 | 2009-12-23 | 鸿富锦精密工业（深圳）有限公司 | A kind of method of synthetic thermal grease |
| CN105210465A (en) * | 2013-03-15 | 2015-12-30 | 天津莱尔德电子材料有限公司 | Thermal interface materials |
| CN104650814A (en) * | 2015-01-15 | 2015-05-27 | 北京大学 | Phase-change thermal rectifier and preparation method thereof |
| CN107760278A (en) * | 2016-08-22 | 2018-03-06 | 杜邦公司 | Composition as thermal interfacial material |
| CN109913183A (en) * | 2019-04-12 | 2019-06-21 | 哈尔滨理工大学 | A kind of insulating heat-conductive preparation of sections method with phase-change characteristic |
| CN111574967A (en) * | 2020-05-06 | 2020-08-25 | 苏州通富超威半导体有限公司 | Heat dissipation material, chip packaging assembly applying heat dissipation material and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20131213 Granted publication date: 20050420 |