EP1601043A2 - Verfahren und Vorrichtung zum Kühlen mit einem Kühlmittel mit einem Druck unterhalb des Umgebungsdrucks - Google Patents

Verfahren und Vorrichtung zum Kühlen mit einem Kühlmittel mit einem Druck unterhalb des Umgebungsdrucks Download PDF

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Publication number
EP1601043A2
EP1601043A2 EP05253020A EP05253020A EP1601043A2 EP 1601043 A2 EP1601043 A2 EP 1601043A2 EP 05253020 A EP05253020 A EP 05253020A EP 05253020 A EP05253020 A EP 05253020A EP 1601043 A2 EP1601043 A2 EP 1601043A2
Authority
EP
European Patent Office
Prior art keywords
coolant
heat
pressure
generating structure
passageway
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05253020A
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English (en)
French (fr)
Other versions
EP1601043A3 (de
Inventor
Richard M. Weber
Kerrin A. Rummel
Albert P. Payton
Gregory Dean Mcintire
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of EP1601043A2 publication Critical patent/EP1601043A2/de
Publication of EP1601043A3 publication Critical patent/EP1601043A3/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture

Definitions

  • This invention relates in general to cooling techniques and, more particularly, to a method and apparatus for controlling cooling of a system that generates a substantial amount of heat through use of coolant at a subambient pressure.
  • circuits of this type can usually be cooled satisfactorily through a passive approach, such as convection cooling.
  • convection cooling there are other circuits that consume large amounts of power, and produce large amounts of heat.
  • One example is the circuitry used in a phased array antenna system. More specifically, a modern phased array antenna system can easily produce 25 to 30 kilowatts of heat, or even more.
  • One known approach for cooling this circuitry is to incorporate a refrigeration unit into the antenna system. However, suitable refrigeration units are large, heavy, and consume many kilowatts of power in order to provide adequate cooling.
  • a typical refrigeration unit may weigh about 200 pounds, and may consume about 25 to 30 kilowatts of power in order to provide about 25 to 30 kilowatts of cooling.
  • refrigeration units of this type have been generally adequate for their intended purposes, they have not been satisfactory in all respects.
  • a method for controlling cooling of a heat-generating structure disposed in an environment having an ambient pressure includes providing a fluid coolant and reducing the pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure.
  • the method further includes boiling and vaporizing coolant to absorb heat from the heat-generating structure by bringing the coolant into thermal communication with the heat generating structure.
  • the method also includes measuring a parameter indicative of a pressure of the coolant and adjusting the pressure of the coolant in response to control the cooling of the heat-generating structure.
  • the temperature of a heat-generating device such as a phase array antenna
  • a control system that feeds back an indication of pressure of a coolant.
  • Such an approach avoids complex control schemes that must take into account thermal delay associated with feeding back the temperature of the heat-generating device.
  • Such an approach may avoid instability problems and provides a stable thermal environment during startup and when heat load environments change.
  • FIGURE 1 is a block diagram of an apparatus 10 that includes a phased array antenna system 12.
  • the antenna system 12 includes a plurality of identical modular parts that are commonly known as slats, two of which are depicted at 14 and 16.
  • a feature of the present invention involves techniques for controlling cooling the slats 14 and 16, so as to remove appropriate amounts of heat generated by electronic circuitry therein.
  • the electronic circuitry within the antenna system 12 has a known configuration, and is therefore not illustrated and described here in detail. Instead, the circuitry is described only briefly here, to an extent that facilitates an understanding of the present invention.
  • the antenna system 12 includes a two-dimensional array of not-illustrated antenna elements, each column of the antenna elements being provided on a respective one of the slats, including the slats 14 and 16.
  • Each slat includes separate and not-illustrated transmit/receive circuitry for each antenna element. It is the transmit/receive circuitry which generates most of the heat that needs to be withdrawn from the slats.
  • the heat generated by the transmit/receive circuitry is shown diagrammatically in FIGURE 1, for example by the arrows at 18 and 20.
  • Each of the slats is configured so that the heat it generates is transferred to a tube 22 or 24 extending through that slat.
  • the tube 22 or 24 could be a channel or passageway extending through the slat, instead of a physically separate tube.
  • a fluid coolant flows through each of the tubes 22 and 24. As discussed later, this fluid coolant is a two-phase coolant, which enters the slat in liquid form. Absorption of heat from the slat causes part or all of the liquid coolant to boil and vaporize, such that some or all of the coolant leaving the slats 14 and 16 is in its vapor phase.
  • This departing coolant then flows successively through a separator 26, a heat exchanger 28, a pump 30, and a respective one of two orifices 32 and 34, in order to again reach the inlet ends of the tubes 22 and 24.
  • the pump 30 causes the coolant to circulate around the endless loop shown in FIGURE 1. In the embodiment of FIGURE 1, the pump 30 consumes only about 0.1 kilowatts to 2.0 kilowatts of power.
  • Separator 26 separates the vaporized portion of the liquid coolant flowing through tubes 22 and 24 from the unvaporized liquid portion.
  • the vaporized portion is provided to heat exchanger 28, and the liquid portion is provided at separator pump 36.
  • Separator pump 36 receives the liquid portion of the coolant that has not vaporized in tubes 22 and 24 circulates this fluid back through tubes 22 and 24 via orifices 32 and 34.
  • the orifices 32 and 34 facilitate proper partitioning of the coolant among the respective slats, and also help to create a large pressure drop between the output of the pump 30 and the tubes 18 and 20 in which the coolant vaporizes. It is possible for the orifices 32 and 34 to have the same size, or to have different sizes in order to partition the coolant in a proportional manner which facilitates a desired cooling profile.
  • Ambient air or liquid 38 is caused to flow through the heat exchanger 28, for example by a not-illustrated fan of a known type. Alternatively, if the apparatus 10 was on a ship, the flow 38 could be ambient seawater.
  • the heat exchanger 28 transfers heat from the coolant to the air flow 38. The heat exchanger 28 thus cools the coolant, thereby causing any portion of the coolant which is in the vapor phase to condense back into its liquid phase.
  • the liquid coolant exiting the heat exchanger 28 is supplied to the expansion reservoir 40.
  • the expansion reservoir 40 is provided in order to take up the volume of liquid coolant that is displaced when some or all of the coolant in the system changes from its liquid phase to its vapor phase.
  • the amount of the coolant that is in its vapor phase can vary over time, due in part to the fact that the amount of heat being produced by the antenna system 12 will vary over time, as the antenna system operates in various operational modes.
  • Pressure controller 42 maintains the coolant at a desired subambient pressure in portions of the cooling loop downstream of the orifices 32 and 34 and upstream of the pump 30, as described in greater detail in conjunction with FIGURES 2 and 3.
  • the ambient air pressure will be that of atmospheric air, which at sea level is 14.7 pounds per square inch area (psia).
  • this subambient pressure may need to be adjusted to allow greater or lesser amounts of heat transfer from slats 18 and 20 at a desired temperature.
  • slats 18 and 20 are maintained at a desired temperature by feeding back the pressure of the coolant as it exits passageways 22 and 24.
  • pressure controller 42 may respond by raising or lowering the pressure of the coolant, which affects the boiling temperature of the coolant and therefore the rate of heat transfer. By feeding back the coolant pressure, as opposed to the temperature of the slats, associated thermal delay is eliminated from the control loop, permitting direct control of pressure without taking into account the thermal delay.
  • one highly efficient technique for removing heat from a surface is to boil and vaporize a liquid which is in contact with the surface. As the liquid vaporizes, it inherently absorbs heat. The amount of heat that can be absorbed per unit volume of a liquid is commonly known as the latent heat of vaporization of the liquid. The higher the latent heat of vaporization, the larger the amount of heat that can be absorbed per unit volume of liquid being vaporized.
  • the coolant used in the disclosed embodiment of FIGURE 1 is water. Water absorbs a substantial amount of heat as it vaporizes, and thus has a very high latent heat of vaporization. However, water boils at a temperature of 100oC at atmospheric pressure of 14.7 psia. In order to provide suitable cooling for an electronic apparatus such as the phased array antenna system 12, the coolant needs to boil at a temperature in the range of approximately 60oC. When water is subjected to a subambient pressure of about 3 psia, its boiling temperature decreases to approximately 60oC. Thus, in the embodiment of FIGURE 1, the orifices 32 and 34 permit the coolant pressure downstream from them to be substantially less than the coolant pressure between the pump 30 and the orifices 32 and 34.
  • Water flowing from the pump 30 to the orifices 32 and 34 has a temperature of approximately 60oC to 65oC, and a pressure in the range of approximately 15 psia to 100 psia. After passing through the orifices 32 and 34, the water will still have a temperature of approximately 60oC to 65oC, but will have a much lower pressure, in the range about 2 psia to 8 psia. Due to this reduced pressure, some or all of the water will boil as it passes through and absorbs heat from the tubes 22 and 24, and some or all of the water will thus vaporize. After exiting the slats, the water vapor (and any remaining liquid water) will still have the reduced pressure of about 2 psia to 8 psia.
  • the air flow 38 has a temperature less than a specified maximum of 55oC, and typically has an ambient temperature below 40oC.
  • any portion of the water which is in its vapor phase will condense, such that all of the coolant water will be in liquid form when it exits the heat exchanger 28.
  • This liquid will have a temperature of approximately 60oC to 65oC, and will still be at the subambient pressure of approximately 2 psia to 8 psia.
  • This liquid coolant will then flow to the pump 30 with a tee connection prior to the expansion reservoir 40.
  • the pump 30 will have the effect of increasing the pressure of the coolant water, to a value in the range of approximately 15 psia to 100 psia, as mentioned earlier.
  • FIGURE 1 operates without any refrigeration system.
  • high-power electronic circuitry such as that utilized in the phased array antenna system 12
  • the absence of a refrigeration system can result in a very significant reduction in the size, weight, and power consumption of the structure provided to cool the antenna system.
  • the coolant used in the embodiment of FIGURE 1 is water.
  • other coolants including but not limited to methanol, a fluorinert, a mixture of water and methanol, or a mixture of water and ethylene glycol (WEGL).
  • These alternative coolants each have a latent heat of vaporization less than that of water, which means that a larger volume of coolant must be flowing in order to obtain the same cooling effect that can be obtained with water.
  • a fluorinert has a latent heat of vaporization which is typically about 5% of the latent heat of vaporization of water.
  • the volume or flow rate of the fluorinert would have to be approximately 20 times the given volume or flow rate of water.
  • FIGURE 2 is a block diagram of the apparatus 10 of FIGURE 1 showing additional details related to the control of apparatus 10.
  • FIGURE 2 additionally illustrates a pressure transducer 44 that measures the pressure of the coolant within tubes 22 and 24.
  • pressure transducer 44 measures the pressure at which coolant within tubes 22 and 24 boils.
  • any transducer capable of providing an indication of the pressure at which coolant within tubes 22 and 24 boils may be utilized.
  • One example of such an alternative transducer is a temperature transducer, because the pressure at which coolant in tubes 22 and 24 boils may be determined by the temperature of such coolant.
  • Temperature transducer 44 provides a signal 46 indicative of the pressure coolant in tubes 22 and 24 to controller 42.
  • Controller 42 controls pressure of coolant in tubes 22 and 24 by either introducing additional coolant or removing coolant from the portion of the control loop between tubes 22 and 24 and heat exchange pump 30.
  • expansion reservoir 40 includes a pump motor 48 having a reversible shaft 50 driving a positive displacement charge pump 52. If it is determined that the pressure in tubes 22 and 24 needs to be increased, controller 42 commands (via command 60) the pump motor 48 to drive the positive displacement charge pump 52 to provide additional coolant to the coolant loop. If it is desired that the coolant pressure in tubes 22 and 24 be lowered, controller 42 commands pump motor 48 to drive positive displacement discharge pump 52 to remove coolant from the coolant loop and store it in a holding reservoir 54. Controller 42 also receives a level indication 56 indicative of the level of holding reservoir 54. Pump meter feeds back its speed to controller 42 via signal 62.
  • controller 42 also receives a signal 58 indicative of the heat load of base array antenna system 12. Because the relationship between the temperature of antenna array 12 and the pressure within tubes 22 and 24 depends upon the amount of heat being generated by antenna array 12, this signal may be utilized by controller 42 to determine whether the pressure in the cooling system loop should be increased or decreased. However, controller 42 may be appropriately programmed to provide the correct pressure adjustment based upon anticipated heat loads without receiving an indication of the actual heat load of antenna system 12. By controlling the temperature of antenna array system 12 through feedback and control of the pressure of the coolant in tubes 22 and 24, control loop complications associated with the thermal delay involved in feeding back temperature (and associated stability problems) can be avoided.
  • FIGURE 3 is a block diagram of the system of FIGURE 1 showing yet even further details related to the control of apparatus 10.
  • controller 42 receives a plurality of additional signals. These signals include a slat temperature level set 64, an ambient temperature 66, an ambient air pressure 68, slat temperatures 70, heat exchanger temperature and pressures 70, and a fan speed 74.
  • controller 42 also is shown as generating a plurality of additional signals, including a separator pump control signal 76, a heat exchange pump control signal 78, and a fan control signal 80.
  • Slat temperature level signal 64 presents a desired temperature for slats 18 and 20.
  • the slat temperature level is set and controller 42 utilizes the desired set level in determining any appropriate changes to the pressure of the coolant in tubes 22 and 24 to maintain this temperature. Such calculations may also include the heat load indicator 58.
  • the ambient air temperature signal 66 is used to set the speed of a fan 82 to ensure that the correct air mass flow rate through heat exchanger 28 occurs for a specific heat load relative to the temperature of the ambient air entering the heat exchanger 28.
  • the ambient air pressure may vary as a function of the operating altitude of apparatus 10.
  • Signal 68 which is indicative of the ambient air pressure is used to set the fan 82 motor speed to ensure the correct air mass flow through the heat exchanger regardless of altitude.
  • the ambient air pressure signal 68 is also used to compensate for pressure variations in the holding reservoir 54 until an optimum pressure is maintained.
  • the heat exchanger temperatures, represented by numeral 72, at the heat exchanger inlet and outlet are provided to controller 42 to indicate the performance of the heat exchanger and to see if the heat exchanger 28 is reaching its maximum capacity, as indicated by the outlet temperature being close to or the same as the inlet temperature.
  • the associated heat exchanger pressures, also represented by reference numeral 72, is provided to controller 42 on both sides of the heat exchanger 38. These pressures are used to determine the air mass flow rate through the heat exchanger and determine the desired fan motor speed. In addition, these pressures are used with the measured fan speed to assess if the heat exchanger 28 is getting clogged with trash or debris.
  • Fan control signal 80 and the associated fan speed 74 are provided by and to controller 42 to control the fan speed to regulate the air mass flow through heat exchanger 28.
  • Slat temperature level set 64 is a signal provided to controller 42 that informs controller 42 that it should raise the saturation pressure in the loop to raise its boiling temperature during periods of low heat load. This is performed to hold the temperature of the slat assembly constant over a range of heat loads.
  • Controller 42 also generates halt and status reporting signals, represented collectively by reference numeral 84. Signals 84 communicate the operational status of the cooling system and reports whether the cooling system is operating within set limits based on the heat load being removed. Controller 42 also reports if any alarm or shutdown limits have been reached.
  • FIGURE 4 is a diagram of an example linear actuated bellows-like reservoir 86 that may be used as an alternative approach for moving fluid into or out of the control loop to control the loop's pressure.
  • Reservoir 86 includes a linear actuator 88 that may pull or push on a free end 90 of the bellows 92 to evacuate the loop or to let coolant flow back into the loop.
  • Reservoir 86 combines the functions of holding reservoir 54 and dispositive displacement charge pump 52.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP05253020A 2004-05-25 2005-05-17 Verfahren und Vorrichtung zum Kühlen mit einem Kühlmittel mit einem Druck unterhalb des Umgebungsdrucks Withdrawn EP1601043A3 (de)

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US853038 2004-05-25
US10/853,038 US20050262861A1 (en) 2004-05-25 2004-05-25 Method and apparatus for controlling cooling with coolant at a subambient pressure

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EP1601043A3 EP1601043A3 (de) 2006-10-11

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007102978A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center
WO2007133357A3 (en) * 2006-05-02 2008-03-06 Raytheon Co Method and apparatus for cooling electronics with a coolant at a subambient pressure
WO2009039057A1 (en) * 2007-09-21 2009-03-26 Raytheon Company Topping cycle for a sub-ambient cooling system
WO2009039128A1 (en) * 2007-09-17 2009-03-26 Raytheon Company Cooling system for high power vacuum tubes
WO2009108572A1 (en) * 2008-02-25 2009-09-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
EP2000753A3 (de) * 2007-03-22 2012-02-15 Raytheon Company System und Verfahren zur Trennung von Komponenten einer Kühlflüssigkeit zur Kühlung einer Struktur

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
US20120022706A1 (en) * 2009-03-27 2012-01-26 Carrier Corporation System and method for controlling a refrigeration system
US20120325436A1 (en) * 2011-06-27 2012-12-27 Shedd Timothy A High efficiency thermal management system
KR102566875B1 (ko) * 2022-10-07 2023-08-14 한화시스템 주식회사 안테나 냉각 장치 및 그 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003065781A1 (en) * 2002-01-29 2003-08-07 Telefonaktiebolaget Lm Ericsson Cabinet cooling
US6866092B1 (en) * 1981-02-19 2005-03-15 Stephen Molivadas Two-phase heat-transfer systems

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1528619A (en) * 1924-09-22 1925-03-03 Paul Hofer Production of cold glaze wall and floor plates
US1906422A (en) * 1931-11-14 1933-05-02 Atlantic Refining Co Apparatus for heating
US2321964A (en) * 1941-08-08 1943-06-15 York Ice Machinery Corp Purge system for refrigerative circuits
US2371443A (en) * 1942-03-02 1945-03-13 G & J Weir Ltd Closed feed system for steam power plants
US3131548A (en) * 1962-11-01 1964-05-05 Worthington Corp Refrigeration purge control
US3174540A (en) * 1963-09-03 1965-03-23 Gen Electric Vaporization cooling of electrical apparatus
US3371298A (en) * 1966-02-03 1968-02-27 Westinghouse Electric Corp Cooling system for electrical apparatus
US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
US3586101A (en) * 1969-12-22 1971-06-22 Ibm Cooling system for data processing equipment
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
US3756903A (en) * 1971-06-15 1973-09-04 Wakefield Eng Inc Closed loop system for maintaining constant temperature
US5333677A (en) * 1974-04-02 1994-08-02 Stephen Molivadas Evacuated two-phase head-transfer systems
US3989102A (en) * 1974-10-18 1976-11-02 General Electric Company Cooling liquid de-gassing system
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
US4301861A (en) * 1975-06-16 1981-11-24 Hudson Products Corporation Steam condensing apparatus
US4003213A (en) * 1975-11-28 1977-01-18 Robert Bruce Cox Triple-point heat pump
US4129180A (en) * 1976-12-06 1978-12-12 Hudson Products Corporation Vapor condensing apparatus
US4169356A (en) * 1978-02-27 1979-10-02 Lloyd Kingham Refrigeration purge system
GB2029250B (en) * 1978-09-05 1982-10-27 Apv Spiro Gills Ltd Water chilling plant
JPS55118561A (en) * 1979-03-05 1980-09-11 Hitachi Ltd Constant pressure type boiling cooler
US4511376A (en) * 1980-04-07 1985-04-16 Coury Glenn E Method of separating a noncondensable gas from a condensable vapor
US4381817A (en) * 1981-04-27 1983-05-03 Foster Wheeler Energy Corporation Wet/dry steam condenser
US4495988A (en) * 1982-04-09 1985-01-29 The Charles Stark Draper Laboratory, Inc. Controlled heat exchanger system
US4794984A (en) * 1986-11-10 1989-01-03 Lin Pang Yien Arrangement for increasing heat transfer coefficient between a heating surface and a boiling liquid
US4998181A (en) * 1987-12-15 1991-03-05 Texas Instruments Incorporated Coldplate for cooling electronic equipment
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
DE4118196C2 (de) * 1990-06-29 1995-07-06 Erno Raumfahrttechnik Gmbh Verdampfungswärmetauscher
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
JPH0827109B2 (ja) * 1990-07-12 1996-03-21 甲府日本電気株式会社 液体冷却装置
US5128689A (en) * 1990-09-20 1992-07-07 Hughes Aircraft Company Ehf array antenna backplate including radiating modules, cavities, and distributor supported thereon
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5067560A (en) * 1991-02-11 1991-11-26 American Standard Inc. Condenser coil arrangement for refrigeration system
US5148859A (en) * 1991-02-11 1992-09-22 General Motors Corporation Air/liquid heat exchanger
US5181395A (en) * 1991-03-26 1993-01-26 Donald Carpenter Condenser assembly
NO915127D0 (no) * 1991-12-27 1991-12-27 Sinvent As Kompresjonsanordning med variabelt volum
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5501082A (en) * 1992-06-16 1996-03-26 Hitachi Building Equipment Engineering Co., Ltd. Refrigeration purge and/or recovery apparatus
US5245839A (en) * 1992-08-03 1993-09-21 Industrial Technology Research Institute Adsorption-type refrigerant recovery apparatus
US5261246A (en) * 1992-10-07 1993-11-16 Blackmon John G Apparatus and method for purging a refrigeration system
US5493305A (en) * 1993-04-15 1996-02-20 Hughes Aircraft Company Small manufacturable array lattice layers
US5507150A (en) * 1994-02-04 1996-04-16 Texas Instruments Incorporated Expendable liquid thermal management system
US5515690A (en) * 1995-02-13 1996-05-14 Carolina Products, Inc. Automatic purge supplement after chamber with adsorbent
US5960861A (en) * 1995-04-05 1999-10-05 Raytheon Company Cold plate design for thermal management of phase array-radar systems
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US5605054A (en) * 1996-04-10 1997-02-25 Chief Havc Engineering Co., Ltd. Apparatus for reclaiming refrigerant
US5701751A (en) * 1996-05-10 1997-12-30 Schlumberger Technology Corporation Apparatus and method for actively cooling instrumentation in a high temperature environment
US5943211A (en) * 1997-04-18 1999-08-24 Raytheon Company Heat spreader system for cooling heat generating components
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
US5841564A (en) * 1996-12-31 1998-11-24 Motorola, Inc. Apparatus for communication by an electronic device and method for communicating between electronic devices
US5806322A (en) * 1997-04-07 1998-09-15 York International Refrigerant recovery method
US5815370A (en) * 1997-05-16 1998-09-29 Allied Signal Inc Fluidic feedback-controlled liquid cooling module
US5818692A (en) * 1997-05-30 1998-10-06 Motorola, Inc. Apparatus and method for cooling an electrical component
US5862675A (en) * 1997-05-30 1999-01-26 Mainstream Engineering Corporation Electrically-driven cooling/heating system utilizing circulated liquid
US5950717A (en) * 1998-04-09 1999-09-14 Gea Power Cooling Systems Inc. Air-cooled surface condenser
US6055154A (en) * 1998-07-17 2000-04-25 Lucent Technologies Inc. In-board chip cooling system
US6018192A (en) * 1998-07-30 2000-01-25 Motorola, Inc. Electronic device with a thermal control capability
US6297775B1 (en) * 1999-09-16 2001-10-02 Raytheon Company Compact phased array antenna system, and a method of operating same
US6519955B2 (en) * 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
US6292364B1 (en) * 2000-04-28 2001-09-18 Raytheon Company Liquid spray cooled module
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
CA2329408C (en) * 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
US6594479B2 (en) * 2000-12-28 2003-07-15 Lockheed Martin Corporation Low cost MMW transceiver packaging
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6976527B2 (en) * 2001-07-17 2005-12-20 The Regents Of The University Of California MEMS microcapillary pumped loop for chip-level temperature control
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
JP3946018B2 (ja) * 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US7000691B1 (en) * 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US6708511B2 (en) * 2002-08-13 2004-03-23 Delaware Capital Formation, Inc. Cooling device with subcooling system
US6957550B2 (en) * 2003-05-19 2005-10-25 Raytheon Company Method and apparatus for extracting non-condensable gases in a cooling system
US6827135B1 (en) * 2003-06-12 2004-12-07 Gary W. Kramer High flux heat removal system using jet impingement of water at subatmospheric pressure
US6952345B2 (en) * 2003-10-31 2005-10-04 Raytheon Company Method and apparatus for cooling heat-generating structure
US6952346B2 (en) * 2004-02-24 2005-10-04 Isothermal Systems Research, Inc Etched open microchannel spray cooling

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6866092B1 (en) * 1981-02-19 2005-03-15 Stephen Molivadas Two-phase heat-transfer systems
WO2003065781A1 (en) * 2002-01-29 2003-08-07 Telefonaktiebolaget Lm Ericsson Cabinet cooling

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007102978A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center
WO2007133357A3 (en) * 2006-05-02 2008-03-06 Raytheon Co Method and apparatus for cooling electronics with a coolant at a subambient pressure
US7908874B2 (en) 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
US8490418B2 (en) 2006-05-02 2013-07-23 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
EP2000753A3 (de) * 2007-03-22 2012-02-15 Raytheon Company System und Verfahren zur Trennung von Komponenten einer Kühlflüssigkeit zur Kühlung einer Struktur
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
WO2009039128A1 (en) * 2007-09-17 2009-03-26 Raytheon Company Cooling system for high power vacuum tubes
WO2009039057A1 (en) * 2007-09-21 2009-03-26 Raytheon Company Topping cycle for a sub-ambient cooling system
WO2009108572A1 (en) * 2008-02-25 2009-09-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack

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