EP1570504A1 - Mikromekanischer schalter und verfahren zur herstellung - Google Patents

Mikromekanischer schalter und verfahren zur herstellung

Info

Publication number
EP1570504A1
EP1570504A1 EP03815100A EP03815100A EP1570504A1 EP 1570504 A1 EP1570504 A1 EP 1570504A1 EP 03815100 A EP03815100 A EP 03815100A EP 03815100 A EP03815100 A EP 03815100A EP 1570504 A1 EP1570504 A1 EP 1570504A1
Authority
EP
European Patent Office
Prior art keywords
bridge
conductive element
conductive
substrate
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03815100A
Other languages
English (en)
French (fr)
Other versions
EP1570504B1 (de
Inventor
Pierre-Louis Charvet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of EP1570504A1 publication Critical patent/EP1570504A1/de
Application granted granted Critical
Publication of EP1570504B1 publication Critical patent/EP1570504B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics

Definitions

  • the invention relates to a micro-mechanical switch, comprising a deformable bridge, connected at its ends to a substrate, and actuating means intended to deform the deformable bridge so as to establish electrical contact between a first conductive element, integral with the substrate and disposed between the bridge and the substrate, and a third conductive element disposed on the substrate at the periphery of the bridge.
  • contact resistance may fluctuate over time or be too high when contact is not intimate enough.
  • a known embodiment comprises a deformable bridge and first conductive elements, intended to be connected to each other, arranged on a substrate between the substrate and the bridge.
  • the bridge has a second conductive element on its underside.
  • the electrical contact between the first conductive elements is established when the bridge is deformed by actuating means so that the second conductive element touches all the first conductive elements.
  • this constitutes a hyperstatic structure (comparable to a table with four legs where one leg is superabundant), that is to say that only one of the contacts is intimate and has a low contact resistance while the contact resistances of the other contacts are higher.
  • very precise precision is required during the manufacture of the switch, which would make manufacture difficult and expensive.
  • Document WO02 / 01584 describes a micro-mechanical switch comprising a metal bridge, arranged on a substrate and deformable by means of an electrostatic actuator, and a conductive element arranged between the bridge and the substrate.
  • the actuation of the electrostatic actuator causes the deformation of the bridge, so as to establish an electrical contact between the bridge and the conductive element.
  • the bridge can undergo hardening, in use, which can lead to its rupture.
  • the invention aims to remedy these drawbacks and, more particularly, to produce a more robust switch, while avoiding the problems of hyperstatic structure.
  • the deformable bridge comprises at least a first insulating layer pierced with an orifice, in which is arranged a conductive material projecting from the face bottom of the bridge so as to form a second conductive element, intended to come into contact with the first conductive element during the deformation of the bridge, a conductive line connecting the second conductive element to the third conductive element being disposed on the first insulating layer.
  • the invention also relates to a method for producing a switch according to the invention, in which the manufacturing of the deformable bridge is carried out by: depositing a sacrificial layer above the first conductive element, depositing a first insulating layer on the sacrificial layer, etching of an orifice in the first insulating layer and in the sacrificial layer, deposition of a metallic layer so as to fill the orifice and to form the second conductive element and the conductive line, removal of the layer sacrificial.
  • FIG. 1 shows a micro-mechanical switch according to the prior art.
  • FIG. 2 represents a micro-mechanical switch according to the invention.
  • FIG. 3 represents a preferred embodiment of a micro-mechanical switch according to the invention.
  • FIG. 4 represents a top view of an embodiment of a switch according to the invention. Description of particular embodiments.
  • the micro-mechanical switch shown in FIG. 1 is composed of a deformable bridge 1, attached at its ends to a substrate 2, and actuation means 3a and 3b intended to deform the deformable bridge 1 so as to establish contact electric between first conductive elements 4 (three in FIG. 1), formed on the substrate 2 between the bridge 1 and the substrate 2, and a second conductive element 5, integral with a lower face of the bridge 1.
  • This switch according to l prior art establishes electrical contact between the first conductive elements 4 when the actuating means 3 deform the bridge
  • the second conductive element 5 is permanently connected, via a conductive line 6 secured to the bridge 1, to a third conductive element 7 disposed on the substrate 2 at the periphery of the bridge 1.
  • the deformation of the bridge 1 establishes an electrical contact, via the conductive line 6 and the second conductive element 5, between the third conductive element 7 and a single first conductive element 4, disposed opposite screw of the second conductive element 5.
  • the deformable bridge 1 is constituted by a first insulating layer pierced with an orifice 10, in which a conductive material is arranged projecting from the underside of the bridge 1 so as to form a second conductive element 5, intended coming into contact with the first conductive element during the deformation of the bridge 1.
  • the underside of the bridge 1 is made of insulating material.
  • the deformable bridge 1 can be formed by a superposition of thin layers.
  • a conductive layer, constituting the conductive line 6 and connecting the second conductive element 5 and the third conductive element 7, can be formed on the first insulating layer.
  • the second conductive element 5 and the conductive line 6 can be constituted by the same conductive layer.
  • a second insulating layer 8 can be formed above the conductive line 6.
  • a conductive line 6 connects the second conductive element 5 to two third conductive elements 7, arranged on either side of the bridge 1.
  • the bridge 1 can have an insulating layer 8 above the conductive line 6.
  • An insulating layer 9 is preferably arranged between the first conductive element 4 and the substrate 2, the insulating layer 9 having lateral dimensions smaller than the lateral dimensions of the first conductive element 4, so that the first conductive element 4 is convex. Thanks to the convex shape of the first conductive element 4, the contact between the first conductive element 4 and the second conductive element 5 forms a contact located at the center of the boss.
  • a switch according to the invention has the advantage of being robust and of having a single contact, which can be made sufficiently intimate by suitable actuation. Therefore, the contact resistance is very low.
  • the micro-mechanical switch can be a normally open radio frequency switch, the actuation means 3 comprising an electrostatic actuator.
  • the first conductive element 4 is a radiofrequency line.
  • the actuating means 3 are preferably constituted by electrodes 3a and 3b of an electrostatic actuator. The electrodes 3a can be placed in the first insulating layer of the bridge
  • the electrodes 3a, integral with the bridge 1, are connected to a voltage source.
  • the electrodes 3b make it possible to establish an attractive electrical force between the electrodes 3a and the electrodes 3b making it possible to deform the bridge 1 when a voltage is applied between the electrodes 3a and 3b.
  • the electrodes 3b serve as a waveguide for the signal transmitted by the radiofrequency line constituting the first conductive element 4.
  • the third conductive elements 7 are constituted by electric ground planes arranged on the substrate 2 on either side of the deformable bridge 1.
  • the radiofrequency switch described above represents the advantage of transmitting, in the on state, the radiofrequency signal without any loss of contact.
  • the entire radiofrequency component can be produced on the substrate 2 by conventional techniques for manufacturing integrated circuits.
  • the surface of the substrate 2, on which the third and first conductive elements 4 and 7 are arranged, must be made of insulating material to avoid a short circuit permanent conductive elements.
  • the insulating material is typically silicon oxide.
  • an insulating layer 9 is deposited on the substrate 2 at the locations of the electrodes 3b and at the location of the first conductive element 4, the insulating layer 9 having lateral dimensions smaller than the lateral dimensions of the electrodes 3b and of the first conductive element 4 respectively.
  • the material of the insulating layer 9 can for example be Si 3 N 4 or Si0 2 .
  • the first conductive element 4 and the electrodes 3b can be deposited on the insulating layer 9 by depositing a metallic layer, preferably made of gold.
  • the sacrificial layer can then be deposited above the first conductive element 4 and the electrodes 3b.
  • the material of the sacrificial layer is typically a polymer material, allowing it to be easily removed after the fabrication of the bridge.
  • a layer of insulating material forming the framework of the bridge 1 is deposited.
  • the insulating material of this layer can for example be Si 3 N 4 or Si0 2 .
  • the electrodes 3a can be manufactured by a metallic deposit on the insulating layer forming the framework of the bridge 1 and covering of the electrodes 3a by an additional insulating layer (not shown), intended to isolate the electrodes 3a from the conductive line 6.
  • the orifice 10 is pierced by etching in the insulating layer forming the framework of the bridge 1, in the additional insulating layer and in the sacrificial layer.
  • the second conductive element 5 and the conductive line 6 are then produced, preferably simultaneously, by depositing a metal layer so as to fill the orifice 10 and to form a layer connecting the second conductive element 5 and the third conductive element 7
  • a second insulating layer Preferably a second insulating layer

Landscapes

  • Micromachines (AREA)
  • Control Of El Displays (AREA)
  • Manufacture Of Switches (AREA)
EP03815100A 2002-12-10 2003-12-09 Mikromekanischer schalter und verfahren zur herstellung Expired - Lifetime EP1570504B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0215605A FR2848331B1 (fr) 2002-12-10 2002-12-10 Commutateur micro-mecanique et procede de realisation
FR0215605 2002-12-10
PCT/FR2003/003641 WO2004064096A1 (fr) 2002-12-10 2003-12-09 Commutateur micro-mecanique et procede de realisation

Publications (2)

Publication Number Publication Date
EP1570504A1 true EP1570504A1 (de) 2005-09-07
EP1570504B1 EP1570504B1 (de) 2011-08-24

Family

ID=32320165

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03815100A Expired - Lifetime EP1570504B1 (de) 2002-12-10 2003-12-09 Mikromekanischer schalter und verfahren zur herstellung

Country Status (5)

Country Link
US (1) US7382218B2 (de)
EP (1) EP1570504B1 (de)
AT (1) ATE521977T1 (de)
FR (1) FR2848331B1 (de)
WO (1) WO2004064096A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2876995B1 (fr) * 2004-10-26 2007-05-04 Commissariat Energie Atomique Microsysteme comportant un pont deformable
JP4234737B2 (ja) * 2006-07-24 2009-03-04 株式会社東芝 Ｍｅｍｓスイッチ
US8450902B2 (en) * 2006-08-28 2013-05-28 Xerox Corporation Electrostatic actuator device having multiple gap heights
KR100837741B1 (ko) * 2006-12-29 2008-06-13 삼성전자주식회사 미세 스위치 소자 및 미세 스위치 소자의 제조방법
JP4334581B2 (ja) * 2007-04-27 2009-09-30 株式会社東芝 静電型アクチュエータ
US7902946B2 (en) * 2008-07-11 2011-03-08 National Semiconductor Corporation MEMS relay with a flux path that is decoupled from an electrical path through the switch and a suspension structure that is independent of the core structure and a method of forming the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046659A (en) * 1998-05-15 2000-04-04 Hughes Electronics Corporation Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications
AU2001268742A1 (en) * 2000-06-28 2002-01-08 The Regents Of The University Of California Capacitive microelectromechanical switches
KR100929601B1 (ko) * 2001-08-20 2009-12-03 허니웰 인터내셔널 인코포레이티드 스냅작동식 열 스위치
US6876282B2 (en) * 2002-05-17 2005-04-05 International Business Machines Corporation Micro-electro-mechanical RF switch
JP4447940B2 (ja) * 2004-02-27 2010-04-07 富士通株式会社 マイクロスイッチング素子製造方法およびマイクロスイッチング素子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004064096A1 *

Also Published As

Publication number Publication date
FR2848331B1 (fr) 2005-03-11
US20050280974A1 (en) 2005-12-22
WO2004064096A1 (fr) 2004-07-29
EP1570504B1 (de) 2011-08-24
FR2848331A1 (fr) 2004-06-11
ATE521977T1 (de) 2011-09-15
US7382218B2 (en) 2008-06-03

Similar Documents

Publication Publication Date Title
EP1639613B1 (de) Bistabiler mikroschalter mit geringer stromaufnahme
FR2690003A1 (fr) Résistance pastille à couche métallique.
CH691559A5 (fr) Micro-contacteur magnétique et son procédé de fabrication.
EP0310463A1 (de) Gehäuse für einen hochintegrierten Schaltkreis
FR2616995A1 (fr) Procede de fabrication de modules electroniques
EP3465724B1 (de) Mems-membran mit integrierter übertragungsleitung
EP1562207B1 (de) Mikroelektromechanisches System mit zwei stabilen Kipplagen
FR2984009A1 (fr) Dispositif mecanique de commutation electrique integre
EP1543535B1 (de) Herstellungsverfahren eines elektrostatisch betriebenen mikroschalters mit kurzer antwortzeit und leistungsumschaltung
EP1570504B1 (de) Mikromekanischer schalter und verfahren zur herstellung
EP1652205B1 (de) Bistabiler mikromechanischer schalter, betätigungsverfahren und entsprechendes verfahren zu seiner realisierung
EP2024986B1 (de) Hochfrequenz- oder hyperfrequenz-mikroschalterstruktur und verfahren zur herstellung einer solchen struktur
EP1438728A2 (de) Mikroeinstellbarer kondensator (mems) mit weitem variationsbereich und niedriger betätigungsspannung
EP1565921B1 (de) Mikromechanischer elektrostatischer schalter mit niedriger betätigungsspannung
EP1231615A1 (de) Struktur einer integrierten Induktivität
EP3459101B1 (de) Mikroelektromechanischer schalter mit variabler funkfrequenz
FR2835963A1 (fr) Micro-composant du type micro-interrupteur et procede de fabrication d'un tel micro-composant
EP0874379A1 (de) Magnetischer Mikroschalter und Herstellungsverfahren
FR2819921A1 (fr) Dispositif de transmission de donnees pour la transmission separee galvaniquement de signaux et utilisation du dispositif
EP1805100B1 (de) Mikrosystem mit verformbarer brücke
FR2862806A1 (fr) Composant incluant un condensateur variable
FR2766962A1 (fr) Microinterrupteur thermique compatible avec un circuit integre
FR3022691A1 (fr) Dispositif capacitif commandable integre
FR2894061A1 (fr) Micro-bobine multicouches
FR2758417A1 (fr) Boitier d'encapsulation de composant hyperfrequence, et procede d'obtention

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050520

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: FRENCH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 60338222

Country of ref document: DE

Effective date: 20111124

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20110824

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111226

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 521977

Country of ref document: AT

Kind code of ref document: T

Effective date: 20110824

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111125

REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

BERE Be: lapsed

Owner name: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES

Effective date: 20111231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111231

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

26N No opposition filed

Effective date: 20120525

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 60338222

Country of ref document: DE

Effective date: 20120525

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111231

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111231

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111231

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20121214

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111205

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111209

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111124

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110824

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131231

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131209

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 14

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20221223

Year of fee payment: 20

Ref country code: FR

Payment date: 20221222

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20221221

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 60338222

Country of ref document: DE

REG Reference to a national code

Ref country code: GB

Ref legal event code: PE20

Expiry date: 20231208

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20231208

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20231208