EP1569262A3 - Verfahren und Vorrichtung für eine verbesserte Steuerung von Handhabungsvorrichtungen für Substrathalter - Google Patents

Verfahren und Vorrichtung für eine verbesserte Steuerung von Handhabungsvorrichtungen für Substrathalter Download PDF

Info

Publication number
EP1569262A3
EP1569262A3 EP05004338A EP05004338A EP1569262A3 EP 1569262 A3 EP1569262 A3 EP 1569262A3 EP 05004338 A EP05004338 A EP 05004338A EP 05004338 A EP05004338 A EP 05004338A EP 1569262 A3 EP1569262 A3 EP 1569262A3
Authority
EP
European Patent Office
Prior art keywords
commands
carrier
prior
carriers
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05004338A
Other languages
English (en)
French (fr)
Other versions
EP1569262A2 (de
Inventor
Michael Teferra
Amit Puri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/981,131 external-priority patent/US7218983B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1569262A2 publication Critical patent/EP1569262A2/de
Publication of EP1569262A3 publication Critical patent/EP1569262A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G29/00—Supports, holders, or containers for household use, not provided for in groups A47G1/00-A47G27/00 or A47G33/00 
    • A47G29/087—Devices for fastening household utensils, or the like, to tables, walls, or the like
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G1/00—Mirrors; Picture frames or the like, e.g. provided with heating, lighting or ventilating means
    • A47G1/16—Devices for hanging or supporting pictures, mirrors, or the like
    • A47G1/1633—Wall members for connection to a conventional picture
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G2200/00—Details not otherwise provided for in A47G
    • A47G2200/10—Magnetism
    • A47G2200/106—Permanent
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31216—Handshake between machine and agv; readiness to load, unload workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31378—Queue control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32266—Priority orders
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP05004338A 2004-02-28 2005-02-28 Verfahren und Vorrichtung für eine verbesserte Steuerung von Handhabungsvorrichtungen für Substrathalter Withdrawn EP1569262A3 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US54858404P 2004-02-28 2004-02-28
US548584P 2004-02-28
US10/981,131 US7218983B2 (en) 2003-11-06 2004-11-04 Method and apparatus for integrating large and small lot electronic device fabrication facilities
US981131 2004-11-04

Publications (2)

Publication Number Publication Date
EP1569262A2 EP1569262A2 (de) 2005-08-31
EP1569262A3 true EP1569262A3 (de) 2008-04-16

Family

ID=34753151

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05004338A Withdrawn EP1569262A3 (de) 2004-02-28 2005-02-28 Verfahren und Vorrichtung für eine verbesserte Steuerung von Handhabungsvorrichtungen für Substrathalter

Country Status (3)

Country Link
EP (1) EP1569262A3 (de)
KR (1) KR20060043293A (de)
TW (1) TWI316043B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8573097B2 (en) 2005-12-14 2013-11-05 Siemens Product Lifecycle Management Software Inc. System and method for automatic local return for lathe NC-machining cycle interruption
US7672748B2 (en) 2006-04-17 2010-03-02 Chartered Semiconductor Manufacturing, Ltd. Automated manufacturing systems and methods
US8160736B2 (en) 2007-01-31 2012-04-17 Globalfoundries Singapore Pte. Ltd. Methods and apparatus for white space reduction in a production facility
JP5369419B2 (ja) 2007-10-18 2013-12-18 村田機械株式会社 保管庫、保管庫セット及び保管庫付き搬送システム
JP5168300B2 (ja) * 2010-02-24 2013-03-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US11101163B2 (en) * 2018-01-30 2021-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for automated robotic arm sensing
TWI826173B (zh) * 2022-12-08 2023-12-11 力晶積成電子製造股份有限公司 晶圓堆的搬運管理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6050768A (en) * 1997-08-08 2000-04-18 Mitsubishi Denki Kabushiki Kaisha Automatic carrier control method in semiconductor wafer cassette transportation apparatus
US6074443A (en) * 1996-10-21 2000-06-13 Applied Materials, Inc. Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
US6134482A (en) * 1997-10-15 2000-10-17 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for controlling semiconductor wafer fabrication equipment based on a remaining process time applicable to the processors
EP1164437A2 (de) * 2000-06-15 2001-12-19 Nikon Corporation Lithographisches System
US6351686B1 (en) * 2000-01-04 2002-02-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device manufacturing apparatus and control method thereof
US6640148B1 (en) * 2002-06-03 2003-10-28 Advanced Micro Devices, Inc. Method and apparatus for scheduled controller execution based upon impending lot arrival at a processing tool in an APC framework

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6074443A (en) * 1996-10-21 2000-06-13 Applied Materials, Inc. Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
US6050768A (en) * 1997-08-08 2000-04-18 Mitsubishi Denki Kabushiki Kaisha Automatic carrier control method in semiconductor wafer cassette transportation apparatus
US6134482A (en) * 1997-10-15 2000-10-17 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for controlling semiconductor wafer fabrication equipment based on a remaining process time applicable to the processors
US6351686B1 (en) * 2000-01-04 2002-02-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device manufacturing apparatus and control method thereof
EP1164437A2 (de) * 2000-06-15 2001-12-19 Nikon Corporation Lithographisches System
US6640148B1 (en) * 2002-06-03 2003-10-28 Advanced Micro Devices, Inc. Method and apparatus for scheduled controller execution based upon impending lot arrival at a processing tool in an APC framework

Also Published As

Publication number Publication date
KR20060043293A (ko) 2006-05-15
TWI316043B (en) 2009-10-21
EP1569262A2 (de) 2005-08-31
TW200535076A (en) 2005-11-01

Similar Documents

Publication Publication Date Title
JP2011123066A5 (de)
JP6802152B2 (ja) ラボラトリ試料分配システムおよびラボラトリ自動化システム
CN101430339B (zh) 检体前处理系统
CN104569462B (zh) 一种样本容器的搬送装置及方法
WO2002086514A3 (en) Sample handling system
JP2012141287A5 (de)
JP2004525376A5 (de)
JP2019117207A (ja) サンプル管を取り扱うための方法および取り扱いデバイス
MY161955A (en) Systems and methods for handling wafers
EP2813855A3 (de) Automatisierte Mehrpunktsondenmanipulation
JP6710558B2 (ja) 検体搬送システムおよび検体検査システム
CN110510405A (zh) 一种物料传输方法、传输装置、传输系统及可读存储介质
JP2017067794A5 (de)
JP3041404B2 (ja) オートサンプリング機構
WO2005005992A3 (en) Assay testing diagnostic analyzer
WO2009129071A3 (en) Transferring disk drives within disk drive testing systems
US10551398B2 (en) Specimen container inclination correction mechanism, and method for controlling same
EP1569262A3 (de) Verfahren und Vorrichtung für eine verbesserte Steuerung von Handhabungsvorrichtungen für Substrathalter
EP3091566B1 (de) Rotierender substratlader
SG142256A1 (en) Electronic device handler for a bonding apparatus
CN108108236A (zh) 一种用于电力采集终端的高效抄表方法
EP1964802A3 (de) System und Verfahren zur Messung und Steuerung von Abstandslängen
US20180350637A1 (en) Carrier adapter insert apparatus and carrier adapter insert detection methods
JP2001096483A (ja) 試験管搬送装置
JP2015096833A5 (de)

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

RIC1 Information provided on ipc code assigned before grant

Ipc: G05B 19/418 20060101ALI20071213BHEP

Ipc: H01L 21/00 20060101AFI20050525BHEP

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

AKX Designation fees paid
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20080617

REG Reference to a national code

Ref country code: DE

Ref legal event code: 8566