EP1568803A2 - Elektroformungsverfahren zur Herstellung von Gegenständen mit hoher Genauigkeit - Google Patents

Elektroformungsverfahren zur Herstellung von Gegenständen mit hoher Genauigkeit Download PDF

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Publication number
EP1568803A2
EP1568803A2 EP05075356A EP05075356A EP1568803A2 EP 1568803 A2 EP1568803 A2 EP 1568803A2 EP 05075356 A EP05075356 A EP 05075356A EP 05075356 A EP05075356 A EP 05075356A EP 1568803 A2 EP1568803 A2 EP 1568803A2
Authority
EP
European Patent Office
Prior art keywords
metal
die
boundary
opening
insulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05075356A
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English (en)
French (fr)
Other versions
EP1568803A3 (de
EP1568803B1 (de
Inventor
Harm Gerrit Knol
Ahmad Dawud Harbiye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stork Veco BV
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Stork Veco BV
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Publication date
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Publication of EP1568803A2 publication Critical patent/EP1568803A2/de
Publication of EP1568803A3 publication Critical patent/EP1568803A3/de
Application granted granted Critical
Publication of EP1568803B1 publication Critical patent/EP1568803B1/de
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves

Definitions

  • the present invention relates to a method for producing, by electroplating, a metal object which has at least one continuous opening that is delimited by metal dykes.
  • An electroforming method generally comprises the creation of an electroforming die produced from an electrically conducting material.
  • the electroforming die may be of any desired shape, but is often a flat plate or a cylinder.
  • a layer of electrically insulating material, such as photoresist, is applied to the electroforming die. This layer is then exposed through a film, so that after developing "full" islands or regions of insulating material remain in place and define the opening or openings to be formed in the object. Therefore, the electroforming die comprises uncovered metal tracks which are connected to one another, and separate islands of insulating material.
  • the die which has been prepared in this way is placed in an electroplating bath and connected as cathode.
  • metal from the electroplating bath is deposited on the electrically conductive regions of the die (i.e. the regions that are not covered by insulating material).
  • the conditions are often selected in such a manner that not only metal is deposited on the uncovered tracks of the electroforming die, so as to fill up the space between the regions of electrically insulating material with the metal deposit that is formed, but also this deposit is produced under conditions that are such that the metal partially grows over the islands of electrically insulating material.
  • any spread in the bath conditions resulting from the electroplating bath used manifests itself in variations in the thickness of the product over the surface thereof.
  • Two important parameters which are responsible for a spread of this nature are the temperature of the bath liquid and the spacing (geometry) between anode and cathode.
  • the thickness of the islands of electrically insulating material play a less important role, and consequently a spread in the thickness of this material in the range from 1-2 micrometres has scarcely any influence on the final accuracy of the end product.
  • the method of the type described in the preamble according to the invention for this purpose comprises the steps of:
  • a boundary of an electrically insulating material such as photoresist, is applied to the electroforming die, which boundary is positioned so as to correspond to the periphery of the opening that is to be formed.
  • the boundary forms a continuous border.
  • a central region where the electrically conductive material of the electroforming die is uncovered remains inside a continuous border of this type which defines an opening.
  • the contour of the opening that is to be obtained is applied to the die, in the form of a frame.
  • the overgrowth of metal over the boundary made from electrically insulating material during step b) takes place from two directions, namely from the tracks which surround the boundary of an opening and from the central region, so that the final metal border of the opening is always located at the same position, namely in this case in the centre of the boundary as seen in the width direction of the dyke between central region and track.
  • This position of the border of the opening is always identical. Consequently, the method according to the invention is self-regulating with regard to the position of the border. Errors in the dimensions of the resist, which are generally symmetrical, have no influence on this position of the border. The influence of the spread in the bath properties on the position of the border of the opening is very low or absent altogether in the method according to the invention.
  • the metal deposit which has grown on the electroforming die from within the central region as defined above can easily be removed from the semi-finished product obtained, for example by being pressed out, since there is only a weak join. However, this does not represent any risk to the tolerances of the final product.
  • the result is an end product with very accurate dimensions of the opening or openings present therein.
  • the abovementioned adhesion between metal deposits which grow towards one another is determined by the width of the boundary of electrically insulating material. For the same final thickness of a product, the adhesion will be lower if the width of the boundary increases.
  • the type of metal from which the object is produced is not critical.
  • suitable metals include, inter alia, nickel, chromium, nickel-palladium alloy and copper.
  • Nickel is particularly preferred.
  • suitable electroplating baths for nickel include what is known as a Watts bath (NiSO 4 ), a sulphamate bath, and examples of suitable electroplating baths for copper include a copper sulphate bath.
  • the bath preferably comprises a brightener belonging to class 1, cf. for example Modern Electroplating, Frederic A. Lowenheim; 3rd edition 1973, John Wiley & Sons and Nickel and Chromiumplating, J.K. Dennis and T.E. Such Butterworth, 2nd edition, 1986.
  • the method according to the invention can be used to produce products with a thickness of up to a few millimetres in a single step.
  • a tolerance of less than ⁇ 5 ⁇ m is achieved for a product with an opening of 30 mm, and a tolerance of less than ⁇ 1 ⁇ m is achieved for an opening of 2 mm.
  • the electroforming die can be designed in such a manner that the walls of the metal deposits on the tracks and from the central region do not grow vertically on the surface of the electroforming die, but rather grow slightly obliquely. As a result of these sloping surfaces, the growth pieces can easily be removed from the semi-finished product after steps b) and c).
  • step a) one or more islands of electrically insulating material are likewise applied within the abovementioned boundary made from electrically insulating material.
  • the effect of the presence of these islands of electrically insulating material within the abovementioned boundary, in other words on the central region, is that the deposition of metal from this central region produces a filler piece which is thicker than the thickness of the end product which is deposited on the electrically conductive parts between the boundaries of different openings.
  • the filling piece widens out in the height direction, as seen from the die. The border of the opening is, as it were, forced back towards the product. The reason for this is that a higher current is obtained between the islands of insulating material inside the boundary.
  • examples of products which can be produced with the aid of the method according to the invention include screens, solar cells, collectors, vapour deposition masks, etc.
  • the openings in products of this type have to have a high level of accuracy, and the method according to the invention is eminently suitable for this purpose.
  • the locations where the adhesion between the product and a filler piece has been broken in an opening that is to be formed leave behind a visible indication that the product has been produced using the method according to the present invention. Electron microscopy may be a useful tool in this respect.
  • Fig. 1 shows an electroforming die 10 made from an electrically conductive metal.
  • a layer of photoresist is applied to the die 10 and is then exposed and developed through a film. This provides resist islands 12 on the die, corresponding to the openings in the object that is to be formed. Therefore, uncovered electrically conductive regions 14 of the die 10 are left between the islands 12.
  • the die 10 that has been prepared in this way is placed in an electroplating bath, for example a nickel sulphamate bath, and connected as cathode. When current is passed through, nickel from the electroplating bath is deposited on the uncovered parts 14 of the die 10. This deposition is continued until the desired thickness of the product has been reached.
  • the metal deposit is to some extent also allowed to grow over the islands 12.
  • the result is a product which comprises metal dykes 16 delimiting continuous openings, the dimensions of which correspond to the periphery of the resist islands minus the abovementioned overgrowth which has occurred over the resist islands 12.
  • P the position of the border of a metal dyke 16 which delimits the abovementioned opening.
  • the variation in the final position P is primarily dependent on the spread in bath parameters of the electroplating bath used. Within one and the same product, this means that the position of point P may vary for the openings. If the same die is used to produce objects by means of series production, this position P may also differ considerably from series to series.
  • Fig. 2 shows a plan view of an example of a die which can be used in the method according to the prior art.
  • the die 10 in this case a flat plate, is covered with a number of resist islands 12, in this case hexagonal in shape, with parts 14 of the die 10 uncovered between the resist islands 12.
  • resist islands 12 in this case hexagonal in shape
  • parts 14 of the die 10 uncovered between the resist islands 12.
  • Fig. 3 shows the principle of the invention. This figure uses the same reference numerals as in Figures 1 and 2 for the same components.
  • a layer of photoresist is applied to the die 10 made from electrically conductive material, and this layer of photoresist is then exposed and developed in the usual way.
  • the pattern of openings that are to be formed is different from that used in the prior art. This is because the pattern only comprises the boundary of an opening or openings to be formed, so that after the photoresist has been developed no solid photoresist islands result, but rather the result is only a boundary comprising a continuous border with an open central region.
  • Fig. 3 shows the principle of the invention. This figure uses the same reference numerals as in Figures 1 and 2 for the same components.
  • this boundary is denoted by reference numeral 20, and the central region by 22. If the die prepared in this way is connected as cathode in an electroplating bath, as described above, metal growth takes place not only on the uncovered parts 14 of the die but also in the central region 22 which is delimited by the boundary 20 of photoresist for each opening that is to be formed. Therefore, in addition to the metal dykes 14, metal filler pieces 24 (cf. Fig. 3) are also deposited on the die 10. After the product formed in this way has been detached from the die, these filler pieces 24 can easily be removed from the metal dykes 16, since there is only a very small amount of adhesion between the filler pieces 24 and the metal dykes 16.
  • Fig. 4 illustrates an embodiment of an electroforming die 10 which is used for this purpose and to which the boundary 20 of an electrically insulating material, such as photoresist, corresponding to the contour of the openings to be formed in the product, has been applied.
  • the central region 22 of the die 10 Within the continuous border 20 is the central region 22 of the die 10, which is likewise uncovered.
  • Fig. 5 and 6 show a modified embodiment of the method according to the invention.
  • small resist islands 30 have also been applied in the central region 22 within the boundary 20 of an opening that is to be formed during the preparation phase of the die.
  • the higher i value will cause the filler piece 24 to grow more quickly and to reach a greater height than the metal dykes 16.
  • the side walls of the filler piece 24 will be oblique, which facilitates the removal of the filler piece 24.
  • a coarse 5 mesh screen with a pitch of 5000 micrometres and a hole size of 5 mm is produced.
  • the resist boundary has a width of 150 micrometres and is 5 micrometres thick.
  • the metal dykes 16 and the filler piece 24 touch one another at point P in the centre of the resist.
  • the deposition of metal is continued until the metal dykes 16 have reached a thickness of 100 micrometres. This means that metal webs 16 and filler piece 24 will grow onto one another over a distance of approx. 20 micrometres. However, this growth of the parts onto one another can easily be broken.
  • the tolerance achieved for the openings in this coarse screen is ⁇ 2 micrometres.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
EP05075356A 2004-02-26 2005-02-10 Elektroformungsverfahren zur Herstellung von Gegenständen mit hoher Genauigkeit Active EP1568803B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1025582 2004-02-26
NL1025582A NL1025582C2 (nl) 2004-02-26 2004-02-26 Elektroformeringswerkwijze voor het met hoge nauwkeurigheid vervaardigen van voorwerpen.

Publications (3)

Publication Number Publication Date
EP1568803A2 true EP1568803A2 (de) 2005-08-31
EP1568803A3 EP1568803A3 (de) 2008-04-02
EP1568803B1 EP1568803B1 (de) 2010-06-02

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ID=34748212

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05075356A Active EP1568803B1 (de) 2004-02-26 2005-02-10 Elektroformungsverfahren zur Herstellung von Gegenständen mit hoher Genauigkeit

Country Status (4)

Country Link
EP (1) EP1568803B1 (de)
AT (1) ATE469995T1 (de)
DE (1) DE602005021569D1 (de)
NL (1) NL1025582C2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1030861C2 (nl) * 2006-01-06 2007-07-09 Stork Veco Bv Werkwijze voor het vervaardigen en eenzijdig bekleden van een metalen voorwerp.
NL1031259C2 (nl) * 2006-03-01 2007-09-04 Stork Veco Bv Elektroformeringswerkwijze.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02267293A (ja) 1989-04-07 1990-11-01 Seiko Epson Corp インクジェットの製造方法
JPH09260241A (ja) 1996-03-18 1997-10-03 Toshiba Corp アパーチャの製作方法、アパーチャ製作のための鋳型及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7500884A (en) * 1975-01-24 1976-07-27 Stork Brabant Bv Matrix die produced by electrolytic process - has Zones between raster elements consisting of grooves with insulating material
US5167776A (en) * 1991-04-16 1992-12-01 Hewlett-Packard Company Thermal inkjet printhead orifice plate and method of manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02267293A (ja) 1989-04-07 1990-11-01 Seiko Epson Corp インクジェットの製造方法
JPH09260241A (ja) 1996-03-18 1997-10-03 Toshiba Corp アパーチャの製作方法、アパーチャ製作のための鋳型及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1030861C2 (nl) * 2006-01-06 2007-07-09 Stork Veco Bv Werkwijze voor het vervaardigen en eenzijdig bekleden van een metalen voorwerp.
NL1031259C2 (nl) * 2006-03-01 2007-09-04 Stork Veco Bv Elektroformeringswerkwijze.

Also Published As

Publication number Publication date
ATE469995T1 (de) 2010-06-15
EP1568803A3 (de) 2008-04-02
NL1025582C2 (nl) 2005-08-29
DE602005021569D1 (de) 2010-07-15
EP1568803B1 (de) 2010-06-02

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