EP1533332A4 - Neues polyimidcopolymer und dieses enthaltendes metall-laminat - Google Patents

Neues polyimidcopolymer und dieses enthaltendes metall-laminat

Info

Publication number
EP1533332A4
EP1533332A4 EP03738668A EP03738668A EP1533332A4 EP 1533332 A4 EP1533332 A4 EP 1533332A4 EP 03738668 A EP03738668 A EP 03738668A EP 03738668 A EP03738668 A EP 03738668A EP 1533332 A4 EP1533332 A4 EP 1533332A4
Authority
EP
European Patent Office
Prior art keywords
same
metal laminate
polyimide copolymer
novel polyimide
novel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03738668A
Other languages
English (en)
French (fr)
Other versions
EP1533332A1 (de
EP1533332B1 (de
Inventor
Min Zuo
Jenq-Tain Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of EP1533332A1 publication Critical patent/EP1533332A1/de
Publication of EP1533332A4 publication Critical patent/EP1533332A4/de
Application granted granted Critical
Publication of EP1533332B1 publication Critical patent/EP1533332B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
EP20030738668 2002-08-20 2003-07-03 Neues polyimidcopolymer und dieses enthaltendes metall-laminat Expired - Lifetime EP1533332B1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002239145 2002-08-20
JP2002239145 2002-08-20
JP2002326599 2002-11-11
JP2002326599 2002-11-11
PCT/JP2003/008484 WO2004018545A1 (ja) 2002-08-20 2003-07-03 新規ポリイミド共重合体およびその金属積層体

Publications (3)

Publication Number Publication Date
EP1533332A1 EP1533332A1 (de) 2005-05-25
EP1533332A4 true EP1533332A4 (de) 2010-07-07
EP1533332B1 EP1533332B1 (de) 2011-05-18

Family

ID=31949541

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20030738668 Expired - Lifetime EP1533332B1 (de) 2002-08-20 2003-07-03 Neues polyimidcopolymer und dieses enthaltendes metall-laminat

Country Status (8)

Country Link
US (3) US7459216B2 (de)
EP (1) EP1533332B1 (de)
JP (1) JP4193797B2 (de)
KR (1) KR100573514B1 (de)
CN (1) CN1311001C (de)
AU (1) AU2003246262A1 (de)
TW (1) TWI249563B (de)
WO (1) WO2004018545A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004018545A1 (ja) 2002-08-20 2004-03-04 Nippon Mektron, Limited 新規ポリイミド共重合体およびその金属積層体
JP2010105258A (ja) * 2008-10-30 2010-05-13 Unimatec Co Ltd チューブ状ポリイミドベルトの製造法
JP5716493B2 (ja) * 2011-03-30 2015-05-13 宇部興産株式会社 ポリイミドフィルムの製造方法、ポリイミドフィルムおよびそれを用いたポリイミド金属積層体
JP5793118B2 (ja) * 2011-06-30 2015-10-14 Ｊｆｅケミカル株式会社 ポリアミド酸組成物およびポリイミド
JP5870720B2 (ja) * 2011-07-08 2016-03-01 宇部興産株式会社 ポリアミック酸からなるカーボンナノチューブ分散剤
KR101978005B1 (ko) * 2011-08-12 2019-05-13 우베 고산 가부시키가이샤 폴리이미드 금속 적층체의 제조 방법
JP6060715B2 (ja) * 2012-02-10 2017-01-18 宇部興産株式会社 ポリイミドガス分離膜、及びガス分離方法
TWI460211B (zh) * 2012-04-20 2014-11-11 Taimide Technology Inc 芳香族聚醯亞胺膜、其製備方法、及其應用
US9410017B2 (en) 2012-05-03 2016-08-09 Lg Chem, Ltd. Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
KR102340689B1 (ko) * 2014-03-31 2021-12-16 닛산 가가쿠 가부시키가이샤 박리층 형성용 조성물
JP7195848B2 (ja) * 2018-09-29 2022-12-26 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、樹脂フィルム、金属張積層体及びその製造方法
KR102489446B1 (ko) * 2020-11-30 2023-01-19 주식회사 넥스플렉스 폴리이미드 필름 제조용 조성물 및 이를 사용하여 제조된 연성금속박적층체용 폴리이미드 필름
US11643514B2 (en) * 2021-04-23 2023-05-09 Dupont Electronics, Inc. Polyimide films and electronic devices
JP7587865B2 (ja) * 2022-04-13 2024-11-21 ネックスフレックス カンパニー，リミテッド ポリイミドフィルム製造用組成物及びこれを用いて製造された軟性金属箔積層体用ポリイミドフィルム
TWI853231B (zh) * 2022-04-14 2024-08-21 南韓商奈克斯弗萊克斯股份有限公司 用於製造聚醯亞胺薄膜的組合物、以及利用其製造的用於撓性金屬箔積層板的聚醯亞胺薄膜

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247165A (en) * 1962-11-15 1966-04-19 Minnesota Mining & Mfg Polyimides
US5290909A (en) * 1993-05-28 1994-03-01 Industrial Technology Research Institute Polyimide composition for polyimide/copper foil laminate
WO2001029136A1 (fr) * 1999-10-18 2001-04-26 Nippon Mektron, Limited Nouveau copolymere polyimide et lamine metallique contenant celui-ci
EP1348728A1 (de) * 2002-03-27 2003-10-01 Nippon Mektron, Limited Filmbildende Polyimidcopolymer
US20040249117A1 (en) * 2003-06-03 2004-12-09 General Electric Company Benzimidazole diamine-based polyetherimide compositions and methods for making them

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS431832Y1 (de) 1965-06-12 1968-01-26
JPS451832B1 (de) * 1966-06-30 1970-01-21
JPH0739161B2 (ja) 1988-03-28 1995-05-01 新日鐵化学株式会社 両面導体ポリイミド積層体及びその製造法
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JP2762688B2 (ja) 1990-05-17 1998-06-04 ブラザー工業株式会社 ミシンの糸巻装置
JP3018647B2 (ja) 1991-10-03 2000-03-13 松下電器産業株式会社 空気調和機の故障診断装置
JPH0739161A (ja) 1993-07-22 1995-02-07 Shindengen Electric Mfg Co Ltd 同期整流型スイッチング電源
JP3223142B2 (ja) * 1997-08-22 2001-10-29 チッソ株式会社 液晶表示素子の製造法
WO2004018545A1 (ja) 2002-08-20 2004-03-04 Nippon Mektron, Limited 新規ポリイミド共重合体およびその金属積層体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247165A (en) * 1962-11-15 1966-04-19 Minnesota Mining & Mfg Polyimides
US5290909A (en) * 1993-05-28 1994-03-01 Industrial Technology Research Institute Polyimide composition for polyimide/copper foil laminate
WO2001029136A1 (fr) * 1999-10-18 2001-04-26 Nippon Mektron, Limited Nouveau copolymere polyimide et lamine metallique contenant celui-ci
EP1229081A1 (de) * 1999-10-18 2002-08-07 Nippon Mektron, Limited Neuer polyimidcopolymer und metallverbundstoff diesen enthaltend
EP1348728A1 (de) * 2002-03-27 2003-10-01 Nippon Mektron, Limited Filmbildende Polyimidcopolymer
US20040249117A1 (en) * 2003-06-03 2004-12-09 General Electric Company Benzimidazole diamine-based polyetherimide compositions and methods for making them

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHEN H L ET AL: "Curl-free high-adhesion polyimide/copper laminate", JOURNAL OF APPLIED POLYMER SCIENCE, JOHN WILEY AND SONS INC. NEW YORK, US LNKD- DOI:10.1002/APP.1994.070510914, vol. 51, no. 9, 28 February 1994 (1994-02-28), pages 1647 - 1652, XP002295806, ISSN: 0021-8995 *
See also references of WO2004018545A1 *

Also Published As

Publication number Publication date
CN1311001C (zh) 2007-04-18
TWI249563B (en) 2006-02-21
EP1533332A1 (de) 2005-05-25
AU2003246262A1 (en) 2004-03-11
JPWO2004018545A1 (ja) 2005-12-08
US7459216B2 (en) 2008-12-02
TW200403320A (en) 2004-03-01
US20040180227A1 (en) 2004-09-16
US20090133907A1 (en) 2009-05-28
US20090136671A1 (en) 2009-05-28
WO2004018545A1 (ja) 2004-03-04
US7763321B2 (en) 2010-07-27
KR20040064701A (ko) 2004-07-19
CN1675288A (zh) 2005-09-28
EP1533332B1 (de) 2011-05-18
JP4193797B2 (ja) 2008-12-10
KR100573514B1 (ko) 2006-04-26

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