Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
  • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
  • G03F7/2032—Simultaneous exposure of the front side and the backside
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
  • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
  • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
  • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/08—Treatments involving gases
  • H05K2203/085—Using vacuum or low pressure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

• the subject of the present invention is a double-sided exposure machine for printed circuit panels and, more particularly, in this machine, the production of plate supports.
• the exposure machines are installations which make it possible to have, facing at least one face of a printed circuit panel to be produced, a plate through which the panel is subjected to a light beam in order to impress a layer. photosensitive previously arranged on at least one face of this panel.
• the exposure machine can have two plate supports arranged on either side of the panel in order to produce a double-sided printed circuit or a single plate support for producing a single-sided printed circuit.
• the picture is made up of a scale 1 image of the printed circuit.
• the upper plate support 10 comprises a metal frame 12 of substantially rectangular shape on which is fixed a transparent window 14 intended to receive the upper plate.
• the lower plate support 16 is also constituted by a substantially rectangular metal frame 18 on which is also fixed a transparent window 20.
• a seal 22 is fixed for example on the underside of the frame 12 of the upper plate support.
• the printed circuit panel 24 to be exposed is placed between the upper 14 and lower 20 panes.
• the panes 14 and 20 can be replaced by other transparent plates made of a material other than glass.
• the upper plate support 10 is brought closer to the lower plate support 16 or the reverse and the seal 22 is inflated so as to constitute a tight volume V limited by the glass upper 14, the lower pane 20 and the peripheral seal 22.
• a vacuum is produced inside the volume V by means of evacuation not shown.
• the panes 14 and 20 tend to deform, in particular in their central region, in order to be pressed against the two faces 24a and 24b of the printed circuit panel 24.
• the two photos are brought as close as possible to the faces of the printed circuit panel to apply them on both sides.
• the tests carried out show that, even if locally a very small space of a few tens of microns remains between the face of the printed panel and the plate, the quality of the transfer will be impaired.
• the exposure machine for a printed circuit panel comprises:
• a first plate support comprising a substantially rectangular frame and a transparent plate capable of receiving said plate, said plate being integral on its periphery with said frame;
• a second plate support consisting of a substantially rectangular frame and a transparent plate capable of receiving said plate, said plate being integral with said frame on its periphery, one of said supports being movable relative to the other, said panel being intended to be disposed between said supports,
• said machine being characterized in that it further comprises:
• At least one pipe for communicating said envelope with said pressure source whereby, when a depression is created in said volume, the periphery of said transparent plate is applied to said envelope.
• source of gas under pressure is meant either the gaseous environment of the machine which is at atmospheric pressure, or possibly an enclosure containing a gas at a regulated pressure greater than the value of the vacuum.
• At least one deformable waterproof envelope is disposed between the panes of plate supports around the printed circuit panel and that this envelope is maintained at least at atmospheric pressure when the volume is placed under vacuum. between the panes of the plate supports, an increasing relative pressure appears in the deformable envelope.
• the envelope thus conforms to the internal face of the panes during their deformation under the effect of depression.
• the envelope thus makes it possible to standardize the stresses applied to the panes in this peripheral region and therefore to avoid the creation of significant localized stresses capable of causing the destruction of this pane. It is also understood that in these critical zones equipped with a sealed envelope, an equilibrium is produced on either side of the glass, which considerably reduces stresses and therefore the risk of breakage.
• the machine comprises a plurality of waterproof deformable envelopes surrounding said panel, each envelope being connected to said source of pressurized gas by a pipe, said envelopes occupying most of the space extending between the periphery of said panel and frames.
• the deformation of the panes is optimized even if the printed circuit panel has dimensions substantially smaller than those of the panes of the plate supports.
• deformable envelopes of different dimensions. It is thus possible to change the deformable envelopes according to the dimensions of the panel.
• the machine further comprises at least one mechanical shim interposed between said frame and the support to control the deformation of the frame itself in addition to the deformation of the glass fixed to the frame, the deformation of this glass being controlled as has already been explained thanks to the installation of the deformable waterproof envelope.
• FIGS. 2A and 2B show in vertical section an embodiment of the principle of the invention in the case of a double-sided exposure machine
• FIG. 2C shows in a simplified manner a preferred mode of implantation of the inflatable deformable envelopes between the panes of the plate supports;
• FIG. 3 is a detailed view in partial vertical section of the upper and lower plate supports;
• - Figure 4 is a top view of the plate supports showing an alternative embodiment of the inflatable envelopes;
• FIG. 5 is a simplified sectional diagram showing the deformation of the glass in the absence of an inflatable envelope; and - Figures 6A; 6B and C illustrate a preferred embodiment of the adjustable mechanical shims interposed between the frames of the plate holders.
• FIG. 2A we find the upper plate support 10 with its frame 12 and its window 14 as well as the lower plate support 16 with its frame 18 and its window 20. Also shown in this figure is the peripheral seal of sealing 22 secured for example to the upper frame 12 as well as the printed circuit panel to be exposed 24 disposed between the two panes 14 and 20. In this figure finally, the peripheral zones, respectively of the panes 14 and 20, have been identified by 26 and 28 close to their attachment zone on frames 12 and 18.
• the panes have a thickness of the order of 8 mm.
• FIG. 2A two envelopes 30 and 32 are shown.
• the envelopes 30 and 32 are connected to a pipe 31, 33 to a source of pressurized gas in the sense that has already been explained.
• the source of gas under pressure is the atmosphere at atmospheric pressure.
• the connection of the envelopes 30 and 32 via the pipes 31 and 33 is permanently maintained with the source of gas under pressure.
• the internal faces of the panes therefore remain in abutment by most of their surface on the envelopes 30 and 32.
• this is thus obtained panes a uniform distribution of the stresses resulting from the deformation of the panes under the effect of depression.
• a reduction in local stresses is therefore effectively obtained compared to that which was obtained with the prior systems described in relation to FIGS. 1A to 1C.
• the risks of breakage of the panes 14 and 20 are thus very significantly reduced.
• the vacuum produced between the panes is of the order of 0.5 bar relative to atmospheric pressure.
• FIG. 2C there is shown in top view a possible mode of implantation of the inflatable elements.
• Each inflatable envelope is associated with a pipe bearing the generic reference C to the source of pressurized gas which is most often atmospheric pressure.
• Each envelope has a substantially rectangular shape and the "horizontal" dimensions of the envelope are much greater than those of its thickness, that is to say the distance between the panes before one begins to create the vacuum.
• the machine comprises several sets of envelopes whose dimensions correspond to the peripheral space left by the printed circuit panels of different dimensions.
• the upper plate support 10 constituted by the frame 12 and the window 14, as well as the lower plate support 16 constituted essentially by the frame 18 and the lower window 20.
• the upper pane 14 is fixed by its periphery 14a to an intermediate frame 40 constituted by a thin sheet.
• this fixing is carried out by gluing.
• the sheet 40 is fixed to the frame 12 for example by screws such as 42.
• the upper picture 44 has been made visible.
• the glass 20 is fixed by its periphery 20a to an intermediate frame 45 consisting of a thin sheet.
• the fixing is also preferably carried out by gluing.
• the intermediate sheet 45 is pinched between the frame 18 and a counter plate 46 which is itself screwed onto the frame itself 18 by screws such as 48.
• the inflatable seal 22 comes into contact with the counter plate 46 when the two supports are in their working positions.
• This figure also shows the lower plate 50 and an automatic mechanical shim system 52 of adjustable thickness which will be described in more detail later.
• the mechanical shim 52 serves to maintain the frames 12 and 18 of the upper and lower plate supports 10 and 16 parallel to each other under the effect of the vacuum created between the panes 14 and 20, that is that is to say to prevent or limit their deformation.
• an inflatable waterproof envelope 32 which is disposed between the panel 24 and the edge 44 of the frame.
• This envelope 32 is arranged opposite the critical zones 26 and 28 of the panes 14 and 20.
• the exposure frame in fact comprises two inflatable envelopes 30 and 32 which are extend along the short sides of the frame 18. These inflatable bags or envelopes are arranged on either side of the panel 24.
• the panel 24 is disposed near the edge 18a of the frame support of the lower plate, this edge constituting the reference edge of the panel between the lower and upper plate supports. Indeed, this edge is the one that is closest to the operator.
• one could also set up in the area marked with dotted lines by the reference 54 another deformable envelope connected to the pressure atmospheric or at a suitable pressure to fill this space. This of course depends on the dimensions of the printed circuit panel 24.
• FIG. 5 schematically illustrates the deformation of the upper window 14 in the absence of the deformable inflatable envelopes of the invention.
• a mechanical shim 52 of controllable height which is interposed between these two frames inside the periphery limited by the seal 22.
• these mechanical shims are fixed on the intermediate frame 46 of the lower plate support serving to fix the lower window 20.
• four mechanical shims of controllable thickness 52, 54, 56 and 58 are provided, extending along the four sides of the frame 18 of the lower plate support.
• these mechanical shims 52 to 58 are interposed between the frames of the plate supports which are metallic. These shims therefore prevent the deformation of the frames themselves under the effect of the vacuum, but they act on parts whose mechanical strength is high. They therefore do not have the drawbacks of the shims described in connection with the state of the art. Furthermore, as will be explained later in more detail, the height of the shims 52 to 58 can be adjusted automatically. The automaton which controls the operation of the entire exposure machine can therefore, depending on the information relating to the thickness of the printed circuit panel to be exposed, adjust the suitable height of the mechanical shims 52 to 58 without disrupt the operation of the automatic chain including the exposure machine in question.
• the mechanical wedge with automatic adjustment 52 comprises a base 60 which is fixed on the lower frame 18 of the lower plate support, an upper part of wedge 62 whose upper face 62a comes into contact with the upper frame 12 to adjust the spacing between the two frames.
• the upper part 62 is fixed horizontally relative to the base 60 and movable vertically.
• the lower face of the upper part 62 defines inclined ramps such as 64 which make an angle of about 10 degrees relative to the horizontal. This angle is determined as a function of the coefficient of friction of the material with which the shim is made in order to obtain an irreversible control of the thickness of the shim.
• the vertical displacement of the upper part 62 is controlled by the lower part 66 of the wedge which is movable in horizontal translation relative to the base 60 and to the upper part of the wedge 62.
• the upper face of the lower part of the wedge comprises inclined ramps such as 68, combined with ramps 64 and having the same inclination relative to the horizontal.
• the horizontal movement of the lower part of the wedge 66 is controlled by a cable system 70. It comprises a body 72 integral with the base 60 in which a rod 74 can move.
• the end 74a of the rod 74 is integral with the lower part of the wedge
• the rod is itself controlled by a rigid cable 80 with positive displacement.
• the actuation of this cable can be carried out hydraulically or pneumatically.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=29797489

Family Applications (1)

Country Status (9)

Families Citing this family (12)

Family Cites Families (6)

• 2002
  • 2002-07-17 FR FR0209030A patent/FR2842617B1/fr not_active Expired - Fee Related
• 2003
  • 2003-07-17 US US10/521,408 patent/US7253883B2/en not_active Expired - Fee Related
  • 2003-07-17 EP EP03750814A patent/EP1521998A2/de not_active Withdrawn
  • 2003-07-17 AU AU2003269030A patent/AU2003269030A1/en not_active Abandoned
  • 2003-07-17 CN CNA03816681XA patent/CN1668983A/zh active Pending
  • 2003-07-17 KR KR1020057000245A patent/KR20060015438A/ko not_active Application Discontinuation
  • 2003-07-17 CA CA002492514A patent/CA2492514A1/en not_active Abandoned
  • 2003-07-17 JP JP2004522248A patent/JP2005533284A/ja active Pending
  • 2003-07-17 WO PCT/FR2003/002256 patent/WO2004010226A2/fr active Application Filing

Non-Patent Citations (1)

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