EP1488449B1 - Component mounting method, component mounting apparatus, and ultrasonic bonding head - Google Patents
Component mounting method, component mounting apparatus, and ultrasonic bonding head Download PDFInfo
- Publication number
- EP1488449B1 EP1488449B1 EP03745015A EP03745015A EP1488449B1 EP 1488449 B1 EP1488449 B1 EP 1488449B1 EP 03745015 A EP03745015 A EP 03745015A EP 03745015 A EP03745015 A EP 03745015A EP 1488449 B1 EP1488449 B1 EP 1488449B1
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- European Patent Office
- Prior art keywords
- component
- oscillator
- ultrasonic vibration
- face
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000000034 method Methods 0.000 title description 7
- 238000010438 heat treatment Methods 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- 230000010355 oscillation Effects 0.000 claims description 6
- 230000037361 pathway Effects 0.000 claims description 6
- 230000005674 electromagnetic induction Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 43
- 239000000463 material Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000032258 transport Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H01L2224/75264—Means for applying energy, e.g. heating means by induction heating, i.e. coils
- H01L2224/75266—Means for applying energy, e.g. heating means by induction heating, i.e. coils in the upper part of the bonding apparatus, e.g. in the bonding head
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Definitions
- the present invention relates to an apparatus for mounting components, such as an electronic component having a plurality of bump electrodes on its surface, onto a mounting object such as a substrate by applying ultrasonic vibration.
- a conventional component mounting apparatus utilizing ultrasonic vibration typically includes a mounting head equipped with a horn and a suction nozzle, means for feeding an electronic component to the mounting head, a supporting base that holds the mounting object, and a positioning device that relatively moves the mounting head against the supporting base in the horizontal direction to put the electronic component in the right place on the mounting object.
- the horn is coupled with the output of an ultrasonic vibration generator horizontally fixed to a supporting bracket that is vertically movably supported by a moving mechanism such as a voice coil motor, while the suction nozzle that holds the electronic component is installed at the end of the horn.
- Component mounting apparatuses of this type are suitably employed when a plurality of bump electrodes formed on a face of the electronic component are ultrasonically bonded onto leads formed on the mounting object.
- the suction nozzle holds the top face of an electronic component that has been fed with its bump electrodes facing down, while the supporting base secures the mounting object thereon.
- the electronic component is put in the right place on the mounting object by relatively moving the mounting head against the supporting base, and then the bump electrodes of the electronic component are contacted with the leads of the mounting object.
- the suction nozzle With a predetermined pressure load applied on the component, the suction nozzle is vibrated in the horizontal direction via the horn with ultrasonic vibration generated by the ultrasonic vibration generator.
- the ultrasonic vibration energy is provided to the contact face between the electronic component and the mounting object, and they are bonded by diffusion and melting.
- the pressure load applied to the suction nozzle must be large to bond many bump electrodes at a time to the leads of the mounting object by ultrasonic vibration.
- the bottom face of the suction nozzle holding the component must be aligned precisely parallel to the bonding face of the mounting object to ensure bonding between all the bump electrodes and the leads of the mounting object. For instance, when mounting such a large bare IC chip, the component holding face of the suction nozzle must be maintained parallel to the bonding face of the mounting object over the entire area within a tolerance of 5 ⁇ m in the direction of ultrasonic vibration.
- the bonding energy provided by ultrasonic vibration is likely to be short, even if the parallelism between the component holding face and the bonding face of the mounting object is maintained and a large pressure load is applied along with ultrasonic vibration. Then it becomes difficult to carry out bonding with high reliability.
- an ultrasonic bonding head where one end of an oscillator working as the horn is coupled with the output of the ultrasonic vibration generator while the other end has a working face disposed parallel to the bonding face.
- the pressure load must be large to ensure bonding if the bonding area is large or the total bonding area of multiple bump electrodes is large.
- the parallelism between the working face of such a working unit and the bonding face of the mounting object must be kept excellent to ensure bonding over the entire bonding area.
- US2001/0051396A discloses a method of bump bonding wherein a horn is preheated to improve bonding strength.
- An object of the present invention is to provide a component mounting apparatus that ultrasonically bonds components with high reliability even when the component has many bump electrodes, and thus, the bonding area between the component and the mounting object is large.
- a component mounting apparatus is a component mounting apparatus for mounting a component having a plurality of bump electrodes on one face thereof onto leads of a mounting object, comprising a component feeder for feeding the component with the bump electrodes facing down, a mounting head for holding the rear face of the component and mounting the component onto the mounting object, a supporting base for securing the mounting object and a positioning device for relatively moving the mounting head against the supporting base to align the component with the mounting object, wherein said mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member for conveying ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the rear face of the component as vibration parallel thereto, a pressure loader for applying a pressure load to the working face of the ultrasonic vibration propagation member, characterised in that the mounting head includes a heater for heating the working face of the ultrasonic propagation member and for heating the rear face of the component, and a cooling unit or a temperature retaining unit disposed adjacent the ultrasonic vibration generator for preventing heat from being
- the ultrasonic vibration is provided while applying a predetermined pressure load onto the bump electrodes uniformly, even if the electronic component has many bump electrodes. Then all the bump electrodes are bonded with high reliability, even if the electronic component has many bump electrodes.
- Ultrasonic vibration energy is given to the bonding face from the working face, with ultrasonic vibration being provided from one end of the oscillator, while a pressure load is applied to the extent that the working face of the oscillator does not slant, and at the same time the working face is heated by a heater.
- a large ultrasonic vibration energy and thermal energy are provided at a time, and the entire bonding face is bonded with high reliability, even if the bonding area is large.
- the heater heats the rear face of the component, and the cooling unit or temperature retaining unit cools the ultrasonic vibration generator and so the oscillation mode of the oscillator remains unaffected by the heater.
- the component mounting apparatus 1 mounts a component 2 (bare IC chip) onto a substrate 3 (mounting object, see FIG. 3).
- the component 2 has a plurality of bump electrodes 2a arranged on one face thereof.
- the component mounting place in the substrate 3 has leads which will be bonded with the bump electrodes 2a.
- the component 2 is, for example, 10-20mm per side, and has 50-100 or more bump electrodes 2a.
- a particularly large component 2 may have 1000 or more bump electrodes.
- an X-direction table 6 holding a mounting head 5 movable in an X direction.
- the mounting head 5 holds the component 2 and mounts it onto the substrate 3.
- a Y-direction table 7 is installed movably in a Y direction between a specific part under the X-direction table 6 and a frontward position of the table 6, while the Y-direction table 7 has a supporting base 8 on which the substrate 3 is mounted.
- a loader 9 that carries the substrate 3 from one end of the base 4 to the Y-direction table 7, and an unloader 10 that carries the substrate 3 from the Y-direction table 7 to the other end of the base 4.
- the loader 9 and the unloader 10 each have a pair of rails that support both sides of the substrate 3.
- the supporting base 8 having transport rails 11 on its front and rear sides that can be connected to the above pair of rails and move vertically, receives the substrate 3 onto the transport rails 11 and then fixes it on the supporting base 8.
- such a component magazine 13 In a frontward position of the X-direction table 6 on the side of the unloader 10 on the base 4, such a component magazine 13 is disposed that houses semiconductor wafers 12 where a number of components 2 have been formed and diced on an expand sheet.
- a magazine lifter 14 is installed to lift a desired semiconductor wafer 12 to a prescribed height, and an expand table 15 is disposed between the magazine lifter 14 and the Y-direction table 7.
- the expand table 15 arranges the components 2 with spacings, expanding the expand sheet for each semiconductor wafer 12 delivered by the magazine lifter 14.
- the expand table 15 is installed on an X-Y table 16 that positions a component 2 in a first component supply position.
- a recognition camera 17 recognizes the component 2 placed on the first component supply position.
- a component flipper 18 catches the component 2 in the first component supply position, transports the component 2 to a second component supply position, using another X-direction table, and turns the component 2 by 180 degrees to face up.
- the bump electrodes 2a of a component 2 are formed on its top face.
- the top face where the bump electrodes 2a are formed is caught by the component flipper 18 and then turned over 180 degrees, the top face of the component 2 where the bump electrodes 2a are formed faces down, and the component 2 is received by the mounting head 5 in the second component supply position.
- Such a magazine lifter 14, expand table 15 and component flipper 18 constitute a component feeder 20 that feeds a component 2 to the mounting head 5.
- a dispenser 19 applies a seal material to the component 2 or to the portion of the substrate 3 where the component 2 will be mounted.
- the mounting head 5 has an ultrasonic bonding head 21 at the bottom end of a spline shaft (not shown) that is moved vertically in the axial direction by a moving device 22 such as a voice coil motor.
- the ultrasonic bonding head 21 is formed by an ultrasonic vibration generator 24 and an oscillator 25 which are secured to a supporting bracket 23.
- the oscillator 25 or the suction nozzle holds the component 2.
- the oscillator 25 of the mounting head 5 or the suction nozzle fixed thereon holds the component 2, and the mounting head 5 moves in the X-direction to a position on the substrate 3 where the component 2 will be mounted, using the X-direction table 6.
- the transport rails 11 come down to a prescribed height and the substrate 3 is mounted on the supporting base 8.
- the Y-direction table 7 moves in the Y direction until the substrate 3 is seated in the right place corresponding to the component 2 under the mounting head 5.
- the moving device 22 of the mounting head 5 lowers the component 2 so that its bump electrodes 2a contact leads of the substrate 3 positioned in the mounting place.
- the ultrasonic vibration generator 24 is activated, while the moving device 22 applies a predetermined pressure load, and the ultrasonic vibration energy is provided to the bonding face between the bump electrodes 2a and the leads of the substrate 3 for bonding by diffusion and fusion.
- the seal material applied by the dispenser 19 is filled in the space between the substrate 3 and the component 2, and then the mounting of the component 2 onto the substrate 3 is completed.
- the transport rails 11 come up and the substrate 3 is received onto the transport rails 11, and the substrate 3 is moved away by the unloader 10 when the transport rails 11 are connected to the unloader 10.
- the structure of the ultrasonic bonding head 21, which is the essential part of the mounting head 5, will be described with reference to FIG. 3.
- a pair of supporting blocks 26a, 26b that hold the oscillator 25 are installed with their axes being aligned horizontal, and the output end 27a of a horn 27 that amplifies the vibration amplitude is coupled concentrically with one end of the oscillator 25, while the ultrasonic vibration generator 24 is connected to the other end of the horn 27.
- the oscillator 25 has a shaft 28 which is (1+3/4) ⁇ long, where ⁇ is the wavelength of oscillation mode M.
- Supporting units 29a, 29b are located at ⁇ /4 from one end and at the other end, respectively, which correspond nodes of the vibration mode, being supported by the supporting blocks 26a, 26b.
- a suction nozzle 30 is installed so as to penetrate the shaft 28 perpendicularly in the position corresponding to an anti-node of the vibration mode in the center between the supporting units 29a, 29b.
- Reference alphanumeral 30a denotes a suction pathway formed in the shaft of the suction nozzle 30.
- a working unit 31 of a size corresponding to the component 2 to be held is formed, with a heater 32 such as a cartridge heater being buried in the working unit 31, and its bottom face works as a working face 33 that holds the component 2.
- the shaft 28 of the oscillator 25 and the suction nozzle 30 constitute an ultrasonic propagation member 34 that conveys ultrasonic vibration generated by the ultrasonic vibration generator 24 to the working face 33.
- the mounting head 5 has an adjustment mechanism (not shown) that holds the parallelism between the working face 33 and the top face of the supporting base 8 at 5 ⁇ m or less.
- Ultrasonic vibration generated by the ultrasonic vibration generator 24 and then conveyed to the working face 33 via the ultrasonic propagation member 34 is controlled in the working face 33 so that its vertical element is less than 3% of the lateral element parallel thereto.
- the pressure load applied onto the working face 33 by the moving device 22 such as a voice coil motor and a cylinder is adjusted in accordance with the diameter of each bump electrode 2a of the component 2 and their number.
- each bump electrode 2a Although it varies with the diameter of each bump electrode 2a, assuming typically 30-50g per bump electrode 2a, a pressure load that is a product of this unit load per bump electrode 2a and the number of bump electrodes is applied. Otherwise, the unit load per bump electrode 2a may be assumed to be 30-200g when calculating the pressure load.
- the moving device 22 lowers the suction nozzle 30 toward the supporting base 8, and sandwiches the substrate 3 and the component 2 between the working face 33 and the top face of the supporting base 8.
- a prescribed pressure load is applied onto the working face 33 via the supporting brackets 23, the pair of supporting blocks 26a, 26b and the shaft 28 constituting the oscillator 25 as well as the suction nozzle 30.
- the pressure load is applied downwardly normal to the working face 33 along its vertical axial line.
- the ultrasonic vibration generator 24 provides ultrasonic vibration, and the heater 32 is activated for heating.
- another heater may be installed on the side of the supporting base 8 to provide thermal energy from the substrate 3 side as well.
- a heater on the side of the supporting base 8 is not essential.
- a heater may be installed only on the side of the supporting base 8 to provide thermal energy.
- the seal material which has been applied to the mounting place on the substrate 3 by the dispenser 19 and filled in between the component 2 and the substrate 3 upon mounting of the component 2, is heated to cure during the above heating process, and then the sealing is completed along with bonding of the component 2 at a time. As a result, no subsequent sealing process becomes necessary, and therefore manufacturing cost is reduced.
- the vertical element of ultrasonic vibration is controlled to be less than 3% of the lateral element parallel to the working face 33, damage to the bump electrodes 2a and their serious deformation are prevented during the ultrasonic bonding under a large pressure load.
- an appropriate bonding condition is provided. If the vertical element of ultrasonic vibration energy is less than 10% (preferably less than 5%) of the lateral element, bonding is performed appropriately even when the number of bump electrodes 2a is rather large. Instead, the vertical element becomes 10% or more, there is a concern that the bump electrodes 2a may deform significantly if a large pressure load is applied.
- the ultrasonic vibration generator 24 has a horn 27 of a relatively large rigidity, and a suction nozzle 30 is vertically installed through the position ⁇ /2 away from the input end face of the horn 27.
- the ultrasonic energy to be provided and the pressure load are reduced by providing thermal energy from the heater 32 embedded in the working unit 31. Then, the parallelism between the working face 33 and the supporting base 8 is held within a prescribed range, while a pressure load being applied, and the vertical element of the ultrasonic vibration energy is limited to less than 10% of the lateral element in the working face 33. As a result, all the bump electrodes 2a are bonded precisely.
- the ultrasonic bonding head 21 is attached to the bottom end of the spline shaft 35 via a fixing unit 36 and a parallelism adjusting mechanism 37, the spline shaft 35 being driven in the vertical direction by the moving device 22 of the mounting head 5.
- the parallelism adjusting mechanism 37 connecting an upper plate 37a to a lower plate 37b via a center connection rod 37c, contacts the bottom ends of three adjuster screws 37d, which are screwed through the upper plate 37a, to the top face of the lower plate 37b to control the slanting of the lower plate 37b by changing the depth of each adjuster screw 37d.
- the ultrasonic bonding head 21 includes an ultrasonic vibration generator 24, an oscillator 38, and a supporting bracket 39, with the top end 39a of the supporting bracket 39 being secured to the bottom face of the parallelism adjusting mechanism 37.
- the oscillator 38 has a block-like shape, and a basal face 40 at its one end is coupled with the ultrasonic vibration generator 24, while a working face 41 is formed at the other end.
- the oscillator 38 is disposed to slant upward with its working face 41 being held horizontal, and a secured unit 38a, which is formed in the position corresponding to a node of the oscillation mode of the oscillator 38, is secured to the supporting bracket 39.
- the oscillator 38 has a shape that makes the ultrasonic vibration provided to the basal face 40 vibrate in the working face 41 approximately in parallel thereto.
- this vibration needs not to be parallel to the working face; instead, the direction of vibration may slant by about 5-35°.
- the supporting bracket 39 has a positioning hole 39b in the center of its topside to share the axial line with the spline shaft 35, while the bracket 39 has in its lower part a groove 45 where the oscillator 38 is to be inserted and a pair of opposed plates 46 on its sides.
- a cartridge heater 47 working as the heater is buried in a lower part of each of the opposed plates 46 to face the end of the oscillator 38. This heater 47 heats up the lower part of each of the plates 46, and the vicinity of the working face 41 of the oscillator 38 is heated by radiant heat. Because the heater is disposed off the oscillator 38, the ultrasonic vibration system is not affected by the heater.
- a cooling chamber 43 working as a cooling unit or a temperature retaining unit is provided so as to surround the connection rod 42 that connects the ultrasonic vibration generator 24 with the oscillator 38.
- the connection rod 42 and the ultrasonic vibration generator 24 are cooled, dissipating heat coming from the heated oscillator 38, and thereby to prevent a temperature rise in the ultrasonic vibration generator 24 to avoid performance failure and damage.
- a thermocouple 44 working as a temperature monitoring member in the connection rod 42, bonding failure and degradation of the ultrasonic vibration performance due to temperature rise are prevented.
- the substrate 3 is mounted on the supporting base 8, and the component 2 that will be bonded is mounted thereon.
- the spline shaft 35 is lowered to move the ultrasonic bonding head 21 downward to the supporting base 8.
- the working face 41 of the oscillator 38 and the top face of the supporting base 8 sandwich the component 2 and the substrate 3, while a prescribed pressure load is applied to the supporting bracket 39.
- the ultrasonic vibration generator 24 provides ultrasonic vibration to the basal face 40 of the oscillator 38, and the cartridge heater 47 is activated for heating.
- the working face 41 kept parallel to the bonding face ultrasonic-vibrates, and the supporting bracket 39 applies a pressure load onto the oscillator 38.
- the cartridge heater 47 heats the lower part of the opposed plates 46, and the heat irradiated therefrom heats the vicinity of the working face 41.
- the heat is conveyed to the component 2 as shown with a broken line in the figure, and then thermal energy is provided to the bonding face between the substrate 3 and the component 2.
- the cartridge heater 47 installed in the opposed plates 46 irradiates heat onto the oscillator 38, the ultrasonic vibration system is not affected.
- the use of the cartridge heater 47 leads to an inexpensive, low-cost system. Since the ultrasonic vibration generator 24 is cooled by the cooling chamber 43, the heat of the cartridge heater 47 does not reach the ultrasonic vibration generator 24, and its performance failure and damage is prevented. Furthermore, because a temperature monitor member such as the thermocouple 44 is installed in the connection rod 42 disposed between the ultrasonic vibration generator 24 and the oscillator 38, high temperatures do not reach the ultrasonic vibration generator 24. Thus, it is possible to prevent its performance failure and bonding failure.
- the heater of the invention is not limited to this type.
- a heat conduction fin 48 is preferably installed on at least either of the opposed faces between the oscillator 38 and the plate 46 to increase the heat conduction by radiation from the opposed plate 46 to the oscillator 38.
- a plate-like ceramic heater 49 instead of the cartridge heater 47, can be installed on the face of the opposed plate 46 to face the oscillator 38. Then the target area is uniformly heated. Meanwhile, as shown in FIG. 9B, if a heat conduction fin 48 is installed on at least either of the opposed faces between the oscillator 38 and the ceramic heater 49, heat conduction by radiation is enhanced.
- a hot-air blower 50 instead of the cartridge heater 47 and the ceramic heater 49, can be installed on the face of the opposed plate 46 to face the oscillator 38. Since hot air directly contacts the oscillator 38, a rapid, uniform heating is achieved. As shown in FIG. 10B, if a heat conduction fin 48 is installed on both sides of the oscillator 38, the heat exchange with the blown out hot air is enhanced, and whereby the heat conduction to the oscillator 38 is raised.
- a heating medium pathway 51 is formed in the oscillator 38 and a heating medium such as hot air is supplied to this pathway 51, as shown with the arrow, using a heating medium feeder 52, the oscillator 38 is heated directly from its inside. Then the target area is further efficiently heated up.
- the heating medium feeder 52 is preferably disposed near the working face 41.
- a heat ray emitter 53 (indicated with a hollow arrow) that emits heat rays such as laser light to the vicinity of the working face 41 of the oscillator 38 can be installed.
- the vicinity of the working face 41 is efficiently heated in a non-contact manner.
- the heat ray emitter 53 if means for emitting electromagnetic waves to the vicinity of the working face 41 is disposed and the oscillator 38 is formed by a ferromagnetic material, the vicinity of the working face 41 is heated by electromagnetic induction.
- the ultrasonic bonding head 21 includes an ultrasonic vibration generator 24, an oscillator 54, and a supporting bracket 55.
- the oscillator 54 has a Y-shaped unit having a base unit 54a and a pair of branches 54b as well as a projection 54c on both sides of the base unit 54a, while the ultrasonic vibration generator 24 is connected to a basal face 56 of the base unit 54a.
- the oscillator 54 and the ultrasonic vibration generator 24 are secured to the supporting bracket 55 in an upwardly slanting attitude, so that the end face of one branch 54b lies horizontal and works as a working face 57.
- the shape of the oscillator 54 is designed so that the working face 57 ultrasonic-vibrates in the horizontal direction as shown by arrow B and so that a node 58 of the oscillation mode appears above the working face 57 on its vertical axial line, when the ultrasonic vibration generator 24 applies ultrasonic vibration of vertical vibration mode of a prescribed frequency to the basal face 56 as shown by arrow A.
- the oscillator 54 has prism-like loading units 59 projecting from both sides thereof at the position corresponding to the node 58, and these loading units 59 are connected to the supporting bracket 55.
- the supporting bracket 55 has a positioning hole 60 formed in the top center concentrically with the spline shaft 35, a groove 61 where the oscillator 54 is inserted in the lower part, and a pair of supporting plates 62 on the sides of the groove 61.
- Each of the supporting plates 62 has in its bottom center a square notch 63, with the loading unit 59 being inserted thereto from the bottom side.
- a cartridge heater 47 is embedded in a lid 64 fixed on the underside of each supporting plate 62, heating the lower part of the plate 62. The heat radiated therefrom in turn heats the vicinity of the working face 57 of the oscillator 54.
- the substrate 3 is put on the supporting base 8.
- the spline shaft 35 is lowered to move the ultrasonic bonding head 21 downward to the supporting base 8.
- the working face 57 of the oscillator 54 and the top face of the supporting base 8 sandwich the substrate 3 and the component 2, and a prescribed pressure load is provided to the supporting bracket 55 via the spline shaft 35.
- the ultrasonic vibration generator 24 provides ultrasonic vibration to the basal face 56 of the oscillator 54, and the cartridge heater 47 is activated for heating.
- the working face 57 of the oscillator 54 ultrasonic-vibrates substantially in parallel thereto, and a pressure load 65 is applied from the supporting bracket 55 to the loading units 59 positioned each at the node 58 of the oscillation mode of the oscillator 54, as shown by the hollow arrow. Since the loading units 59 are disposed immediately above the working face 57, the pressure load works 100% normal to the working face 57.
- the lower part of each supporting plate 62 is heated by the cartridge heater 47, and the radiant heat heats the vicinity of the working face 57. As the broken lines indicate, such heat reaches the component 2, and thermal energy is thereby provided to the bonding face between the bump electrodes 2a of the component 2 and the leads of the substrate 3.
- the employed heater is a cartridge heater 47 embedded in the supporting plates 62 and the produced heat is irradiated onto the oscillator 54, the ultrasonic vibration system is not affected by the heater, and the use of a cartridge heater 47 leads to an inexpensive, low-cost system.
- a cooling unit 66 that cools the ultrasonic vibration generator 24 or a temperature retaining unit is preferably installed as shown with imaginary lines in FIG. 13, and in addition a temperature monitor member 67 may be installed in the ultrasonic vibration generator 24 or its vicinity, in order to prevent the ultrasonic vibration generator 24 from being exposed to high temperatures due to heating of the oscillator 54 by the cartridge heater 47.
- a temperature monitor member 67 is preferable that blows cool air to the vicinity of the ultrasonic vibration generator 24 because it is less likely to affect the vibration system.
- a thermocouple is preferably installed in a position that does not affect the vibration system.
- the cooling unit 66 prevents overheat of the ultrasonic vibration generator 24, bonding failure is prevented accordingly. In addition, if the temperature monitor member 67 is installed, bonding failure due to degradation of ultrasonic vibration performance is prevented.
- the heater As the heater, an example where the cartridge heater 47 is embedded in the lid 64 fixed to the supporting plates 62 of the supporting bracket 55 was demonstrated.
- the present invention is not limited to the exemplified heater, but the same variations as those shown in FIGS. 8A-12 for the third embodiment are also applicable.
- one of the supporting plates 62 can be detachably attached to the supporting bracket 55, and the loading units 59 projecting from both sides of the oscillator 54 can be fit in the supporting holes formed in the supporting plates 62 via a thermal insulator 68, while embedding the cartridge heater 47 in each supporting plate 62.
- FIG. 17B by installing a heat conduction fin 48 on at least either side face of the oscillator 54 or the face of the supporting plate 62 facing the oscillator, the heat conduction by radiation from the supporting plate 62 to the oscillator 54 is enhanced.
- a plate-like ceramic heater 49 instead of the cartridge heater 47, can be installed on the face of the supporting plate 62 to face the oscillator 54. Then the target area is uniformly heated.
- a heat conduction fin 48 on at least either the side face of the oscillator 54 or the face of the ceramic heater 49-facing the oscillator, the heat conduction by radiation from the ceramic heaters 49 to the oscillator 54 is enhanced.
- a hot air blower 50 can be installed on the face of the supporting plate 62 to face the oscillator 54. Since hot air contacts the oscillator 54, a rapid, uniform heating is achieved. Moreover, as shown in FIG. 19B, by installing a heat conduction fin 48 on both sides of the oscillator 54, the heat exchange with the blown out hot air is enhanced, whereby the heat conduction to the oscillator 54 is raised.
- the oscillator 54 is heated directly from the inside. Then, the target area is further efficiently heated up.
- the heating medium feeder 52 is preferably disposed near the working face 57.
- a heat ray emitter 53 (shown with a hollow arrow) that emits heat rays such as laser to the vicinity of the working face 57 of the oscillator 54 can be installed.
- the vicinity of the working face 57 is heated up efficiently in a non-contact manner.
- a heat ray emitter 53 if means for emitting electromagnetic waves to the vicinity of the working face 57 is disposed and the oscillator 54 is made of a ferromagnetic material, the vicinity of the working face 57 is heated by electromagnetic induction.
- the oscillator 38, 54 is unitary. However, in order to provide the best working face 41, 57 corresponding to the shape and dimensions of the component 2 to be mounted, the entire ultrasonic bonding head 21 must be exchanged when the specs of the component 2 have been changed. Since the ultrasonic bonding head 21 is expensive, the machine cost will be high if a number of ultrasonic bonding heads 21 are prepared to meet the specs of each component 2. Thus, as shown in FIG. 22, it is preferable to constitute the vicinity of the working face 41, 57 of the oscillator 38, 54 with a detachable separate piece 41a, 57a.
- Such a separate piece 41a, 57a can be detachably secured to the oscillator 38, 54 with bolts 70, as shown in FIG. 22. If a plurality of bolts 70 are used to secure the separate piece, the contact area, and the contact strength with the oscillator 38, 54 are enlarged, whereby the ultrasonic propagation efficiency is increased.
- FIG. 22 shows an example where the contact face between the separate piece and the oscillator is parallel to the ultrasonic vibration, it is further preferable to prepare a contact face normal to the direction of vibration and secure the separate piece with more than one face.
- pressure bolts, combination of pressure bolts and slanting faces for fitting, or a wedge can be used together to secure the separate piece.
- the present invention is not limited to such examples.
- the invention is useful when mounting an arbitrary component onto a mounting object, or when bonding various components to an arbitrary object by ultrasonic vibration using an ultrasonic bonding head.
- the bump electrode ends of the electronic component are held precisely parallel to the bonding face of the mounting object even when a large pressure load is applied to the rear face of the electronic component.
- the invention is therefore useful in bonding an electronic component which has many bump electrodes, and thus, the bonding area is large.
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Abstract
Description
- The present invention relates to an apparatus for mounting components, such as an electronic component having a plurality of bump electrodes on its surface, onto a mounting object such as a substrate by applying ultrasonic vibration.
- As disclosed in Japanese Patent Laid-Open Publication No. 2000-68327 for example, a conventional component mounting apparatus utilizing ultrasonic vibration typically includes a mounting head equipped with a horn and a suction nozzle, means for feeding an electronic component to the mounting head, a supporting base that holds the mounting object, and a positioning device that relatively moves the mounting head against the supporting base in the horizontal direction to put the electronic component in the right place on the mounting object. The horn is coupled with the output of an ultrasonic vibration generator horizontally fixed to a supporting bracket that is vertically movably supported by a moving mechanism such as a voice coil motor, while the suction nozzle that holds the electronic component is installed at the end of the horn.
- Component mounting apparatuses of this type are suitably employed when a plurality of bump electrodes formed on a face of the electronic component are ultrasonically bonded onto leads formed on the mounting object. The suction nozzle holds the top face of an electronic component that has been fed with its bump electrodes facing down, while the supporting base secures the mounting object thereon. The electronic component is put in the right place on the mounting object by relatively moving the mounting head against the supporting base, and then the bump electrodes of the electronic component are contacted with the leads of the mounting object. With a predetermined pressure load applied on the component, the suction nozzle is vibrated in the horizontal direction via the horn with ultrasonic vibration generated by the ultrasonic vibration generator. The ultrasonic vibration energy is provided to the contact face between the electronic component and the mounting object, and they are bonded by diffusion and melting.
- In these years, however, there is a need for reducing the number of electronic components (chips) to downsize electronic circuits, and the functions and density of electronic components have been much improved. As a result, individual electronic components have become larger and come to have more electrodes than ever. For example, electronic components (bare IC chips) were about 0.3 to 5mm per side and had about 2 to 30 bump electrodes. However, they are expected to be 10-20mm per side and have 50-100 or even 1000 or more bump electrodes in the near future.
- When such an electronic component is mounted on a circuit with a conventional component mounting apparatus, the pressure load applied to the suction nozzle must be large to bond many bump electrodes at a time to the leads of the mounting object by ultrasonic vibration. In addition, the bottom face of the suction nozzle holding the component must be aligned precisely parallel to the bonding face of the mounting object to ensure bonding between all the bump electrodes and the leads of the mounting object. For instance, when mounting such a large bare IC chip, the component holding face of the suction nozzle must be maintained parallel to the bonding face of the mounting object over the entire area within a tolerance of 5µm in the direction of ultrasonic vibration.
- However, in the above configuration, if a large pressure load is applied by the supporting bracket to the vicinity of the junction between the ultrasonic vibration generator and the horn, since the suction nozzle is fastened to the end of the horn, and thus, the bottom face of the suction nozzle is distant from the position receiving such pressure load, a bending moment works on the horn. Then a deformation of the horn due to the pressure load makes the component holding face slant, and a precise parallelism cannot be obtained. Meanwhile, there is an idea to insert an elastic unit between the horn and the component holding face of the suction nozzle for ensuring parallelism therebetween. This, in turn, significantly lowers the ultrasonic vibration propagation efficiency. Then bonding efficiency becomes lower, and reliable bonding cannot be provided.
- When the chip has many bump electrodes, the bonding energy provided by ultrasonic vibration is likely to be short, even if the parallelism between the component holding face and the bonding face of the mounting object is maintained and a large pressure load is applied along with ultrasonic vibration. Then it becomes difficult to carry out bonding with high reliability.
- There has been another problem that the process cost becomes high because extra steps are needed to fill a seal material in between the chip and the mounting object after bonding and then to thermo-cure the seal material.
- On the other hand, there is an ultrasonic bonding head where one end of an oscillator working as the horn is coupled with the output of the ultrasonic vibration generator while the other end has a working face disposed parallel to the bonding face.
- According to this method, however, the pressure load must be large to ensure bonding if the bonding area is large or the total bonding area of multiple bump electrodes is large. At the same time, the parallelism between the working face of such a working unit and the bonding face of the mounting object must be kept excellent to ensure bonding over the entire bonding area.
- In fact, however, excellent parallelism cannot be provided because a bending moment works on the oscillator when a large pressure load is applied thereto and because the working face slants due to the bend of the oscillator. Particularly when a plurality of bump electrodes are arranged over a wide bonding face, it is difficult to ensure parallelism. Otherwise, if ultrasonic vibration is provided under a pressure load that does not cause such a slanting problem in the working face, the bonding energy of ultrasonic vibration may not be high enough to provide a reliable bonding condition.
- US2001/0051396A discloses a method of bump bonding wherein a horn is preheated to improve bonding strength.
- An object of the present invention is to provide a component mounting apparatus that ultrasonically bonds components with high reliability even when the component has many bump electrodes, and thus, the bonding area between the component and the mounting object is large.
- A component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a plurality of bump electrodes on one face thereof onto leads of a mounting object, comprising a component feeder for feeding the component with the bump electrodes facing down, a mounting head for holding the rear face of the component and mounting the component onto the mounting object, a supporting base for securing the mounting object and a positioning device for relatively moving the mounting head against the supporting base to align the component with the mounting object, wherein said mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member for conveying ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the rear face of the component as vibration parallel thereto, a pressure loader for applying a pressure load to the working face of the ultrasonic vibration propagation member, characterised in that the mounting head includes a heater for heating the working face of the ultrasonic propagation member and for heating the rear face of the component, and a cooling unit or a temperature retaining unit disposed adjacent the ultrasonic vibration generator for preventing heat from being supplied to the same.
- According to this configuration, the ultrasonic vibration is provided while applying a predetermined pressure load onto the bump electrodes uniformly, even if the electronic component has many bump electrodes. Then all the bump electrodes are bonded with high reliability, even if the electronic component has many bump electrodes.
- Ultrasonic vibration energy is given to the bonding face from the working face, with ultrasonic vibration being provided from one end of the oscillator, while a pressure load is applied to the extent that the working face of the oscillator does not slant, and at the same time the working face is heated by a heater. A large ultrasonic vibration energy and thermal energy are provided at a time, and the entire bonding face is bonded with high reliability, even if the bonding area is large. The heater heats the rear face of the component, and the cooling unit or temperature retaining unit cools the ultrasonic vibration generator and so the oscillation mode of the oscillator remains unaffected by the heater.
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- FIG. 1 is a perspective view showing the schematic structure of a component mounting apparatus according to a first comparative example which does not form part of the claimed invention;
- FIG. 2 is a perspective view showing a mounting head of the component mounting apparatus of Fig. 1;
- FIG. 3 is a sectional front view showing the essential part of the mounting head according to the example;
- FIG. 4 is a sectional front view showing the essential part of a mounting head according to a second comparative example which does not form part of the claimed invention;
- FIG. 5 is a sectional front view showing the essential part of a mounting head according to a first embodiment; of the present invention;
- FIG. 6 is a sectional view taken along the line VI-VI in FIG. 5;
- FIG. 7 is a view illustrating the bonding configuration according to the embodiment;
- FIG. 8A is a perspective view showing a first variation of the heater according to the embodiment, and FIG. 8B is a side view of its improved example;
- FIG. 9A is a perspective view showing a second variation of the heater according to the embodiment, and FIG. 9B is a side view of its improved example;
- FIG. 10A is a perspective view showing a third variation of the heater according to the embodiment, and FIG. 10B is a side view of its improved example;
- FIG. 11 is a front view showing the oscillator of a fourth variation of the heater according to the embodiment;
- FIG. 12 is a perspective view showing a fifth variation of the heater according to the embodiment;
- FIG. 13 is a front view showing the essential part of a mounting head according to a second embodiment of the present invention;
- FIG. 14 is a sectional view taken along the line XIV-XIV in FIG. 13;
- FIG. 15 is a sectional view across the XV-XV line in FIG. 13;
- FIG. 16 is a view illustrating the operation of the oscillator according to the embodiment;
- FIG. 17A is a perspective view showing a first variation of the heater according to the embodiment, and FIG. 17B is a side view of its improved example;
- FIG. 18A is a perspective view showing a second variation of the heater according to the embodiment, and FIG. 18B is a side view of its improved example;
- FIG. 19A is a side view showing a third variation of the heater according to the embodiment, and FIG. 19B is a side view of its improved example;
- FIG. 20 is a front view showing an oscillator of a fourth variation of the heater according to the embodiment;
- FIG. 21 is a perspective view showing a fifth variation of the heater according to the embodiment; and
- FIG. 22 is a front view showing the essential part of a variation of the oscillator.
- Embodiments of the component mounting apparatus will be described below with reference to the accompanying drawings.
- The component mounting method and apparatus according to a first comparative example are described with reference to FIGS.1-3.
- First, the overall structure of the component mounting apparatus is described with reference to FIGS. 1-2. The
component mounting apparatus 1 mounts a component 2 (bare IC chip) onto a substrate 3 (mounting object, see FIG. 3). Thecomponent 2 has a plurality ofbump electrodes 2a arranged on one face thereof. The component mounting place in thesubstrate 3 has leads which will be bonded with thebump electrodes 2a. Thecomponent 2 is, for example, 10-20mm per side, and has 50-100 ormore bump electrodes 2a. A particularlylarge component 2 may have 1000 or more bump electrodes. - In a rearward position of the
base 4 of thecomponent mounting apparatus 1, installed is an X-direction table 6 holding a mountinghead 5 movable in an X direction. The mountinghead 5 holds thecomponent 2 and mounts it onto thesubstrate 3. A Y-direction table 7 is installed movably in a Y direction between a specific part under the X-direction table 6 and a frontward position of the table 6, while the Y-direction table 7 has a supportingbase 8 on which thesubstrate 3 is mounted. In front of the X-direction table 6, installed is aloader 9 that carries thesubstrate 3 from one end of thebase 4 to the Y-direction table 7, and anunloader 10 that carries thesubstrate 3 from the Y-direction table 7 to the other end of thebase 4. Theloader 9 and theunloader 10 each have a pair of rails that support both sides of thesubstrate 3. The supportingbase 8, havingtransport rails 11 on its front and rear sides that can be connected to the above pair of rails and move vertically, receives thesubstrate 3 onto the transport rails 11 and then fixes it on the supportingbase 8. - In a frontward position of the X-direction table 6 on the side of the
unloader 10 on thebase 4, such acomponent magazine 13 is disposed that housessemiconductor wafers 12 where a number ofcomponents 2 have been formed and diced on an expand sheet. Amagazine lifter 14 is installed to lift a desiredsemiconductor wafer 12 to a prescribed height, and an expand table 15 is disposed between themagazine lifter 14 and the Y-direction table 7. The expand table 15 arranges thecomponents 2 with spacings, expanding the expand sheet for eachsemiconductor wafer 12 delivered by themagazine lifter 14. The expand table 15 is installed on an X-Y table 16 that positions acomponent 2 in a first component supply position. Arecognition camera 17 recognizes thecomponent 2 placed on the first component supply position. - A
component flipper 18 catches thecomponent 2 in the first component supply position, transports thecomponent 2 to a second component supply position, using another X-direction table, and turns thecomponent 2 by 180 degrees to face up. In asemiconductor wafer 12, thebump electrodes 2a of acomponent 2 are formed on its top face. When the top face where thebump electrodes 2a are formed is caught by thecomponent flipper 18 and then turned over 180 degrees, the top face of thecomponent 2 where thebump electrodes 2a are formed faces down, and thecomponent 2 is received by the mountinghead 5 in the second component supply position. Such amagazine lifter 14, expand table 15 andcomponent flipper 18 constitute acomponent feeder 20 that feeds acomponent 2 to the mountinghead 5. Adispenser 19 applies a seal material to thecomponent 2 or to the portion of thesubstrate 3 where thecomponent 2 will be mounted. - Referring now to FIG. 2, the mounting
head 5 has anultrasonic bonding head 21 at the bottom end of a spline shaft (not shown) that is moved vertically in the axial direction by a movingdevice 22 such as a voice coil motor. Theultrasonic bonding head 21 is formed by anultrasonic vibration generator 24 and anoscillator 25 which are secured to a supportingbracket 23. Theoscillator 25 or the suction nozzle holds thecomponent 2. - Now the mounting operation of such a component mounting apparatus is described below. After the
component feeder 20 supplies acomponent 2 with itsbump electrodes 2a facing down to the second component supply position, theoscillator 25 of the mountinghead 5 or the suction nozzle fixed thereon holds thecomponent 2, and the mountinghead 5 moves in the X-direction to a position on thesubstrate 3 where thecomponent 2 will be mounted, using the X-direction table 6. On the other hand, after thesubstrate 3 delivered by theloader 9 is moved onto the transport rails 11 attached to the Y-direction table 7, the transport rails 11 come down to a prescribed height and thesubstrate 3 is mounted on the supportingbase 8. Next, the Y-direction table 7 moves in the Y direction until thesubstrate 3 is seated in the right place corresponding to thecomponent 2 under the mountinghead 5. Next, after thedispenser 19 has applied a seal material as required, the movingdevice 22 of the mountinghead 5 lowers thecomponent 2 so that itsbump electrodes 2a contact leads of thesubstrate 3 positioned in the mounting place. Theultrasonic vibration generator 24 is activated, while the movingdevice 22 applies a predetermined pressure load, and the ultrasonic vibration energy is provided to the bonding face between thebump electrodes 2a and the leads of thesubstrate 3 for bonding by diffusion and fusion. The seal material applied by thedispenser 19 is filled in the space between thesubstrate 3 and thecomponent 2, and then the mounting of thecomponent 2 onto thesubstrate 3 is completed. When the mounting of thecomponent 2 has been completed, the transport rails 11 come up and thesubstrate 3 is received onto the transport rails 11, and thesubstrate 3 is moved away by theunloader 10 when the transport rails 11 are connected to theunloader 10. - Next, the structure of the
ultrasonic bonding head 21, which is the essential part of the mountinghead 5, will be described with reference to FIG. 3. To the supportingbracket 23, a pair of supportingblocks 26a, 26b that hold theoscillator 25 are installed with their axes being aligned horizontal, and theoutput end 27a of ahorn 27 that amplifies the vibration amplitude is coupled concentrically with one end of theoscillator 25, while theultrasonic vibration generator 24 is connected to the other end of thehorn 27. Theoscillator 25 has ashaft 28 which is (1+3/4)ë long, where ë is the wavelength of oscillation modeM. Supporting units 29a, 29b are located at ë/4 from one end and at the other end, respectively, which correspond nodes of the vibration mode, being supported by the supportingblocks 26a, 26b. Asuction nozzle 30 is installed so as to penetrate theshaft 28 perpendicularly in the position corresponding to an anti-node of the vibration mode in the center between the supportingunits 29a, 29b.Reference alphanumeral 30a denotes a suction pathway formed in the shaft of thesuction nozzle 30. At the bottom of thesuction nozzle 30, a workingunit 31 of a size corresponding to thecomponent 2 to be held is formed, with aheater 32 such as a cartridge heater being buried in the workingunit 31, and its bottom face works as a workingface 33 that holds thecomponent 2. Theshaft 28 of theoscillator 25 and thesuction nozzle 30 constitute an ultrasonic propagation member 34 that conveys ultrasonic vibration generated by theultrasonic vibration generator 24 to the workingface 33. - The mounting
head 5 has an adjustment mechanism (not shown) that holds the parallelism between the workingface 33 and the top face of the supportingbase 8 at 5µm or less. Ultrasonic vibration generated by theultrasonic vibration generator 24 and then conveyed to the workingface 33 via the ultrasonic propagation member 34 is controlled in the workingface 33 so that its vertical element is less than 3% of the lateral element parallel thereto. The pressure load applied onto the workingface 33 by the movingdevice 22 such as a voice coil motor and a cylinder is adjusted in accordance with the diameter of eachbump electrode 2a of thecomponent 2 and their number. Although it varies with the diameter of eachbump electrode 2a, assuming typically 30-50g perbump electrode 2a, a pressure load that is a product of this unit load perbump electrode 2a and the number of bump electrodes is applied. Otherwise, the unit load perbump electrode 2a may be assumed to be 30-200g when calculating the pressure load. - In the above configuration, with the
substrate 3 being mounted on the supportingbase 8 and thecomponent 2 being held by the workingface 33 of theultrasonic bonding head 21, the movingdevice 22 lowers thesuction nozzle 30 toward the supportingbase 8, and sandwiches thesubstrate 3 and thecomponent 2 between the workingface 33 and the top face of the supportingbase 8. In this state, a prescribed pressure load is applied onto the workingface 33 via the supportingbrackets 23, the pair of supportingblocks 26a, 26b and theshaft 28 constituting theoscillator 25 as well as thesuction nozzle 30. At this time, the pressure load is applied downwardly normal to the workingface 33 along its vertical axial line. Under this condition, theultrasonic vibration generator 24 provides ultrasonic vibration, and theheater 32 is activated for heating. - Because a pressure load is vertically applied from a directly upward position onto the rear face of the
component 2, the ends of the plurality ofbump electrodes 2a of thecomponent 2 are held precisely parallel to the bonding face of thesubstrate 3, even when a large pressure load is applied. Thus, even if thecomponent 2 hasmany bump electrodes 2a and the applied pressure load is large, ultrasonic vibration is provided to thebump electrodes 2a, with a prescribed pressure load being applied thereto uniformly. All thebump electrodes 2a are thereby bonded with high reliability. - Furthermore, by providing thermal energy to the
component 2 from its rear face with theheater 32, while providing ultrasonic energy to between thebump electrodes 2a and the leads of thesubstrate 3, all thebump electrodes 2a are bonded efficiently even if thecomponent 2 hasmany bump electrodes 2a and the bonding area is large. Note that heating may be continued across before and after bonding. - In such a case, another heater (not shown) may be installed on the side of the supporting
base 8 to provide thermal energy from thesubstrate 3 side as well. Such a heater on the side of the supportingbase 8 is not essential. Alternatively, a heater may be installed only on the side of the supportingbase 8 to provide thermal energy. - The seal material, which has been applied to the mounting place on the
substrate 3 by thedispenser 19 and filled in between thecomponent 2 and thesubstrate 3 upon mounting of thecomponent 2, is heated to cure during the above heating process, and then the sealing is completed along with bonding of thecomponent 2 at a time. As a result, no subsequent sealing process becomes necessary, and therefore manufacturing cost is reduced. - As described before, since the vertical element of ultrasonic vibration is controlled to be less than 3% of the lateral element parallel to the working
face 33, damage to thebump electrodes 2a and their serious deformation are prevented during the ultrasonic bonding under a large pressure load. Thus, an appropriate bonding condition is provided. If the vertical element of ultrasonic vibration energy is less than 10% (preferably less than 5%) of the lateral element, bonding is performed appropriately even when the number ofbump electrodes 2a is rather large. Instead, the vertical element becomes 10% or more, there is a concern that thebump electrodes 2a may deform significantly if a large pressure load is applied. - In such a
component 2 that has 50 ormore bump electrodes 2a on its face, if a unit load onto eachbump electrode 2a is controlled to be 30-50g and the product of this unit load and the number ofbump electrodes 2a is applied as the pressure load, no excess load works on eachbump electrode 2a and bumpelectrodes 2a do not deform. - Now a second comparative example of the component mounting apparatus will be described with reference to FIG. 4. In the following, the same members as those used in the preceding comparative example have the same numerals throughout the figures, and their description is omitted. Instead, only differences will be described below.
- In the present comparative example, the
ultrasonic vibration generator 24 has ahorn 27 of a relatively large rigidity, and asuction nozzle 30 is vertically installed through the position λ/2 away from the input end face of thehorn 27. - Under such configuration, the ultrasonic energy to be provided and the pressure load are reduced by providing thermal energy from the
heater 32 embedded in the workingunit 31. Then, the parallelism between the workingface 33 and the supportingbase 8 is held within a prescribed range, while a pressure load being applied, and the vertical element of the ultrasonic vibration energy is limited to less than 10% of the lateral element in the workingface 33. As a result, all thebump electrodes 2a are bonded precisely. - Now a first embodiment of the component mounting apparatus of the invention will be described with reference to FIGS. 5-12.
- Referring to FIGS. 5 and 6, the
ultrasonic bonding head 21 is attached to the bottom end of thespline shaft 35 via a fixingunit 36 and aparallelism adjusting mechanism 37, thespline shaft 35 being driven in the vertical direction by the movingdevice 22 of the mountinghead 5. Theparallelism adjusting mechanism 37, connecting anupper plate 37a to alower plate 37b via acenter connection rod 37c, contacts the bottom ends of threeadjuster screws 37d, which are screwed through theupper plate 37a, to the top face of thelower plate 37b to control the slanting of thelower plate 37b by changing the depth of eachadjuster screw 37d. - The
ultrasonic bonding head 21 includes anultrasonic vibration generator 24, anoscillator 38, and a supportingbracket 39, with thetop end 39a of the supportingbracket 39 being secured to the bottom face of theparallelism adjusting mechanism 37. Theoscillator 38 has a block-like shape, and abasal face 40 at its one end is coupled with theultrasonic vibration generator 24, while a workingface 41 is formed at the other end. Theoscillator 38 is disposed to slant upward with its workingface 41 being held horizontal, and asecured unit 38a, which is formed in the position corresponding to a node of the oscillation mode of theoscillator 38, is secured to the supportingbracket 39. Preferably, theoscillator 38 has a shape that makes the ultrasonic vibration provided to thebasal face 40 vibrate in the workingface 41 approximately in parallel thereto. However, this vibration needs not to be parallel to the working face; instead, the direction of vibration may slant by about 5-35°. - The supporting
bracket 39 has apositioning hole 39b in the center of its topside to share the axial line with thespline shaft 35, while thebracket 39 has in its lower part agroove 45 where theoscillator 38 is to be inserted and a pair ofopposed plates 46 on its sides. Acartridge heater 47 working as the heater is buried in a lower part of each of theopposed plates 46 to face the end of theoscillator 38. Thisheater 47 heats up the lower part of each of theplates 46, and the vicinity of the workingface 41 of theoscillator 38 is heated by radiant heat. Because the heater is disposed off theoscillator 38, the ultrasonic vibration system is not affected by the heater. - A cooling
chamber 43 working as a cooling unit or a temperature retaining unit is provided so as to surround theconnection rod 42 that connects theultrasonic vibration generator 24 with theoscillator 38. By introducing cooling air from aninlet 43a and discharging from anoutlet 43b, theconnection rod 42 and theultrasonic vibration generator 24 are cooled, dissipating heat coming from theheated oscillator 38, and thereby to prevent a temperature rise in theultrasonic vibration generator 24 to avoid performance failure and damage. By embedding athermocouple 44 working as a temperature monitoring member in theconnection rod 42, bonding failure and degradation of the ultrasonic vibration performance due to temperature rise are prevented. - In the above configuration, as shown in FIG. 7, the
substrate 3 is mounted on the supportingbase 8, and thecomponent 2 that will be bonded is mounted thereon. Otherwise, with thecomponent 2 being held with a suction device (not shown) installed in theoscillator 38, thespline shaft 35 is lowered to move theultrasonic bonding head 21 downward to the supportingbase 8. The workingface 41 of theoscillator 38 and the top face of the supportingbase 8 sandwich thecomponent 2 and thesubstrate 3, while a prescribed pressure load is applied to the supportingbracket 39. Under this condition, theultrasonic vibration generator 24 provides ultrasonic vibration to thebasal face 40 of theoscillator 38, and thecartridge heater 47 is activated for heating. - The working
face 41 kept parallel to the bonding face ultrasonic-vibrates, and the supportingbracket 39 applies a pressure load onto theoscillator 38. Thecartridge heater 47 heats the lower part of theopposed plates 46, and the heat irradiated therefrom heats the vicinity of the workingface 41. The heat is conveyed to thecomponent 2 as shown with a broken line in the figure, and then thermal energy is provided to the bonding face between thesubstrate 3 and thecomponent 2. - In this manner, with the parallelism between the working
face 41 and the bonding face between thecomponent 2 and thesubstrate 3 being maintained and the pressure load being applied, ultrasonic vibration is applied to provide ultrasonic energy and at the same time thermal energy is also provided. Then the entire bonding face is bonded with high reliability even if the bonding area is large. If a seal material is put in advance between thesubstrate 3 and thecomponent 2, the seal material is cured at the same time as bonding. There is no need to prepare a separate seal-filling/curing process, thereby reducing the manufacturing cost. - Since the
cartridge heater 47 installed in the opposed plates 46 (facing both sides of the oscillator 38) irradiates heat onto theoscillator 38, the ultrasonic vibration system is not affected. In addition, the use of thecartridge heater 47 leads to an inexpensive, low-cost system. Since theultrasonic vibration generator 24 is cooled by the coolingchamber 43, the heat of thecartridge heater 47 does not reach theultrasonic vibration generator 24, and its performance failure and damage is prevented. Furthermore, because a temperature monitor member such as thethermocouple 44 is installed in theconnection rod 42 disposed between theultrasonic vibration generator 24 and theoscillator 38, high temperatures do not reach theultrasonic vibration generator 24. Thus, it is possible to prevent its performance failure and bonding failure. - Although the
cartridge heater 47 buried in theopposed plates 46 was exemplified, the heater of the invention is not limited to this type. - For example, like a first variation shown in FIG. 8A, at least one of the pair of
opposed plates 46 may be detachably attached to the supportingbracket 39, and thecartridge heater 47 may be buried in thisplate 46. As shown in FIG. 8B, aheat conduction fin 48 is preferably installed on at least either of the opposed faces between theoscillator 38 and theplate 46 to increase the heat conduction by radiation from the opposedplate 46 to theoscillator 38. - Otherwise, like a second variation shown in FIG. 9A, a plate-like
ceramic heater 49, instead of thecartridge heater 47, can be installed on the face of theopposed plate 46 to face theoscillator 38. Then the target area is uniformly heated. Meanwhile, as shown in FIG. 9B, if aheat conduction fin 48 is installed on at least either of the opposed faces between theoscillator 38 and theceramic heater 49, heat conduction by radiation is enhanced. - As shown in a third variation of FIG. 10A, a hot-
air blower 50, instead of thecartridge heater 47 and theceramic heater 49, can be installed on the face of theopposed plate 46 to face theoscillator 38. Since hot air directly contacts theoscillator 38, a rapid, uniform heating is achieved. As shown in FIG. 10B, if aheat conduction fin 48 is installed on both sides of theoscillator 38, the heat exchange with the blown out hot air is enhanced, and whereby the heat conduction to theoscillator 38 is raised. - Meanwhile, as shown in a fourth variation of FIG. 11, if a
heating medium pathway 51 is formed in theoscillator 38 and a heating medium such as hot air is supplied to thispathway 51, as shown with the arrow, using aheating medium feeder 52, theoscillator 38 is heated directly from its inside. Then the target area is further efficiently heated up. Theheating medium feeder 52 is preferably disposed near the workingface 41. - As shown in a fifth variation of FIG. 12, a heat ray emitter 53 (indicated with a hollow arrow) that emits heat rays such as laser light to the vicinity of the working
face 41 of theoscillator 38 can be installed. The vicinity of the workingface 41 is efficiently heated in a non-contact manner. Instead of theheat ray emitter 53, if means for emitting electromagnetic waves to the vicinity of the workingface 41 is disposed and theoscillator 38 is formed by a ferromagnetic material, the vicinity of the workingface 41 is heated by electromagnetic induction. - Now a second embodiment of the component mounting apparatus of the invention will be described with reference to FIGS. 13-21.
- The essential part of the mounting
head 5 of the embodiment is described with reference to FIGS. 13-16. In FIG. 13, theultrasonic bonding head 21 includes anultrasonic vibration generator 24, anoscillator 54, and a supportingbracket 55. Referring to FIG. 16, theoscillator 54 has a Y-shaped unit having abase unit 54a and a pair ofbranches 54b as well as a projection 54c on both sides of thebase unit 54a, while theultrasonic vibration generator 24 is connected to abasal face 56 of thebase unit 54a. Theoscillator 54 and theultrasonic vibration generator 24 are secured to the supportingbracket 55 in an upwardly slanting attitude, so that the end face of onebranch 54b lies horizontal and works as a workingface 57. - As shown in FIG. 13 and FIG. 16, the shape of the
oscillator 54 is designed so that the workingface 57 ultrasonic-vibrates in the horizontal direction as shown by arrow B and so that anode 58 of the oscillation mode appears above the workingface 57 on its vertical axial line, when theultrasonic vibration generator 24 applies ultrasonic vibration of vertical vibration mode of a prescribed frequency to thebasal face 56 as shown by arrow A. Theoscillator 54 has prism-like loading units 59 projecting from both sides thereof at the position corresponding to thenode 58, and theseloading units 59 are connected to the supportingbracket 55. - As shown in FIGS. 13-15, the supporting
bracket 55 has apositioning hole 60 formed in the top center concentrically with thespline shaft 35, agroove 61 where theoscillator 54 is inserted in the lower part, and a pair of supportingplates 62 on the sides of thegroove 61. Each of the supportingplates 62 has in its bottom center asquare notch 63, with theloading unit 59 being inserted thereto from the bottom side. Acartridge heater 47 is embedded in alid 64 fixed on the underside of each supportingplate 62, heating the lower part of theplate 62. The heat radiated therefrom in turn heats the vicinity of the workingface 57 of theoscillator 54. - In the above structure shown in FIG. 16, the
substrate 3 is put on the supportingbase 8. With thecomponent 2 being held with a suction device (not shown) carried on theoscillator 54 of theultrasonic bonding head 21, thespline shaft 35 is lowered to move theultrasonic bonding head 21 downward to the supportingbase 8. The workingface 57 of theoscillator 54 and the top face of the supportingbase 8 sandwich thesubstrate 3 and thecomponent 2, and a prescribed pressure load is provided to the supportingbracket 55 via thespline shaft 35. Under this condition, theultrasonic vibration generator 24 provides ultrasonic vibration to thebasal face 56 of theoscillator 54, and thecartridge heater 47 is activated for heating. - Then the working
face 57 of theoscillator 54 ultrasonic-vibrates substantially in parallel thereto, and apressure load 65 is applied from the supportingbracket 55 to theloading units 59 positioned each at thenode 58 of the oscillation mode of theoscillator 54, as shown by the hollow arrow. Since theloading units 59 are disposed immediately above the workingface 57, the pressure load works 100% normal to the workingface 57. The lower part of each supportingplate 62 is heated by thecartridge heater 47, and the radiant heat heats the vicinity of the workingface 57. As the broken lines indicate, such heat reaches thecomponent 2, and thermal energy is thereby provided to the bonding face between thebump electrodes 2a of thecomponent 2 and the leads of thesubstrate 3. - In this manner, a large ultrasonic energy is provided by ultrasonic vibration, with the parallelism between the working
face 57 and the bonding face of thecomponent 2 and thesubstrate 3 being well maintained and a large pressure load being applied thereto, while thermal energy is provided together. In a case where thecomponent 2 has a number ofbump electrodes 2a, and thus, the bonding area is large, all thebump electrodes 2a are bonded with the leads of thesubstrate 3 with high reliability. At the same time, the seal material applied to thesubstrate 3 where thecomponent 2 will be mounted and filled in the space between thecomponent 2 and thesubstrate 3 upon mounting thecomponent 2 is cured by thermal energy. Mounting and sealing of thecomponent 2 is thereby completed at a time. - Since the employed heater is a
cartridge heater 47 embedded in the supportingplates 62 and the produced heat is irradiated onto theoscillator 54, the ultrasonic vibration system is not affected by the heater, and the use of acartridge heater 47 leads to an inexpensive, low-cost system. - Furthermore, as is the case with the first embodiment, a cooling
unit 66 that cools theultrasonic vibration generator 24 or a temperature retaining unit is preferably installed as shown with imaginary lines in FIG. 13, and in addition atemperature monitor member 67 may be installed in theultrasonic vibration generator 24 or its vicinity, in order to prevent theultrasonic vibration generator 24 from being exposed to high temperatures due to heating of theoscillator 54 by thecartridge heater 47. As thecooling unit 66, such a unit is preferable that blows cool air to the vicinity of theultrasonic vibration generator 24 because it is less likely to affect the vibration system. With respect to thetemperature monitor member 67, a thermocouple is preferably installed in a position that does not affect the vibration system. - Because the
cooling unit 66 prevents overheat of theultrasonic vibration generator 24, bonding failure is prevented accordingly. In addition, if thetemperature monitor member 67 is installed, bonding failure due to degradation of ultrasonic vibration performance is prevented. - As the heater, an example where the
cartridge heater 47 is embedded in thelid 64 fixed to the supportingplates 62 of the supportingbracket 55 was demonstrated. However, the present invention is not limited to the exemplified heater, but the same variations as those shown in FIGS. 8A-12 for the third embodiment are also applicable. - For example, like a first variation shown in FIG. 17A, one of the supporting
plates 62 can be detachably attached to the supportingbracket 55, and theloading units 59 projecting from both sides of theoscillator 54 can be fit in the supporting holes formed in the supportingplates 62 via athermal insulator 68, while embedding thecartridge heater 47 in each supportingplate 62. Meanwhile, as shown in FIG. 17B, by installing aheat conduction fin 48 on at least either side face of theoscillator 54 or the face of the supportingplate 62 facing the oscillator, the heat conduction by radiation from the supportingplate 62 to theoscillator 54 is enhanced. - As is the case with a second variation shown in FIG. 18A, a plate-like
ceramic heater 49, instead of thecartridge heater 47, can be installed on the face of the supportingplate 62 to face theoscillator 54. Then the target area is uniformly heated. As shown in FIG. 18B, by installing aheat conduction fin 48 on at least either the side face of theoscillator 54 or the face of the ceramic heater 49-facing the oscillator, the heat conduction by radiation from theceramic heaters 49 to theoscillator 54 is enhanced. - Otherwise, like a third variation shown in FIG. 19A, instead of the
cartridge heater 47 and theceramic heater 49, ahot air blower 50 can be installed on the face of the supportingplate 62 to face theoscillator 54. Since hot air contacts theoscillator 54, a rapid, uniform heating is achieved. Moreover, as shown in FIG. 19B, by installing aheat conduction fin 48 on both sides of theoscillator 54, the heat exchange with the blown out hot air is enhanced, whereby the heat conduction to theoscillator 54 is raised. - Like a fourth variation shown in FIG. 20, by forming a heating medium pathway-51 in the
oscillator 54 and by feeding a heating medium such as hot air to thispathway 51, as shown with the arrow, using theheating medium feeder 52, theoscillator 54 is heated directly from the inside. Then, the target area is further efficiently heated up. Theheating medium feeder 52 is preferably disposed near the workingface 57. - As shown in a fifth variation of FIG. 21, a heat ray emitter 53 (shown with a hollow arrow) that emits heat rays such as laser to the vicinity of the working
face 57 of theoscillator 54 can be installed. The vicinity of the workingface 57 is heated up efficiently in a non-contact manner. Instead of such aheat ray emitter 53, if means for emitting electromagnetic waves to the vicinity of the workingface 57 is disposed and theoscillator 54 is made of a ferromagnetic material, the vicinity of the workingface 57 is heated by electromagnetic induction. - In the
ultrasonic bonding head 21 of the above embodiments, theoscillator face component 2 to be mounted, the entireultrasonic bonding head 21 must be exchanged when the specs of thecomponent 2 have been changed. Since theultrasonic bonding head 21 is expensive, the machine cost will be high if a number of ultrasonic bonding heads 21 are prepared to meet the specs of eachcomponent 2. Thus, as shown in FIG. 22, it is preferable to constitute the vicinity of the workingface oscillator separate piece - Such a
separate piece oscillator bolts 70, as shown in FIG. 22. If a plurality ofbolts 70 are used to secure the separate piece, the contact area, and the contact strength with theoscillator - Although the above embodiments described examples where the
component 2 having a plurality ofbump electrodes 2a is mounted onto thesubstrate 3, the present invention is not limited to such examples. For instance, the invention is useful when mounting an arbitrary component onto a mounting object, or when bonding various components to an arbitrary object by ultrasonic vibration using an ultrasonic bonding head. - According to the component mounting apparatus of the invention, the bump electrode ends of the electronic component are held precisely parallel to the bonding face of the mounting object even when a large pressure load is applied to the rear face of the electronic component. The invention is therefore useful in bonding an electronic component which has many bump electrodes, and thus, the bonding area is large.
Claims (15)
- A component mounting apparatus for mounting a component having a plurality of bump electrodes on one face thereof onto leads of a mounting object, comprising:a component feeder (20) for feeding the component (2) with the bump electrodes facing down;a mounting head (5) for holding the rear face of the component and mounting the component onto the mounting object (3);a supporting base (8) for securing the mounting object; anda positioning device (6, 7) for relatively moving the mounting head against the supporting base to align the component with the mounting object,wherein said mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) for conveying ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the rear face of the component as vibrating parallel thereto, a pressure loader (22, 23, 39, 55, 59) for applying a pressure load to the working face of the ultrasonic vibration propagation member,
characterised in that the mounting head includes a heater (32, 47, 49, 50, 51, 52, 53) for heating the working face of the ultrasonic propagation member (34, 38, 54) and for heating the rear face of the component (2), and a cooling unit (43, 66) or a temperature retaining unit arranged to surround a connection between the ultrasonic propagation member (34,38,54) the ultrasonic vibration generator (24) and part of the ultrasonic generator itself, such that said connection and said ultrasonic vibration generator (24) are cooled. - A component mounting apparatus according to claim 1, wherein said pressure loader (22, 23, 39, 55, 59) applies pressure load to the working face (33, 41, 57) of the ultrasonic vibration propagation member (34, 38, 54) from a position immediately thereabove in a direction perpendicular thereto.
- A component mounting apparatus according to claim 1 or 2, wherein said heater (32, 51, 52) is installed in contact with said ultrasonic vibration propagation member (34, 38, 54) .
- A component mounting apparatus according to claim 1 or 2, wherein said heater (47, 49, 50, 53) is installed in non-contact with said ultrasonic vibration propagation member (34, 38, 54).
- A component mounting apparatus according to any one of claims 1 to 4,
wherein said mounting head further includes:an oscillator (54) of which one end face (56) is connected to the ultrasonic vibration generator and the other end face works as the working face (57), the oscillator being configured such that vibration provided to the end face (56) causes vibration in the working face in a direction substantially parallel thereto and such that a node (58) of an oscillation mode is formed therein; and whereinthe pressure loader (59, 55, 22) applies a pressure load (65) to the node of the oscillator. - A component mounting apparatus according to claim 5, wherein the heater (47, 49) is disposed in each of the segments of a supporting bracket (55) supporting the node (58) of the oscillator (54), the segments facing both sides of the oscillator, and the oscillator is heated by radiant heat from the heater.
- A component mounting apparatus according to claim 5, wherein a heat conduction fin (48) is installed on at least one of a side wall of the oscillator (38, 54) or a face of the supporting bracket (39, 55) facing the oscillator.
- A component mounting apparatus according to claim 5, wherein the heater comprises a heating medium pathway (51) formed in the oscillator (38, 54) and a device (52) for supplying a heating medium to the heating medium pathway.
- A component mounting apparatus according to any one of claims 1 to 8, wherein a temperature monitor (44, 67) is installed in the ultrasonic vibration generator (24) or in the vicinity thereof.
- A component mounting apparatus according to any one of claims 1 to 9, wherein the working face (41, 57) of the ultrasonic vibration propagation member (38, 54) is formed by a detachable separate piece (41a, 57a).
- A component mounting apparatus according to claim 5, wherein the heater (47, 49) is disposed in position facing both sides of the oscillator (38, 54), and the oscillator is heated by radiant heat from the heater.
- A component mounting apparatus according to claim 11, wherein the heater is a cartridge heater (47) or a ceramic heater (49) disposed in positions facing both sides of the oscillator (38, 54).
- A component mounting apparatus according to claim 5, wherein the heater is a hot air blower (50) disposed in positions facing both sides of the oscillator (38, 54) to blow hot air to the oscillator.
- A component mounting apparatus according to claim 5, wherein the heater is a device (53) for emitting heat rays to the working face (41, 57) of the oscillator (38, 54).
- A component mounting apparatus according to claim 5, wherein the heater is a device for heating the working face (41, 57) of the oscillator (38, 54) by electromagnetic induction.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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JP2002087595 | 2002-03-27 | ||
JP2002087594 | 2002-03-27 | ||
JP2002087596 | 2002-03-27 | ||
JP2002087596A JP4056276B2 (en) | 2002-03-27 | 2002-03-27 | Component mounting method and apparatus |
JP2002087594A JP4109000B2 (en) | 2002-03-27 | 2002-03-27 | Electronic component mounting equipment |
JP2002087595A JP4093781B2 (en) | 2002-03-27 | 2002-03-27 | Ultrasonic head |
PCT/JP2003/003906 WO2003081644A2 (en) | 2002-03-27 | 2003-03-27 | Electronic component mounting method and apparatus and ultrasondic bonding head |
Publications (2)
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EP1488449A2 EP1488449A2 (en) | 2004-12-22 |
EP1488449B1 true EP1488449B1 (en) | 2006-09-13 |
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EP03745015A Expired - Lifetime EP1488449B1 (en) | 2002-03-27 | 2003-03-27 | Component mounting method, component mounting apparatus, and ultrasonic bonding head |
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US (2) | US7229854B2 (en) |
EP (1) | EP1488449B1 (en) |
KR (2) | KR100934064B1 (en) |
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DE (1) | DE60308340T2 (en) |
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JP3533992B2 (en) * | 1999-06-28 | 2004-06-07 | 松下電器産業株式会社 | Bonding device and bonding tool for electronic components |
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JP3451373B2 (en) * | 1999-11-24 | 2003-09-29 | オムロン株式会社 | Manufacturing method of data carrier capable of reading electromagnetic wave |
JP4666546B2 (en) * | 1999-11-29 | 2011-04-06 | パナソニック株式会社 | Pressure device and bump bonding device, bonding device, and pressure bonding device using the same |
JP2001308141A (en) * | 2000-02-18 | 2001-11-02 | Sony Corp | Method of manufacturing electronic circuit device |
JP2001308145A (en) * | 2000-04-25 | 2001-11-02 | Fujitsu Ltd | Method of mounting semiconductor chip |
JP3491827B2 (en) * | 2000-07-25 | 2004-01-26 | 関西日本電気株式会社 | Semiconductor device and manufacturing method thereof |
JP2002076590A (en) | 2000-08-29 | 2002-03-15 | Matsushita Electric Ind Co Ltd | Component mounter, component mounting method, component mounting system and circuit board |
-
2003
- 2003-03-10 TW TW092105078A patent/TWI230102B/en not_active IP Right Cessation
- 2003-03-27 CN CNB038071347A patent/CN100377293C/en not_active Expired - Fee Related
- 2003-03-27 EP EP03745015A patent/EP1488449B1/en not_active Expired - Lifetime
- 2003-03-27 KR KR1020047015150A patent/KR100934064B1/en not_active IP Right Cessation
- 2003-03-27 US US10/508,460 patent/US7229854B2/en not_active Expired - Lifetime
- 2003-03-27 WO PCT/JP2003/003906 patent/WO2003081644A2/en active IP Right Grant
- 2003-03-27 DE DE60308340T patent/DE60308340T2/en not_active Expired - Lifetime
- 2003-03-27 KR KR1020097002605A patent/KR100950619B1/en not_active IP Right Cessation
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2007
- 2007-03-30 US US11/731,312 patent/US7861908B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI833240B (en) * | 2021-06-14 | 2024-02-21 | 日商新川股份有限公司 | Manufacturing equipment for ultrasonic welding heads and semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
DE60308340D1 (en) | 2006-10-26 |
KR20090032115A (en) | 2009-03-31 |
CN1643652A (en) | 2005-07-20 |
CN100377293C (en) | 2008-03-26 |
EP1488449A2 (en) | 2004-12-22 |
US7229854B2 (en) | 2007-06-12 |
WO2003081644A3 (en) | 2004-04-15 |
US20070187457A1 (en) | 2007-08-16 |
KR20040091152A (en) | 2004-10-27 |
US20050227429A1 (en) | 2005-10-13 |
TWI230102B (en) | 2005-04-01 |
DE60308340T2 (en) | 2007-01-11 |
KR100950619B1 (en) | 2010-04-01 |
US7861908B2 (en) | 2011-01-04 |
TW200305472A (en) | 2003-11-01 |
WO2003081644A2 (en) | 2003-10-02 |
KR100934064B1 (en) | 2009-12-24 |
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