EP1471539B1 - Sytème d'imagerie pour un microscope à base de rayonnement extrême ultraviolet (EUV) - Google Patents
Sytème d'imagerie pour un microscope à base de rayonnement extrême ultraviolet (EUV) Download PDFInfo
- Publication number
- EP1471539B1 EP1471539B1 EP03016371A EP03016371A EP1471539B1 EP 1471539 B1 EP1471539 B1 EP 1471539B1 EP 03016371 A EP03016371 A EP 03016371A EP 03016371 A EP03016371 A EP 03016371A EP 1471539 B1 EP1471539 B1 EP 1471539B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- reflective
- imaging system
- imaging
- diffractive
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K7/00—Gamma- or X-ray microscopes
Definitions
- the present invention relates to a reflective imaging system for an X-ray microscope for examining an object in an object plane, wherein the object is illuminated with rays of a wavelength ⁇ 100 nm, in particular ⁇ 30 nm and magnified in an image plane.
- the microscopic examination of objects with X-rays is becoming increasingly important, especially in the semiconductor industry. Smaller structure sizes consequently require ever higher resolutions, which can only be achieved by shortening the examination wavelength. This is especially important in the microscopic inspection of masks for the lithographic process.
- the lithography with extreme ultraviolet (EUV) radiation represents the most promising solution for the chip production in the next years.
- US Patents US 5,144,497, US 5,291,339 and US 5,131,023 relate to X-ray microscopes in which Schwarzschild systems are used as imaging systems. In these X-ray microscopes, the beam paths are designed to be telecentric on the object to be examined, which makes it difficult to image objects in reflection.
- a further disadvantage of such systems for use in the examination of objects, in particular those which are used in the field of X-ray lithography, is their great structural length in order to achieve a sufficient magnification. This complicates use, for example, in inspection systems for inspecting masks in EUV projection exposure equipment.
- a reflective X-ray microscope for investigating an object for microlithography in an object plane with radiation of a wavelength ⁇ 100 nm, in particular ⁇ 30 nm, is known from JP 2001116900.
- This in X-ray microscope disclosed in this application is a Schwarzschild system with a concave first mirror and a convex second mirror.
- the beam path for the examination of the object on the object is not telecentric, so that a study in reflection, for example of EUV reflection masks, is made possible.
- a disadvantage of this system is the very large length to achieve large imaging scales.
- Another X-ray microscopic arrangement is described for example in the applications DE 102 20 815 and DE 102 20 816.
- the imaging optics is designed as a purely reflective system and optimized in terms of short length at high magnifications. This will u. a. achieved by using highly aspheric mirrors.
- a disadvantage of these arrangements is that the manufacturing tolerances for the aspherical mirror to achieve a high image quality are extremely demanding and therefore high demands are placed on the manufacturing technology and measurement technology.
- the present invention has for its object to develop an imaging system for an X-ray microscope, which avoids the disadvantages known in the prior art. Furthermore, it should be achieved with a reasonable production cost high image quality.
- the proposed imaging system includes all optical elements associated with an imaging optic and generates a corresponding intermediate image by the extreme ultraviolet (EUV) radiation. This can be further processed by further imaging systems, ie further increased.
- EUV extreme ultraviolet
- the imaging system according to the invention can be used for example in photolithography.
- a diffractive-reflective structure in the form of a line structure.
- the diffractive-reflective structure is applied to a spherical or planar base surface of one or both imaging optical elements 2 and 3 . Concave or convex curvatures are possible as a spherical base.
- a further imaging system is subordinated to the first imaging system.
- the second imaging system can be based on an X-ray image, an electro-optical image or an image that uses a radiation above 200 nm.
- the second imaging system can also be another imaging optical element with a spherically convex base surface without a diffractive structure.
- the imaging system according to the invention is preferably provided for wavelengths in the range of less than 30 nm, at a magnification of 5-1000 ⁇ and a length less than 3 m.
- the imaging system has two imaging optical elements 2 and 3 each having a diffractive-reflective structure, the first imaging optical element 2 having a concave base surface and the second imaging optical element 3 having a convex base surface for the respective diffractive reflective surface. have reflective structure.
- the imaging optical elements 2 and 3 are arranged so that the optical paths intersect one another.
- the optical axis of the imaging system is inclined to the object normal.
- the imaging optical elements 2 and 3 can also be arranged so that the optical paths do not intersect.
- the imaging system according to the invention can be used as the basis for an inspection system for lithographic masks.
- the work focuses on wavelengths around 13.5nm, because only here efficient optics for the required exposure systems can be produced.
- the first imaging optical element 2 with spherically concave base surface has, for example, a diffractive-reflective structure with approximately 240 lines / mm
- the second imaging optical element 3 with a spherically convex base surface has a diffractive-reflective structure with approximately 660 lines / mm.
- the imaging optical elements 2 and 3 are arranged so that the optical paths intersect once.
- FIG. 1 and FIG. 2 (enlarged detail), the corresponding beam paths in the imaging system, starting from the object 1 to be examined, via the imaging optical elements 2 and 3 , up to the intermediate image 4 produced, are shown.
- the illustrated beam path relates to an imaging system for an extreme ultraviolet (EUV) radiation based microscope or a corresponding inspection system for lithographic masks.
- EUV extreme ultraviolet
- FIG. 4 shows the schematic overall view of an inspection system for lithographic masks based on EUV radiation.
- EUV radiation In contrast to UV radiation, EUV radiation is absorbed very strongly in almost all materials. Since the absorption length in air at atmospheric pressure is well below 1 mm, the EUV radiation can propagate almost loss-free only in vacuum over the distances required for EUV lithography.
- the EUV radiation is focused by the illumination optics 6 onto the object 1.
- the reflected from the object 1 EUV radiation is focused by the imaging optics 7 as an intermediate image 4 on a transducer layer.
- the subsystem according to the invention, starting from the object plane 1 to the intermediate image 4 , on the transducer layer is also referred to as the first subsystem and is based entirely on the EUV radiation.
- the intermediate image 4 thus produced can be further enlarged, for example, by a second subsystem.
- the second subsystem can be based on both the EUV radiation and a different wavelength.
- the EUV radiation is converted, for example, in VIS radiation.
- This VIS radiation is imaged onto a camera chip 9 by a further imaging optics 8 which is used as a second subsystem and which is simultaneously designed as a window of the vacuum chamber 10 .
- the camera chip 9 is used to control the irradiation.
- an imaging system is provided which avoids the disadvantages known in the prior art and ensures a high imaging quality.
- the production costs remain justifiable by the exclusive use of spherical mirrors.
- the Römgenmikroskopie in Verfanren such as the so-called AIMS (Aenai Imaging Measurement).
- AIMS Azai Imaging Measurement
- the lithography stepper is simulated by a less expensive and simpler microscopic arrangement. It is important that the image with the same wavelength of z. B. 13.5nm, the same lighting conditions and the same image quality as an EUV stepper is generated. In contrast to the stepper but the image field with about 10 ⁇ m instead of several mm is much smaller. Another difference is that the mask is typically imaged 10 to 1000 times larger on a camera.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Studio Devices (AREA)
Claims (6)
- Système d'imagerie réfléchissant pour un microscope à base de rayonnement extrême ultraviolet (EUV) avec des longueurs d'ondes dans la plage de < 100 nm, avec une réduction respectivement un agrandissement de 0,1-1000x et une longueur de construction <5m, dans lequel au moins un de plusieurs éléments optiques de représentation, présents dans le trajet des rayons, présente une structure de diffraction-réflexion sous la forme d'une structure de lignes.
- Système d'imagerie réfléchissant selon la revendication 1, où la structure de diffraction-réflexion est appliquée sur une face de base sphérique ou plane et présente une forme asymétrique, non symétrique en rotation.
- Système d'imagerie réfléchissant selon la revendication 1 et 2, où les faces de base sphériques sont concaves ou convexes.
- Système d'imagerie réfléchissant selon au moins l'une des revendications précédentes, dans lequel deux éléments optiques de représentation sont dotés chacun d'une structure de diffraction-réflexion, où le premier élément optique de représentation présente une face de base sphérique concave et le second élément optique de représentation une face de base sphérique convexe pour la structure de diffraction-réflexion respective.
- Système d'imagerie réfléchissant selon au moins l'une des revendications précédentes, dans lequel les éléments optiques de représentation sont disposés de façon que les chemins optiques se croisent au moins une fois.
- Système d'inspection pour des masques de lithographie basé sur un système d'imagerie réfléchissant selon au moins l'une des revendications précédentes, dans lequel un premier élément optique de représentation, à face de base sphérique concave, présente une structure à effet de diffraction-réflexion avec environ 240 lignes/mm, et un second élément optique de représentation, à face de base sphérique convexe, une structure à effet de diffraction-réflexion avec environ 660 lignes/mm, et dans lequel les chemins optiques se croisent une fois.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10319269A DE10319269A1 (de) | 2003-04-25 | 2003-04-25 | Abbildungssystem für ein, auf extrem ultravioletter (EUV) Strahlung basierendem Mikroskop |
DE10319269 | 2003-04-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1471539A1 EP1471539A1 (fr) | 2004-10-27 |
EP1471539B1 true EP1471539B1 (fr) | 2006-08-23 |
Family
ID=32946454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03016371A Expired - Lifetime EP1471539B1 (fr) | 2003-04-25 | 2003-07-19 | Sytème d'imagerie pour un microscope à base de rayonnement extrême ultraviolet (EUV) |
Country Status (4)
Country | Link |
---|---|
US (1) | US6894837B2 (fr) |
EP (1) | EP1471539B1 (fr) |
AT (1) | ATE337605T1 (fr) |
DE (2) | DE10319269A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4639352B2 (ja) * | 2002-05-10 | 2011-02-23 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 波長≦100nmで物体を検査する検査系 |
DE102008015996A1 (de) * | 2008-03-27 | 2009-10-01 | Carl Zeiss Sms Gmbh | Mikroskop und Mikroskopierverfahren zur Untersuchung eines reflektierenden Objektes |
DE102010029050A1 (de) | 2010-05-18 | 2011-03-31 | Carl Zeiss Smt Gmbh | Vergrößernde abbildende Optik sowie Metrologiesystem mit einer derartigen abbildenden Optik |
DE102011081914A1 (de) | 2011-08-31 | 2012-09-06 | Carl Zeiss Smt Gmbh | Beleuchtungsoptik zur Beleuchtung eines in einem Objektfeld anordenbaren, strukturierten Objektes |
DE102013211269A1 (de) | 2013-06-17 | 2014-04-30 | Carl Zeiss Smt Gmbh | Beleuchtungsoptik zur Beleuchtung eines in einem Objektfeld anordenbaren, strukturierten Objektes sowie Metrologiesystem für die Untersuchung eines strukturierten Objektes |
DE102019124919B4 (de) | 2019-09-17 | 2021-08-26 | Ri Research Instruments Gmbh | Mikroskopisches System zur Prüfung von Strukturen und Defekten auf EUV-Lithographie-Photomasken |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02210299A (ja) | 1989-02-10 | 1990-08-21 | Olympus Optical Co Ltd | X線用光学系及びそれに用いる多層膜反射鏡 |
JP2865257B2 (ja) | 1989-03-07 | 1999-03-08 | オリンパス光学工業株式会社 | シュヴアルツシルド光学系 |
JP2945431B2 (ja) | 1990-03-01 | 1999-09-06 | オリンパス光学工業株式会社 | 結像型x線顕微鏡 |
JP2921038B2 (ja) | 1990-06-01 | 1999-07-19 | キヤノン株式会社 | X線を用いた観察装置 |
DE4027285A1 (de) | 1990-08-29 | 1992-03-05 | Zeiss Carl Fa | Roentgenmikroskop |
US5291339A (en) | 1990-11-30 | 1994-03-01 | Olympus Optical Co., Ltd. | Schwarzschild optical system |
JPH04353800A (ja) | 1991-05-31 | 1992-12-08 | Olympus Optical Co Ltd | 軟x線顕微鏡 |
US5177774A (en) | 1991-08-23 | 1993-01-05 | Trustees Of Princeton University | Reflection soft X-ray microscope and method |
US5384817A (en) * | 1993-07-12 | 1995-01-24 | Ovonic Synthetic Materials Company | X-ray optical element and method for its manufacture |
JP2690036B2 (ja) * | 1995-03-23 | 1997-12-10 | 工業技術院長 | X線分光集光素子 |
JP3167095B2 (ja) * | 1995-07-04 | 2001-05-14 | キヤノン株式会社 | 照明装置とこれを有する露光装置や顕微鏡装置、ならびにデバイス生産方法 |
US6469827B1 (en) | 1998-08-06 | 2002-10-22 | Euv Llc | Diffraction spectral filter for use in extreme-UV lithography condenser |
US6118577A (en) * | 1998-08-06 | 2000-09-12 | Euv, L.L.C | Diffractive element in extreme-UV lithography condenser |
JP4374735B2 (ja) * | 1999-08-11 | 2009-12-02 | 株式会社ニコン | 反射型軟x線顕微鏡、マスク検査装置及び反射マスクの製造方法 |
DE10130212A1 (de) | 2001-06-22 | 2003-01-02 | Zeiss Carl Jena Gmbh | Objektiv |
DE10220816A1 (de) | 2002-05-10 | 2003-11-20 | Zeiss Carl Microelectronic Sys | Reflektives Röntgenmikroskop und Inspektionssystem zur Untersuchung von Objekten mit Wellenlängen 100 nm |
DE10220815A1 (de) | 2002-05-10 | 2003-11-20 | Zeiss Carl Microelectronic Sys | Reflektives Röntgenmikroskop und Inspektionssystem zur Untersuchung von Objekten mit Wellenlängen 100 nm |
US6801298B2 (en) * | 2002-07-25 | 2004-10-05 | Intel Corporation | Light condenser |
-
2003
- 2003-04-25 DE DE10319269A patent/DE10319269A1/de not_active Ceased
- 2003-07-19 AT AT03016371T patent/ATE337605T1/de not_active IP Right Cessation
- 2003-07-19 EP EP03016371A patent/EP1471539B1/fr not_active Expired - Lifetime
- 2003-07-19 DE DE50304739T patent/DE50304739D1/de not_active Expired - Fee Related
- 2003-07-24 US US10/626,130 patent/US6894837B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE50304739D1 (de) | 2006-10-05 |
EP1471539A1 (fr) | 2004-10-27 |
US20040212891A1 (en) | 2004-10-28 |
US6894837B2 (en) | 2005-05-17 |
DE10319269A1 (de) | 2004-11-25 |
ATE337605T1 (de) | 2006-09-15 |
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