EP1468436B1 - Micro-electromechanical system and method for production thereof - Google Patents

Abstract

The micro-electromechanical system has a substrate (S) and a pair of micro-elements (1,2) having facing surfaces (3a,4a) generated via a structuring method with a minimum separation characteristic. One of the micro-elements is bistable and is switched into a second bistable state in which the separation of the surfaces is less than the minimum separation characteristic. An Independent claim for a manufacturing method for a micro-electromechanical system is also included.

Description

Technical area

• auf ein Mikro-elektromechanisches System gemäss dem Oberbegriff des Patentanspruches 1 sowie
• auf ein Verfahren zur Herstellung eines mikro-elektromechanischen Systems gemäss dem Oberbegriff des Patentanspruches 21.

The invention relates to the field of micro-electro-mechanical systems, in particular

• to a micro-electro-mechanical system according to the preamble of claim 1 and also
• to a method for producing a micro-electro-mechanical system according to the preamble of claim 21.

State of the art

Such, the preamble of claims 1 and 21 forming micro-electro-mechanical system (micro electro-mechanical system, MEMS) and a corresponding method are for example off DE 198 00 189 A1. There, a micromechanical switch is described, which a flat carrier substrate, one on the carrier substrate fixed contact piece, a movable electrode and a fixed with the Carrier substrate connected counter electrode comprises. The movable electrode has a free end and a fixed, connected to the carrier substrate The End. The movable electrode and the counter electrode face each other Surfaces on. By electrostatic forces of attraction between these mutually facing surfaces, the movable electrode bent, that is elastically deformed, that the free end of the movable electrode of the counter electrode and thereby also approximates the contact piece until it comes to contact between the free end the movable electrode and the contact piece comes. The movement of the free end of the movable electrode takes place laterally, that is parallel to the sheet carrier substrate.

The electrostatic forces of attraction between the facing each other Surfaces of the movable electrode and the counter electrode is through the application of a voltage between the movable electrode and the Counter electrode generated. To a short circuit, that is an electrical Contact between the movable electrode and the counter electrode To avoid, stoppers are introduced into the counter electrode, over the protrude the surface of the counter electrode facing the movable electrode and not at the same potential as the counter electrode. For the same purpose springs may be provided, which on the Counter electrode opposite side of the movable electrode attached are and the movement of the movable electrode in the direction of the counter electrode limit. In addition, for the same purpose also the the counter electrode facing surface of the movable electrode with be provided an electrically insulating layer.

The electrostatic attraction F between two parallel surfaces of the surface A at a distance d when applying a switching voltage U between the two surfaces is given by F = ε 0 · A · U 2 / ( 2d 2 )

The force thus decreases linearly with the surface, square with the stress and inversely proportional to the square of the distance.

The disclosed in the cited DE 198 00 189 A1 microsystem was under Use of a Siliziumtiefenätzprozesses generated from the carrier substrate. In this case, after applying a mask to the carrier substrate in the places where the mask is open, etched material from the carrier substrate. Resulting trenches or etch channels that at least have a characteristic of the etching minimum width.

In order to achieve a mobility of the free end of the movable electrode, a sacrificial shift process is applied, which is the free end of the mobile Electrode separates from the carrier substrate. For this purpose, one in the carrier substrate below the moving parts of the micromechanical switch arranged sacrificial layer selectively removed by an etching process, wherein the sacrificial layer at sites where connection to the substrate is desired is, as at the counter electrode, the fixed contact piece and the fixed end of the movable electrode.

DE 42 05 029 C1 shows an electrostatically operated microelectromechanical Relay working horizontally. That means the switching movement this relay is substantially perpendicular to a carrier substrate. From a silicon substrate is a tongue-shaped electrode with contact piece etched. The substrate is then coated with a counter substrate a counter electrode and a mating contact applied to the electrode with the counter electrode encloses a wedge-shaped gap. By Applying a switching voltage between the electrode and the counter electrode these are movable towards each other, creating an electrically conductive Achieve connection between contact and mating contact. Size Contact forces can be achieved by relatively wide electrodes.

In DE 197 36 674 C1 is also a micro-electromechanical relay and discloses a method of manufacturing which operates horizontally. One movable contact is on an anchor tongue fixed on one side to a substrate attached, which is curved away from the substrate in the resting state. To generate a high contact force this contact acts with a Fixed contact together, which at a likewise curved away from the substrate Spring tongue is attached. The curvature of the contacts is through realized the application of a tensile layer on both contacts. Achieving a high reproducibility of such a curvature generated the contacts and thus the contact distances in the idle state (opened) is not easy to manufacture.

In US 5'638'946 and US 6'057'520 are further horizontally operating MEMS Switch described.

J. Qiu et al., "A Centrally-Clamped Parallel-Beam Bistable MEMS Mechanism." Proc. of MEMS 2001, Interlaken, Switzerland, Jan. 20-22, 2001, shows a bistable switchable micro-electro-mechanical mechanism. This one exists from two parallel spring tongues or membranes suspended on both sides, which describe a cosinusoidal course. In the middle are the spring tongues connected to each other, and at their ends they are on a support substrate set. This bistable micro-element is by means of ion etching and sacrificial layer technology generated from the silicon carrier substrate, so that the spring tongues are laterally movable and two stable states be shown. By applying a perpendicular to the spring tongues and parallel to the carrier substrate directed force is the bistable Mechanism between the two stable states back and forth switchable, wherein the respective mirror-image to the initial position end position finally reached by a snap of the mechanism independently becomes. On the one hand elastic mobility and on the other hand mechanical To achieve stability of the micro-element, the 3 mm long spring tongues only 10 μm to 20 μm wide, but 480 μm high.

Other laterally movable micro-electromechanical mechanisms are in M. Taher, A. Saif, "On a Tunable Bistable MEMS - Theory and Experiment", Journal of Microelectromechanical Systems, Vol. 9, 157-170 (June 2000).

In US 5'677'823 is an electrostatically switchable bistable memory element discloses which works horizontally. A substantially parallel to one Carrier substrate aligned, bridge-like movable contact is above arranged by a fixed contact connected to the carrier substrate. At its two ends is the movable contact on the carrier substrate fixed while standing in the middle of the carrier substrate arched away (first stable position) or in the direction of the carrier substrate is curved (second stable position). Touch in the second stable position the movable contact and the fixed contact: the switch is closed. In the first stable position, the switch is open. The bistability of the switch results from mechanical stresses, which at the manufacture of the switch are introduced into the movable contact. Also below the moving contact are side by side Fixed contact two electrodes arranged. By applying electrical Strains on the movable contact and these electrodes can Contact and electrodes are charged electrically, so that electrostatic Attraction or repulsion forces between them, through which the switch between the two stable positions back and can be switched.

Another horizontally operating bistable MEMS mechanism is in Sun. et al., "A Bistable Microrelay Based on Two-Segment Multimorph Cantilevers Actuators ", IEEE Catalog No. 98CH361 76.

Presentation of the invention

It is therefore an object of the invention to provide a microelectromechanical system (MEMS) of the type mentioned, which is a more flexible MEMS design allows. In particular, an improved switchability and new functionalities are possible. This task is solved by a MEMS with the features of claim 1.

Furthermore, it is an object of the invention to provide an improved process for the preparation of MEMS to create. This task triggers a procedure with the Features of claim 21.

Improved switchability, for example, can mean a shift Already at lower switching voltages can be triggered. New functionalities For example, the realization of closed without voltage Terminals or of micro-relays with both open without voltage as well as dead terminals mean.

• das erste Mikro-Element und das zweite Mikro-Element mit dem Substrat verbunden sind,
• das erste Mikro-Element eine erste Fläche aufweist und das zweite Mikro-Element eine zweite Fläche aufweist, welche Flächen einander zugewandt sind und durch ein Strukturierungsverfahren erzeugt sind,
• das erste Mikro-Element einen Schaltteil beinhaltet, durch den es bistabil zwischen einer Initialposition und einer Arbeitsposition schaltbar ist, und
• der Abstand zwischen der ersten Fläche und der zweiten Fläche in der Arbeitsposition des ersten Mikro-Elementes kleiner als ein durch das Strukturierungsverfahren erzeugbarer Minimalabstand zwischen der ersten Fläche und der zweiten Fläche ist.

The inventive MEMS comprises a substrate and a first micro-element and a second micro-element, wherein

• the first micro-element and the second micro-element are connected to the substrate,
• the first micro-element has a first surface and the second micro-element has a second surface which surfaces face each other and are produced by a structuring method,
• the first micro-element includes a switching part by which it is switchable bistable between an initial position and a working position, and
• the distance between the first surface and the second surface in the working position of the first micro-element is smaller than a minimum distance between the first surface and the second surface that can be generated by the structuring method.

So there is a first, between the two stable positions initial position and work position switchable micro-element so in conjunction with a second micro-element used that the first micro-element after Switching from the initial position to the working position a lower one Distance to the second micro-element than in the initial position. Both micro-elements are connected to the substrate and used a structuring process generated. The mentioned smaller distance in According to the invention, the working position is smaller than one for the structuring method characteristic minimum distance between the two micro-elements.

In this way it is achieved that new degrees of freedom in the design of MEMS are obtained because process-related boundary conditions be overcome. Various micro actuators can be new or be realized easier or in an improved form.

In a preferred embodiment of the subject invention has the second micro-element has a first fixedly connected to the substrate End and a movable part, wherein in the working position of the first micro-element of the movable part of the second micro-element by electrostatic forces between the first micro-element and the second micro-element from a switch-off position into a switch-on position is movable, and wherein the two micro-elements in the area of the body, at the said smaller distance between the two micro-elements is present, have contact points and formed electrically non-conductive are. The fact that there are points of contact means that the mentioned lower Distance is zero.

This makes it possible to produce electro-statically operating actuators, their electrostatically switchable electrodes (electrode and counter electrode) touching each other. The small or vanishing achieved Electrode gaps result in improved switchability. A switching of the actuator at very low switching voltages is possible.

In a further advantageous embodiment of the subject invention In addition, the first micro-element is designed such that there is a matched counter electrode, that of the shape of the second micro-element is adapted: the adapted counterelectrode is shaped in such a way that in the on position of the second micro-element, the adapted Counter electrode and the second micro-element in the range of said Overlap contact areas over a large area. In the switch-on position of the second micro-element thus nestle the adapted counter electrode and the second micro-element to each other. This will be a Maximizing the areas reached, between which the electrostatic Attractions act, resulting in greater electrostatic attractions and thus has an improved switchability result. A switching of the actuator at very low switching voltages is possible.

In a further advantageous embodiment, said adapted Counter electrode additionally has a second section opposite the section of the counterelectrode which conforms to the second microelement stepped back. In the switch-on position of the second micro-element close this second section of the adapted Counter electrode and the second micro-element a gap. On This way, a force can be applied to the second micro-element in its on position able to exercise, tailor made and very large be dimensioned by the length, width and height of the gap becomes. The force that can be selected in this way can be, for example a contact force of the second micro-element on one or two electrical Be contacts that the second micro-element in its on position contacted, creating a secure electrical contact can be made.

In a further preferred embodiment, a changeover relay realized.

In other advantageous embodiments - the subject invention become relays or changeover relays with volt-free connections realized.

In particular, in a preferred embodiment, the movable part of the second micro-element by switching the first micro-element from the initial position to the working position elastically deformable. Thereby it is possible to realize dead-ended connections.

The inventive method includes after the structuring of two Micro-elements with facing surfaces switching the bistable switchable micro-element. This can be new or improved MEMS, such as those mentioned above, are produced.

Further preferred embodiments are defined in the dependent claims and the figures.

Brief description of the drawings

Fig. 1

eine schematische Darstellung eines erfindungsgemässen MEMS mit kosinusförmigem bistabilen Element, in Aufsicht;

Fig. 2

eine schematische Darstellung eines erfindungsgemässen MEMS mit schwingungsbauchförmigem bistabilen Element, in Aufsicht;

Fig. 3

eine schematische Darstellung eines erfindungsgemässen MEMS mit kosinusförmigem bistabilen Element und angepasster Gegenelektrode, in Aufsicht;

Fig. 4

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit kosinusförmigem bistabilen Element und angepasster Gegenelektrode, in Aufsicht;

Fig. 5

eine schematische Darstellung eines erfindungsgemässen Mikro-Wechselschalt-Relais mit zwei kosinusförmigen bistabilen Elementen und angepasster Gegenelektrode, in Aufsicht;

Fig. 6

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit kosinusförmigem bistabilen Element und gestufter Gegenelektrode, in Aufsicht;

Fig.7

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit kosinusförmigem bistabilen Element und gestufter Gegenelektrode und zweiteiligem beweglichen Teil des zweiten Mikro-Elementes, in Aufsicht;

Fig. 8

eine schematische Darstellung eines erfindungsgemässen Wechselschalt-Relais mit monostabilem zweiten Mikro-Element und NO- und NC-Anschlüssen, in Aufsicht;

Fig. 9

eine schematische Darstellung eines erfindungsgemässen Wechselschalt-Relais mit bistabilem zweiten Mikro-Element und NO- und NC-Anschlüssen, in Aufsicht;

Fig. 10a

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit NC-Anschluss, Zustand: erstes Mikro-Element in Initialposition; in Aufsicht;

Fig. 10b

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit NC-Anschluss, Zustand: erstes Mikro-Element in Arbeitsposition, zweites Mikro-Element in Ausschaltposition; in Aufsicht;

Fig. 10c

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit NC-Anschluss, Zustand: erstes Mikro-Element in Arbeitsposition, zweites Mikro-Element in Einschaltposition; in Aufsicht;

Fig. 11a

eine schematische Darstellung eines erfindungsgemässen horizontal arbeitenden Mikro-Relais mit NC-Anschluss, geschnittene Seitenansicht;

Fig. 11b

eine schematische Darstellung eines erfindungsgemässen horizontal arbeitenden Mikro-Relais mit NC-Anschluss, in Aufsicht;

In the following, the subject invention will be explained in more detail with reference to preferred embodiments, which are illustrated in the accompanying drawings. Show it:

Fig. 1

a schematic representation of an inventive MEMS with cosinusoidal bistable element, in plan view;

Fig. 2

a schematic representation of an inventive MEMS with schwingungsbauchförmigem bistable element, in plan view;

Fig. 3

a schematic representation of an inventive MEMS with cosinusoidal bistable element and matched counter electrode, in plan view;

Fig. 4

a schematic representation of an inventive micro-relay with cosinusoidal bistable element and matched counter electrode, in supervision;

Fig. 5

a schematic representation of an inventive micro-changeover relay with two cosinusoidal bistable elements and matched counter electrode, in plan view;

Fig. 6

a schematic representation of an inventive micro-relay with cosinusoidal bistable element and stepped counter electrode, in plan view;

Figure 7

a schematic representation of an inventive micro-relay with cosinusoidal bistable element and stepped counter electrode and two-part moving part of the second micro-element, in plan view;

Fig. 8

a schematic representation of an inventive switching relay with monostable second micro-element and NO and NC ports, in plan view;

Fig. 9

a schematic representation of an inventive switching relay with bistable second micro-element and NO and NC connections, in supervision;

Fig. 10a

a schematic representation of an inventive micro-relay with NC port, state: first micro-element in initial position; in supervision;

Fig. 10b

a schematic representation of an inventive micro-relay with NC connection, state: first micro-element in working position, second micro-element in the off position; in supervision;

Fig. 10c

a schematic representation of a micro-relay according to the invention with NC connection, state: first micro-element in working position, second micro-element in the on position; in supervision;

Fig. 11a

a schematic representation of an inventive horizontal working micro-relay with NC port, sectional side view;

Fig. 11b

a schematic representation of an inventive horizontal working micro-relay with NC port, in supervision;

The reference numerals used in the drawings and their meaning are listed in the list of references summarized. in principle In the figures, parts which have the same effect are given the same reference numerals.

Ways to carry out the invention

Fig. 1 shows a schematic plan view of a first according to the invention microelectromechanical system (MEMS). It includes a first micro-element 1 and a second micro-element 2, both of which are rigid with one Substrate S are connected.

The substrate S is a wafer of monocrystalline silicon in which one of the two largest surfaces forms a major surface of the substrate. In Fig. 1, this major surface is in the plane of the paper. Using ionic charges (DRIE, dry reactive ion etching) and sacrificial layer technology the first micro-element 1 and the second micro-element 2 from the Substrate S shaped.

The structuring method DRIE has the property of a material-removing To be a method; it is an etching process. It also has the property good for creating narrow but deep channels, columns or Being suitable trenches, whereby the DRIE awarded a preferred direction which can be the direction of the preferred material removal indicates and is thus perpendicular to the main surface of the substrate. Perpendicular again to this preferred direction is the width of a DRIE trench down, ie narrow trenches limited. The means that there is one through the structuring process (for example, DRIE) given minimum producible trench width. For the two surfaces, which form the lateral boundaries of such a trench, there are thus a minimum distance. Details, such as ion bombardment and sacrificial shelling technology the micro-elements 1,2 are formed from the substrate can, is known in the art and can, for example, the said Publication DE 198 00 189 A1 are taken, the thereby incorporated with their entire disclosure content in the description becomes.

DRIE generated microelements typically have side surfaces, which are aligned almost perpendicular to the main surface of the substrate S, or in other words: (local) surface normal vectors of the side surfaces run virtually parallel to the main surface of the substrate S. Such Thus, microelements are essentially in the shape of a straight one (right - angled) prism whose base is parallel to the main surface of the Substrates S is aligned. In addition, typically the height of such Micro-element (perpendicular to the main surface) very large compared to the (narrowest) width of such a micro-element. The first micro-element and the second micro-element are of this type.

The first micro-element 1 is a bistable elastic MEMS mechanism as described in the cited publication J. Qiu et al., "A Centrally-Clamped Parallel-Beam Bistable MEMS Mechanism ", Proc. Of MEMS 2001, Interlaken, Switzerland, Jan. 20-22, 2001. Details too Embodiments, characteristics and for the production of such Micro-element can be found in this publication, which thereby incorporated with their entire disclosure content in the description becomes. The first micro-element 1 is at a first end 6 and a second end 7 fixed on the substrate S. In between, this points first micro-element 1 two parallel, cosinusoidal curved Spring tongues, which in the middle 8 between the two ends 6,7 with each other are connected. Considering their small width and big ones Height (perpendicular to the substrate main surface) you can use these spring tongues also as a parallel membrane.

The first micro-element 1 is bistable between an initial position A and a working position B switchable (the latter shown in phantom in Fig. 1). That is, the micro-element 1 has two mechanically stable states or positions A and B, between which it is applied by applying a lateral, So substrate-parallel force is reciprocable; the movement takes place substantially laterally. Possible intermediate positions are not stable, but lead independently to a rapid transition into one of the two stable states A or B. The transition takes place by preferably elastic deformation of the first micro-element 1. The first micro-element 1 consists here only of a switching part 5, through which it is bistable switchable.

The first micro-element 1 has on the second micro-element 2 facing Page on a formed by DRIE side surface, the first Surface 3a is called. This first surface 3a has a first coating 3b, which is electrically insulating and whose outer, that is from the surface facing away from the first surface 3a, the first surface 3 of the first Micro-element 1 forms. The first coating 3b will typically produced by oxidation of the silicon.

The second micro-element 2 has a first fixed end 10 on which it is set on the substrate S, and a movable part 11; it is arranged adjacent to the first micro-element 1. On the side of the second micro-element facing the first micro-element 1 is, the second micro-element 2 has a DRIE formed side surface referred to as the second surface 4a. This second surface 4a has a second coating 4b, which is electrically insulating and whose outer, so facing away from the second surface 4a surface second surface 4 of the second micro-element 2 forms. The first surface 3 and the second surface 4 are facing surfaces, as well as the first surface 3a and the second surface 4a facing each other are. The second coating 4b also typically becomes oxidized of silicon.

After forming the first surface 3a and the second surface 4a by means DRIE is the first micro-element 1 in the initial position A and the second micro-element 2 in an off position A '. Since the areas 3a and 4a mittes DRIE are formed, they have a distance from each other, at least is as large as a minimum distance given by DRIE. With the Distance of the surfaces from each other is meant the distance that such two Have points that are closest to each other, with the one Point on the first surface 3a and the other point on the second surface 4a lies. The distance is thus the width of the trench between the first Surface 3a and the second surface 4a at its narrowest point. In Fig. 1 is this point at a corner of the first fixed end 10 of the second micro-element 2 and near the first end 6 of the first micro-element 1 at the membrane of the first micro-element 1, which has the first surface 3a.

The initial position A of the first micro-element 1 is a production-related Initial position. The arrangement of the first micro-element 1 and of the second micro-element 2 is selected such that after switching of the first micro-element 1 from the initial position A to the working position B is the distance of the first surface 3a from the second surface 4a smaller than the one mentioned, by the manufacturing method (for example DRIE) given minimum distance. In the MEMS in Fig. 1, the distance is even zero, that is, in working position A, the first micro-element touch 1 and the second micro-element 2. In the working position A can a intended interaction of the first micro-element 1 with the second micro-element 2 within the MEMS.

The MEMS in Fig. 1 represents a microactuator, that of the first micro-element 1 and the second micro-element 2, together with the substrate S. is formed. In this case, the second micro-element 2 acts as a movable, electrostatically switchable electrode and the bistable switchable first micro-element 1 as an associated electrostatic counter electrode. The first Micro-element 1 is in working position A.

The operation of the microactuator when it is in working position B, is essentially known from the prior art: On the first fixed End 6 of the first micro-element 1 is a contacting electrode C, and at the first fixed end 10 of the second micro-element 2 a contacting electrode C 'is provided. These contacting electrodes C, C 'serve to apply switching voltages to the microelements 1,2, through which the micro-elements electrostatically charge, so that electrostatic forces between the micro-elements 1 and 2 Act. For this, the material from which the micro-elements are made, be sufficiently conductive, which, for example, by appropriate doping of silicon is achieved. Due to the electrostatic forces between the micro-elements (more precisely: between the first surface 3 and the second surface 4) is the movable part 11 of the second micro-element 2 from the switch-off position A 'to a switch-on position B' of the second microelement 2 movable. The switch-on position B 'is shown in FIG. 1 shown in dashed lines. In the MEMS in Fig. 1 is an opposite one Charging the micro-elements 1,2 and thus an attractive electrostatic Force provided. For switching back the second micro-element 2 in the switch-off position A 'are the charges of the micro-elements 1,2 reduced. That no unwanted discharges take place, in particular, when the micro-elements touch 1.2, is caused by the non-conductive Coatings 3b, 4b achieved.

As can be seen from equation (1), the electrostatic force decreases inversely proportional to the distance. The MEMS according to the invention Fig. 1 thus has the great advantage, even with smaller switching voltages to be switchable than they would be needed for a MEMS whose spacing between electrode and counter electrode greater than or equal to that through the Structuring method given minimum distance.

The micro-actuator in Fig. 1, for example, as an optical micro-switch be used by passing a Lichstrahl to be switched or interrupted by the movable part 11 of the second micro-element 2 is, depending on whether the second micro-element 2 in the off position A 'or in the switch-on position B' is located. Just as well is the redirecting a light beam with the micro-actuator in Fig. 1 possible, for example if in the movable part 11 of the second micro-element 2 a is arranged reflective area (not shown). The switch-on position B 'is, by definition, present when appropriate switching voltages are applied; otherwise the switch-off position A 'is present.

The bistable switchable first micro-element 1 is called an electrostatic Electrode or counter electrode used.

The embodiment in Fig. 1 has been described in great detail. Out For clarity and clarity, below are some of already mentioned details of the operation of the inventive MEMS, which should now have become clear to the skilled person, not anymore extra mentioned.

Fig. 2 shows a MEMS which largely corresponds to the MEMS of Fig. 1; Indeed is the first micro-element 1 constructed differently. The first micro-element 1 is here as another lateral, bistable and preferably elastic switchable mechanism formed. The first micro-element 1 is also here at a first end 6 and a second end 7 on the substrate S set. In between, the first micro-element 1 but a curved Spring tongue, which has the shape of a vibration belly. In view of its small width and its high height (perpendicular to the Substrate main surface) can also be this spring tongue as a membrane describe.

In the initial position A, ie in the state in which the first micro-element 1, the first micro-element 1 describes a symmetrical antinode, in working position B an asymmetric Antinode (the latter in Fig. 2 drawn by dashed lines). Of the asymmetric antinode represents the second stable position of the first Micro-element 1 is and is due to the fact that one with the Substrate S firmly connected stop the first micro-element 1 in the working position B touches and to the corresponding deformation of the first Micro-element 1 leads. This stop is here by a corresponding formed and arranged first fixed end 10 of the second micro-element 2 formed. The corresponding touch point is conveniently to the right of a link leading from the second end 7 extends to the first end 6 of the first micro-element 1 when the symmetrical antinode in the initial position A to the left of this Link is arranged. The value of a parallel to this link guided position coordinate of the point of contact is not 0.5 (no asymmetric antinode) and is preferably between 0.52 and 0.92 of the length of the link; he is here about 0.84. The stop can also by a correspondingly shaped first End 6 or second end 7 of the first micro-element 1 are formed or as a separately on the substrate S fixed stop (which then to be considered as belonging to the first micro-element 1).

As in the embodiment of FIG. 1, the bistable micro-element 1 generated in the initial position A (structured), the distance between first micro-element 1 and the second micro-element 2 at least as big is like a minimum distance given by the structuring method (between these micro-elements 1,2). Still in the context of production of the MEMS becomes the first after application of coatings 3b, 4b Micro-element 1 switched from the initial position A in the working position B, wherein in the working position B, the distance between the two Micro-elements 1.2 is smaller than the said minimum distance. By doing So MEMS become two micro-elements with one through the structuring process can not be produced small distance from each other realized (by taking advantage of the bistable switchability of one of the micro-elements). For Further details on the embodiment of Fig. 2 will be related to this referenced with Fig. 1.

FIG. 3 shows a MEMS according to the invention, which largely corresponds to that in FIG. 1 corresponds to the embodiment shown; however, here is the first one Micro-element 1 not only from a switching part 5, but additionally includes another electrode 9. The electrode 9 has an elongated part, the first surface 3a, the first coating 3b and the first surface 3 of the first micro-element 1 includes. This part is by means of another elongate member which is approximately perpendicular to the said aligned is, with the switching part 5 in the middle 8 between the ends 6,7 of the first Micro-element 1 connected.

Since the electrode 9 is fixed to the switching part 5, it moves with the Switching part 5 with when from the initial position A to the working position B (and possibly back again) is switched. Are by applying appropriate Switching voltages electrostatic forces of attraction between the first Micro-element 1 (of course in the working position A) and the second micro-element 2 generates, the movable part 11 of the second micro-element 2 elastically deformed and approaches the electrode 9: It is from the switch-off position A 'is switched to the switch-on position B'. The shape of the Electrode 9, and in particular the shape of the first surface 3, is preferably shaped such that the first surface 3 and the second Touch surface 4 fully in the switch-on position. It means that there is a surface contact between the two surfaces 3,4, which does not mean that the two surfaces 3,4 touch completely have to. The first surface 3 is thus in the shape of the second surface 4 adjusted in the switch-on position. The two surfaces are 3.4 snuggled together in the on position B '. You can do such a thing Designate electrode 9 as a matched electrode 9. By the adapted Electrode 9 becomes the surface effective for the electrostatic forces maximizes and minimizes the effective distances. Consequently, already at small switching voltages are switched. For more details on the Embodiment of Fig. 3 is written to that in connection with Fig. 1 directed.

Fig. 4 shows a MEMS, which represents a micro-relay. The embodiment corresponds largely to that of FIG. 3. It also includes a (adapted) Electrode 9 and a cosinus formed bistable elastic switchable micro-element 1. In addition, the second micro-element 2, or more precisely: the movable part 11 of the second micro-element 2, a Contact area 16, which is electrically conductive. Preferably, the Contact area 16 in the region of that end of the movable part 11th of the second micro-element 2, which is not at the first fixed end 10 of the second micro-element 2 is adjacent. The contact region 16 forms a part of a side surface of the second micro-element 2 and is preferably formed as a coating by means of vapor deposition or Sputtering techniques is applied to the second micro-element 2.

Furthermore, the MEMS comprises two fixed on the substrate S, electrically conductive fixed contacts 17,18. The arrangement of the fixed contacts 17,18 and the contact region 16 is selected such that when concerns appropriate Switching voltages on the first micro-element 1 and the second micro-element 2 (ie in the switch-on position B 'of the second micro-element 2) the contact region 16 is an electrically conductive connection between the Fixed contact 17 and the fixed contact 18 generated. In the off state A 'is this is not the case. So there is an electrostatic micro-relay, through which by means of the switching voltages formed by the fixed contacts 17,18 Connection can be switched.

Very beneficial to this, but also to the embodiments discussed below is that the distance in the open state between the Contact area 16 of the second micro-element 2 and the fixed contacts 17,18 is selectable and manufacturing technology is very well reproducible.

The contact region 16 in FIG. 4 is on the side of the second microelement 2, which faces the first micro-element 1, So on the side that includes the surface 4. By attractive electrostatic forces between the first micro-element 1 and the second micro-element 2 is an electrical contact between the fixed contacts 17,18 feasible.

It is also possible (not shown) to arrange the fixed contacts 17,18, that they are in that region of the substrate S which is located on the the first micro-element 1 side facing away from the second micro-element 2 lies. The contact area 16 will then be corresponding to that Side of the movable part 11 of the second micro-element 2, which faces away from the first micro-element 1. Built like that the relay can be switched by means of repelling electrostatic forces. Of course it is also possible to use this micro-relay or the in Fig. 4 shown micro-relay without (matched) electrode 9 build (analogous to the structure in Fig. 1).

Fig. 5 shows an inventive micro-changeover relay. It contains all the features of such a MEMS, as related to Fig. 4 has been described. In addition, the MEMS includes but one more third micro-element 1 'and two further fixed contacts 17', 18 '; and the second micro-element 2 has a further electrically conductive contact area 16 ', which on one side of the movable part 11 of the second Micro-element 2 is arranged, which is opposite to the side which the Contact area 16 has. The third micro-element 1 'and the others Fixed contacts 17 ', 18' are with respect to the elongated movable Part 11 of the second micro-element 2 arranged in mirror image to the first micro-element 1 and the fixed contacts 17,18. Of course, the arrangement needs not exactly mirror image; it is enough if the third micro-element 1 'in a region of the substrate S connected to the substrate is, on the side facing away from the first micro-element 1 side of the second Micro-element (2) is located and the other fixed contacts 17 ', 18' in a range of the substrate S are connected to the substrate on the den Fix contacts 17,18 opposite side of the second micro-element 2 is located. The structure of the third micro-element 1 'corresponds to the structure of the first Micro-element 1. The other fixed contacts 17 ', 18' are similar designed as the fixed contacts 17,18.

The interaction between the third micro-element 1 'and the second micro-element (2) and the other fixed contacts (17 ', 18') corresponds the above-described interaction between the first micro-element 1 and the second micro-element 2 and the fixed contacts 17,18. When applying appropriate switching voltages to the third micro-element 1 ' and the second micro-element 2 may be an electrically conductive connection between the other fixed contacts 17 ', 18' through the further contact area 16 'are created. Thus, with this embodiment is a Three-position switch or a changeover relay that defined three States has: (1) contacts between both fixed contact pairs 17,18; 17 ', 18' open, (2.) contacts between the other fixed contacts 17 ', 18' open and Contacts between the fixed contacts 17,18 closed and (3.) contacts between the fixed contacts 17,18 open and contacts between the others Fixed contacts 17 ', 18' closed.

FIG. 6 shows a further MEMS according to the invention, which largely corresponds to the MEMS of FIG. 4. It contains the features of the MEMS Fig. 4, for which reference is made to the corresponding part of the description. However, the electrode 9 of the first micro-element 1 is special here educated. The electrode 9 has an (optionally stepped) recess on. The electrode 9 comprises a gap-forming surface 1 2, which with respect to the first surface 3 of the first micro-element 1 stepped is set back. You can this electrode 9 as a stepped Designate electrode 9. This MEMS will be attractive electrostatic Forces to switch from the switch-off position A 'to the switch-on position B' used. Is the first micro-element 1 in the working position B and the second micro-element 2 in the on position B ', so close the slit-forming surface 12 and the second micro-element 2, or more precisely: the movable part 11 of the second micro-element 2, a gap 13 a. Thereby, the size of a contact force, that of the second micro-element 2 is exerted on the fixed contacts 17,18, are selected. Especially This can be a very good, secure contact and a great Contact force can be reached. The choice of the geometry of the gap allows a Targeted anticipation and choice of contact power. In particular, can For this purpose, the length of the gap and the width of the gap (ie the Distance between the movable part 11 of the second micro-element 2 and the gap-forming surface 12) and optionally the course of the Width of the gap can be selected. Typically, the length of the gap by about one order of magnitude, preferably by about two orders of magnitude greater than the width of the gap. An advantageous (approximately) even wide gap selected, and the first surface 3 touches the second Surface 4 over the entire surface. The relative arrangement of the micro-elements 1,2 and the fixed contacts 17,18 on the substrate has to be done carefully.

Furthermore, such a MEMS has the advantage that any problems that may arise when switching from the switch-on position B 'to the switch-off position A', by a slow or poor detachment of the movable part 11th of the second micro-element 2 of the electrode 9 (that is, more precisely: of the first surface 3), for example due to surface effects can occur can be reduced. The (air) gap 13 allows a rapid detachment of the movable part 11 of the second micro-element 2 from the electrode 9 when switching from the on position B 'to the off position A ', while still in the on position B' large electrostatic Attractiveness between the first micro-element 1 and the second micro-element 2 act when the gap width accordingly was chosen low.

In Fig. 7, a further advantageous embodiment of the invention is shown. It largely corresponds to the embodiment shown in Fig. 6 and will be described starting therefrom. The movable part 11 of the second Micro-element 2 is specially designed here. He has a first area 14 and a second region 15, wherein the first region 14 less stiff, so easier deformable, is formed as the second region 15th And the first area is between the fixed first end 10 of the second Micro-element 2 and the second region 15 is arranged. The contact area 16 is advantageously arranged in the second region 15, in particular in the Area of the first area 15 opposite end of the second Area 16. Preferably, the second area 15 comprises at least those Area of the movable part 11, in which the movable part 11th and the second micro-element 2 do not face each other. Especially advantageous is a (slight) overlap of the second area 15 with the area of the movable part 11, in which the movable part 11 and the second Micro-element 2 face. In the embodiment shown in Fig. 7 with stepped electrode 9, the second region 15 comprises Advantageously, at least even that portion of the movable Part 11, in which the movable part 11 and the gap-forming surface 12 face each other. Is particularly advantageous in this case, if the second area 15 also a (small) overlap with the first Surface 3 has. Advantageously takes in the on state B 'a full-surface Contact between the first surface 3 and a part of the second Surface 4 instead, with this part of the second surface 4 completely lies in the first region 14.

The greater rigidity of the second region 15 with respect to the first region 14 is achieved in the embodiment of FIG. 7 in that the second region 15 is thicker or wider than the first region 14. It is also possible to make the second region 15 harder to bend make, for example, by applying a coating there; to the Example on a base of the straight prismatic body, the second region 15 forms, or on at least one of the side surfaces. through a corresponding (large, long) trained contact area, the As a coating is formed, this could be achieved.

By the two different stiff areas 14,15 is already at low Switching voltages and attractive forces between the two micro-elements 1.2 switching of the second micro-element 2 from the off position A 'in the on position B' allows; the mobile one Part 11 (more precisely: the first region 14) of the second micro-element 2 nestles, rolling, even at low attractions to the Electrode 9 on. This, while in the second area and preferably in the Contact area 16 no or only a small deformation of the second micro-element 2 is expected. A safe electrical contact can this way by means of the contact area 16 between the fixed contacts 17,18 are made.

The above features can of course also apply mutatis mutandis to the above and on the embodiments described below (FIGS. 1 to 6 and 8 to 11 b).

Fig. 8 shows a further advantageous embodiment of the invention, namely a changeover relay, which except a Normally Open connection (NO connection) additionally also a Normally Closed connection (NC connection). NO connection means that the connection is open when there is no appropriate switching voltage (opened without voltage), as in the above-mentioned embodiments (Fig. 4 to Fig. 7) is the case. NC connections, which are not required a suitable switching voltage are closed (dead closed), are, however, difficult to realize, and will be in this Embodiment realized. In particular, here is an NC port in realized by means of DRIE structured MEMS.

The MEMS in Fig. 8 is a mirror image and includes a first micro-element 1, a third micro-element 1 ', a fourth micro-element 19 and a fifth micro-element 20, all of which are bistable switchable and one Stable initial position A (solid line) and stable working position B (shown in dashed lines). They are here as such formed bistable micro-Elerriente, as described in connection with FIG. 1 are described in more detail (two parallel, cosinus-shaped, connected in their midst Spring tongues). The position in which these micro-elements using DRIE be structured, is the initial position A. The first micro-element 1 and the third micro-element 1 'correspond to each other largely in their Function. They only consist of a switching part 5. The fourth micro-element 19 and the fifth micro-element 20 also correspond to each other largely in their function. They each have a contacting electrode D, D '(for applying a signal to be switched, for example one electric current) and an electrically conductive contact electrode 21,22 on. The conductivity of the contact electrodes 21,22 is preferably by produces a metallic coating. The contact electrodes 21, 22 are elongated, finger-shaped and approximately in the middle 8 between the two Ends of the respective micro-element 19,20 on the respective micro-element 19,20 attached. Furthermore, the MEMS still has two with the Substrate S connected Fixelektroden 17,18 on (to create another electric current to be switched).

The MEMS in Fig. 8 further comprises a second micro-element 2. The second micro-element 2 is a monostable micro-element; it thus has only one stable position. It comprises a first fixed end 10 and a second fixed end 10 ', which ends 10, 10' on the substrate S are fixed, and one between these two fixed ends 10,10 ' arranged movable part 11. The movable part 11 is as one, preferably Vibration-shaped, curved structure formed at the the two fixed ends 10,10 'of the second micro-element 2 is attached and an electrically conductive contact region 16. The mobile one Part 11 further has a second surface 4, which is an optional one second coating 4b is formed, and which second surface 4 a first surface 3 of the first micro-element 1 faces is. The same applies to a fourth surface 4 'of the second micro-element 2 and a third surface 3 'of the third micro-element 1'.

The second surface 4 is between the first fixed end 10 and the Contact area 16 arranged. Analogously, the fourth surface 4 'is between the second fixed end 10 'and the contact region 16 are arranged. To the structuring of the second micro-element 2 is the movable Part 11 in the switch-off position A ', the stable position of the second Micro-element 2.

Due to the existence of the already mentioned minimum distance between two are DRIE generated micro-elements or surfaces the bistable micro-elements 1,1 ', 19,20 from the second micro-element 2 spaced with at least such a minimum distance. After application the optional non-conductive coatings 3b, 3b 'of the first or third micro-element 1,1 'and the optional electrically conductive Coatings of the contact electrodes 21, 22 are used in the context of inventive manufacturing method of the MEMS the bistable micro-elements 1,1 ', 19,20 switched from the initial position A in the working position B. This will change the distance between the micro elements or Surfaces smaller than said minimum distance; in Fig. 8 touch even the micro elements. In particular, both contact electrodes touch 21,22 the contact area 16. This is an electrically conductive Connection between the two contact electrodes 21,22 and thus the NC connection generated. In this way, a tensionless closed, but realized releasable contact. The surfaces 3,4 and the surfaces 3 ', 4' also touch each other. This can already be done by applying relatively low switching voltages between the second micro-element. 2 and the first micro-element 1 and between the second micro-element 2 and the third micro-element 1 'sufficiently large electrostatic Attractive forces between the second micro-element 2 and the Micro-elements 1,1 'are generated, which cause a switching of the second Micro-element 2 from the switch-off position A 'to the switch-on position B' to lead. In the switch-on position B ', the NC connection is now open, while the NO connection is closed. Due to its monostability switches the second micro-element 2 when not applying a suitable Switching voltage returns to the switch-off position by itself: NC connection closed, NO connection open.

• Es ist möglich, das MEMS nicht spiegelsymmetrisch aufzubauen.
• Man kann auf die Fixkontakte 17,18 verzichten und hat dann ein NC-Anschluss-Mikro-Relais.
• Man kann auf die Mikro-Elemente 19,20 verzichten und hat dann ein NO-Anschluss-Mikro-Relais.
• Wenn auf die Fixkontakte 17,18 oder auf die Mikro-Elemente 19,20 verzichtet wird, reicht es, wenn der Kontaktbereich 16 des zweiten Mikro-Elementes 2 nur auf einer Seite elektrisch leitfähig ist.
• Man kann die Mikro-Elemente 1,1' mit (angepassten, optional: gestuften) Elektroden 9 versehen (siehe Fig. 3 bis Fig. 7).
• Man kann die Kontaktierungselektroden 21,22 anders ausbilden; oder ganz auf sie verzichten und dann mittels des vorzugsweise elektrisch leitend beschichteten Schaltteils den Kontaktteil 16 des zweiten Mikro-Elementes 2 kontaktieren.
• Es ist möglich, die Mikro-Elemente 1,1' auf der anderen Seite des zweiten Mikro-Elementes 2 anzuordnen, also in dem Bereich des Substrates S, der auf der den Fixkontakten 17,18 abgewandten Seite des zweiten Mikro-Elementes 2 liegt. Dann ist das Mikro-Relais durch elektrostatische Abstossungskäfte schaltbar.
• Es ist auch möglich, das erste Mikro-Element 1 in einem anderen Bereich (des Substrates S, bezüglich des zweiten Mikro-Elementes 2) anzuordnen als das dritte Mikro-Element 1'.
• Man kann auf das dritte Mikro-Element 1' verzichten und nur das erste Mikro-Element 1 als elektrostatische Gegenelektrode zu dem zweiten Mikro-Element 2 als beweglicher Elektrode einsetzen.

Die genannten Merkmale können gemeinsam oder auch einzeln oder in beliebiger Kombination vorteilhaft sein.Numerous modifications of the embodiment of FIG. 8 are conceivable and advantageous: Here are some examples:

• It is possible to construct the MEMS not mirror-symmetric.
• You can do without the fixed contacts 17,18 and then has a NC connection micro-relay.
• One can dispense with the micro-elements 19,20 and then has a NO terminal micro-relay.
• If the fixed contacts 17, 18 or the micro-elements 19, 20 are omitted, it is sufficient if the contact region 16 of the second micro-element 2 is only electrically conductive on one side.
• The microelements 1, 1 'can be provided with (adapted, optionally stepped) electrodes 9 (see FIGS. 3 to 7).
• It is possible to form the contacting electrodes 21, 22 differently; or completely dispense with them and then contact the contact part 16 of the second micro-element 2 by means of the preferably electrically conductive coated switching part.
• It is possible to arrange the microelements 1, 1 'on the other side of the second microelement 2, that is to say in the region of the substrate S which lies on the side of the second microelement 2 facing away from the fixed contacts 17, 18. Then the micro-relay can be switched by electrostatic repulsive forces.
• It is also possible to arrange the first micro-element 1 in a different area (of the substrate S, with respect to the second micro-element 2) than the third micro-element 1 '.
• It is possible to dispense with the third micro-element 1 'and to use only the first micro-element 1 as electrostatic counterelectrode to the second micro-element 2 as a movable electrode.

The features mentioned may be advantageous together or individually or in any combination.

Fig. 9 shows a changeover relay, which except a Normally Open connection (NO connection) additionally also a Normally Closed connection (NC connection). The MEMS is very similar in construction that described in Fig. 8; for corresponding features is based on the above Text directed. However, the second micro-element 2 is not monostable here, but bistable executed. In particular, it has a structure with two parallel, cosinusoidal spring tongues connected in their middle, as described in detail in connection with FIG. 1. The two stable positions of the second micro-element 2 are the off position A 'and the switch-on position B'. A big advantage of the bistability of the second micro-element 2 is that there is no applied switching voltage required to the second micro-element 2 in the off position A 'or the Hold position B '. After applying a suitable switching voltage and the switching process thereby caused to the other state A ', B' remains the second micro-element 2 automatically in this state FROM'. This allows each of the two pairs of contacts to which one switching signal is applied (Fixelektroden 17,18 or micro-elements 19,20) should be a NO connection or an NC connection.

In addition, the MEMS in Fig. 9, two more bistable switchable micro-elements on: the sixth micro-element 23 and the seventh micro-element 24. These are also here with two parallel, cosinusoid, built in their middle connected spring tongues and each have one (adapted) electrode 9. They are arranged in the region of the substrate S, which is on the side of the second micro-element 2, the Is remote micro-elements 1,1 '. The micro-elements 23,24 act in analogous manner with the second micro-element 2 together as the micro-elements 1.1 '. For example, the second micro-element 2 has a sixth surface 26a and an eighth surface 26a ', which with a fifth Surface 25a (the sixth micro-element 23) or a seventh Surface 25a '(the seventh micro-element 24) cooperate. through electrostatic attraction forces between the second micro-element 2 and the sixth micro-element 23 (more precisely: between the corresponding ones Surfaces or surfaces) or the seventh micro-element 24 (more precisely: between the corresponding surfaces or surfaces) For example, the second micro-element 2 may be switched from the turn-on state B 'in FIG Off state A 'are switched.

• Es ist möglich, das MEMS nicht spiegelsymmetrisch aufzubauen.
• Man kann auf die Fixkontakte 17,18 verzichten.
• Man kann auf die Mikro-Elemente 19,20 verzichten.
• Wenn auf die Fixkontakte 17,18 oder auf die Mikro-Elemente 19,20 verzichtet wird, reicht es, wenn der Kontaktbereich 16 des zweiten Mikro-Elementes 2 nur auf einer Seite elektrisch leitfähig ist.
• Man kann die Mikro-Elemente 1,1' mit (angepassten, optional: gestuften) Elektroden 9 versehen (siehe Fig. 3 bis Fig. 7).
• Man kann die Mikro-Elemente 23,24 ohne angepasste Elektroden 9 einsetzen.
• Man kann die Kontaktierungselektroden der Mikro-Elemente 19,20 anders ausbilden; oder ganz auf sie verzichten und dann mittels des vorzugsweise elektrisch leitend beschichteten Schaltteils den Kontaktteil 16 des zweiten Mikro-Elementes 2 kontaktieren.
• Es ist möglich, das Mikro-Relais durch elektrostatische Abstossungskäfte zu schalten; oder es mittels elektrostatischer Abstossungskäfte und elektrostatischer Anziehungskäfte zu schalten.
• Man kann auf eines, zwei oder drei der Mikro-Elemente 1,1',23,24 verzichten; insbesondere auf die diagonal einander gegenüberleigenden Mikro-Elemente 1,24 oder die Mikro-Elemente 1',23.
• Wenn ein Schaltvorgang durch Zusammenwirken mindestens zweier Mikro-Elemente 1,1',23,24 mit dem zweiten Mikro-Element 2 erzeugt wird, ist es besonders vorteilhaft, wenn mindestens eine der entsprechenden Schaltspannungen mit einer zeitlicher Verzögerung relativ zu mindestens einer der anderen Schaltspannungen angelegt wird. Dadurch kann die Bewegung, welche der bewegliche Teil 11 des zweiten Mikro-Elementes 2 beim Schaltvorgang macht, unterstützt werden. Insbesondere kann der asymmetrischen Bewegung der zwei parallelen, kosinusförmig gekrümmten Federzungen des zweiten Mikro-Elementes 2 Rechnunng getragen werden. Es können auch entsprechend angepasste zeitliche Schaltspannungsprofile benutzt werden.
• Wenn statt eines kosinusförmigen bistabilen zweiten Mikro-Elementes 2 ein schwingungsbauchförmiges eingesetzt wird, werden vorteilhaft die Fixkontakte 17,18 oder das vierte und/oder fünfte Mikro-Element 19,20 derart angeordnet, dass mindestens einer von diesen für die Asymmetrische Ausbildung des Schwingungsbauches sorgt.

Die genannten Merkmale können gemeinsam oder auch einzeln oder in beliebiger Kombination vorteilhaft sein.Several advantageous modifications of this embodiment are conceivable:

• It is possible to construct the MEMS not mirror-symmetric.
• You can do without the fixed contacts 17,18.
• One can do without the micro-elements 19,20.
• If the fixed contacts 17, 18 or the micro-elements 19, 20 are omitted, it is sufficient if the contact region 16 of the second micro-element 2 is only electrically conductive on one side.
• The microelements 1, 1 'can be provided with (adapted, optionally stepped) electrodes 9 (see FIGS. 3 to 7).
• You can use the micro-elements 23,24 without matched electrodes 9.
• It is possible to form the contacting electrodes of the microelements 19, 20 differently; or completely dispense with them and then contact the contact part 16 of the second micro-element 2 by means of the preferably electrically conductive coated switching part.
• It is possible to switch the micro-relay by electrostatic repulsive juices; or to switch it by means of electrostatic repulsive forces and electrostatic attraction forces.
• One can do without one, two or three of the micro-elements 1,1 ', 23,24; in particular on the diagonally opposing micro-elements 1,24 or the micro-elements 1 ', 23rd
• When a switching operation is produced by interaction of at least two microelements 1, 1 ', 23, 24 with the second microelement 2, it is particularly advantageous if at least one of the corresponding switching voltages is delayed with respect to at least one of the other switching voltages is created. Thereby, the movement which the movable part 11 of the second micro-element 2 makes in the switching operation can be promoted. In particular, the asymmetrical movement of the two parallel, cosinusoidally curved spring tongues of the second microelement 2 can be borne. It is also possible to use correspondingly adapted temporal switching voltage profiles.
• If a schwingungsbauchförmiges is used instead of a cosinusoidal bistable second micro-element 2, the fixed contacts 17,18 or the fourth and / or fifth micro-element 19,20 are advantageously arranged such that at least one of these provides for the asymmetric formation of the antinode ,

The features mentioned may be advantageous together or individually or in any combination.

10a to 10c show a further advantageous embodiment of the Invention in different positions. This MEMS is about a micro-relay with an NC connector, which in general only difficult to realize. The MEMS is based on that shown in Fig. 4 Embodiment described as it is the same components having. Fig. 10a shows the MEMS in the state after structuring by means of DRIE: The first micro-element 1 is in the initial position A. Fig. 10b shows the MEMS in a state in which the first micro-element 1 is in the working position B, and the second micro-element 2 is in the off state A '. Fig. 10c shows the MEMS in a state in which the first micro-element 1 is in the working position B, and the second micro-element 2 in the On state B 'is located.

Unlike the embodiments discussed above, it is here so that the first micro-element 1 after switching from the initial position A in the working position B not just the second micro-element 2 comes closer than the given by DRIE minimum distance and the second micro-element 2 only (slightly) touched. Rather, here is the arrangement the micro-elements 1,2 on the substrate S and the embodiment of the Micro-elements 1,2 selected such that the first micro-element 1 in the Working position B a force on the movable part 11 of the second micro-element 2, which leads to a (significant) elastic deformation of the movable part 11 of the second micro-element 2 leads (see Fig. 1 0b). The movable part 11 of the second micro-element 2 is deformed in such a way that the electrically conductive contact region 16 of the second micro-element 2 the fixed contacts 17,18 conductively connects: The NC port is closed. It becomes a dead, but detachable contact realized; in a structured using DRIE MEMS. In other words: By switching the first micro-element 1 from the initial position A in the working position B is a switching operation of the second micro-element 2 caused. Since there is no switching voltage for it, is the second micro-element 2 after this switching operation in the Switch-off position A '. In order to reopen the NC connection, one must suitable switching voltage between the first micro-element 1 and the second micro-element 2 are created. By means of electrostatic attraction the NC port is opened, and the second micro element 2 goes into the on state B '(see Fig. 10c).

In combination with features mentioned above can be found on the Basis of the figures 10a-10c further advantageous embodiments be created. In particular, it is possible to dispense with the electrode 9. Or the electrode 9 can be formed differently. Especially can be advantageous to form the electrode 9 and the micro-elements Arrange 1.2 to each other such that the points of contact between the two micro-elements 1,2, (when the first micro-element 1 in the working position A and the second micro-element 2 in the off position A 'is) lie substantially on a straight line with the middle 8 in the initial position A and the middle 8 in the working position. This can be a achieved low mechanical stress of the first micro-element 1 be, while large contact forces on the fixed contacts 17,18 can be exercised (secure contacts).

It is also advantageous, in analogy to the embodiment shown in FIG. 5, a second pair of fixed contacts 17 ', 18' (not shown in Fig. 10) provide, these fixed contacts 17 ', 18' are to be arranged such that the contact region 16 of the second micro-element 2 these fixed contacts 17 ', 18' electrically conductively interconnects when the second micro-element 2 is in the switch-on position B '. So you get a changeover relay, similar to that of Fig. 5, but with only one bistable micro-element 1. Advantageously, also the movable part 11 of the second micro-element 2 are formed in two parts (analogous to the Embodiment of Fig. 7).

In the above, only laterally working MEMS were discussed. But it is also possible, the described MEMS (in a similar form) as to build horizontal working MEMS. The preparation then becomes typical not used DRIE, but it is more likely to others from the MEMS or semiconductor technology known methods, such as for example, in the already mentioned US Pat. Nos. 5,638,946, US 5,677,823 or DE 42 05 029 C1 be mentioned. The revelation These patents are therefore hereby incorporated into the present specification added.

11a and 11b show a possible embodiment in which the moving parts of the MEMS are substantially horizontally movable. Fig. 11a is a sectional side view of that shown in Fig. 11b in plan view MEMS. In Fig. 11b, with Xla-Xla, the line of the section is Fig. 11a shown. The MEMS is a micro-relay with an NC connection.

The first micro-element 1 is here as a schwabungsbauchförmiges bistable formed elastically switchable micro-element, analogous to that in Fig. 2nd shown in the first micro-Efement 1. In the initial position A is the symmetrical Vibration belly arched away from the substrate S. The second end 7 of the first micro-element 1 is formed here like a bridge. Thereby can be arranged below the antinode second micro-element 2 to outside the area between the first end 6 and second end 7 of the first micro-element 1 extend. The first solid End 10 of the second micro-element 2 serves as a stop for the Formation of the asymmetric antinode of the first microelement 1 in working position B.

The movable part 11 of the second micro-element 2 runs initially (after structuring) substantially parallel to the major surface of the Substrate S. After switching the first micro-element 1 from the initial position A in the working position B exerts the first micro-element 1 a Compressive force on the movable part 11 of the second micro-element 2 from. The second micro-element 2 is elastically deformed. It gets into his Off position A ', in softer one attached to the movable part 11 movable contact electrode E a fixed on the Sustrat S Fixelektrode 17 touched. This creates an NC connection between the moving Contact electrode E and the Fixelektrode 17. This generation of a NC connection is quite analogous to that in connection with the Fig. 10a to 10c described method.

Be suitable switching voltages between the two micro-elements 1.2 applied, the second micro-element 2 goes into the on state B 'over, in which the movable part 11 of the second micro-element 2 is bent away from the substrate and the NC port opened is. The contacting electrodes C, C 'serve to apply Switching voltages. For applying a signal to be switched serve contacting electrodes D, D 'The contacting electrode D, which is electrically is connected to the movable contact electrode E, here is on the first fixed end 10 of the second micro-element 2 is arranged. With the fixed contact 17 electrically connected contacting electrode D 'is on arranged the substrate S.

Other inventive MEMS, such as those described above MEMS can also be realized as horizontally operating MEMS.

An arrangement with a Fixelektrode 17 and a movable contact electrode E, as in Figs. 11a and 11b, is also advantageous in the above described MEMS, which with a contact region 16 and two Fixelektroden 17,18 are described, feasible.

Very advantageous in this embodiment of Fig. 11a, b is that the distance in the opened state between the movable contact electrode E. of the second micro-element 2 and the fixed contact 17 can be selected and manufacturing technology is very well reproducible. The same applies to the next Embodiments discussed above, provided that they are analogous to Fig. 11a, b with a movable contact electrode E performs.

A MEMS according to the invention is not only, as in the above examples, as Switch or relay executable. There are a variety of micro-actuators feasible. For example, inventive MEMS micro-valves or Represent or operate micro-pumps.

The substrate S used for producing a MEMS according to the invention is preferably formed fläching. It typically has one Main surface, which is structured to produce the MEMS, wherein the Movement of the moving parts of the MEMS substantially parallel or are movable perpendicular to this main surface. Preferably, this is Substrate S made of a semiconductor material, in particular silicon, which is advantageous monocrystalline and particularly advantageous (for a sufficient electrical Conductivity) is also doped. In monocrystalline silicon is under mechanical stress standing bistable switchable micro-elements 1,1 ', 2,19,20,23,24 advantageously no or only very slowly taking place Relaxation to be expected.

In particular, an SOI wafer (silicon-on-insulator) can be used, consisting of three substrate-parallel layers of silicon-silicon-silicon. there the silicon oxide layer serves as a sacrificial layer.

The mentioned structuring method is typically a material removal Method, preferably an etching method. The LIGA technique or in particular the reactive ion etching and particularly advantageous the ion etching (DRIE) come here in question. The DRIE method has the advantage very well suited to the production of areas that (relative to their subordinate vertical height) are closely spaced and practically perpendicular to the main surface of the substrate S run. For the production laterally working MEMS is good for DRIE. But also procedures, the material Apply are conceivable, for example, when so produced facing each other Surfaces due to the process have a minimum distance. For example using photopolymerization rapid prototyping method.

Except electrostatically actuated actuators according to the invention, for example Electromagnetically or piezoelectrically actuated actuators will be realized. The actuating forces can be repulsive or attractive be.

A bistable switchable micro-element according to the invention can also be tristable or otherwise multistable switchable. It is for some applications also not necessary that the micro-elements 1,1 ', 19,20,23,24 after the first switching from the initial position A to the working position B are also zurückschalbar in the initial position A are. One can also consider a one-time, for example plastic, deformation. However, the micro-elements 1,1 ', 19,20,23,24 are preferably bistable elastic switchable and switch back to the initial position A. Especially it is advantageous to the bistable micro-elements 1,1 ', 2,19,20,23,24 as the described cosinusoidal or as the described oscillation bulbous Forming micro-elements, these also being modified Form and combined within a MEMS are feasible.

Depending on the purpose, the micro-elements can optionally be electrically conductive or electrically non-conductive coated. A non-conductive coating Preferably, it serves to prevent discharges between each other touching electrostatic electrodes. For example, as an alternative or additional protection against such discharges may stopper or Springs are used, as they are already quoted from DE 198 00 189 A1 are known. The contacting electrodes C, C ', D, D' can be produced in a known manner (for example by sputtering) and for example contactable by bonding.

For the manufacturing process for the inventive MEMS is to be noted that the first switching of the first micro-element 1 and also the other bistable switchable micro-elements 1 ', 19,20,23,24 of the initial position A in the working position B as to the manufacturing process of the MEMS is considered. This initial switching process can be done mechanically. Preferably, this switching operation but in Frame of a quality or functional test (burn-in) of the MEMS, whereby other units connected to the substrate are also tested or initialized. The initial switching process can then preferably by creating an attractive force between the bistable Micro-element 1,1 ', 19,20,23,24 and the second micro-element 2 take place, this force advantageous by applying a switching chip he follows. Such a switching voltage is typically higher than one Switching voltage for switching the second micro-element 2 between OFF position A 'and ON position B' is used.

The features mentioned can be used together or individually or in any Combination be beneficial.

The linear expansion of the described MEMS is typically between 0.2 mm and 5 mm, preferably 0.8 mm to 2 mm. For DRIE as structuring method is the mentioned minimum distance (minimum trench width) about 5 μm to 15 μm; he has a low dependence on the Depth of the structured trench. Typically, the depth of the structured trench 300 microns to 550 microns. By switching from the initial position A in the working position B, the corresponding distance to typically reduced to zero or 0.1 μm to 1 μm. Layer thicknesses of the electric nonconductive coatings 3b, 3b ', 4b, 4b' are typically 50 nm to 500 nm

The switching voltages for the described MEMS (switching between switch-off position A 'and switch-on position B') are typically 10 V to 80 V, preferably 25 V to 50 V. When the first switching of the bistable Micro-elements from the initial position A to the working position electrostatic attractions, typically become Switching voltages between 70 V and 300 V, preferably between 100 V. and 200V used.

LIST OF REFERENCE NUMBERS

1

first micro-element

1'

third micro-element

2

second micro-element

3

first surface (of the first micro-element); the second surface facing

3a

first surface (of the first micro-element); facing the second surface

3b

first coating (the first surface)

3 '

third surface (of the third micro-element); the fourth surface facing

3a '

third surface (of the third micro-element); facing the fourth surface

3b '

third coating (the third surface)

4

second surface (of the second micro-element); the first Facing the surface

4a

second surface (of the second micro-element); the first surface facing

4b

second coating (the second surface)

4 '

fourth surface (of the second micro-element); the third surface facing

4a '

fourth surface (of the second micro-element); facing the third surface

4b '

fourth coating (the fourth surface)

5

Switching part of the first micro-element

6

first end of the first micro-element

7

second end of the first micro-element

8th

Middle between the first and second ends of the first micro-element

9

(adapted) electrode of the first micro-element

10

first fixed end of the second micro-element

10 '

second fixed end of the second micro-element

11

movable part of the second micro-element

12

slit-forming surface

13

gap

14

first region of the movable part of the second micro-element

15

second area of the movable part of the second micro-element

16.16 '

Contact area of the movable part of the second micro-element

17.18

Fixkontakte

17 ', 18'

Fixkontakte

19

fourth micro-element

20

fifth micro-element

21.22

contact electrode

23

sixth micro-element

24

seventh micro-element

25a

fifth surface (of the sixth micro-element); the sixth area facing

25a '

seventh surface (of the seventh micro-element); facing the eighth surface

26a

sixth surface (of the second micro-element); the fifth surface facing

26a '

eighth surface (of the second microelement); the fifth surface facing

A

initial position

B

working position

A '

Switch-off position (of the second micro-element)

B '

Switch-on position (of the second micro-element)

C, C '

contacting electrodes

D, D '

contacting electrodes

e

movable contacting electrode (of the second micro-element)

S

substratum

Claims (23)

1. Micro-electromechanical system, comprising a substrate (S) and a first micro-element (1) and a second micro-element (2),

   (a) the first micro-element (1) and the second micro-element (2) being connected to the substrate (S) and

   (b) the first micro-element (1) having a first face

   (3a) and the second micro-element (2) having a second face (4a), which faces (3a, 4a) are facing each other and are produced by a patterning process,

   characterized

   (c) in that the second micro-element (2) comprises a movable part (11),

   (d) in that the first micro-element (1) incorporates a switching part (5), by which it can be switched in a bistable manner between an initial position (A) and an operating position (B),

   (e) the distance between the first face (3a) and the second face (4a) in the operating position (B) of the first micro-element (1) being less than a minimum distance between the first face (3a) and the second face (4a) that can be produced by the patterning process.
2. Micro-electromechanical system according to Claim 1, characterized in that

   (a) the first micro-element (1) has a first surface (3), which is one and the same as the first face (3a) or, if the first face (3a) is provided with a first coating (3b), one and the same as the surface of this coating (3b), and

   (b) in that the second micro-element (2) has a second surface (4), which is one and the same as the second face (4a) or, if the second face (4a) is provided with a second coating (4b), is one and the same as the surface of this coating (4b).
3. Micro-electromechanical system according to Claim 2,

   (a) the second micro-element (2) having a first fixed end (10), which is firmly connected to the substrate (S), and a movable part (11),
   characterized

   (b) in that the first surface (3) and the second surface (4) are electrically non-conducting, and

   (c) in that, in the operating position (B), the first surface (3) and the second surface (4) have contact points, and

   (d) in that the second micro-element (2) can be switched from an off position (A') into an on position (B') by means of that, in the operating position (B) of the first micro-element (1), the movable part (11) of the second micro-element (2) can be moved by electrostatic forces between the first micro-element (1) and the second micro-element (2).
4. Micro-electromechanical system according to Claim 3, characterized

   (a) in that the first micro-element (1) comprises an electrode (9), which electrode (9) incorporates the first surface (3), and

   (b) in that the electrode (9) and the second micro-element (2) are formed in such a way that, in the on position (B') of the second micro-element (2), the first surface (3) and the second surface (4) are in full surface-area contact.
5. Micro-electromechanical system according to Claim 4, characterized in that the electrode (9) has a gap-forming surface (12), which is formed in such a way that it is set back in a step-like manner with respect to the first surface (3) and encloses a gap (13) with the second micro-element (2) when the first micro-element (1) is in the operating position (B) and the second micro-element (2) is in the on position (B').
6. Micro-electromechanical system according to one of Claims 3 to 5, characterized in that the movable part (11) of the second micro-element (2) has a first region (14) and a second region (15), the first region (14)

   being arranged between the second region (15) and the first fixed end (10) of the second micro-element (2),

   comprising a part of the second surface (4), and

   being formed in such a way that it is less rigid than the second region (15).
7. Micro-electromechanical system according to one of Claims 3 to 5, characterized

   (a) in that the micro-electromechanical system has two fixed contacts (17, 18), which are firmly connected to the substrate, and

   (b) in that the movable part (11) of the second micro-element (2) has an electrically conductive contact region (16),

   which contact region (16) is arranged in the region of an end of the second micro-element (2) lying opposite the first fixed end (10) of the second micro-element (2), and

   by which contact region (16) the two fixed contacts (17, 18) are connected to each other in a conducting manner in the on position (B') of the second micro-element (2).
8. Micro-electromechanical system according to Claim 7, characterized

   (a) in that the micro-electromechanical system comprises a third micro-element (1'),

   which can be switched in a bistable manner,

   which is connected to the substrate (S), and

   which is arranged in a region which lies on the side of the second micro-element (2) that is facing away from the first micro-element (1), and

   (b) in that the micro-electromechanical system has two further fixed contacts (17', 18'), which further fixed contacts (17', 18') are firmly connected to the substrate (S) and arranged in a region which lies on the side of the second micro-element (2) that is facing away from the fixed contacts (17, 18),

   (c) in that the movable part (11) of the second micro-element (2) has a further electrically conductive contact region (16'), which is arranged in the region of an end of the second micro-element (2) opposite from the first fixed end (10) of the second micro-element (2), on the side of the second micro-element (2) that is facing away from the contact region (16), and

   (d) the third micro-element (1') interacting with the second micro-element (2) and with the further fixed contacts (17', 18') in a way analogous to how the first micro-element (1) interacts with the second micro-element (2) and with the fixed contacts (17, 18).
9. Micro-electromechanical system according to Claims 6 and 7 or according to Claims 6 and 8, characterized in that the contact region (16) is arranged in the second region (15) of the movable part (11) of the second micro-element (2).
10. Micro-electromechanical system according to Claim 1, characterized

    (a) in that the micro-electromechanical system comprises a third micro-element (1'), which

    is connected to the substrate (S) and

    has a third face (3a'),

    (b) in that the second micro-element (2) incorporates a switching part, which has

    a first fixed end (10), which is firmly connected to the substrate (S),

    a second fixed end (10'), which is firmly connected to the substrate (S),

    a movable part (11), which is arranged between these two fixed ends (10, 10'), and

    a fourth face (4a'),

    and

    (c) by which switching part the second micro-element (2) can be switched between an off position (A') and an on position (B'),

    (d) the movable part (11) of the second micro-element (2) comprising an electrically conductive contact region (16),

    (e) the second face (4a) being arranged between the first fixed end (10) and the contact region (16), and

    (f) the fourth face (4a') being arranged between the second fixed end (10') and the contact region (16),

    (g) the third face (3a') and the fourth face (4a') being produced by the patterning process and facing each other, and

    (h) in that the third micro-element (1') incorporates a switching part, by which it can be switched in a bistable manner between an initial position (A) and an operating position (B), and

    (i) in that the distance between the third face (3a') and the fourth face (4a') in the operating position (B) of the third micro-element (1') is less than a minimum distance between the third face (3a') and the fourth face (4a') which can be produced by the patterning process.
11. Micro-electromechanical system according to Claim 10, characterized

    (a) in that the third micro-element (1') has a third surface (3'), which is one and the same as the third face (3a') or, if the third face (3a') is provided with a coating (3b'), is one and the same as the surface of this coating (3b'), and

    (b) in that the second micro-element (2) has a fourth surface (4'), which is one and the same as the fourth face (4a') or, if the fourth face (4a') is provided with a fourth coating (4b'), is one and the same as the surface of this coating (4b').
12. Micro-electromechanical system according to Claim 11, characterized

    (a) in that the micro-electromechanical system incorporates two fixed contacts (17, 18), which are firmly connected to the substrate (S),

    (b) in that, as a result, the second micro-element (2) can be switched from its off position (A') into its on position (B'), in that, in the operating position (B) of the first micro-element (1) and of the third micro-element (1'), the movable part (11) of the second micro-element (2) can be moved elastically by electrostatic forces between the first micro-element (1) and the second micro-element (2) and between the third micro-element (1') and the second micro-element (2), and

    (c) in that the two fixed contacts (17, 18) are connected to each other in a conducting manner by the contact region (16) in the on position (B') of the second micro-element (2).
13. Micro-electromechanical system according to Claim 12, characterized

    (a) in that the micro-electromechanical system comprises

    a fourth micro-element (19) and

    a fifth micro-element (20),

    (b) which micro-elements (19, 20)

    are connected to the substrate (S) in a region which lies on the side of the second micro-element (2) that is facing away from the fixed contacts (17, 18),

    incorporate switching parts by which they can be switched in a bistable manner between an initial position (A) and an operating position (B), and

    each have a contact electrode (21, 22), which is provided with an electrically conductive coating, and

    (c) in that, in the off position (A') of the second micro-element (2) in the operating position (B) of the fourth micro-element (19) and the fifth micro-element (20), the two contact electrodes (21, 22) are connected to each other in an electrically conducting manner by the contact region (16).
14. Micro-electromechanical system according to one of Claims 10 to 13, characterized in that the second micro-element (2) can be switched elastically in a bistable manner between its off position (A') and its on position (B').
15. Micro-electromechanical system according to Claim 14, characterized

    (a) in that the micro-electromechanical system comprises

    a sixth micro-element (23) and

    a seventh micro-element (24),

    (b) which micro-elements (23, 24)

    are connected to the substrate (S),

    are arranged on the side of the second micro-element (2) which is facing away from the second surface (4) and fourth surface (4'),

    incorporate switching parts by which they can be switched in a bistable manner between an initial position (A) and an operating position (B),

    (c) in that the sixth micro-element (23) has a fifth face (25a),

    (d) in that the second micro-element (2) comprises a sixth face (26a), which is arranged on the side of the second micro-element (2) that is facing away from the second surface (4) between the first fixed end (10) and the contact region (16),

    (e) the fifth face (25a) and the sixth face (26a) facing each other and being produced by the patterning process,

    (f) in that the seventh micro-element (24) has a seventh face (25a'),

    (g) in that the second micro-element (2) comprises an eighth face (26a'), which is arranged on the side of the second micro-element (2) that is facing away from the fourth surface (4') between the second fixed end (10') and the contact region (16),

    (h) the seventh face (25a') and the eighth face (26a') facing each other and being produced by the patterning process, and

    (i) in that the distance between the fifth face (25a) and the sixth face (26a) in the operating position (B) of the sixth micro-element (23) is less than a minimum distance between the fifth face (25a) and the sixth face (26a) which can be produced by the patterning process, and

    (j) in that the distance between the seventh face (25a') and the eighth face (26a') in the operating position (B) of the seventh micro-element (24) is less than a minimum distance between the seventh face (25a') and the eighth face (26a') which can be produced by the patterning process, and

    (k) in that, as a result, the second micro-element (2) can be switched from its on position (B') into its off position (A'), in that, in the operating position (B) of the sixth micro-element (23) and of the seventh micro-element (24), the movable part (11) of the second micro-element (2) can be moved elastically by electrostatic forces between the sixth micro-element (23) and the second micro-element (2) and between the seventh micro-element (24) and the second micro-element (2).
16. Micro-electromechanical system according to either of Claims 14 and 15,

    (a) the substrate (S) being formed as a two-dimensionally extending solid body with a main face, and

    (b) the micro-elements (1, 1', 2, 19, 20, 23, 24) being formed as right prismatic bodies, the bases of which are aligned parallel to the main face, characterized

    (c) in that the movable part (11) of the second micro-element (2)

    is formed as a right prismatic body and

    is laterally movable, and

    (d) in that the base of the right prismatic body forming the movable part (11)
    either

    has the form of a symmetrical antinode in the off position (A') and

    the form of an asymmetrical antinode in the on position (B'),

    or

    describes two parallel cosinusoidal lines which are joined to each other in the middle (8) between their two ends (6, 7).
17. Micro-electromechanical system according to one of Claims 1 to 16,

    (a) the substrate (S) being formed as a two-dimensionally extending solid body with a main face, and

    (b) the micro-elements (1, 1', 2, 19, 20, 23, 24) being formed as right prismatic bodies, the bases of which are aligned parallel to the main face, characterized

    (c) in that there is at least one micro-element (1, 1', 2, 19, 20, 23, 24) which can be switched in a bistable manner between an initial position (A) and an operating position (B) and the switching part of which incorporates

    a first fixed end, which is firmly connected to the substrate (S),

    a second fixed end, which is firmly connected to the substrate (S), and

    a movable part, which is arranged between these two fixed ends,

    (d) which movable part

    is formed as a right prismatic body and

    is laterally movable, and

    (e) in that the base of the right prismatic body forming the movable part
    either

    has the form of a symmetrical antinode in the off position (A') and

    the form of an asymmetrical antinode in the on position (B'),

    or

    describes two parallel cosinusoidal lines which are joined to each other in the middle between their two ends.
18. Micro-electromechanical system according to Claim 3, characterized in that
    the movable part (11) of the second micro-element (2) can be elastically deformed by switching the first micro-element (1) from the initial position (A) into the operating position (B).
19. Micro-electromechanical system according to Claim 18, characterized

    (a) in that the micro-electrvmechanical system has two fixed contacts (17, 18), which are firmly connected to the substrate, and

    (b) in that the movable part (11) of the second micro-element (2) has an electrically conductive contact region (16),

    which contact region (16) is arranged in the region of an end of the second micro-element (2) lying opposite the first fixed end (10) of the second micro-element (2), and

    by which contact region (16) the two fixed contacts (17, 18) are connected to each other in a conducting manner in the off position (A') of the second micro-element (2).
20. Micro-electromechanical system according to one of Claims 1 to 9 or 18 or 19,

    (a) the substrate (S) being formed as a two-dimensionally extending solid body with a main face, characterized

    (b) in that the switching part (5) of the first micro-element (1) is horizontally movable, and

    (c) in that the movable part (11) of the second micro-element (2) is horizontally movable.
21. A method for producing a micro-electromechanical system, in which method

    (a) a substrate (S) is used to produce a first micro-element (1), which is connected to the substrate, and

    (b) a substrate is used to produce a second micro-element (2), which is connected to the substrate, and

    (c) by using a patterning process, a first face (3a) of the first micro-element (1) and a second face (4a) of the second micro-element (2) is formed, which faces (3a, 4a) are facing each other and spaced apart from each other,
    characterized

    (d) in that the second micro-element (2) is formed in such a way that it comprises a movable part (11),

    (e) in that the first micro-element (1) is formed in such a way that

    it is located in an initial position (A),

    it can be switched in a bistable manner from the initial position (A) into an operating position (B),
    the distance of the first face (3a) from the second face (4a) in the operating position (B) being less than a minimum distance between the first face (3a) and the second face (4a) that can be produced by the patterning process, and

    (f) in that, after forming of the first face (3a) and the second face (4a) by the patterning process, the first micro-element (1) is switched into the operating position (B).
22. Production method according to Claim 21, characterized in that, before the switching over of the first micro-element (1) into the operating position (B), the first face (3a) of the first micro-element (1) is provided with a first electrically conducting or electrically non-conducting coating (3b),
    and/or
    the second face (4a) of the second micro-element (2) is provided with a second electrically conducting or electrically non-conducting coating (4b).
23. Production method according to either of Claims 21 and 22, characterized in that one of the micro-electromechanical systems according to one of Claims 1 to 20 is produced.

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