EP1448336A1 - Procede de fraisage par laser utilisant un algorithme de trajet d'outil constant - Google Patents

Procede de fraisage par laser utilisant un algorithme de trajet d'outil constant

Info

Publication number
EP1448336A1
EP1448336A1 EP02782385A EP02782385A EP1448336A1 EP 1448336 A1 EP1448336 A1 EP 1448336A1 EP 02782385 A EP02782385 A EP 02782385A EP 02782385 A EP02782385 A EP 02782385A EP 1448336 A1 EP1448336 A1 EP 1448336A1
Authority
EP
European Patent Office
Prior art keywords
tool path
laser
workpiece
operable
radius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02782385A
Other languages
German (de)
English (en)
Other versions
EP1448336A4 (fr
Inventor
Chen-Hsiung Cheng
Xinbing Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/266,934 external-priority patent/US6897405B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP1448336A1 publication Critical patent/EP1448336A1/fr
Publication of EP1448336A4 publication Critical patent/EP1448336A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Definitions

  • the present invention generally relates to material ablation with pulsed light sources and particularly relates to laser drilling and laser milling.
  • Ultrafast lasers generate intense laser pulses with durations from roughly 10 "11 seconds (10 picoseconds) to 10 "14 seconds (10 femtoseconds).
  • Short pulse lasers generate intense laser pulses with durations from roughly 10 "10 seconds (100 picoseconds) to 10 "11 seconds (10 picoseconds).
  • These lasers are also a useful tool for milling or drilling holes in a wide range of materials. Hole sizes as small as a few microns, even sub- microns, can readily be drilled. High aspect ratio holes can be drilled in hard materials, such as cooling channels in turbine blades, nozzles in ink-jet printers, or via holes in printed circuit boards.
  • micromachining One problem that persists in the field relates to avoiding manufacturing off-specification products with micromachining. This problem is persistent because, in micromachining, the tolerance for error is low and consistency is critical from product to product. For example, inkjet nozzle holes must be manufactured consistently to provide equal ink ejection from each hole when used. When a process is not consistent or repeatable, the manufacturing line produces off-specification products that result in wasted time and energy, mandatory rework, and reduced throughput. This in turn reduces profitability of a manufacturing facility. What is needed is a way to avoid manufacturing off-specification products with micromachining. Another persistent problem related to micromachining involves production of consistent, repeatable results in milling. As noted above, consistency and repeatability are important factors in producing technically acceptable, high quality micro-machined products. However, current methods of milling are not designed to ensure that the required hole geometry is consistent from item to item in the manufacturing line. What is needed is a way to produce consistent, repeatable results in milling.
  • a further persistent problem relating to micromachining involves providing guidelines for creating tool path geometry; in recent history, milling techniques that produce predictable and repeatable hole geometries have proven difficult to achieve.
  • Trial and error methods have been used to manufacture desired hole geometries: parameters are iteratively changed to reach the desired shape.
  • a typical procedure is to step through the desired tool path radius linearly over time; however, this technique introduces uneven pitches in the spiral path, which causes variations in the radial overlap. The uneven ablation that results is undesirable.
  • An algorithmic approach proves mildly successful, in that a desired shape is produced using a constant angular velocity and tool pitch. However, this process does not compensate for the spacing of exposure steps generated near the center of the hole as shown in Figure 1. What is needed is a way to provide guidelines for creating tool path geometry.
  • a still further persistent problem relating to micromachining involves providing a laser drilling system tool path allowing for constant material removal.
  • Current requirements for milling require total material ablation across the workpiece target area.
  • Past techniques include such methods as excimer laser ablation and a constant angular velocity approach, shown in Figure 1. However, these techniques do not provide the flat surface required by customer specifications. What is needed is a way to provide a laser drilling system tool path allowing for constant material removal.
  • a still further persistent problem relating to micromachining involves maintaining constant exposure of a laser source on a workpiece when the tool path is changing. In a constant pulse laser system, the laser is pulsed at a fixed repetition rate; therefore, the uniform ablation is translated into a required constant propagation speed of the laser strike point onto the workpiece.
  • the linear speed of the strike point should be constant throughout the laser milling process to maintain constant ablation. What is needed is a way to maintain constant exposure of a laser source on a workpiece when the tool path is changing.
  • the present invention is a method of creating a milled structure in a fixed material using a moving laser beam, where a picosecond laser provides short pulses of light energy to produce required exposure steps, where a variable rate of laser beam movement conducts the milling upon the material, where the laser beam tool path directs the milling process to produce a milled hole of high quality and repeatability, and where the knowledge of how to measure these 3 quantities is returned as feedback into the laser system.
  • the present invention is a spiral milled tool path structured to achieve the customer specified tapered hole shape.
  • the constant arc speed tool path is required to produce tapered holes to customer specification.
  • a rate of traversal of the laser beam with respect to the surface of the workpiece is more generally modified as a function of distance from at least one fixed axis (for example, an oval has two relevant axes).
  • Figure 1 is a block diagram of a constant angular velocity tool path
  • Figure 2 is a block diagram depicting a simplified schematic of a laser drilling system
  • Figure 3A is a block diagram of constant arc speed tool path corresponding to a round, inward spiral
  • Figure 3B is a block diagram of a constant arc speed tool path corresponding to a round, outward spiral;
  • Figure 4 is a flowchart diagram depicting a method of laser milling
  • Figure 5 is a perspective view showing major constituent components of an ink-jet printer
  • Figure 6 is a schematic cross-sectional view of an ink-jet head.
  • the present invention is a method of milling using a constant tool path algorithm (or alternatively, "milling algorithm") that can be used to produce holes in a consistent, repeatable process. Further, the process can be used to parallel-process a plurality of milled holes simultaneously.
  • a constant tool path algorithm or alternatively, "milling algorithm”
  • tool path 100 includes an initial voltage at the outer contour (V max ) 110, a plurality of laser exposure steps 120, and the spacing of tool pitch 130.
  • V max outer contour
  • a large number of exposure steps 120 are generated near the target center, which result in excessive ablation in this area.
  • approximately 10,000 laser exposure steps 120 are used to create the spiraling shape of tool path 100.
  • a simplified schematic of a laser drilling system 200 includes a laser 205, a beam 207, a shutter 210, an attenuator
  • a beam expander 220 uses a picosecond laser system
  • a spinning half-wave plate 225 uses a first mirror 208, a second mirror 217, a third mirror 221 , a fourth mirror 222, a piezo electric transducer (PZT) scan mirror 230, a diffractive optical element (DOE) 235, a plurality of sub-beams 237, a scan lens 240, a microfilter 245, an image transfer lens 250, and a workpiece 255, arranged as shown.
  • DOE diffractive optical element
  • the present invention uses a picosecond laser system
  • the present invention may be generalized for use with other laser systems, such as excimer, C0 2 , and copper vapor laser systems.
  • picosecond laser 205 emits beam 207 along the optical path identified in Figure 2.
  • Beam 207 propagates along the optical path, where it is incident upon first mirror 208.
  • First mirror 208 redirects beam 207 along the optical path, where it is incident upon shutter 210.
  • Shutter 210 opens and closes to selectively illuminate the work piece material.
  • Beam 207 exits shutter 210 and propagates along the optical path to attenuator 215.
  • Attenuator 215 filters the energy of picosecond laser 205 in order to precisely control ablation parameters
  • Beam 207 exits attenuator 215 and propagates along the optical path, where it is incident upon second mirror 217.
  • Second mirror 217 redirects beam 207 along the optical path, where it is incident upon beam expander 220.
  • Beam expander 220 increases the size of beam 207 to serve two purposes. First, it increases the beam size for the correct functioning of the DOE 235 as beam splitter. For the DOE 235 to function correctly, the beam size incident upon DOE 235 needs to be big enough to cover several periods of DOE 235. Second, it increases the beam size to match the scan lens pupil size. Beam 207 exits beam expander 220 and propagates along the optical path, where it is incident upon third mirror 221. Third mirror 221 redirects beam 207 along the optical path, where it is incident upon fourth mirror 222. Fourth mirror 222 redirects beam 207 along the optical path, where it is incident upon spinning half-wave plate 225. Spinning half-wave plate 225 changes the polarization of beam 207.
  • beam 207 Upon exiting spinning half- wave plate 225, beam 207 propagates along the optical path, where it is incident upon PZT scan mirror 230.
  • PZT scan mirror 230 moves in a pre- defined pattern using a milling algorithm (not shown) to drill the holes in workpiece 255.
  • PZT scan mirror 230 redirects beam 207 along the optical path, where it is incident upon DOE 235.
  • DOE 235 splits beam 207 into a plurality of sub-beams 237, which allow parallel drilling of workpiece 255.
  • Sub-beams 237 exit DOE 235 and propagate along the optical path, where they are incident upon scan lens 240.
  • Scan lens 240 determines the spot size of sub-beams 237 upon workpiece 255.
  • Sub-beams 237 exit scan lens 240 and propagate along the optical path, where they are incident upon microfilter 245.
  • Microfilter 245 equalizes the intensities of sub-beams 237.
  • Sub-beams 237 exit microfilter 245 and propagate along the optical path, where they are incident upon image transfer lens 250.
  • Image transfer lens 250 re-images the focal spots of sub- beams 237 onto workpiece 255.
  • Sub-beams 237 ablate workpiece 255 in a pattern according to the pre-defined milling algorithm.
  • a constant arc speed tool path 300A and includes an initial outer contour exposure voltage (Vm a x) 310, a plurality of exposure steps 320 having constant arc speed and spacing, and the spacing of tool pitch 330.
  • the desired tool path 300A in the present example, consists of many revolutions separated by a tool pitch 330, which can be constant or variable depending on the desired final shape. Utilizing this constant arc speed tool path provides a way to avoid manufacturing off- specification products and a way to produce repeatable results in milling.
  • V max 310 determines the outer radius of the spiral in tool path 300A.
  • Each revolution, as shown, has many discrete exposure steps 320, which are specified by the software algorithm described in step 430 of method 400 below.
  • the uniform ablation is translated into a constant propagation speed of PZT scan mirror 230 to direct the laser strike point onto exposure steps 320 of workpiece 255.
  • the constant arc speed tool path depicted in Figure 3A provides for a flat surface in workpiece 255 being ablated. Maintaining this flat surface in workpiece 255 provides a laser drilling system tool path allowing for constant material removal. This constant arc speed tool path also provides a way to provide a laser drilling system tool path allowing for constant material removal.
  • a method 400 of laser milling includes several steps.
  • an operator or technician provides a control system (not shown), such as a computer, that is capable of running an algorithm via a software program.
  • the control system is electronically connected to PZT scan mirror 230 to provide operational control signals for implementation of the algorithm.
  • the operator or technician uses customer-specified information, such as CAD files, and technical notes to determine the desired hole geometry, including taper angle, exit hole diameter, and entrance hole diameter.
  • the operator or technician determines the voltage, V ma ⁇ 310, by considering entrance hole diameter, laser spot size, and voltage response of PZT scan mirror 230.
  • the operator or technician also uses the spot size of laser 205 to determine the minimum allowable tool pitch 330 of tool path 300A. For example, if the spot size is 10 microns, tool pitch 330 should be a maximum of 10 microns to prevent under-ablated ridges from forming along outer walls of the radial contours. A pitch size around two microns works well with the 10-micron laser spot.
  • the operator or technician launches software code (not shown), which resides in the control system identified in step 410 above to calculate the radius and angular speed over the period of laser drilling, T, to manufacture the desired hole geometry.
  • software code (not shown), which resides in the control system identified in step 410 above to calculate the radius and angular speed over the period of laser drilling, T, to manufacture the desired hole geometry.
  • T the following formula, Formula (A), describes the radius "r" along tool path 300A at any given time "t" during the laser drilling:
  • the laser strike point is directed moving in an outward spiral tool path 300B determined by the following equations during T
  • control system transmits the results of the algorithm executed in step 430 to a tool path controller (not shown), such as a microprocessor, to initiate execution of the tool path and commence laser drilling.
  • a tool path controller such as a microprocessor
  • the controller identified in step 440 transmits voltages to
  • PZT scan mirror 230 over time that correspond to the digital output of the algorithm executed in step 430.
  • the voltages are applied to PZT scan mirror 230 to translate its position in accordance with the calculated tool path and desired hole geometry in workpiece 255.
  • laser drilling system 200 mills workpiece 255 per the tool path algorithm, in a pattern illustrated in Figure 3 above.
  • laser milling is performed using a layer-by-layer spiraling algorithm ("tool path"), thus, forming a tapered hole by decreasing V max 310 for successive spirals.
  • V max can be decreased in various ways between successive layers to achieve a desired contour in a finished workpiece.
  • the vertical cross section containing the axis of the hole determines how the V max (i) is progressed where i is the number of steps for reducing the V max .
  • a linear function of V max (i + 1 ) V max results in a constant taper with fixed taper angle.
  • Another function of V max (i + 1 ) V max (i) - ( ⁇ V max * i) makes the taper progressively steeper.
  • V max (i + 1) V max (i) - ( ⁇ Vmax / i) makes the taper angle less and less steep as radius is reduced.
  • the Vmax(i) needs to be determined by the cross section (or shape) specification.
  • the tool path algorithm identified in step 430 determines whether the desired hole geometry has been achieved. The hole geometry has been achieved when the tool path algorithm has completed the pre-calculated number of necessary spiral ablations. Conventional measuring techniques such as use of confocal microscopy and optical profilometry can also be used to determine if the desired hole geometry has been reached. If yes, method 400 ends; if no, method 400 returns to step 450.
  • a nozzle plate of an ink-jet head may be constructed with the laser drilling system of the present invention as further detailed below.
  • an ink-jet printer 500 has an ink-jet head 502 capable of recording on a recording medium 504 via a pressure generator. Ink droplets emitted from the ink-jet head 502 are deposited on the recording medium 504, such as a sheet of copy paper, so that recording can be performed on the recording medium 504.
  • the ink-jet head 502 is mounted on a carriage 506 capable of reciprocating movement along a carriage shaft 508. More specifically, the ink-jet head 502 is structured such that it can reciprocate in a primary scanning direction X in parallel with the carriage shaft 508.
  • the recording medium 504 is timely conveyed, by rollers 510 in a secondary scanning direction Y. The ink-jet head 502 and the recording medium 504 are relatively moved by the rollers 510.
  • a pressure generator 600 is preferably a piezoelectric system, a thermal system, and/or equivalent system.
  • the pressure generator 600 corresponds to a piezoelectric system which comprises an upper electrode 602, a piezoelectric element 604, and an under electrode 606.
  • a nozzle plate 608 comprises a nozzle substrate 610 and a water repellent layer 612.
  • the nozzle substrate 610 is made of metal, resin, and/or equivalent material.
  • the water repellant layer 612 is made, for example, of fluororesin or silicone resin.
  • the nozzle substrate 610 is made of stainless steel and has a thickness of 50 urn
  • the water repellent layer 612 is made of a fluororesin and has a thickness of 0.1 urn.
  • the ink-jet ink is filled in an ink supplying passage 614, a pressure chamber 616, an ink passage 618, and a nozzle 620. Ink droplets are ejected from the nozzle 620 as the pressure generator 600 pushes the pressure chamber element 620.
  • a first advantage of the present invention is that it avoids manufacturing off- specification products with micromachining.
  • a second advantage of the present invention is that it provides a way to produce consistent, repeatable results in milling.
  • a third advantage of the present invention is that it provides a system and guidelines for creating tool path geometry.
  • a fourth advantage of the present invention is that it maintains constant exposure of a laser source on a workpiece without active laser power control.
  • a fifth advantage of the present invention is that it provides constant material removal.
  • a sixth advantage of the present invention is that the spiraling milling effect provides a continuous, consistent, and seamless laser ablation of a workpiece.
  • a seventh advantage of the present invention is that the spiraling milling provides a way to machine micro features with cylindrical symmetry using laser ablation.
  • An eighth advantage of the present invention is that it provides uniform material removal with predictable ablation rate so that an arbitrary profile may be established.
  • the present invention also has some disadvantages.
  • One disadvantage of the present invention is that it is time intensive. However, any milling operation will require a similar amount of time to perform and thus is not a significant concern.
  • a second disadvantage of the present invention is that it provides an increase in operational speed at the expense of control. However, the alternative closed loop system that provides additional control is too slow for cost effective mass manufacturing environment.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Numerical Control (AREA)

Abstract

Procédé pour former une structure fraisée dans une matière fixe en utilisant un faisceau laser (207), dans lequel un laser picosecondes (205) émet des impulsions brèves d'énergie lumineuse pour atteindre les stades d'exposition requis, la vitesse variable de déplacement du faisceau laser (207) permettant le fraisage du matériau. Le mouvement du faisceau laser (207) guide le fraisage dans le matériau, à l'endroit où le trajet de l'outil laser guide le processus de fraisage et permet ainsi de former un trou fraisé de qualité et de répétabilité élevées, la connaissance des modalités de mesure de ces trois quantités étant retournée dans le système laser (200) sous forme de rétroaction.
EP02782385A 2001-11-30 2002-11-27 Procede de fraisage par laser utilisant un algorithme de trajet d'outil constant Withdrawn EP1448336A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US33474601P 2001-11-30 2001-11-30
US334746P 2001-11-30
US266934 2002-10-08
US10/266,934 US6897405B2 (en) 2001-11-30 2002-10-08 Method of laser milling using constant tool path algorithm
PCT/US2002/037962 WO2003047805A1 (fr) 2001-11-30 2002-11-27 Procede de fraisage par laser utilisant un algorithme de trajet d'outil constant

Publications (2)

Publication Number Publication Date
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Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
EP1993781A4 (fr) 2006-02-03 2016-11-09 Semiconductor Energy Lab Co Ltd Procédé de fabrication d'élément de mémoire, appareil d'irradiation laser, et procédé d'irradiation laser
JP5178022B2 (ja) * 2006-02-03 2013-04-10 株式会社半導体エネルギー研究所 記憶素子の作製方法
US8580700B2 (en) 2006-02-17 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7532378B2 (en) 2006-02-21 2009-05-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, method of laser irradiation, and method for manufacturing semiconductor device
JP4833773B2 (ja) * 2006-08-31 2011-12-07 本田技研工業株式会社 微細穴開け加工方法
JP5122833B2 (ja) * 2007-02-20 2013-01-16 ファナック株式会社 レーザ加工方法及びレーザ加工装置
US8481887B2 (en) * 2007-05-03 2013-07-09 Electro Scientific Industries, Inc. Method for machining tapered micro holes
EP2163339B1 (fr) * 2008-09-11 2016-11-02 Bystronic Laser AG Installation de coupe au laser destinée à couper une pièce usinée à l'aide d'un rayon laser à vitesse de coupe variable
CN101811229B (zh) * 2009-02-19 2013-12-25 株式会社日立高科技 激光加工方法、激光加工装置以及太阳能电池板制造方法
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
CN104439716A (zh) * 2014-11-17 2015-03-25 深圳锜宏伟科技有限公司 激光加工系统及激光加工方法
CN104985329B (zh) * 2015-06-16 2016-09-21 沈阳飞机工业（集团）有限公司 双曲率立体化铣零件激光刻型加工方法
CN111136389A (zh) * 2020-01-22 2020-05-12 苏州德龙激光股份有限公司 激光成像法切割pi网板的装置及其方法
CN113427137A (zh) * 2020-03-06 2021-09-24 大族激光科技产业集团股份有限公司 孔加工方法
CN111822887B (zh) * 2020-07-14 2022-04-26 深圳中科光子科技有限公司 一种激光打孔厚玻璃的加工系统及方法
WO2022149181A1 (fr) 2021-01-05 2022-07-14 コニカミノルタ株式会社 Plaque de buse de tête à jet d'encre, procédé de fabrication pour celle-ci, tête à jet d'encre et dispositif d'impression par jet d'encre
CN117733358B (zh) * 2024-01-04 2024-07-23 江苏富乐华半导体科技股份有限公司 一种覆铜板雕刻二维码的返工方法
CN118060708B (zh) * 2024-04-22 2024-08-27 深圳市圭华智能科技有限公司 一种电池激光加工设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1425340A (en) * 1972-08-25 1976-02-18 Europ Rotogravure Ass Method of engraving a printing member by means of a beam of energy
US4718418A (en) * 1983-11-17 1988-01-12 Lri L.P. Apparatus for ophthalmological surgery
EP0308512A1 (fr) * 1987-02-24 1989-03-29 Nippon Steel Corporation Appareil pour le matage de rouleaux par un faisceau laser a impulsions
US5237148A (en) * 1990-10-04 1993-08-17 Brother Kogyo Kabushiki Device for manufacturing a nozzle and its manufacturing method
US5798927A (en) * 1995-03-20 1998-08-25 Electro Scientific Industries, Inc. Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system
US6231566B1 (en) * 1998-08-12 2001-05-15 Katana Research, Inc. Method for scanning a pulsed laser beam for surface ablation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2829851A1 (de) * 1978-07-07 1980-01-24 Precitec Gmbh Anordnung zur messung des abstands zwischen einem metallischen werkstueck und einem bearbeitungswerkzeug
US4270421A (en) * 1979-03-22 1981-06-02 The United States Of America As Represented By The United States Department Of Energy Apparatus for correcting precision errors in slide straightness in machine tools
US4754208A (en) * 1986-11-17 1988-06-28 Nippon Kokan Kabushiki Kaisha Circular path control apparatus and method for multi-axis servomechanisms
JPH11281814A (ja) * 1998-03-30 1999-10-15 Sekisui Chem Co Ltd カラーフィルタの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1425340A (en) * 1972-08-25 1976-02-18 Europ Rotogravure Ass Method of engraving a printing member by means of a beam of energy
US4718418A (en) * 1983-11-17 1988-01-12 Lri L.P. Apparatus for ophthalmological surgery
EP0308512A1 (fr) * 1987-02-24 1989-03-29 Nippon Steel Corporation Appareil pour le matage de rouleaux par un faisceau laser a impulsions
US5237148A (en) * 1990-10-04 1993-08-17 Brother Kogyo Kabushiki Device for manufacturing a nozzle and its manufacturing method
US5798927A (en) * 1995-03-20 1998-08-25 Electro Scientific Industries, Inc. Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system
US6231566B1 (en) * 1998-08-12 2001-05-15 Katana Research, Inc. Method for scanning a pulsed laser beam for surface ablation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO03047805A1 *

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CN1596172A (zh) 2005-03-16
AU2002348254A1 (en) 2003-06-17
EP1448336A4 (fr) 2006-03-15
JP2005511312A (ja) 2005-04-28
CN1295052C (zh) 2007-01-17

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