EP1445040A1 - Procédé d'enlèvement d'au moins une couche cassante d'un substrat - Google Patents

Procédé d'enlèvement d'au moins une couche cassante d'un substrat Download PDF

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Publication number
EP1445040A1
EP1445040A1 EP03000755A EP03000755A EP1445040A1 EP 1445040 A1 EP1445040 A1 EP 1445040A1 EP 03000755 A EP03000755 A EP 03000755A EP 03000755 A EP03000755 A EP 03000755A EP 1445040 A1 EP1445040 A1 EP 1445040A1
Authority
EP
European Patent Office
Prior art keywords
layer
substrate
brittle
temperature
room temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03000755A
Other languages
German (de)
English (en)
Inventor
Beate Heimberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to EP03000755A priority Critical patent/EP1445040A1/fr
Publication of EP1445040A1 publication Critical patent/EP1445040A1/fr
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes

Definitions

  • the invention relates to a method for removal at least a brittle layer of a substrate according to claim 1.
  • a layer system consists of a substrate and at least a layer which is arranged on the substrate.
  • the object is achieved by a method according to claim 1.
  • Figure 1 shows a layer system in a first step of inventive method.
  • the layer system 1 consists of a substrate 4 and at least a layer 7 which is arranged on the substrate 4, and is used, for example, for gas turbine parts (blades).
  • the substrate 4 can be a ceramic or a metal, in particular a cobalt or nickel based superalloy.
  • the layer 7 can also be made of a metallic or ceramic Be formed material, but the metallic Layer due to corrosion or oxidation, for example has become brittle so that it exhibits brittle fracture behavior.
  • Figure 2 shows the layer system in a further process step.
  • the layer system has been brought to a temperature much higher than the room temperature (T »RT).
  • T »RT room temperature
  • the temperature difference is at least 200K, but preferably about 500K.
  • layer systems which have just been produced and are still warm, the layers of which have been incorrectly produced and are obviously not usable, do not have to be cooled down at all (FIG. 1) in order to achieve this process state.
  • the heating step is therefore completely omitted or less.
  • FIG. 3 shows the layer system 1 in a further process step.
  • the layer system 1 has been cooled very quickly to room temperature after the temperature which is very much above room temperature has been reached.
  • the at least one layer 7 at least partially flakes off the substrate 4 due to the greatly different thermal expansions of the substrate 4 and the layer 7. It is even possible for the layer 7 to crumble into many individual parts.
  • Air cooling, compressed air or dry ice blasting can be used for cooling.
  • the layer system 1 can be highly heated by thermal shocks and be cooled to room temperature, however it is also possible, the layer system only moderately above room temperature to heat and then to a temperature well below the room temperature, for example in liquid nitrogen (77K) cool down.
  • 77K liquid nitrogen
  • FIG. 4 shows a further component in the form of a layer system 1 which has been treated with the method according to the invention.
  • the layer system 1 consisted of a substrate 4 and two layers 7, 10.
  • the substrate 4 consists, for example, of a nickel- or cobalt-based superalloy with a metallic MCrAlY layer, where M stands for element from the group iron, cobalt or nickel.
  • An aluminum oxide layer 7, for example, has grown on the MCrAlY layer as part of the substrate 4.
  • a ceramic thermal insulation layer 10 is applied to this layer 7. During the operational use of the layer system 1, the aluminum oxide layer 7 grows and also ages, so that there are microcracks and pores within the aluminum oxide layer 7. As a result, the adhesion of the ceramic thermal barrier coating 10 to the substrate is reduced.
  • the substrate 4 is not damaged in this method and can be re-coated with a ceramic thermal barrier coating become.
  • Figure 5 shows schematically why it is in the implementation of the inventive method for a separation between the Layer 7 and the substrate 4 comes.
  • Layer 7 faces due to its growth and aging Micro cracks and larger cracks and is or has been therefore brittle.
  • this layer In order to remove a layer with the method according to the invention To be able to, this layer must be in thermal shock Have brittle fracture behavior. Even if layer 7, the should be removed, not brittle behavior from the outset shows, it can often be done in a pretreatment Sandblasting or aging at sufficiently high temperatures or transformed into a brittle material in an aggressive environment to be successful in the process of the invention to be able to perform.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating By Spraying Or Casting (AREA)
EP03000755A 2003-01-13 2003-01-13 Procédé d'enlèvement d'au moins une couche cassante d'un substrat Withdrawn EP1445040A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP03000755A EP1445040A1 (fr) 2003-01-13 2003-01-13 Procédé d'enlèvement d'au moins une couche cassante d'un substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03000755A EP1445040A1 (fr) 2003-01-13 2003-01-13 Procédé d'enlèvement d'au moins une couche cassante d'un substrat

Publications (1)

Publication Number Publication Date
EP1445040A1 true EP1445040A1 (fr) 2004-08-11

Family

ID=32605231

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03000755A Withdrawn EP1445040A1 (fr) 2003-01-13 2003-01-13 Procédé d'enlèvement d'au moins une couche cassante d'un substrat

Country Status (1)

Country Link
EP (1) EP1445040A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2110517A1 (fr) * 2008-04-15 2009-10-21 Siemens Aktiengesellschaft Procédé destiné à éliminer les dépôts de composants haute température et un dispositif
EP2716788A1 (fr) * 2012-10-08 2014-04-09 Siemens Aktiengesellschaft Procédé destiné à supprimer une couche métallique sur un substrat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2377017A1 (fr) * 1977-01-07 1978-08-04 Murre Jean Pierre Procedes de nettoyage des faces externes des parois d'echange thermique
US4705574A (en) * 1985-02-04 1987-11-10 Mg Industries, Inc. Debonding process for removing non-metallic coatings from metal hangers
EP0628358A1 (fr) * 1993-06-08 1994-12-14 Entreprise Gagneraud Pere Et Fils Procédé et dispositif de décapage de matériaux solides thermorésistants
US5614054A (en) * 1994-12-22 1997-03-25 General Electric Company Process for removing a thermal barrier coating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2377017A1 (fr) * 1977-01-07 1978-08-04 Murre Jean Pierre Procedes de nettoyage des faces externes des parois d'echange thermique
US4705574A (en) * 1985-02-04 1987-11-10 Mg Industries, Inc. Debonding process for removing non-metallic coatings from metal hangers
EP0628358A1 (fr) * 1993-06-08 1994-12-14 Entreprise Gagneraud Pere Et Fils Procédé et dispositif de décapage de matériaux solides thermorésistants
US5614054A (en) * 1994-12-22 1997-03-25 General Electric Company Process for removing a thermal barrier coating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2110517A1 (fr) * 2008-04-15 2009-10-21 Siemens Aktiengesellschaft Procédé destiné à éliminer les dépôts de composants haute température et un dispositif
EP2716788A1 (fr) * 2012-10-08 2014-04-09 Siemens Aktiengesellschaft Procédé destiné à supprimer une couche métallique sur un substrat

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