EP1317163B1 - Appareil auditif - Google Patents

Appareil auditif Download PDF

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Publication number
EP1317163B1
EP1317163B1 EP02023515A EP02023515A EP1317163B1 EP 1317163 B1 EP1317163 B1 EP 1317163B1 EP 02023515 A EP02023515 A EP 02023515A EP 02023515 A EP02023515 A EP 02023515A EP 1317163 B1 EP1317163 B1 EP 1317163B1
Authority
EP
European Patent Office
Prior art keywords
integrated
housing
hearing device
contacts
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP02023515A
Other languages
German (de)
English (en)
Other versions
EP1317163A3 (fr
EP1317163A2 (fr
Inventor
Richard Niccolai
Paul Portmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sonova Holding AG
Original Assignee
Phonak AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phonak AG filed Critical Phonak AG
Priority to DK02023515.6T priority Critical patent/DK1317163T3/da
Priority to EP02023515A priority patent/EP1317163B1/fr
Publication of EP1317163A2 publication Critical patent/EP1317163A2/fr
Publication of EP1317163A3 publication Critical patent/EP1317163A3/fr
Application granted granted Critical
Publication of EP1317163B1 publication Critical patent/EP1317163B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/021—Behind the ear [BTE] hearing aids
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/025—In the ear hearing aids [ITE] hearing aids
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/77—Design aspects, e.g. CAD, of hearing aid tips, moulds or housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/602—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of batteries
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/65—Housing parts, e.g. shells, tips or moulds, or their manufacture
    • H04R25/652—Ear tips; Ear moulds

Definitions

  • the invention relates to a hearing aid according to the preamble of claim 1.
  • Known hearing aids have a plurality of components housed in a multi-part plastic device housing, namely generally a microphone, an amplifier circuit, a receiver and a power source. These components are connected to each other via electrical connections, which must be mounted in the rule after the production of the device housing in this. In certain components, their electronic components are mounted on a separate substrate and electrically communicate with each other via traces provided on the substrate. The production and assembly of the substrates takes place in a separate process. The production of such hearing aids is therefore associated with a relatively large effort.
  • the present invention is now based on the object to provide a hearing aid of the type mentioned, which has a smaller size and can be produced more cheaply than the conventional hearing aids.
  • FIGS. 1 and 2 is shown on an enlarged scale a hearing aid 1, which is worn in the ear (in-ear hearing aid).
  • the hearing device 1 has a device housing 2 made of plastic, which consists of a shell 3, the outer shape of which is adapted to the auditory canal of the wearer, and a cover part 4 placed on the shell 3.
  • a handset 5 In the interior of the shell 3, different, designed as units hearing aid components are housed, namely a handset 5 and a microphone assembly 6.
  • the handset 5 includes electronic components of a known amplifier and transmission circuit and has a sound channel 7, which leads to a sound outlet 8 in the shell 3 leads.
  • the microphone assembly 6, whose construction is based on the Fig. 3 will be explained in more detail is used in the lid part 4.
  • the shell 3 is formed as a molded part with integrated strip conductors, ie as a spatially injection-molded circuit carrier.
  • integrated strip conductors ie as a spatially injection-molded circuit carrier.
  • Such circuit carriers whose production is known per se (see, for example, the WO-A-00/67982 ), are referred to in technical language with Molded Interconnect Devices (MID).
  • MID Molded Interconnect Devices
  • Fig. 1 and 2 From these integrated tracks only the tracks 9 and 10 are visible.
  • Both the receiver module 5 and the microphone assembly 6 have protruding spring contacts 11 and 12, which with the conductor tracks 9, 10 of the shell. 3 in contact ( Fig. 1 ).
  • the units 5, 6 are thus electrically connected to one another via the spring contacts 11, 12 and the conductor tracks 9, 10.
  • the microphone assembly 6 has a multi-part housing 13 made of plastic, which consists of a receiving part 14, a down this closing housing bottom 15 and a housing cover 16.
  • the housing bottom 15 is screwed by means of screws 17 with the receiving part 14, to which the housing cover 16 is fastened by means of a hinge 18.
  • the housing cover 16 is provided with a locking cam 19 which cooperates with the housing cover 16 closed with a locking recess 20 in the receiving part 14.
  • the housing bottom 15 is likewise designed as a molded part with integrated interconnects 21 forming a conductor pattern structure, ie as a spatially injection-molded circuit carrier (Molded Interconnect Device, MID).
  • the housing bottom 15 is equipped with only schematically illustrated microphones 22 and 23 and also shown only schematically, unspecified electronic components 24, 25, 26.
  • the microphones 22, 23 and the electronic components 24, 25, 26 are interconnected via the conductor tracks 21.
  • the housing bottom 15 thus serves not only as a lower termination of the receiving part 14 of the housing 13, but also as a carrier for the microphones 22, 23, the electronic components 24, 25, 26 and the conductor tracks 21st
  • the housing cover 16 is also a molded part with an integrated conductor 27, i. So also an MID, but carries in contrast to the housing bottom 15 no electronic components.
  • the conductor track 27 is designed as a contact surface which is in contact with the housing cover 16 closed with a housed in the receiving part 14 battery 28, which serves to power the hearing aid components.
  • the microphone assembly 6 described is smaller, has less Components on and can be made easier.
  • the Fig. 4 and 5 show in exploded view views of a hearing aid 30 worn behind the ear (behind-the-ear hearing aid) from two different directions.
  • the hearing aid 30 has a device housing 31 made of plastic, which consists of a housing bottom 32 and a housing cover 33 which are interconnected by means of screws 34.
  • various housing units designed as hearing aid components are housed, namely a handset unit 35, a microphone unit 36 and a different electronic components having amplifier module 37.
  • To the amplifier module 37 is pivotally mounted a battery compartment 38 which serves to accommodate a battery 39.
  • the housing bottom 32 is embodied as a molded part with integrated conductor tracks 40 and integrated contacts 41, 42, 43, 44, which are grouped into groups, ie as a spatially injection-molded circuit carrier (Molded Interconnect Device, MID).
  • the tracks 40 connect certain of the contacts 41, 42, 43, 44 with each other.
  • electronic components 45 and 46 are soldered, which are also connected via certain interconnects 40 with contacts 41, 42 and 43 or 41 and 44. These electronic components 45, 46, instead of being soldered onto the housing bottom 32, could also be integrated into the receiver module 35, the microphone module 36 and / or the amplifier module 37.
  • the housing bottom 32 is provided with further integrated, grouped into a group 47 contacts, which are integrated via integrated tracks 48 with programming contacts 49, which are the same as the other contacts 41, 42, 43, 44, 47 also produced moderately in the housing bottom 32 in Connection stand.
  • the programming contacts 49 are used for connecting a non-illustrated, known per se programming device, of which in the Fig. 4 only the plug 50 is shown.
  • the handset unit 35, the microphone assembly 36 and the amplifier assembly 37 are provided with grouped spring contacts 51, 52 and 53, 54, 55 ( Fig. 5 ).
  • the spring contacts 52 of the microphone assembly 36 contact the contacts 41 in the housing bottom 32 and the spring contacts 51 of the receiver module 35, the contacts 42 in the housing bottom 32, while the spring contacts 53 of the amplifier module 37 with the contacts 47 in Housing bottom 32, the spring contacts 54 with the contacts 43 and the spring contacts 55 with the contacts 44 are in communication.
  • the amplifier module 37 is thus connected on the one hand via the contacts 47 in the housing bottom 32 with the programming contacts 49 and on the other hand via the contacts 42 and 43 and the contacts 41 and 44 and the tracks 40 with the receiver module 35 and the microphone assembly 36
  • FIG. 4 illustrates parts of the housing of the handset assembly 35, the microphone assembly 36, and the repeater assembly 37 as moldings with integrated circuit structure (Molded Interconnect Devices; MID).
  • connection between the units 5, 6 or 35, 36, 37 and the integrated conductor tracks 9, 10 or the integrated contacts 41, 41, 43, 44 can also in other ways than by means of the spring contacts 11, 12 and 51, respectively , 52, 53, 54, 55 are made, for example by means of conductor strands.
  • the device housing 2, 31 forming components, namely the shell 3 and the cover part 4 of the device housing 2 and the housing bottom 32 and the housing cover 33 of the device housing 31 may be formed so that when assembling these components the latter form-fitting or non-positively mechanically get connected.
  • the latter form-fitting or non-positively mechanically get connected.
  • Latching or snap connections e.g. Latching or snap connections.
  • MID Molded Interconnect Devices

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)

Claims (14)

  1. Appareil auditif comprenant un boîtier (2 ; 31) en plastique de l'appareil comprenant au moins deux parties (3, 4 ; 32, 33) et des assemblages électroniques (5, 6 ; 35, 36, 37) ou composants électroniques (22-26) en connexion électronique mutuel situés dans le boîtier (2 ; 31) de l'appareil, caractérisé en ce qu'au moins une pièce du boîtier (3 ; 32) et/ou au moins un composant plastique (15) d'un assemblage électronique disposé dans l'intérieur du boîtier (2) de l'appareil est formé comme pièce moulée avec des pistes conductrices (9, 10 ;21 ;40) y intégrées, par lesquelles certains assemblages ou composants électroniques sont mutuellement connectées.
  2. Appareil auditif selon la revendication 1, caractérisé en ce que la pièce moulée est en outre formée avec des pistes conductrices (41-44 ; 47, 49) y intégrées.
  3. Appareil auditif selon la revendication 1 ou 2, caractérisé en ce que les assemblages électroniques (5, 6 ; 35, 36, 37) disposés dans le boîtier (2 ;31) de l'appareil sont prévus avec des éléments de contact (11, 12 ; 51, 52, 53, 54, 55) qui sont en contact avec les pistes conductrices (9, 10) y intégrées ou avec les contacts (41, 42, 43, 44) intégrés dans une pièce (3 ; 32) du boîtier de l'appareil.
  4. Appareil auditif selon la revendication 3, caractérisé en ce que les éléments de contact sont formés comme contacts à ressort (11, 12; 51, 52, 53, 54, 55).
  5. Appareil auditif selon la revendication 1, caractérisé en ce que l'un des assemblages électroniques (6) disposés dans le boîtier (2) de l'appareil comprend un boîtier (13) en plastique formé d'au moins deux pièces (14, 15, 16) dans lequel des composants électroniques (22-26) sont agencés, et en ce qu'au moins une partie desdites composants électroniques (22-26) sont attachés à une partie de boîtier (15) formé comme pièce moulée avec des pistes conductrices intégrées (21), dans lequel les composants électroniques (22-26) attachés à cette partie (15) de boîtier sont connectés mutuellement par ces pistes conductrices (21).
  6. Appareil auditif selon la revendication 5, caractérisé en ce que la partie du boîtier servant de fond de boîtier (15) est formée comme partie moulée avec pistes conductrices (21) y intégrées.
  7. Appareil auditif selon la revendication 5 ou 6, caractérisé en ce qu'une partie de boîtier supplémentaire (16), préférablement la partie servant de couvercle de boîtier (16), est formée comme partie moulée ayant une piste conductrice (27) y intégrée servant de surface de contact.
  8. Appareil auditif selon les revendications 1 et 2, caractérisé en ce que les contacts intégrés (41-44 ; 47, 49) sont mutuellement connectés par des pistes conductrices intégrées (49, 48).
  9. Appareil auditif selon l'une des revendications 1 à 3, caractérisé en ce que des composants électroniques (45, 46) sont attachés à la partie du boîtier (32), qui est formée comme pièce moulée avec des pistes conductrices (40) y intégrées, et également, le cas échéant, avec des contacts intégrés (41, 42, 43, 44), ces composants électroniques (45, 46) étant en connexion électrique via les pistes conductrices (40) intégrées avec des autres composants électroniques et/ou le cas échéant avec des contacts intégrés (41, 42, 43, 44).
  10. Appareil auditif selon la revendication 8, caractérisé en ce que certains des contacts intégrés (49) sont accessibles de l'extérieur du boîtier (31) de l'appareil et sont connectés par des pistes conductrices intégrées (48) avec des éléments de contact, préférablement des contacts intégrés (47), agencés dans l'intérieur du boîtier (31) de l'appareil.
  11. Appareil auditif selon l'une des revendications 1 à 10, caractérisé en ce que les pièces (3, 4 ; 32, 33) du boîtier de l'appareil (2 ; 31) sont mutuellement connectés par moyens d'un verrouillage à force ou à forme, par exemple une liaison par encliquetage ou par clipsage.
  12. Appareil auditif selon l'une des revendications 1 à 11, caractérisé en ce que les pièces moulées (3 ; 15, 16 ; 32) avec des pistes conductrices y intégrées (9, 10 ; 21 ; 27 ; 40) sont formées comme des Moulded Interconnect Devices.
  13. Appareil auditif selon l'une des revendications 1 à 11, caractérisé en ce que les pièces moulées (3 ; 15, 16 ; 32) avec des pistes conductrices y intégrées (9, 10 ; 21 ; 27 ; 40) sont formées par prototypage rapide.
  14. Appareil auditif selon la revendication 13, caractérisé en ce que les pièces moulées (3 ; 15, 16 ; 32) avec des pistes conductrices y intégrées (9, 10 ; 21 ; 27 ; 40) sont formées par frittage à laser, stéréolithographie, ou un procédé de thermojet.
EP02023515A 2002-10-22 2002-10-22 Appareil auditif Expired - Lifetime EP1317163B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DK02023515.6T DK1317163T3 (da) 2002-10-22 2002-10-22 Høreapparat
EP02023515A EP1317163B1 (fr) 2002-10-22 2002-10-22 Appareil auditif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02023515A EP1317163B1 (fr) 2002-10-22 2002-10-22 Appareil auditif

Publications (3)

Publication Number Publication Date
EP1317163A2 EP1317163A2 (fr) 2003-06-04
EP1317163A3 EP1317163A3 (fr) 2003-12-10
EP1317163B1 true EP1317163B1 (fr) 2012-08-29

Family

ID=8185485

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02023515A Expired - Lifetime EP1317163B1 (fr) 2002-10-22 2002-10-22 Appareil auditif

Country Status (2)

Country Link
EP (1) EP1317163B1 (fr)
DK (1) DK1317163T3 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10343292B3 (de) * 2003-09-18 2004-12-02 Siemens Audiologische Technik Gmbh Hörgerät ohne separates Mikrofongehäuse
DE102004009268B3 (de) 2004-02-26 2005-10-20 Siemens Audiologische Technik Ohreinsatz für ein Hörsystem
DE102005017357A1 (de) * 2005-04-14 2006-10-26 Siemens Audiologische Technik Gmbh Mikrofonvorrichtung für ein Hörgerät
DE102005041356B4 (de) 2005-08-31 2009-07-23 Siemens Audiologische Technik Gmbh Audioschuhkontakt für ein Hörgerät
DE102006023722A1 (de) * 2006-05-19 2007-11-22 Siemens Audiologische Technik Gmbh Hörvorrichtung mit angeschraubter Verschlusseinrichtung
DE102006026785A1 (de) * 2006-06-07 2007-12-13 Siemens Audiologische Technik Gmbh Abdeckvorrichtung für Hörgerät-Gehäuseanordnung
DE102008022926A1 (de) * 2008-05-09 2009-06-04 Siemens Medical Instruments Pte. Ltd. Hörhilfegehäuse mit elektrischem Steckverbinder
US8254608B2 (en) 2009-08-28 2012-08-28 Siemens Medical Instruments Pte. Ltd. Hearing aid device and method of producing a hearing aid device
US8224006B2 (en) 2009-08-28 2012-07-17 Siemens Medical Instruments Pte. Ltd. Hearing aid device and a method of manufacturing a hearing aid device
CN104396352A (zh) 2012-06-20 2015-03-04 西门子医疗器械公司 具有集成印刷电路板的注模的线路载体
WO2014064544A1 (fr) 2012-10-22 2014-05-01 Siemens Medical Instruments Pte. Ltd. Bloc de construction de routage pour des structures de mid complexes dans des instruments d'écoute
US9913052B2 (en) * 2013-11-27 2018-03-06 Starkey Laboratories, Inc. Solderless hearing assistance device assembly and method
US9906879B2 (en) 2013-11-27 2018-02-27 Starkey Laboratories, Inc. Solderless module connector for a hearing assistance device assembly
WO2015139749A1 (fr) * 2014-03-20 2015-09-24 Sonova Ag Procédé de fabrication d'un dispositif auditif ainsi que dispositif auditif

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8328734U1 (de) * 1983-10-05 1986-02-13 Siemens AG, 1000 Berlin und 8000 München Hörgerät
DE8708894U1 (fr) * 1987-06-26 1988-10-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
ATE123204T1 (de) * 1990-12-18 1995-06-15 Siemens Ag Hörgerät.
DE19920941A1 (de) * 1999-05-07 2000-11-16 Krauss Maffei Kunststofftech Verfahren zum Herstellen von Kunststoffteilen mit aufgeprägter Struktur und Vorrichtung zur Durchführung des Verfahrens

Also Published As

Publication number Publication date
EP1317163A3 (fr) 2003-12-10
EP1317163A2 (fr) 2003-06-04
DK1317163T3 (da) 2012-12-17

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