EP1228266B1 - Verfahren zur elektrochemischen metallisierung eines isolierenden substrats - Google Patents
Verfahren zur elektrochemischen metallisierung eines isolierenden substrats Download PDFInfo
- Publication number
- EP1228266B1 EP1228266B1 EP00966282A EP00966282A EP1228266B1 EP 1228266 B1 EP1228266 B1 EP 1228266B1 EP 00966282 A EP00966282 A EP 00966282A EP 00966282 A EP00966282 A EP 00966282A EP 1228266 B1 EP1228266 B1 EP 1228266B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- substrate
- film
- electrochemical cell
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Definitions
- the present invention relates to a method of metallization of an insulating substrate electrochemically.
- the oldest processes consist in putting the insulating plate to be metallized in contact with a solution of a salt of the metal and a reducing solution which causes a precipitation.
- the contacting can be done by watering or by immersion. These methods require the use a mixture of salts and optionally additives. In addition, they do not allow to control neither the speed of deposit, nor the texture, that is to say the quality of the deposit obtained.
- V. Fleury "Branched fractal patterns in non-equilibrium electrochemical deposition from oscillatory nucleation and growth", Nature, Vol. 390, Nov. 1997, 145-148] discloses a method for depositing a copper film on a galvanically insulating substrate. The surface to be metallized of the insulating substrate is covered with a thin film of gold.
- the substrate is then placed in a solution of a copper salt and is connected to an anode constituted by copper and a cathode constituted by a gold film, the two electrodes being connected to a current generator.
- the deposit on the surface of the insulating substrate is obtained by reducing the copper at the cathode.
- the reduced metal begins to settle at the cathode, then the deposit continues on the surface to be metallized covered with the thin non-conductive gold film. But in this case too, it leads to a dendritic growth that does not form a regular thin film completely covering.
- the structure of the deposit is extremely arborescent and tortuous.
- the research carried out by the inventor made it possible show that when an electrochemical process is used to grow powders along the surface of a substrate, by applying to the electrochemical cell a density much higher current than the densities of current beyond which it could not, according to the art previous, obtain that three-dimensional powders, one obtained on the substrate a deposit in which the grains arrange to form a uniform film covering and not more dendrites.
- the subject of the present invention is a electrochemical process for deposition on a substrate insulation, a continuous thin metal film.
- the current can vary within the above range. It is however preferable to operate in galvanostatic mode by imposing a current constant to improve the homogeneity of the deposited film.
- the method of the invention can be implemented to metallize a wide variety of insulating substrates, such as examples of plates or glass fibers, plates or Teflon® threads, filter paper, ceramic.
- the solvent of the electrolyte may be aqueous or non-aqueous. Aqueous solutions are particularly preferred for the simplicity of their implementation.
- the salt concentration of the electrolyte is preferably between 0.02 and 0.05 mol.l -1 .
- the device comprises an electrochemical cell 1 connected to a generator 2.
- Cell 1 is constituted by two rectangular glass slides 3 and 4 placed vertically and parallel to each other, one of the sides (of length L) of the blades being placed horizontally.
- the substrate to be metallized is the face of the oriented blade 3 towards the inside of the cell.
- Blades 3 and 4 are maintained spaced at a distance h by a separator 5.
- the separator 5 may be a blade or a wire of the metal M or a another stable metal with respect to the electrolyte, that is to say a metal that has a higher oxidation potential than that of the metal M, so as to avoid the deposit of type electroless.
- the distance h is preferably between about 50 ⁇ m and a few mm.
- a cathode 6, located at the upper part of the blade 3, can be constituted by a simple painting of metal (type "silver lacquer") filed on the upper edge of the blade 3.
- An anode 7, located at the lower part of the blade 3, can be constituted by a wire or sheet of metal M.
- the separator 5 is also used contact between the generator 2 and the electrode 6.
- the anode 7 also serves as a separator.
- the anode is directly connected to the substrate. Islands of metal M 'in layer 8 sufficiently thin to be non-percolating, are deposited on the face to be metallized of the blade 3.
- the intensity of the current applied to the cell which makes it possible to obtain a uniform and covering film of metal M is between 100. and 2000 ⁇ A, when the salt concentration C of the metal M in the electrolyte is of the order of 0.05 mol / liter.
- This intensity of current applied to the electrochemical cell causes a current density between 2.5 and 50 mA per cm 2 of surface in the horizontal section of the cell at the level of the growth front of the deposit.
- e 2h x C / C M.
- the thickness e of the film can be varied by altering the concentration of metal salt M in the electrolyte.
- the electrochemical cell can be adapted from in a way that the deposition of the metal M takes place continuously. we then pulls the substrate vertically upwards through the cell, as the part immersed in the electrolyte is covered with metal.
- the cell consists of a glass tube segment capillary, inner diameter 1 mm and length 3 cm, curved U-shaped, so that both openings are located in the upper position, to prevent the electrolyte from disperses by gravity.
- the tube was filled with a solution of silver nitrate.
- Fiberglass which has a diameter 200 ⁇ m, was coated with a silver lacquer primer and vertically into one of the openings, up to that the cathodic portion serving as a primer is immersed in the electrolyte to a depth of about 2 mm.
- a wire counter electrode anode
- the current was circulated through the tube by imposing a constant current of 100 ⁇ A between the primer on the fiber and the anode. We thus obtained a uniform deposit of a metal film on the fiber. The fiber has then removed by pulling it upwards, making sure to do not scrape the metallized fiber on the edges of the tube glass.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Claims (9)
- Verfahren zum Metallisieren eines isolierenden Substrats durch Auftragen eines gleichmäßigen dünnen Films aus einem Metall M auf dem isolierenden Substrat, wobei das Metall M aus Kupfer, Silber, Kobalt, Eisen oder Zinn ausgewählt ist, wobei das Verfahren darin besteht, das isolierende Substrat in einer elektrochemischen Zelle anzuordnen, die als Elektrolyt eine Lösung eines Salzes von Metall M in einem Lösungsmittel enthält und die eine Anode, die aus dem Metall M besteht, und eine Kathode umfasst, die in direktem Kontakt mit dem isolierenden Substrat steht, und dann eine Elektrolyse bei konstantem Strom durchzuführen, wobei das Verfahren dadurch gekennzeichnet ist, dasszunächst auf ein Ende des Substrates ein leitender Film aufgebracht wird, der die Kathode bildet;das Substrat so in der elektrochemischen Zelle angeordnet wird, dass die zu metallisierende Oberfläche vertikal verläuft und sich die Kathode im oberen Abschnitt befindet;an die elektrochemische Zelle ein Strom mit einer solchen Intensität eingeprägt wird, dass sie eine Stromdichte zwischen 1 und 50 mA/cm2 im horizontalen Abschnitt der elektrochemischen Zelle auf Höhe der Wachstumsfläche des sich ablagernden Films erzeugt.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das isolierende Substrat eine Glasplatte oder -faden, eine Platte oder ein Faden aus Teflon®, Filterpapier oder eine Keramikplatte ist.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass der Elektrolyt eine wässrige Kupfersulfat-, Kupferchlorid-, Silbernitrat-, Zinnchlorid- oder Eisenchloridlösung mit einer Salzkonzentration über 10-3 Mol.l-1 ist.
- Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass die Salzkonzentration zwischen 0,02 und 0,05 Mol.l-1 liegt.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die Oberfläche des zu metallisierenden Substrats mit einem Niederschlag eines nicht perkolierenden und somit nicht leitenden dünnen metallischen Films aus einem gegenüber Luft stabilen Metall in der metallischen Form vorbehandelt wird.
- Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass der nicht perkolierende dünne metallische Film aus Gold oder Palladium besteht.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die Intensität des an die elektrochemische Zelle angelegten Stroms zwischen 2,5 und 50 mA bei einem Zellenquerschnitt von 1 cm2 liegt.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das Substrat eine rechteckige Platte ist, die vertikal in der elektrochemischen Zelle angeordnet ist, wobei der obere Abschnitt der Platte den als Kathode dienenden leitenden Film trägt, wobei der gegenüberliegende Abschnitt der Platte mit der Anode aus Metall M verbunden ist.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das Substrat ein Faden ist, dessen eines Ende mit einem leitenden Film bedeckt ist und die Kathode bildet, während das andere Ende entweder frei oder direkt mit einer Anode aus Metall M verbunden ist.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9912644 | 1999-10-11 | ||
FR9912644A FR2799475B1 (fr) | 1999-10-11 | 1999-10-11 | Procede de metallisation d'un substrat isolant par voie electrochimique |
PCT/FR2000/002757 WO2001027356A1 (fr) | 1999-10-11 | 2000-10-04 | Procédé de métallisation d'un substrat isolant par voie électrochimique |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1228266A1 EP1228266A1 (de) | 2002-08-07 |
EP1228266B1 true EP1228266B1 (de) | 2004-02-04 |
Family
ID=9550779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00966282A Expired - Lifetime EP1228266B1 (de) | 1999-10-11 | 2000-10-04 | Verfahren zur elektrochemischen metallisierung eines isolierenden substrats |
Country Status (10)
Country | Link |
---|---|
US (1) | US6764586B1 (de) |
EP (1) | EP1228266B1 (de) |
JP (1) | JP4637429B2 (de) |
AT (1) | ATE259006T1 (de) |
AU (1) | AU7672900A (de) |
CA (1) | CA2387109C (de) |
DE (1) | DE60008134T2 (de) |
ES (1) | ES2213047T3 (de) |
FR (1) | FR2799475B1 (de) |
WO (1) | WO2001027356A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2812723B1 (fr) * | 2000-08-01 | 2002-11-15 | Centre Nat Rech Scient | Capteur de molecules gazeuses reductrices |
DE10240921B4 (de) * | 2002-09-02 | 2007-12-13 | Qimonda Ag | Verfahren und Anordnung zum selektiven Metallisieren von 3-D-Strukturen |
US20170105287A1 (en) * | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Process of Producing Electronic Component and an Electronic Component |
US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2596515A (en) * | 1946-03-14 | 1952-05-13 | Libbey Owens Ford Glass Co | Coating vitreous substances |
JP2829304B2 (ja) * | 1992-11-05 | 1998-11-25 | 誠 河瀬 | セラミック上へのZr合金めっき方法 |
FR2707673B1 (fr) * | 1993-07-16 | 1995-08-18 | Trefimetaux | Procédé de métallisation de substrats non-conducteurs. |
FR2746116B1 (fr) * | 1996-03-15 | 1998-06-05 | Galvanoplastie sous champ | |
US6572743B2 (en) * | 2001-08-23 | 2003-06-03 | 3M Innovative Properties Company | Electroplating assembly for metal plated optical fibers |
-
1999
- 1999-10-11 FR FR9912644A patent/FR2799475B1/fr not_active Expired - Lifetime
-
2000
- 2000-10-04 CA CA2387109A patent/CA2387109C/fr not_active Expired - Lifetime
- 2000-10-04 WO PCT/FR2000/002757 patent/WO2001027356A1/fr active IP Right Grant
- 2000-10-04 AU AU76729/00A patent/AU7672900A/en not_active Abandoned
- 2000-10-04 JP JP2001529484A patent/JP4637429B2/ja not_active Expired - Lifetime
- 2000-10-04 US US10/110,126 patent/US6764586B1/en not_active Expired - Lifetime
- 2000-10-04 DE DE60008134T patent/DE60008134T2/de not_active Expired - Lifetime
- 2000-10-04 ES ES00966282T patent/ES2213047T3/es not_active Expired - Lifetime
- 2000-10-04 EP EP00966282A patent/EP1228266B1/de not_active Expired - Lifetime
- 2000-10-04 AT AT00966282T patent/ATE259006T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60008134D1 (de) | 2004-03-11 |
EP1228266A1 (de) | 2002-08-07 |
FR2799475B1 (fr) | 2002-02-01 |
AU7672900A (en) | 2001-04-23 |
FR2799475A1 (fr) | 2001-04-13 |
JP4637429B2 (ja) | 2011-02-23 |
JP2003511564A (ja) | 2003-03-25 |
CA2387109C (fr) | 2011-05-24 |
CA2387109A1 (fr) | 2001-04-19 |
ES2213047T3 (es) | 2004-08-16 |
US6764586B1 (en) | 2004-07-20 |
ATE259006T1 (de) | 2004-02-15 |
DE60008134T2 (de) | 2004-09-02 |
WO2001027356A1 (fr) | 2001-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20160017502A1 (en) | Electrochemical Process for Producing Graphene, Graphene Oxide, Metal Composites, and Coated Substrates | |
EP1927129B1 (de) | Elektroplattierungsverfahren zur beschichtung einer substratoberfläche mit einem metall | |
WO2010001054A2 (fr) | Procede de preparation d'un film isolant electrique et application pour la metallisation de vias traversants | |
EP2898121B1 (de) | Elektrolyt und verfahren zur galvanischen abscheidung von kupfer auf einer barriereschicht | |
WO2007034116A2 (fr) | Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal | |
EP0124452B1 (de) | Verfahren zur Metallisierung von biegsamen elektrisch isolierenden Filmen und nach dem Verfahren erhaltene Gegenstände | |
Mengoli et al. | Enhanced Raman scattering from iron electrodes | |
EP1595001A1 (de) | Oberflächenbeschichtungsverfahren | |
FR2529582A1 (fr) | Procede perfectionne de revetement electrolytique de surfaces non metalliques | |
EP1838902A2 (de) | Nanoporöser filter | |
EP1228266B1 (de) | Verfahren zur elektrochemischen metallisierung eines isolierenden substrats | |
FR3061601A1 (fr) | Soltion d'electrodeposition de cuivre et procede pour des motifs de facteur de forme eleve | |
CA2462295C (en) | Elemental silicon nanoparticle plating and method for the same | |
BE1008086A3 (fr) | Procede de depot par electropolymerisation d'un film organique sur une surface conductrice de l'electricite. | |
Duan et al. | Electrochemical Studies of the Mechanism of the Formation of Metal‐TCNQ Charge‐Transfer Complex Film | |
FR2519031A1 (fr) | Bain de dorure et procede pour appliquer des depots d'or par galvanoplastie | |
Gómez et al. | Study and preparation of silver electrodeposits at negative potentials | |
Altube et al. | Electrodeposition and optical properties of silver infiltrated photonic nanostructures | |
Ignatova et al. | Electrodeposition of Ni-Co alloy on chemically oxidized Al | |
Jrajri et al. | Effect of Potential on Electrodeposited Cu2O Thin Film onto Copper Substrate at Low Duration | |
Dumitru et al. | Electrochemical studies on the growth process of the zinc oxide films from nitrate solutions | |
Cooper et al. | Bitrex: A new levelling agent for copper | |
PL219821B1 (pl) | Sposób osadzania nanocząstek metalu na powierzchni | |
Sun et al. | Multilayered microstructure of a Pb–Sn alloy coating obtained by electrochemical deposition | |
EP0277886A1 (de) | Vorrichtung zur Überwachung der kontinuierlichen metallischen Beschichtung eines sich bewegenden Metalldrahts, dessen metallische Zusammensetzung sich von der der Beschichtung unterscheidet |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20020405 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
17Q | First examination report despatched |
Effective date: 20030206 |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040204 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040204 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040204 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040204 Ref country code: IE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040204 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: FRENCH |
|
REF | Corresponds to: |
Ref document number: 60008134 Country of ref document: DE Date of ref document: 20040311 Kind code of ref document: P |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040504 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040504 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040504 |
|
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 20040520 |
|
LTIE | Lt: invalidation of european patent or patent extension |
Effective date: 20040204 |
|
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2213047 Country of ref document: ES Kind code of ref document: T3 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FD4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041031 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041031 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20041031 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20041105 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040704 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 17 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 18 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 19 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: LU Payment date: 20190913 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20191009 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 20191119 Year of fee payment: 20 Ref country code: BE Payment date: 20191025 Year of fee payment: 20 Ref country code: IT Payment date: 20191015 Year of fee payment: 20 Ref country code: FR Payment date: 20191031 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20191018 Year of fee payment: 20 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R071 Ref document number: 60008134 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: PE20 Expiry date: 20201003 Ref country code: BE Ref legal event code: MK Effective date: 20201004 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20201003 |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20220127 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20201005 |