ATE259006T1 - Verfahren zur elektrochemischen metallisierung eines isolierenden substrats - Google Patents
Verfahren zur elektrochemischen metallisierung eines isolierenden substratsInfo
- Publication number
- ATE259006T1 ATE259006T1 AT00966282T AT00966282T ATE259006T1 AT E259006 T1 ATE259006 T1 AT E259006T1 AT 00966282 T AT00966282 T AT 00966282T AT 00966282 T AT00966282 T AT 00966282T AT E259006 T1 ATE259006 T1 AT E259006T1
- Authority
- AT
- Austria
- Prior art keywords
- insulating substrate
- electrochemical cell
- cathode
- metal
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9912644A FR2799475B1 (fr) | 1999-10-11 | 1999-10-11 | Procede de metallisation d'un substrat isolant par voie electrochimique |
PCT/FR2000/002757 WO2001027356A1 (fr) | 1999-10-11 | 2000-10-04 | Procédé de métallisation d'un substrat isolant par voie électrochimique |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE259006T1 true ATE259006T1 (de) | 2004-02-15 |
Family
ID=9550779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00966282T ATE259006T1 (de) | 1999-10-11 | 2000-10-04 | Verfahren zur elektrochemischen metallisierung eines isolierenden substrats |
Country Status (10)
Country | Link |
---|---|
US (1) | US6764586B1 (de) |
EP (1) | EP1228266B1 (de) |
JP (1) | JP4637429B2 (de) |
AT (1) | ATE259006T1 (de) |
AU (1) | AU7672900A (de) |
CA (1) | CA2387109C (de) |
DE (1) | DE60008134T2 (de) |
ES (1) | ES2213047T3 (de) |
FR (1) | FR2799475B1 (de) |
WO (1) | WO2001027356A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2812723B1 (fr) * | 2000-08-01 | 2002-11-15 | Centre Nat Rech Scient | Capteur de molecules gazeuses reductrices |
DE10240921B4 (de) * | 2002-09-02 | 2007-12-13 | Qimonda Ag | Verfahren und Anordnung zum selektiven Metallisieren von 3-D-Strukturen |
US20170105287A1 (en) * | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Process of Producing Electronic Component and an Electronic Component |
US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2596515A (en) * | 1946-03-14 | 1952-05-13 | Libbey Owens Ford Glass Co | Coating vitreous substances |
JP2829304B2 (ja) * | 1992-11-05 | 1998-11-25 | 誠 河瀬 | セラミック上へのZr合金めっき方法 |
FR2707673B1 (fr) * | 1993-07-16 | 1995-08-18 | Trefimetaux | Procédé de métallisation de substrats non-conducteurs. |
FR2746116B1 (fr) * | 1996-03-15 | 1998-06-05 | Galvanoplastie sous champ | |
US6572743B2 (en) * | 2001-08-23 | 2003-06-03 | 3M Innovative Properties Company | Electroplating assembly for metal plated optical fibers |
-
1999
- 1999-10-11 FR FR9912644A patent/FR2799475B1/fr not_active Expired - Lifetime
-
2000
- 2000-10-04 US US10/110,126 patent/US6764586B1/en not_active Expired - Lifetime
- 2000-10-04 EP EP00966282A patent/EP1228266B1/de not_active Expired - Lifetime
- 2000-10-04 JP JP2001529484A patent/JP4637429B2/ja not_active Expired - Lifetime
- 2000-10-04 AU AU76729/00A patent/AU7672900A/en not_active Abandoned
- 2000-10-04 WO PCT/FR2000/002757 patent/WO2001027356A1/fr active IP Right Grant
- 2000-10-04 ES ES00966282T patent/ES2213047T3/es not_active Expired - Lifetime
- 2000-10-04 DE DE60008134T patent/DE60008134T2/de not_active Expired - Lifetime
- 2000-10-04 AT AT00966282T patent/ATE259006T1/de not_active IP Right Cessation
- 2000-10-04 CA CA2387109A patent/CA2387109C/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2799475B1 (fr) | 2002-02-01 |
AU7672900A (en) | 2001-04-23 |
ES2213047T3 (es) | 2004-08-16 |
DE60008134D1 (de) | 2004-03-11 |
EP1228266A1 (de) | 2002-08-07 |
CA2387109C (fr) | 2011-05-24 |
JP4637429B2 (ja) | 2011-02-23 |
WO2001027356A1 (fr) | 2001-04-19 |
DE60008134T2 (de) | 2004-09-02 |
EP1228266B1 (de) | 2004-02-04 |
US6764586B1 (en) | 2004-07-20 |
JP2003511564A (ja) | 2003-03-25 |
CA2387109A1 (fr) | 2001-04-19 |
FR2799475A1 (fr) | 2001-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |