EP1208047A4 - Inverted pressure vessel with horizontal through loading - Google Patents

Inverted pressure vessel with horizontal through loading

Info

Publication number
EP1208047A4
EP1208047A4 EP00957297A EP00957297A EP1208047A4 EP 1208047 A4 EP1208047 A4 EP 1208047A4 EP 00957297 A EP00957297 A EP 00957297A EP 00957297 A EP00957297 A EP 00957297A EP 1208047 A4 EP1208047 A4 EP 1208047A4
Authority
EP
European Patent Office
Prior art keywords
loading
horizontal
pressure vessel
inverted pressure
inverted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00957297A
Other languages
German (de)
French (fr)
Other versions
EP1208047A1 (en
Inventor
James Tseronis
Heiko Moritz
Mohan Chandra
Robert Farmer
Ijaz Jafri
Jonathan Talbot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SC Fluids Inc
Original Assignee
SC Fluids Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SC Fluids Inc filed Critical SC Fluids Inc
Publication of EP1208047A1 publication Critical patent/EP1208047A1/en
Publication of EP1208047A4 publication Critical patent/EP1208047A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C13/00—Details of vessels or of the filling or discharging of vessels
    • F17C13/02—Special adaptations of indicating, measuring, or monitoring equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/008—Processes carried out under supercritical conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/06—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Closures For Containers (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
EP00957297A 1999-08-05 2000-08-04 Inverted pressure vessel with horizontal through loading Withdrawn EP1208047A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US14725199P 1999-08-05 1999-08-05
US147251P 1999-08-05
US15545499P 1999-09-20 1999-09-20
US155454P 1999-09-20
PCT/US2000/021338 WO2001010733A1 (en) 1999-08-05 2000-08-04 Inverted pressure vessel with horizontal through loading

Publications (2)

Publication Number Publication Date
EP1208047A1 EP1208047A1 (en) 2002-05-29
EP1208047A4 true EP1208047A4 (en) 2004-03-31

Family

ID=26844748

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00957297A Withdrawn EP1208047A4 (en) 1999-08-05 2000-08-04 Inverted pressure vessel with horizontal through loading

Country Status (7)

Country Link
EP (1) EP1208047A4 (en)
JP (1) JP2003506646A (en)
KR (1) KR20020061589A (en)
CN (1) CN1204024C (en)
AU (1) AU6893600A (en)
IL (1) IL147986A0 (en)
WO (1) WO2001010733A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
AU2001290171A1 (en) * 2000-07-26 2002-02-05 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
WO2002011911A1 (en) * 2000-08-04 2002-02-14 S. C. Fluids, Inc. Inverted pressure vessel with shielded closure mechanism
US6722642B1 (en) * 2002-11-06 2004-04-20 Tokyo Electron Limited High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
CN110410498A (en) * 2018-04-28 2019-11-05 重庆海扶医疗科技股份有限公司 Hoop component and pressure vessel
RU2766224C1 (en) 2018-07-25 2022-02-10 Графтек Интернэшнл Холдингз Инк. Extrusion press and method of application thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5221019A (en) * 1991-11-07 1993-06-22 Hahn & Clay Remotely operable vessel cover positioner
EP0623948A1 (en) * 1992-11-13 1994-11-09 Asm Japan K.K. Load lock chamber for vertical type heat treatment apparatus
EP0841689A2 (en) * 1996-11-06 1998-05-13 Asm Japan K.K. Method of processing semiconductor substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744660A (en) * 1970-12-30 1973-07-10 Combustion Eng Shield for nuclear reactor vessel
US4789077A (en) * 1988-02-24 1988-12-06 Public Service Electric & Gas Company Closure apparatus for a high pressure vessel
US4823976A (en) * 1988-05-04 1989-04-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Quick actuating closure
US5236669A (en) * 1990-09-12 1993-08-17 E. I. Du Pont De Nemours And Company Pressure vessel
US5556497A (en) * 1995-01-09 1996-09-17 Essef Corporation Fitting installation process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5221019A (en) * 1991-11-07 1993-06-22 Hahn & Clay Remotely operable vessel cover positioner
EP0623948A1 (en) * 1992-11-13 1994-11-09 Asm Japan K.K. Load lock chamber for vertical type heat treatment apparatus
EP0841689A2 (en) * 1996-11-06 1998-05-13 Asm Japan K.K. Method of processing semiconductor substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0110733A1 *

Also Published As

Publication number Publication date
EP1208047A1 (en) 2002-05-29
CN1204024C (en) 2005-06-01
JP2003506646A (en) 2003-02-18
IL147986A0 (en) 2002-09-12
AU6893600A (en) 2001-03-05
KR20020061589A (en) 2002-07-24
WO2001010733A1 (en) 2001-02-15
CN1368928A (en) 2002-09-11

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20020222

AK Designated contracting states

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Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

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A4 Supplementary search report drawn up and despatched

Effective date: 20040218

RIC1 Information provided on ipc code assigned before grant

Ipc: 7B 01J 3/00 B

Ipc: 7B 65D 55/00 A

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20071211