EP1204786B1 - Dispositif permettant a un liquide de s'ecouler uniformement sur la surface d'un echantillon et utilisation de ce dispositif - Google Patents

Dispositif permettant a un liquide de s'ecouler uniformement sur la surface d'un echantillon et utilisation de ce dispositif Download PDF

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Publication number
EP1204786B1
EP1204786B1 EP00963895A EP00963895A EP1204786B1 EP 1204786 B1 EP1204786 B1 EP 1204786B1 EP 00963895 A EP00963895 A EP 00963895A EP 00963895 A EP00963895 A EP 00963895A EP 1204786 B1 EP1204786 B1 EP 1204786B1
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EP
European Patent Office
Prior art keywords
sample
liquid
arrangement according
flow
tubes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00963895A
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German (de)
English (en)
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EP1204786A1 (fr
Inventor
Daniel Hosten
Helge Schmidt
Michael Schwab
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
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Filing date
Publication date
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Publication of EP1204786A1 publication Critical patent/EP1204786A1/fr
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Definitions

  • the invention relates to an arrangement for uniform flow around a surface of a sample with liquid, where the sample rotates in the liquid.
  • the invention further relates to the use of the arrangement.
  • Such arrangements are used in particular for galvanic Machining surfaces, being in an electrolyte the sample connected to the cathode and an anode face. It is desirable that with galvanic Deposit the deposited layers over the coated one Are homogeneous in terms of layer thickness and other functional properties, such as. B. intrinsic Stress. This requires a smooth transition of the Solute electrolyte on the layer surface.
  • EP 0 856 598 A1 describes an arrangement for galvanic Coating a surface known to be a rotating
  • the electrolyte flows through the sample laterally through a nozzle becomes.
  • the rotating sample can be used for averaging a homogeneous layer thickness can be achieved.
  • the disadvantage this arrangement is that from the nozzle emerging flow is not laminar. The one that occurs Vortex formation leads to uneven separation rates. Further the uneven flow also affects the anode from where the material to be deposited is located in the electrolyte dissolves. If the flow to the anode is uneven, ion concentration differences can occur occur within the electrolyte.
  • the aim of the present invention is therefore an arrangement for even flow around a surface of a sample Provide liquid at the flow vortex, flow shadow and inhomogeneities due to a dormant Sample should be avoided and the flow over the Surface is laminar.
  • the invention provides an arrangement for uniform flow around a surface of a sample with liquid, which a Has flow space through which the liquid flows is.
  • a Has flow space through which the liquid flows is.
  • Sample that can be rotated about an axis of rotation by means of a rotary drive is.
  • Starting from an inlet tank and an outlet tank run inflow tubes or outflow tubes from and to opposite ends of the flow space.
  • the go Tubes from the containers.
  • the liquid will fed to the inlet tank via an inlet pipe.
  • the liquid is via a drain pipe that begins in the drain container dissipated from this.
  • Inlet and outlet tanks meet just a distributor function from the pipes to the Tubes.
  • the arrangement also has means for generating are suitable for a current.
  • the arrangement Filters on at one point in the arrangement of the liquid be flowed through. These filters are either or drain container or arranged in the inflow or outflow tubes.
  • the pores of the filter or filters are set in size and number so that the Pressure difference between the inflow and outflow tubes, which are different are far away from the inlet / outlet pipe becomes. This is preferably achieved by continuing at tubes removed from the inlet or outlet pipe have a larger total pore area of the associated filter or filter section is flowed through by liquid than in tubes which are arranged close to the inlet or outlet pipe.
  • the sample and the electrode are with one Power source connected.
  • a DC power source can be used be, the polarity according to the application to Apply or remove is selected.
  • the power source can be above also be pulsating, which makes the deposition mechanical allows strained layers on the sample surface becomes.
  • An arrangement for galvanic is particularly advantageous Application or removal of material on or from a surface a sample in which the flow space two according to the invention has parallel boundary walls parallel to each other.
  • This Boundary walls have a first and a second Recess on.
  • the sample is essentially flat Surface and is around a perpendicular to the surface Rotational axis rotatably arranged so that with this Surface of the first recess is covered, the Surface with the associated boundary wall one level forms.
  • the electrode also has a flat surface, which covers the second recess and with the associated boundary wall forms a level.
  • the flow space is in in this case of parallel to the inflow and outflow tubes flat boundary walls limited what training a laminar flow is also favored.
  • An arrangement for galvanic is particularly advantageous Application of material in which the anode according to the invention Mesh basket made of electrochemically inert material, which has a flat surface containing holes.
  • This Mesh basket is with the material to be separated as granules filled. Due to the granulate shape of the material to be separated the contact area with the electrolyte is particularly large, which makes the material to be separated easier in the electrolyte dissolves.
  • the electrode is off one coated with platinum or another precious metal Metal.
  • a possible electrochemical reaction with a dissolved nickel containing electrolytes would be, for example, the deposition of nickel on the cathode and the simultaneous generation of Oxygen from the water of the solution at the anode.
  • An arrangement for uniformity is particularly advantageous Flow around a surface of a sample with liquid according to the invention, the inlet and outlet pipe each via Throttle valve in a reservoir filled with liquid are led.
  • a liquid pump is considered, which is the liquid pumps the reservoir through the inlet pipe.
  • the liquid is an electrolyte are also means for regulating the ion concentration of the electrolyte.
  • the invention can be used particularly advantageously for Deposition of a mechanically strained layer of nickel / iron alloy on a wafer.
  • This wafer then exists preferably made of silicon or ceramic.
  • the composition of the alloy and the intrinsic mechanical Tension of the layer over the wafer is homogeneous.
  • From the secluded Layer can be structured by structuring rectangles, which are then partially under-etched by the wafer bent springs can be produced in a batch process. Such springs are used for example in miniaturized Relay.
  • the arrangement according to the invention can also be particularly advantageous are used for coating wafers with electrophoretic Paint.
  • the voltage required for electrophoresis is between the wafer and an opposite one Electrode applied.
  • the arrangement according to the invention can also be special can be used advantageously for the currentless deposition of Material on the surface of the sample.
  • the arrangement according to the invention can also be used are used to remove material from the surface the sample using an etching solution. For example etched the surface of a silicon wafer with KOH solution become.
  • Figure 1 shows an inventive arrangement for flow around a surface of a sample with liquid in schematic Longitudinal section.
  • Figure 2 shows the flow space of an arrangement according to the invention for uniform flow around a surface in the schematic Cross-section.
  • FIG. 3 shows a storage container into which an inlet and an inlet Drain pipe are guided, in a schematic longitudinal section.
  • Figure 1 shows an arrangement for uniform flow around a Surface with a flow space 1, in which a Electrolyte 2 is located.
  • a wafer 3 On the top of the flow space 1 a wafer 3 is arranged.
  • the wafer 3 is connected to a cathode 4 connected and by means of a rotary drive 5 about an axis rotatable perpendicular to its surface.
  • the rotary drive 5 is stored with the help of the bearing 22 and with the help of the seal 23 sealed against the wafer.
  • Located opposite the wafer 3 a grid basket 15 connected to an anode 6, which contains the material to be separated in the form of granules 14.
  • the flow space 1 is surrounded by a housing 18.
  • An inlet tank 9 is located on each side of the flow chamber 1 and a drain container 10 is arranged.
  • the containers 9, 10 are Via inflow tubes 7 or outflow tubes 8 with the flow space 1 connected.
  • This filter 13 flows through the inflow tubes as evenly as possible 7 and the discharge tubes 8 reached.
  • the filter 13 contains Filter pores 24 through which the electrolyte 2 can flow.
  • FIG. 2 shows a flow space 1 on the top is covered with a wafer 3. Laterally to flow space 1 an inlet container 9 and an outlet container 10 are arranged. An inlet pipe 11, the liquid, ends in the inlet tank 9 transported into the feed tank 9. In the drain container 10 begins a drain pipe 12, the liquid from the drain container 10 transported away. The flow space 1 is with the inlet tank 9 and the outlet tank 10 via parallel extending inflow tubes 7 and 8 outflow tubes connected. In the inlet tank 9 and in the outlet tank 10 is located a filter 13 with filter pores 24. The size of the filter pores 24 is chosen so that it varies over the total filter area the pressure difference between different distances from the inlet pipe 11 or drain pipe 12 removed inflow tubes 7 or outflow tubes 8 is balanced. This will make it uniform Flow through the inflow tubes 7 and the outflow tubes 8 reached, which favors a laminar flow in the flow space 1.
  • FIG. 3 shows a storage container filled with electrolyte 2 17, into which a drain pipe 12 and an inlet pipe 11 are guided are.
  • the inlet pipe 11 is via a throttle valve 16 led into the reservoir 17.
  • the feed pump 20 is used.
  • a heater 19 is arranged for temperature control is used.
  • the invention is not limited to those shown by way of example Embodiments, but is in its most general Form defined by claim 1.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)

Claims (11)

  1. Dispositif permettant un écoulement continu d'un liquide (2) autour de la surface d'un échantillon (3), comprenant
       un espace d'écoulement (1) traversé par le liquide (2)
       un échantillon (3) agencé au moins partiellement dans l'espace d'écoulement (1), pouvant être tourné autour d'un axe de rotation par l'intermédiaire d'un mécanisme d'entraínement en rotation (5),
       des tubes d'alimentation et d'évacuation (7, 8) partant respectivement d'un récipient d'alimentation et d'évacuation (9, 10),
       un tube d'alimentation (11) se terminant dans le récipient d'alimentation (9),
       un tube d'évacuation (12),
       un moyen (20) destiné à établir un écoulement, et
       des filtres (13) traversés par le liquide, agencés dans le récipient d'alimentation et/ou d'évacuation (9, 10) ou dans les tubes d'amenée ou d'échappement (7, 8),
       caractérisé en ce que les tubes d'alimentation et d'évacuation (7, 8) s'étendent vers les extrémités opposées de l'espace d'écoulement (1) et en ce que le tube d'évacuation (12) s'étend à partir du récipient d'évacuation (10).
  2. Dispositif selon la revendication 1, dans lequel les dimensions et le nombre des pores filtrants (24) sont ajustés de manière variable sur l'ensemble de la surface du filtre, de sorte à compenser une différence de pression, entraínant un écoulement irrégulier à travers les tubes (7, 8) entre des tubes d'amenée/d'échappement (7, 8) agencés à des distances différentes du tube d'alimentation/d'évacuation (11, 12) par différentes surfaces à pores globales traversées par l'écoulement, affectées aux différents tubes (7, 8).
  3. Dispositif selon les revendications 1 ou 2 permettant l'application électrolytique de matériau sur la surface de l'échantillon ou la séparation correspondante, comportant une électrode (6) dans l'espace d'écoulement (1), le liquide (2) étant constitué par un électrolyte, l'échantillon (3) et l'électrode (6) étant reliés à une source de courant à pulsations ou continue.
  4. Dispositif selon la revendication 3 permettant l'application ou la séparation par galvanisation de matériau sur la surface de l'échantillon, dans lequel
       l'espace d'écoulement (1) comporte deux parois de délimitation comportant un premier et un deuxième évidement, agencées parallèlement à la direction de l'écoulement,
       l'échantillon (3) a pour l'essentiel une surface plane, l'axe de rotation étant agencé perpendiculairement à celle-ci,
       l'échantillon (3) recouvre le premier évidement et la surface formant un plan avec la paroi de délimitation correspondante, et
       l'électrode (6) recouvre avec une surface plane le deuxième évidement et formant un plan avec la paroi de délimitation correspondante.
  5. Dispositif selon la revendication 4, dans lequel l'électrode (6) comporte un panier grillagé (15), composé d'un matériau électrochimiquement inerte, comportant une surface plane contenant des trous, rempli du matériau devant être séparé (14) sous forme de granules.
  6. Dispositif selon la revendication 4, dans lequel l'électrode (6) est constituée par un corps métallique comportant une surface plane revêtue de platine ou d'un autre métal précieux.
  7. Dispositif selon les revendications 1 à 6, dans lequel le tube d'alimentation et/ou d'évacuation (11, 12) est guidé par l'intermédiaire d'une soupape d'étranglement (16) dans un réservoir (17) rempli d'un liquide (2), comportant des moyens de filtrage (21) et de réglage de la température (19), de la valeur pH, du niveau de remplissage et éventuellement aussi de la concentration ionique du liquide (2).
  8. Utilisation du dispositif selon les revendications 5 à 7 pour la séparation d'une couche composée d'un alliage de nickel/fer d'une plaquette de silicium ou de céramique (3), la composition de l'alliage et la tension mécanique intrinsèque de la couche étant homogènes au-delà de la plaquette (3).
  9. Utilisation du dispositif selon les revendications 1 à 7 pour le vernissage d'une plaquette (3) avec un vernis photosensible électrophorétique.
  10. Utilisation du dispositif selon les revendications 1 ou 2 pour la séparation sans courant de matériau de la surface de l'échantillon.
  11. Utilisation du dispositif selon les revendications 1 ou 2 pour la séparation de matériau de la surface de l'échantillon, le liquide étant constitué par une solution de décapage.
EP00963895A 1999-08-13 2000-08-10 Dispositif permettant a un liquide de s'ecouler uniformement sur la surface d'un echantillon et utilisation de ce dispositif Expired - Lifetime EP1204786B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19938409A DE19938409C1 (de) 1999-08-13 1999-08-13 Anordnung zum gleichmäßigen Umströmen einer Oberfläche einer Probe mit Flüssigkeit und Verwendung der Anordnung
DE19938409 1999-08-13
PCT/DE2000/002704 WO2001012882A1 (fr) 1999-08-13 2000-08-10 Dispositif permettant a un liquide de s'ecouler uniformement sur la surface d'un echantillon et utilisation de ce dispositif

Publications (2)

Publication Number Publication Date
EP1204786A1 EP1204786A1 (fr) 2002-05-15
EP1204786B1 true EP1204786B1 (fr) 2003-03-12

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EP00963895A Expired - Lifetime EP1204786B1 (fr) 1999-08-13 2000-08-10 Dispositif permettant a un liquide de s'ecouler uniformement sur la surface d'un echantillon et utilisation de ce dispositif

Country Status (4)

Country Link
US (1) US6949172B1 (fr)
EP (1) EP1204786B1 (fr)
DE (2) DE19938409C1 (fr)
WO (1) WO2001012882A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7184385B2 (en) 2002-09-27 2007-02-27 Koninklijke Philips Electronics N.V. Optical scanning device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003201092A1 (en) * 2002-01-17 2003-07-30 Koninklijke Philips Electronics N.V. Optical scanning device
US7374646B2 (en) * 2003-01-31 2008-05-20 Ebara Corporation Electrolytic processing apparatus and substrate processing method
US20050028929A1 (en) * 2003-08-07 2005-02-10 Kenji Furusawa Substrate processing apparatus and method thereof
DE10352708A1 (de) * 2003-11-07 2005-06-09 Würth Elektronik Pforzheim GmbH & Co. KG Verfahren und Vorrichtung zum Galvanisieren
US8707971B2 (en) * 2008-05-16 2014-04-29 Xyratex Corporation Laminated walls for uniform fluid flow

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US4696729A (en) * 1986-02-28 1987-09-29 International Business Machines Electroplating cell
JPH0533196A (ja) * 1991-07-31 1993-02-09 Tanaka Kikinzoku Kogyo Kk メツキ装置
JPH0625899A (ja) * 1992-07-10 1994-02-01 Nec Corp 電解メッキ装置
US5597460A (en) 1995-11-13 1997-01-28 Reynolds Tech Fabricators, Inc. Plating cell having laminar flow sparger
EP0854210B1 (fr) * 1996-12-19 2002-03-27 Toshiba Ceramics Co., Ltd. Appareillage pour le dépôt de films minces à partir de la phase vapeur
DE29701092U1 (de) * 1997-01-23 1997-03-20 Technotrans Gmbh Galvanische Abscheidungsvorrichtung
JP3500050B2 (ja) * 1997-09-08 2004-02-23 東京エレクトロン株式会社 不純物除去装置、膜形成方法及び膜形成システム
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7184385B2 (en) 2002-09-27 2007-02-27 Koninklijke Philips Electronics N.V. Optical scanning device

Also Published As

Publication number Publication date
DE19938409C1 (de) 2001-03-22
US6949172B1 (en) 2005-09-27
WO2001012882A1 (fr) 2001-02-22
EP1204786A1 (fr) 2002-05-15
DE50001464D1 (de) 2003-04-17

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